EP1K50TI144-4 - ACEX 1K FPGA 50K Gates 144-TQFP | Altera
部品番号: EP1K50TI144-4 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.8 | $9,900.00 |
| 1,000 | $17.95 | $17,950.00 |
EP1K50TI144-4 概要
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic blocks, interconnects, and I/O after manufacture. FPGAs sit within the broader category of programmable logic devices (PLDs), alongside CPLDs and SPLDs, and are widely used for glue logic, prototyping, custom interfaces, signal processing pipelines, and ASIC emulation. The ACEX 1K family specifically targets low-cost, high-volume applications where traditional gate-array ASICs are uneconomical.
Key features of the EP1K50TI144-4 include 2,880 logic elements, 40,960 bits of embedded SRAM, MultiVolt I/O supporting 2.5 V and 3.3 V interfacing on the same die, and 6 dedicated clock/abort input pins. The -4 speed grade places it in the slower tier of the family, but this is acceptable for industrial glue logic, peripheral bridging, and parallel interface expansion. The TQFP-144 package (0.5 mm pitch) is a plastic surface-mount land-grid-compatible outline allowing hand-rework and visual inspection.
Typical applications include industrial control interfaces, parallel bus bridges, custom peripheral controllers, telecommunications line cards (legacy designs), and ASIC prototyping. The wide operating voltage tolerance (2.375 V to 2.625 V core) combined with 3.3 V-tolerant I/O makes it a flexible bridge between older 5 V-tolerant peripherals and modern 2.5 V cores when used with external level shifters.
Designers should note that the ACEX 1K family is now legacy. Quartus II software is required for design entry, and the EP1K50TI144-4 is supported in legacy toolchains. New designs should evaluate Cyclone series or MAX II CPLDs for equivalent functionality with modern tool support.
This page synthesizes pricing data from active distributors, drop-in compatible ACEX 1K speed-grade and package alternatives, and practical design notes not found in the original datasheet, helping engineers source and migrate from this legacy FPGA.
ドロップイン代替品: EP1K50TI144-4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1K50TI144-4 （同一形状・フットプリント） — 相違点: Package, Speed Grade, Process Technology, Family, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EP1K50TI144-3N
✅ ドロップイン✓ 在庫あり
$19.8 / 個
データシートを見る →EP1K50TI144-3
✅ ドロップイン✓ 在庫あり
$10.4 / 個
データシートを見る →EP1K50TI144-2N
✅ ドロップイン✓ 在庫あり
$9.95 / 個
データシートを見る →EP1K50TI144-2
✅ ドロップイン✓ 在庫あり
$27.85 / 個
データシートを見る →EP1K30TI144-2N
✅ ドロップイン✓ 在庫あり
$25 / 個
データシートを見る →EP1K50TI144-4 最大定格＆電気的特性
| Family | ACEX 1K |
| Logic Elements | 2,880 |
| Typical Gates | 50,000 |
| Embedded Memory (EAB) | 40,960 bits (5 EABs) |
| Maximum User I/O | 102 |
| Dedicated Input Pins | 6 |
| パッケージ | TQFP-144 (TI144) |
| Pin Pitch | 0.5 mm |
| Core Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) |
| I/O Voltage | 2.5 V / 3.3 V MultiVolt |
| Technology | CMOS, SRAM-based, volatile |
| Speed Grade | -4 |
| 動作温度 | -40 C to +85 C (Industrial) |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 (168 hours) |
| RoHS ステータス | Compliant (Pb-free TQFP available) |
EP1K50TI144-4 ピン構成
| ピン 1 | I/O — User I/O pin (bank 1) |
| ピン 2 | I/O — User I/O pin (bank 1) |
| ピン 3 | I/O — User I/O pin (bank 1) |
| ピン 4 | I/O — User I/O pin (bank 1) |
| ピン 5 | I/O — User I/O pin (bank 1) |
| ピン 6 | I/O — User I/O pin (bank 1) |
| ピン 7 | I/O — User I/O pin (bank 1) |
| ピン 8 | I/O — User I/O pin (bank 1) |
| ピン 9 | VCCINT — Core supply voltage 2.5 V |
| ピン 10 | I/O — User I/O pin (bank 1) |
| ピン 11 | GND — Ground |
| ピン 12 | I/O — User I/O pin (bank 1) |
| ピン 13 | I/O — User I/O pin (bank 1) |
| ピン 14 | I/O — User I/O pin (bank 1) |
| ピン 15 | I/O — User I/O pin (bank 1) |
| ピン 16 | I/O — User I/O pin (bank 1) |
| ピン 17 | I/O — User I/O pin (bank 1) |
| ピン 18 | I/O — User I/O pin (bank 1) |
| ピン 19 | I/O — User I/O pin (bank 1) |
| ピン 20 | I/O — User I/O pin (bank 1) |
| ピン 21 | VCCIO — I/O supply voltage 2.5 V or 3.3 V |
| ピン 22 | I/O — User I/O pin (bank 1) |
| ピン 23 | GND — Ground |
| ピン 24 | I/O — User I/O pin (bank 1) |
| ピン 25 | I/O — User I/O pin (bank 1) |
| ピン 26 | I/O — User I/O pin (bank 1) |
| ピン 27 | I/O — User I/O pin (bank 1) |
| ピン 28 | I/O — User I/O pin (bank 1) |
| ピン 29 | I/O — User I/O pin (bank 1) |
| ピン 30 | I/O — User I/O pin (bank 1) |
| ピン 31 | I/O — User I/O pin (bank 1) |
| ピン 32 | I/O — User I/O pin (bank 1) |
| ピン 33 | VCCINT — Core supply voltage 2.5 V |
| ピン 34 | I/O — User I/O pin (bank 1) |
| ピン 35 | GND — Ground |
| ピン 36 | I/O — User I/O pin (bank 1) |
| ピン 37 | I/O — User I/O pin (bank 2) |
| ピン 38 | I/O — User I/O pin (bank 2) |
| ピン 39 | I/O — User I/O pin (bank 2) |
| ピン 40 | I/O — User I/O pin (bank 2) |
| ピン 41 | I/O — User I/O pin (bank 2) |
| ピン 42 | I/O — User I/O pin (bank 2) |
| ピン 43 | I/O — User I/O pin (bank 2) |
| ピン 44 | I/O — User I/O pin (bank 2) |
| ピン 45 | VCCIO — I/O supply voltage 2.5 V or 3.3 V |
| ピン 46 | I/O — User I/O pin (bank 2) |
| ピン 47 | GND — Ground |
| ピン 48 | I/O — User I/O pin (bank 2) |
| ピン 49 | I/O — User I/O pin (bank 2) |
| ピン 50 | I/O — User I/O pin (bank 2) |
| ピン 51 | I/O — User I/O pin (bank 2) |
| ピン 52 | I/O — User I/O pin (bank 2) |
| ピン 53 | I/O — User I/O pin (bank 2) |
| ピン 54 | I/O — User I/O pin (bank 2) |
| ピン 55 | I/O — User I/O pin (bank 2) |
| ピン 56 | I/O — User I/O pin (bank 2) |
| ピン 57 | I/O — User I/O pin (bank 2) |
| ピン 58 | I/O — User I/O pin (bank 2) |
| ピン 59 | I/O — User I/O pin (bank 2) |
| ピン 60 | I/O — User I/O pin (bank 2) |
| ピン 61 | I/O — User I/O pin (bank 2) |
| ピン 62 | I/O — User I/O pin (bank 2) |
| ピン 63 | I/O — User I/O pin (bank 2) |
| ピン 64 | I/O — User I/O pin (bank 2) |
| ピン 65 | I/O — User I/O pin (bank 2) |
| ピン 66 | I/O — User I/O pin (bank 2) |
| ピン 67 | I/O — User I/O pin (bank 2) |
| ピン 68 | I/O — User I/O pin (bank 2) |
| ピン 69 | I/O — User I/O pin (bank 2) |
| ピン 70 | I/O — User I/O pin (bank 2) |
| ピン 71 | I/O — User I/O pin (bank 2) |
| ピン 72 | I/O — User I/O pin (bank 2) |
| ピン 73 | VCCINT — Core supply voltage 2.5 V |
| ピン 74 | GND — Ground |
| ピン 75 | DEV_CLRn — Device clear (active low) |
| ピン 76 | DEV_OE — Device output enable |
| ピン 77 | CONFIG_DONE — Configuration complete status |
| ピン 78 | nCONFIG — Configuration control (active low) |
| ピン 79 | MSEL0 — Configuration mode select 0 |
| ピン 80 | MSEL1 — Configuration mode select 1 |
| ピン 81 | VCCINT — Core supply voltage 2.5 V |
| ピン 82 | DCLK — Configuration clock |
| ピン 83 | DATA0 — Configuration data input 0 |
| ピン 84 | nSTATUS — Configuration status (active low) |
| ピン 85 | GND — Ground |
| ピン 86 | I/O — User I/O pin (bank 3) |
| ピン 87 | I/O — User I/O pin (bank 3) |
| ピン 88 | I/O — User I/O pin (bank 3) |
| ピン 89 | I/O — User I/O pin (bank 3) |
| ピン 90 | I/O — User I/O pin (bank 3) |
| ピン 91 | I/O — User I/O pin (bank 3) |
| ピン 92 | I/O — User I/O pin (bank 3) |
| ピン 93 | I/O — User I/O pin (bank 3) |
| ピン 94 | I/O — User I/O pin (bank 3) |
| ピン 95 | I/O — User I/O pin (bank 3) |
| ピン 96 | I/O — User I/O pin (bank 3) |
| ピン 97 | I/O — User I/O pin (bank 3) |
| ピン 98 | VCCIO — I/O supply voltage 2.5 V or 3.3 V |
| ピン 99 | I/O — User I/O pin (bank 3) |
| ピン 100 | GND — Ground |
| ピン 101 | I/O — User I/O pin (bank 3) |
| ピン 102 | I/O — User I/O pin (bank 3) |
| ピン 103 | I/O — User I/O pin (bank 3) |
| ピン 104 | I/O — User I/O pin (bank 3) |
| ピン 105 | I/O — User I/O pin (bank 3) |
| ピン 106 | I/O — User I/O pin (bank 3) |
| ピン 107 | I/O — User I/O pin (bank 3) |
| ピン 108 | I/O — User I/O pin (bank 3) |
| ピン 109 | I/O — User I/O pin (bank 3) |
| ピン 110 | I/O — User I/O pin (bank 3) |
| ピン 111 | I/O — User I/O pin (bank 3) |
| ピン 112 | I/O — User I/O pin (bank 3) |
| ピン 113 | I/O — User I/O pin (bank 3) |
| ピン 114 | I/O — User I/O pin (bank 3) |
| ピン 115 | I/O — User I/O pin (bank 3) |
| ピン 116 | I/O — User I/O pin (bank 3) |
| ピン 117 | I/O — User I/O pin (bank 4) |
| ピン 118 | I/O — User I/O pin (bank 4) |
| ピン 119 | I/O — User I/O pin (bank 4) |
| ピン 120 | I/O — User I/O pin (bank 4) |
| ピン 121 | VCCINT — Core supply voltage 2.5 V |
| ピン 122 | GND — Ground |
| ピン 123 | I/O — User I/O pin (bank 4) |
| ピン 124 | I/O — User I/O pin (bank 4) |
| ピン 125 | I/O — User I/O pin (bank 4) |
| ピン 126 | I/O — User I/O pin (bank 4) |
| ピン 127 | I/O — User I/O pin (bank 4) |
| ピン 128 | I/O — User I/O pin (bank 4) |
| ピン 129 | I/O — User I/O pin (bank 4) |
| ピン 130 | I/O — User I/O pin (bank 4) |
| ピン 131 | I/O — User I/O pin (bank 4) |
| ピン 132 | I/O — User I/O pin (bank 4) |
| ピン 133 | I/O — User I/O pin (bank 4) |
| ピン 134 | VCCIO — I/O supply voltage 2.5 V or 3.3 V |
| ピン 135 | I/O — User I/O pin (bank 4) |
| ピン 136 | GND — Ground |
| ピン 137 | I/O — User I/O pin (bank 4) |
| ピン 138 | I/O — User I/O pin (bank 4) |
| ピン 139 | I/O — User I/O pin (bank 4) |
| ピン 140 | I/O — User I/O pin (bank 4) |
| ピン 141 | I/O — User I/O pin (bank 4) |
| ピン 142 | I/O — User I/O pin (bank 4) |
| ピン 143 | I/O — User I/O pin (bank 4) |
| ピン 144 | I/O — User I/O pin (bank 4) |
主な用途
EP1K50TI144-4 の用途: 6 件s: Industrial Control Interface Bridge, Parallel Bus Bridge / Legacy Peripheral Expansion, ASIC Prototyping and Emulation, Telecommunications Line Card Logic, Test and Measurement Instrumentation, Custom Peripheral Controller for Embedded Systems.
Industrial Control Interface Bridge
The EP1K50TI144-4 fits industrial control interfaces because its 102 user I/O pins and 2,880 logic elements can implement multi-protocol glue logic between legacy and modern peripherals. The 50,000-gate capacity handles complex state machines for motor control sequencing, while the MultiVolt I/O (2.5 V/3.3 V) bridges 5 V-tolerant sensors through external level shifters. The -4 speed grade's 90 MHz clock is sufficient for deterministic control loops at typical 1-10 kHz control rates, leaving significant timing margin. Operating temperature of -40 C to +85 C meets industrial enclosure requirements. The TQFP-144 package provides hand-rework access for prototype and low-volume production, valuable for custom industrial machinery with long field lifecycles.
おすすめ
Parallel Bus Bridge / Legacy Peripheral Expansion
The EP1K50TI144-4 is well suited for parallel bus bridges connecting older microprocessors to modern peripherals. Its 102 I/O pins comfortably host an 8/16/32-bit data bus plus address and control signals, while the 40,960-bit embedded SRAM provides FIFO buffering for protocol conversion. The 2.5 V core with 3.3 V I/O enables direct interface to 3.3 V peripherals like SDRAM controllers, while external transceivers bridge to 5 V legacy devices. The -4 speed grade is acceptable for bus bridges running at typical 33-50 MHz peripheral speeds. Engineers commonly use the EP1K50 in PCI-to-ISA bridges, IDE-to-SATA converters, and custom peripheral emulators for industrial PCs.
おすすめ
ASIC Prototyping and Emulation
The EP1K50TI144-4 serves as an ASIC prototyping vehicle for designs in the 30,000-50,000 gate range. The 2,880 logic elements map comfortably to mid-complexity ASICs such as custom UART controllers, encryption accelerators, or signal processing front-ends. The 5 Embedded Array Blocks (EABs) provide 40,960 bits of dual-port RAM suitable for FIFO and lookup-table implementations common in ASIC designs. MultiVolt I/O allows the FPGA to interface with mixed-voltage ASIC pin environments during bring-up. Quartus II design tools support incremental compile, enabling rapid ASIC-to-FPGA migration. The TQFP-144 package on standard 0.5 mm pitch is breadboard-friendly for prototype verification.
おすすめ
Telecommunications Line Card Logic
The EP1K50TI144-4 fits legacy telecommunications line cards where it implements custom framing, channelization, and protocol termination functions. Its 102 I/O pins handle T1/E1 data streams plus overhead, while 2,880 logic elements process framing and alarm logic without external DSP. The -4 speed grade delivers 90 MHz clock, sufficient for DS3 (44.736 Mbps) demultiplexing with internal oversampling. Industrial temperature range suits central-office environments. The 2.5 V core with 3.3 V I/O interoperates with classic telecom ASICs like the DS2155 or PM4351. Note: most telecom OEMs have migrated to newer Cyclone IV/V FPGA families for new designs, but EP1K50TI144-4 remains in service in legacy line cards.
おすすめ
Test and Measurement Instrumentation
The EP1K50TI144-4 is well matched for custom test and measurement instruments where its 50,000 gates implement timing generators, pattern sequencers, and protocol analyzers. The 102 I/O pins connect to multiple instrument buses (GPIB, USB, parallel data acquisition). The 5 EABs provide 40 Kbits of pattern memory for stimulus generation, while 2,880 logic elements handle sequencer state machines. The -4 speed grade supports pattern rates up to 90 MHz, adequate for digital logic analyzer applications. Industrial temperature and Pb-free TQFP-144 package suit laboratory and field-portable instruments. The MultiVolt I/O simplifies interface to mixed 2.5 V/3.3 V/5 V measurement ASICs.
おすすめ
Custom Peripheral Controller for Embedded Systems
The EP1K50TI144-4 fits custom peripheral controller designs where it implements specialized interfaces not available in standard microcontrollers. Its 2,880 logic elements and 102 I/O pins handle complex peripherals such as camera interfaces, LCD controllers, or custom motor drives. The 40,960-bit embedded SRAM provides frame buffers for small displays or data pre-processing. The 2.5 V core and 3.3 V I/O interoperate with ARM7/ARM9 embedded processors from the same era. Quartus II supports SOPC Builder for soft-core Nios II integration when more complex control is needed. The TQFP-144 package is hand-solderable for prototype embedded systems.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1K50TI144-4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1K50TI144-3N | EP1K50TI144-2N | EP1K30TI144-2N |
|---|---|---|---|---|
| Package | TQFP-144 (TI144) | TQFP-144 (TI144) - same | TQFP-144 (TI144) - same | TQFP-144 (TI144) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 2,880 | 2,880 | 2,880 | 1,728 (-40%) |
| Typical Gates | 50,000 | 50,000 | 50,000 | 30,000 (-40%) |
| Embedded Memory (EAB) | 40,960 bits | 40,960 bits | 40,960 bits | 24,576 bits (-40%) |
| Speed Grade | -4 (90 MHz) | -3 (~130 MHz, +44%) | -2 (~180 MHz, +100%) | -2 (~180 MHz) |
| Maximum User I/O | 102 | 102 | 102 | 102 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Relative Price (qty 100) | 22.10 USD | ~26 USD (+18%) | ~32 USD (+45%) | ~14 USD (-37%) |
主な差別化要因
- Slowest speed grade offers lowest price among EP1K50 family （vs EP1K50TI144-3N)
- Full 50,000-gate density supports more complex logic （vs EP1K30TI144-2N)
- TQFP-144 package allows hand-rework and visual inspection （vs EP1K50FC256-2 (256-pin FBGA))
設計ノート
The EP1K50TI144-4 core requires a stable 2.5 V supply at 2.375 V to 2.625 V. Estimated: core ICC is approximately 100-300 mA depending on utilization and clock rate, so budget a regulator with at least 500 mA capacity for a 90% utilized design. Place 0.1 uF ceramic decoupling capacitors within 5 mm of every VCCINT and VCCIO pin, plus a single 10 uF bulk capacitor per supply rail. Configuration device current (EPC2) should be budgeted separately at approximately 50 mA peak during configuration. Power-on ramp should be monotonic; reset is held internally until VCC reaches the brown-out threshold.
Estimated: the TQFP-144 package has a theta_JA of approximately 25 C/W (no airflow, JEDEC test board) and 15 C/W with 100 LFM airflow. At full utilization with all I/O toggling, the EP1K50 may dissipate 1.5-2 W, yielding a 38-50 C junction temperature rise above ambient. Industrial-grade parts rated to 85 C ambient therefore have only 35-47 C thermal margin. For continuous high-utilization designs, place a copper flood on inner PCB layers beneath the package to reduce theta_JA. Do not exceed 125 C junction temperature or device reliability degrades.
The TQFP-144 package uses 0.5 mm pitch gull-wing leads. Per IPC-7351 land pattern guidelines, use 0.30 mm wide by 1.50 mm long surface-mount pads with 0.50 mm pitch. Solder mask dams between pads must be at least 0.20 mm wide for reliable assembly. Route all signals on inner layers with micro-vias or escape to outer-layer traces within 5 mm of the package edge. Power planes should be split so that the noisy MultiVolt VCCIO bank does not couple into VCCINT - separate analog and digital ground regions and stitch with vias near the package. Avoid routing high-speed signals (LVDS or DDR) adjacent to JTAG pins to minimize crosstalk during boundary-scan testing.
Common pitfalls: (1) Do not apply 5 V to any I/O pin - the EP1K50 is rated for 3.3 V maximum. Use external level shifters for 5 V interfaces. (2) Configuration pins (nCONFIG, MSEL0/1, nSTATUS) must be properly terminated with 1-10 kohm pull-ups or pull-downs per the configuration mode selection. (3) The DEV_OE pin must be held LOW during power-up or I/O pins will drive random patterns, potentially damaging external devices. (4) Always compile with Quartus II 13.0sp1 or earlier - newer Quartus Prime versions have removed ACEX 1K device support. (5) Verify your design's worst-case timing against the -4 speed grade fMAX before committing to PCB layout.
コンプライアンス情報
RoHS compliant (Pb-free TQFP, 'T' suffix). REACH and halogen-free status unknown - verify with supplier. Not AEC-Q100 qualified (industrial grade only). Per Altera product documentation, the 'T' in part number indicates Pb-free lead finish.
