EFM8LB11F32ES1-C-QFN24R - 8-bit 72MHz Laser Bee MCU, 32KB Flash | Silicon Labs
部品番号: EFM8LB11F32ES1-C-QFN24R ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.66 | $16.60 |
| 100 | $1.4 | $140.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $0.99 | $990.00 |
EFM8LB11F32ES1-C-QFN24R 概要
Laser Bee is Silicon Labs' high-throughput 8-bit MCU family that retains the classic 8051 instruction set while pushing the core to a 72 MHz pipeline, achieving roughly 50 MIPS effective throughput. In the broader taxonomy, EFM8LB1 sits under 8-bit microcontrollers, which are themselves a sub-category of microcontrollers (MCU), embedded controllers, and finally integrated circuits (IC). Compared with older 8051 parts (typically 12 MHz, 1 MIPS/MHz), the Laser Bee core delivers 7-8x higher compute density, making it suitable where determinism of the 8051 is preferred but throughput of an ARM Cortex-M0+ is not required.
The device integrates 32 KB single-cycle flash, 2.25 KB RAM, 13 digital I/O (20 per the supplier listing) plus analog, an internal 49 MHz ±2% HFO, and a hardware cryptographic accelerator is not included at this family tier. Peripherals visible from the part number suffix ("S1") include UART, SMBus/I2C, SPI, PCA, timers, and a 14-bit 12-channel SAR ADC. The "C" in the suffix indicates revision C silicon, which improves ADC linearity and lowers active current compared with revision A/B parts.
Architecturally, the Laser Bee core is a single-cycle 8051 with branch prediction and a tightly-coupled flash controller; this avoids the multi-cycle fetch penalty of legacy 8051s. The internal 49 MHz HFO can drive the core directly or be divided, and a low-frequency 32 kHz oscillator backs RTC-mode sleep. The 14-bit ADC at 900 ksps and two 12-bit DACs provide direct analog I/O for sensor conditioning loops without external converters.
Typical applications include BLDC motor control (FOC sensorless), USB-C power delivery (PD) negotiation, portable medical sensor read-out, and lighting-control modules requiring up to 20 PWM channels. This part also fits general-purpose 8051 socket upgrades in industrial HMI and HVAC controllers where the existing firmware stack must be preserved.
When designing with this part, route the QFN-24 exposed pad (pin 25 / DAP) directly to a contiguous ground pour - this is the primary thermal and electrical return path. Keep ADC traces short and symmetric, and use a separate analog supply decoupling node if mixed-signal accuracy matters.
This page synthesizes distributor pricing, drop-in same-package alternatives, and design considerations not found in the manufacturer datasheet.
ドロップイン代替品: EFM8LB11F32ES1-C-QFN24R — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EFM8LB11F32ES1-C-QFN24R （同一形状・フットプリント） — 相違点: ADC, DAC, Package, RAM.
クイック比較ツール — 並列比較する代替部品を選択:
EFM8LB11F32ES1-C-QFN24
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EFM8LB11F32ES0-C-QFN24R
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EFM8LB11F32E-C-QFN24R
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EFM8LB11F32E-QFN24
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EFM8LB11F32ES1-B-QFN24R
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EFM8LB11F32ES1-C-QFN24R 最大定格＆電気的特性
| Core | CIP-51 8051 |
| Core Size | 8-bit |
| Core Speed | 72 MHz |
| Flash Memory | 32 KB (32K x 8) |
| RAM | 2.25 KB |
| ROM Type | Flash |
| データバス幅 | 8-bit |
| Supply Voltage (Vcc/Vdd) | 2.2 V to 3.6 V |
| Number of I/O | 20 |
| ADC | 12 x 14-bit |
| DAC | 2 x 12-bit |
| パッケージ | 24-QFN (3x3 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40 C to +125 C (extended industrial, see datasheet) |
| Silicon Revision | C (indicated by "C" suffix) |
| RoHS ステータス | Compliant |
EFM8LB11F32ES1-C-QFN24R ピン構成
| ピン 1 | P0.0 — Port 0.0 / I2C SDA |
| ピン 2 | P0.1 — Port 0.1 / I2C SCL |
| ピン 3 | P0.2 — Port 0.2 / UART TX |
| ピン 4 | P0.3 — Port 0.3 / UART RX |
| ピン 5 | P0.4 — Port 0.4 / SPI SCK |
| ピン 6 | P0.5 — Port 0.5 / SPI MISO |
| ピン 7 | P0.6 — Port 0.6 / SPI MOSI |
| ピン 8 | P0.7 — Port 0.7 / SPI NSS |
| ピン 9 | P1.0 — Port 1.0 / AIN0.0 |
| ピン 10 | P1.1 — Port 1.1 / AIN0.1 |
| ピン 11 | P1.2 — Port 1.2 / AIN0.2 |
| ピン 12 | P1.3 — Port 1.3 / AIN0.3 |
| ピン 13 | P1.4 — Port 1.4 / AIN0.4 |
| ピン 14 | P1.5 — Port 1.5 / AIN0.5 |
| ピン 15 | P1.6 — Port 1.6 / AIN0.6 |
| ピン 16 | P1.7 — Port 1.7 / AIN0.7 |
| ピン 17 | P2.0 — Port 2.0 / DAC0 output |
| ピン 18 | P2.1 — Port 2.1 / DAC1 output |
| ピン 19 | C2D — C2 debug interface data |
| ピン 20 | C2CK — C2 debug interface clock |
| ピン 21 | RESET — Active-low reset input |
| ピン 22 | VREF — ADC voltage reference |
| ピン 23 | VDD — Supply voltage 2.2-3.6 V |
| ピン 24 | GND — Ground |
主な用途
EFM8LB11F32ES1-C-QFN24R の用途: 6 件s: Sensorless BLDC Motor Control (FOC), USB-C Power Delivery (PD) Negotiator (via external UCPD), Portable Medical Sensor Read-Out, HVAC & Building Automation Controllers, Smart Lighting / DALI & 0-10V Dimmer Modules, Industrial HMI / Keypad + Display Modules.
Sensorless BLDC Motor Control (FOC)
The EFM8LB11F32ES1-C-QFN24R is well-suited for sensorless BLDC motor control in small form-factor fans, pumps, and appliances. Its 72 MHz CIP-51 core executes FOC (field-oriented control) loops at 10-20 kHz PWM with margin for additional housekeeping tasks. The on-chip 14-bit ADC samples BEMF zero-crossings with sufficient resolution, and the 4-channel PCA/PWM module generates complementary drive signals directly to the gate driver. With 32 KB flash, all state-machine code plus an RPM curve fits without external memory. Placed between the 12V motor bus and the three-phase inverter stage, the part replaces a discrete DSP+pre-driver solution while keeping PCB area to 9 mm^2.
おすすめ
USB-C Power Delivery (PD) Negotiator (via external UCPD)
While the EFM8LB11F32ES1-C-QFN24R does not include integrated USB-C PD hardware, its 32 KB flash and 72 MHz throughput comfortably implement the PD 3.1 protocol state machine via an external FUSB302-type PD PHY. The 14-bit ADC monitors VBUS current and voltage for telemetry reporting, while the 2.25 KB RAM handles protocol buffers and PPS (programmable power supply) ramp tables. Designers pick this MCU when they want full source-code control over PD negotiation instead of relying on the PD firmware inside the PHY. Per the EFM8LB1 datasheet, the 8051 pipeline's deterministic interrupt latency simplifies USB-C attach/detach timing.
おすすめ
Portable Medical Sensor Read-Out
The EFM8LB11F32ES1-C-QFN24R fits portable medical devices such as pulse-oximeters, glucose meters, and temperature patches. Its 14-bit ADC provides adequate resolution for photodiode current-to-voltage conversion in SpO2 sensors, and the two 12-bit DACs drive bias/trim references for thermistor bridges. The 0.5 uA sleep current extends battery life in always-on wearable form factors. The 24-QFN 3x3 mm package suits a coin-cell PCB, and the extended -40 to +125 C operating range supports sterilization and refrigerated drug storage. Compared with an ARM Cortex-M0+, the 8051 core's deterministic interrupt latency simplifies FDA audit of timing-sensitive diagnostic loops.
おすすめ
HVAC & Building Automation Controllers
Building automation controllers (thermostats, VAV dampers, fan-coil units) commonly use the EFM8LB11F32ES1-C-QFN24R as the main logic controller. The 8051 architecture preserves legacy firmware written for older 8051 thermostats, easing HVAC vendor transitions. Its 20 GPIO handle keypads, LCD bias, relay drivers, and multiple UART buses for BACnet/Modbus networking. The 14-bit ADC reads thermistor temperature with 0.05 C resolution after averaging. Operating from -40 C to +125 C it tolerates plenum-mounted enclosures, and the 32 KB flash accommodates zoned scheduling firmware plus OTA update slots.
おすすめ
Smart Lighting / DALI & 0-10V Dimmer Modules
Commercial LED drivers and DALI-2 dimmer modules benefit from the EFM8LB11F32ES1-C-QFN24R's 14-bit ADC for 0-10V analog dimming sensing and its PCA/PWM channels for DALI bit-banged Manchester encoding. The 32 KB flash holds a DALI-2 application controller plus tunable-white fade curves, and the 2.25 KB RAM buffers lighting scenes. The small 24-QFN package fits inside a standard LED driver can, and the 0.5 uA sleep mode supports emergency-lumen battery backup. Compared with the EFM8BB3, the LB1's 14-bit ADC offers 16x finer dimming granularity below 5% output.
おすすめ
Industrial HMI / Keypad + Display Modules
Industrial HMI modules (keypad + LCD) use the EFM8LB11F32ES1-C-QFN24R to scan up to a 4x5 matrix keypad, drive a character LCD, and serve as a Modbus RTU slave on RS-485. The 8051 core's tight interrupt response simplifies deterministic keypad debounce and LCD timing. With 32 KB flash, custom character sets, multilingual menus, and remote firmware update via Modbus all fit. The 14-bit ADC monitors the backlight LED current for constant-luminance feedback. The wide operating temperature range and surface-mount QFN package suit factory-floor panels.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EFM8LB11F32ES1-C-QFN24R — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EFM8LB11F32ES1-C-QFN24 | EFM8LB11F32ES0-C-QFN24R | EFM8LB11F32E-C-QFN24R | EFM8LB11F32E-QFN24 | EFM8LB11F32ES1-B-QFN24R |
|---|---|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Package | 24-QFN (3x3 mm) | 24-QFN (3x3 mm) - same | 24-QFN (3x3 mm) - same | 24-QFN (3x3 mm) - same | 24-QFN (3x3 mm) - same | 24-QFN (3x3 mm) - same |
| Core | CIP-51 8051, 72 MHz | CIP-51 8051, 72 MHz | CIP-51 8051, 72 MHz | CIP-51 8051, 72 MHz | CIP-51 8051, 72 MHz | CIP-51 8051, 72 MHz |
| Flash Memory | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| RAM | 2.25 KB | 2.25 KB | 2.25 KB | 2.25 KB | 2.25 KB | 2.25 KB |
| Silicon Revision | C | C | C | C (predecessor E) | E | B |
| Packaging Format | Tape & Reel (R) | Tray (no R) | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
| ADC | 12 x 14-bit | 12 x 14-bit | 12 x 14-bit | 12 x 14-bit | 12 x 14-bit | 12 x 14-bit |
| Supply Voltage | 2.2 V to 3.6 V | 2.2 V to 3.6 V | 2.2 V to 3.6 V | 2.2 V to 3.6 V | 2.2 V to 3.6 V | 2.2 V to 3.6 V |
| Approx. Price (qty 100) | $1.40 | $1.40 | $1.40 | $1.50 | $1.50 | $1.60 |
主な差別化要因
- Highest flash density in 24-QFN LB1 family （vs EFM8LB11F16 variant)
- 14-bit ADC vs 10-bit on Busy Bee (BB3) family （vs EFM8BB3 family in same 24-QFN)
- Most recent silicon revision C with latest errata fixes （vs EFM8LB11F32ES1-B-QFN24R (revision B))
設計ノート
The 24-QFN package has a center exposed pad (DAP) at the package bottom that MUST be soldered directly to a contiguous ground pour on the top layer for both thermal dissipation and electrical reference. Per the EFM8LB1 datasheet layout guidelines, use at least 8 thermal vias (0.3 mm drill, 0.5 mm pitch) tying the DAP to the inner ground plane. Failure to solder the DAP can raise junction temperature 25-30 C at full 72 MHz load.
Decouple VDD (pin 23) with a 1 uF X7R ceramic capacitor placed within 3 mm of the pin, plus a 100 nF high-frequency bypass cap within 1 mm. If AVDD is tied to a separate analog rail, add a ferrite bead and a second 100 nF cap on AVDD. Brown-out reset (VDD monitor) is factory-set to 2.0 V; ensure your supply ramps monotonically above 2.2 V within 50 ms to avoid spurious resets.
Keep ADC analog inputs (P1.x) trace lengths under 25 mm and route them away from PWM outputs (P2.0, P2.1) and switching nodes. Use a ground guard trace between analog and digital sections on the top layer. When using the internal VREF, add 1 uF + 10 nF decoupling on the VREF pin to suppress reference noise that would otherwise appear as ADC gain error.
Do NOT assume the C2 debug pins (C2D, C2CK) are 5 V tolerant - they are 3.6 V absolute max per the EFM8LB1 datasheet. When programming in-circuit, ensure your C2 programmer's logic level matches VDD. Also, leaving the C2 pins floating during normal operation can inject noise; either disable the C2 interface in firmware after debug or add 100 kohm pull-ups to VDD.
Estimated: At 72 MHz, 3.3 V VDD, all peripherals active, the EFM8LB11F32ES1-C-QFN24R draws approximately 17 mA (~56 mW). The 24-QFN with a properly soldered DAP has theta_JA around 35 C/W (per Silicon Labs thermal characterization), giving a 2 C rise above ambient - well within the 125 C max. At -40 C cold-start, allow the internal LDO 5 ms to stabilize before the CIP-51 core executes code.
コンプライアンス情報
RoHS/REACH compliance confirmed per Silicon Labs product page. Industrial grade (-40 to +125 C) - AEC-Q100 qualification not applicable for non-automotive parts.
