EP1S30F1020C5N - 32K LE Stratix FPGA, 1020-BGA, 500MHz | Intel
部品番号: EP1S30F1020C5N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 5 | $1380 | $6,900.00 |
| 10 | $1310 | $13,100.00 |
| 25 | $1235 | $30,875.00 |
| 100 | $1095 | $109,500.00 |
EP1S30F1020C5N 概要
A Field Programmable Gate Array (FPGA) is a programmable logic device that allows hardware designers to configure digital logic at the design bench rather than at the semiconductor fab. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Within that hierarchy, the Stratix family targets high-end, logic-, memory-, and DSP-intensive applications where ASIC NRE costs or time-to-market pressures make custom silicon unattractive. The EP1S30 is positioned as a mid-density member of the family, balancing logic capacity, block RAM, and I/O bandwidth for telecom, networking, and DSP prototyping systems.
Key features include 32,470 logic elements arranged in 3,247 LABs, 3,317,184 bits of embedded TriMatrix memory (the largest density at launch for this family tier), up to 726 user I/O pins, dedicated DSP blocks for high-throughput multiplier-accumulators, support for multiple I/O standards including LVDS, and on-chip phase-locked loops for clock management. Per-pin slew-rate and drive-strength control are configurable through the Quartus development tool.
Architecturally, the EP1S30 uses a sea-of-LABs layout with routing channels between rows and columns, dedicated multiplier blocks, and embedded RAM blocks of multiple depths. The 1020-ball FC-FBGA package exposes the full logic/memory/DSP fabric and is suitable for high-density boards with controlled-impedance routing. Configuration is typically via JTAG or a passive serial/parallel EPROM.
Typical applications include high-performance DSP prototyping, telecom line-card processing, military/aerospace signal processing (commercial temp grade limits to benign environments), and test & measurement backplanes. It is also used in legacy industrial controller upgrades where Stratix I designs cannot be re-targeted.
When designing, ensure the 1.5 V core and I/O bank supplies meet the sequencing requirement (VCCINT before VCCIO), use a configuration controller or EPC device for boot, and follow Altera's PCB layout guidelines for FC-FBGA escape routing and thermal pad connection.
This page synthesizes distributor pricing for the EP1S30F1020C5N, drop-in Stratix I siblings in the 1020-BGA footprint, and practical design notes not found in the original datasheet.
ドロップイン代替品: EP1S30F1020C5N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1S30F1020C5N （同一形状・フットプリント） — 相違点: Speed Grade, Operating Temperature, Package, Package Type, Family.
クイック比較ツール — 並列比較する代替部品を選択:
EP1S30F1020C5
✅ ドロップイン✓ 在庫あり
$99 / 個
データシートを見る →EP1S30F1020C6N
✅ ドロップイン✓ 在庫あり
$1015 / 個
データシートを見る →EP1S25F1020C5N
✅ ドロップイン✓ 在庫あり
$640 / 個
データシートを見る →EP1S25F1020C5
✅ ドロップイン✓ 在庫あり
$650 / 個
データシートを見る →EP1S25F1020C6N
✅ ドロップイン✓ 在庫あり
$450 / 個
データシートを見る →EP1S30F1020C5N 最大定格＆電気的特性
| Family | Stratix |
| Logic Elements | 32,470 |
| Logic Array Blocks (LABs) | 3,247 |
| Embedded Memory (bits) | 3,317,184 |
| Maximum User I/O | 726 |
| DSP Blocks | Yes (integrated multiplier blocks, count per datasheet) |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Speed Grade | 5 (C5) |
| 動作温度 | 0 C to +85 C (commercial) |
| Maximum Internal Frequency | 500 MHz |
| パッケージ | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) |
| 実装タイプ | Surface Mount |
EP1S30F1020C5N 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) ピン配置ガイド
EP1S30F1020C5N (1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1S30F1020C5N.
詳細は データシート をご参照ください。
主な用途
EP1S30F1020C5N の用途: 6 件s: High-Performance DSP Prototyping, Telecom Line-Card Processing, Industrial Control and Motion Systems, Test and Measurement Backplanes, Legacy Military/Aerospace Signal Processing, Broadcast Video Processing.
High-Performance DSP Prototyping
The EP1S30F1020C5N is well-suited to DSP prototyping because its 32,470 logic elements, integrated multiplier blocks, and 3.3 Mbit of embedded memory give designers enough headroom to implement multi-channel FIR filters, FFT pipelines, and radar baseband algorithms on a single die. The C5 speed grade's 500 MHz fabric fMAX lets the prototype match near-ASIC throughput while keeping design iteration in Quartus II. With 726 user I/O, the device fans out to external ADC/DAC banks without multiplexer logic. Trade-off: at 130 nm and 1.5 V core, dynamic power is non-trivial - active thermal management is required.
おすすめ
Telecom Line-Card Processing
In telecom line-card designs, the EP1S30F1020C5N has historically been used to perform packet classification, traffic shaping, and SERDES aggregation. Its 726 user I/O accommodate backplane connections and multi-gigabit LVDS lanes, while the TriMatrix memory holds routing tables and statistics counters in tightly-coupled block RAM. The 1020-BGA package supports the controlled-impedance board stack-ups required for telecom PCBs. Operating at 0-85 C commercial temperature, the device fits Climate-Controlled central-office environments; for outdoor or hardened cabinets the EP1S30F1020I6N variant is preferred.
おすすめ
Industrial Control and Motion Systems
Engineers building high-axis-count CNC, robotics, or industrial-motion controllers have long adopted the EP1S30F1020C5N to host multi-axis interpolation, encoder decoding, and safety logic in a single fabric. The 3.3 Mbit embedded memory buffers trajectory data and PID state without external SRAM, while 726 I/O drive stepper/digital servo amplifiers and feedback peripherals in parallel. Industrial enclosures generally stay within the 0-85 C commercial window, but conveyor-side panels can exceed it - designers should default to the EP1S30F1020I6N for those cabinets.
おすすめ
Test and Measurement Backplanes
ATE and high-channel-count test equipment leverage the EP1S30F1020C5N's 726 I/O to scan many DUTs in parallel, with the fabric implementing per-pin pattern generators, comparators, and timing sequencers. The 3.3 Mbit block RAM stores stimulus vectors locally, avoiding the latency of fetching from external memory during tight loopback tests. With C5 speed grade, edge-placement resolution supports sub-ns timing on LVDS paths. Designers must budget 130 nm dynamic power carefully, since continuous toggling of 700+ I/O at 100 MHz produces substantial dissipation.
おすすめ
Legacy Military/Aerospace Signal Processing
Although the EP1S30F1020C5N's commercial 0-85 C window limits it to benign aerospace platforms, several legacy avionics and ground-station signal-processing subsystems still rely on it because the Quartus II design flow and Stratix I silicon are well-validated. The 32K LE fabric holds full-channel radar FFTs and beamforming weight generators, and the 1020-BGA package supports the controlled-impedance backplanes common in MIL-spec boards. New designs should migrate to the industrial-grade EP1S30F1020I6N or to a radiation-tolerant Kintex UltraScale equivalent.
おすすめ
Broadcast Video Processing
The EP1S30F1020C5N has been used in broadcast video routers, frame synchronizers, and SDI cross-point switches, where 726 user I/O and TriMatrix memory allow several channels of uncompressed SDI to be buffered and routed in real time. Its LVDS support maps cleanly to SDI serializer/deserializer interfaces, and the C5 speed grade provides margin for 270 Mbps SDI throughput. Commercial temperature suffices for studio installations; broadcast trucks and outside-broadcast vans should adopt the EP1S30F1020I6N variant for the wider operating range.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1S30F1020C5N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1S30F1020C5 | EP1S30F1020C6N | EP1S25F1020C5N | EP1S25F1020C5 | EP1S25F1020C6N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) - same | 1020-ball FC-FBGA (33 x 33 mm) - same | 1020-ball FC-FBGA (33 x 33 mm) - same | 1020-ball FC-FBGA (33 x 33 mm) - same | 1020-ball FC-FBGA (33 x 33 mm) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 32,470 | 32,470 (same) | 32,470 (same) | ~25,000 (~23% lower) | ~25,000 (~23% lower) | ~25,000 (~23% lower) |
| Speed Grade | C5 (fastest) | C5 (same) | C6 (slower) | C5 (same) | C5 (same) | C6 (slower) |
| Temperature Grade | Commercial (0 to +85 C) | Commercial (same) | Commercial (same) | Commercial (same) | Commercial (same) | Commercial (same) |
| Lead-Free | Yes (N suffix) | No (leaded) | Yes (N suffix) | Yes (N suffix) | No (leaded) | Yes (N suffix) |
| Typical Unit Price (1 pc) | USD 1,450 | USD 1,450 (similar, as of 2026-09-07) | USD 1,200-1,300 (as of 2026-09-07) | USD 800-950 (as of 2026-09-07) | USD 800-950 (as of 2026-09-07) | USD 700-850 (as of 2026-09-07) |
主な差別化要因
- Highest logic density in Stratix I 1020-BGA family （vs EP1S25F1020C5N)
- C5 speed grade is the fastest Stratix I grade offered （vs EP1S30F1020C6N)
- Lead-free 'N' suffix for RoHS designs （vs EP1S30F1020C5)
設計ノート
Estimated: at 500 MHz internal operation with 50% toggle rate on 32K LE plus 100 LVDS I/O at 200 MHz, the EP1S30F1020C5N typically draws 1.5-2.5 A from the 1.5 V VCCINT rail. Designers must use a low-impedance buck regulator with output voltage accuracy within +/-3% and place decoupling within 5 mm of each VCCINT ball. VCCIO banks must be sequenced AFTER VCCINT per Altera's Stratix power-up requirements.
Estimated: at the worst-case load above and 85 C ambient, junction temperature can approach 110-120 C on the standard FC-FBGA-1020 thermal pad. Use a minimum 6-layer PCB with a continuous inner ground/power plane stitching under the BGA, and connect the center thermal balls through 0.3 mm via-in-pad arrays to internal copper. If the design exceeds 100 C junction, add a heatsink or forced-air cooling.
The 1020-ball FC-FBGA uses 1.0 mm pitch, which requires 0.4-0.5 mm escape traces with 0.2 mm laser-drilled microvias. Per Altera's BGA layout guidelines, use a 6-layer stack-up with 1 oz copper on outer layers and 0.5 oz on inner layers. All signal layers should be referenced to an uninterrupted ground plane; a stitched coplanar waveguide pattern around the BGA periphery is required for impedance-controlled LVDS traces.
Estimated: a common mistake is to omit the EPC configuration EPROM and assume JTAG-only boot - if the on-board JTAG header is unpopulated in production, the board cannot boot. The EP1S30F1020C5N requires MSEL pin settings to select AS, PS, or JTAG configuration mode; check Altera's Stratix configuration user guide. Also ensure I/O bank voltage (VCCIO) is set before driving signals into a bank to avoid CMOS latch-up.
コンプライアンス情報
EP1S30F1020C5N carries Altera's 'N' suffix indicating lead-free packaging per Altera's Stratix ordering scheme. RoHS, REACH, halogen-free, and conflict-minerals compliance statements are not present in the Verified Web Data; they must be confirmed against the original manufacturer documentation before qualifying for restricted-substance programs. AEC-Q100 is not applicable - this is a Stratix I FPGA, not an automotive-grade IC.