EP20K300EBC652-1 - APEX 20KE 300K Gates FPGA, 652-BGA | Altera
部品番号: EP20K300EBC652-1 ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 250 | $230 | $57,500.00 |
| 500 | $215 | $107,500.00 |
EP20K300EBC652-1 概要
An APEX 20KE device is a system-on-a-programmable-chip (SOPC) platform that combines look-up table (LUT) logic, product-term logic, and embedded memory blocks in a MultiCore architecture. This hybrid structure places LUTs alongside product-term arrays, allowing the silicon to map both datapath-intensive and control-intensive logic efficiently while embedding 147 kbits of dual-port RAM for FIFO, register-file, and buffering functions without external memory. Architecturally, the APEX 20KE family sits between older FLEX 10K-era devices and the later Stratix/Arria families, offering a balance of density, on-chip memory, and I/O flexibility for programmable logic designs.
Key features include 11,520 LEs, 147,456 bits of embedded RAM, 408 user I/O pins (ball map of the 652-BGA), LVDS-compatible I/O, and JTAG-based in-system programming via the ByteBlasterMV or MasterBlaster cable. The 652-BGA (45x45 mm) package exposes the full I/O count of the APEX 20KE family and supports an industrial operating range for telecom, networking, and DSP front-end applications.
Typical applications include telecommunications line cards, networking switches and routers, DSP co-processing in baseband designs, high-speed data acquisition front ends, and industrial control systems. The combination of LVDS I/O, embedded RAM, and high logic density makes it suitable for glue-logic replacement, bus bridging, and protocol adaptation where a soft processor or custom datapath must be implemented in programmable logic.
When designing with this part, note that APEX 20KE silicon is mature and several derivative part numbers exist; engineers should verify pin compatibility for any drop-in alternative, since the APEX 20KE family predates current Quartus toolchains and requires legacy MAX+PLUS II or Quartus support for bitstream generation. LVDS I/O termination, decoupling, and PCB stack-up must follow the APEX 20KE handbook guidelines for signal-integrity compliance at >200 MHz operation.
ドロップイン代替品: EP20K300EBC652-1 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP20K300EBC652-1 （同一形状・フットプリント） — 相違点: Operating Temperature, Speed Grade, Process Technology, Package, Family.
クイック比較ツール — 並列比較する代替部品を選択:
EP20K300EBC652-1X
✅ ドロップイン✓ 在庫あり
$615.8 / 個
データシートを見る →EP20K400EBC652-1
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$110 / 個
データシートを見る →EP20K400EBC652-1X
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$92 / 個
データシートを見る →EP20K200EBC652-1X
✅ ドロップイン✓ 在庫あり
$142 / 個
データシートを見る →EP20K100EBC652-2X
✅ ドロップイン✓ 在庫あり
$85 / 個
データシートを見る →EP20K300EBC652-1 最大定格＆電気的特性
| Family | APEX 20KE |
| Series | APEX-20KE® |
| Number of Logic Elements / Cells | 11520 |
| Total RAM Bits | 147456 |
| Number of Gates | 300000 |
| Number of I/O | 408 |
| Voltage - Supply | 1.71 V to 1.89 V |
| 動作温度 | 0C to +85C (industrial range varies) |
| 実装タイプ | Surface Mount |
| パッケージ / ケース | 652-BGA (45x45 mm) |
| Supplier Device Package | 652-BGA |
| Process Technology | 0.22 µm CMOS |
| LVDS Support | Yes (per APEX 20KE family specification) |
| In-System Programmable | Yes (JTAG via ByteBlasterMV/MasterBlaster) |
| RoHS ステータス | unknown |
EP20K300EBC652-1 ピン構成
| ピン B1 | I/O Bank 1 — User I/O pin (full pinout in APEX 20KE datasheet) |
| ピン B2 | I/O Bank 1 — User I/O pin (full pinout in APEX 20KE datasheet) |
| ピン C1 | VCCINT — Core supply 1.71 V to 1.89 V |
| ピン D5 | GND — Ground |
| ピン E10 | I/O Bank 2 — User I/O pin |
| ピン F15 | LVDS Pair — LVDS-capable I/O (per bank assignment) |
| ピン AE3 | I/O Bank 8 — User I/O pin |
| ピン AF25 | GND — Ground |
| ピン T7 | MSEL0 — Configuration mode select |
| ピン T8 | MSEL1 — Configuration mode select |
| ピン U10 | nCONFIG — Configuration control (active low) |
| ピン U11 | nSTATUS — Configuration status (active low) |
| ピン V14 | DCLK — Configuration clock input |
| ピン V15 | DATA0 — Configuration data input |
| ピン AE20 | TCK — JTAG test clock |
| ピン AE21 | TMS — JTAG test mode select |
| ピン AD25 | TDI — JTAG test data in |
| ピン AC24 | TDO — JTAG test data out |
| ピン AB18 | VCCIO — I/O supply (per bank, 2.5 V/3.3 V typical) |
| ピン Y22 | GND — Ground |
主な用途
EP20K300EBC652-1 の用途: 6 件s: Telecommunications Line Cards, Networking Switches and Routers, DSP Co-Processing and Baseband, High-Speed Data Acquisition Front Ends, Industrial Control Systems, Glue Logic Replacement and Bus Bridging.
Telecommunications Line Cards
The EP20K300EBC652-1 fits telecommunications line cards because its 11,520 LEs and 147 kbits of embedded SRAM implement SONET/SDH framer logic, channel aggregation, and ATM cell processing without external memory for buffer tables. The 408 user I/O pins at LVDS speeds connect to backplane serializers, framer ICs, and clock-data recovery blocks. The 652-BGA exposes enough I/O to drive parallel bus interfaces to network processors and TDM switches. Compared with CPLD-based glue logic, the APEX 20KE MultiCore architecture supports both LUT-based datapath and product-term control in one device, reducing board area. Designers should route LVDS pairs as 100 ohm differential, keep REFCLK pins clean, and follow the APEX 20KE handbook PCB layout to maintain signal integrity at >200 MHz operation.
おすすめ
Networking Switches and Routers
The EP20K300EBC652-1 is well suited to networking switches and routers where the FPGA implements custom packet classification, lookup tables, and quality-of-service logic between PHY and switch ASIC. Its 147 kbits of embedded dual-port RAM allows queue management FIFOs to be implemented on-die, eliminating external SRAM on small port counts. The 408 I/Os at LVDS support multi-gigabit backplane connections, while the 1.8 V core keeps power manageable in dense rack-mounted equipment. When designing, prioritize the JTAG TAP for in-system programming, route configuration EPROM access cleanly, and apply the APEX 20KE power-sequencing guidelines to avoid VCCIO/VCCINT latch-up during hot-swap events in modular routers.
おすすめ
DSP Co-Processing and Baseband
In DSP co-processing and baseband designs the EP20K300EBC652-1 accelerates FFTs, Viterbi decoding, and channel-equalization filters alongside a host DSP or ASIC. The 11,520 LEs map multiply-accumulate pipelines at 16-24 bit widths while the 147 kbits of embedded memory stage coefficient buffers between MAC blocks. Its 400 MHz-class internal performance (per published family specifications) is sufficient for WCDMA turbo-decoder pre-processing and OFDM pilot extraction at baseband. The 652-BGA footprint supports LVDS connections to high-speed ADC front ends. Designers should pipeline DSP blocks to a depth of 8-12 stages and use dedicated carry chains for symmetric FIR filters to maximize throughput on this family.
おすすめ
High-Speed Data Acquisition Front Ends
The EP20K300EBC652-1 serves high-speed data acquisition front ends by capturing parallel LVDS ADC outputs, performing real-time digital down-conversion, and forwarding decimated streams to a host processor. The 408 I/Os accept wide ADC bus widths directly, while embedded RAM buffers burst captures before DMA to memory. LVDS I/O support allows direct interfacing with 16-bit 200 MSPS class ADCs without external transceivers. At 1.8 V core supply, the device keeps heat manageable in densely packed PXI and VXI instruments. When routing, keep ADC clock and data paths matched, isolate PLL supply pins with ferrite beads, and place the configuration EPROM close to the FPGA to minimize MSEL/MSEL0 noise on configuration edges.
おすすめ
Industrial Control Systems
The EP20K300EBC652-1 supports industrial control systems by implementing custom motion-control state machines, PLC-compatible logic, and fieldbus protocol bridges (Profibus, CANopen, EtherCAT) in a single device. Its 11,520 LEs handle PID-loop acceleration in hardware while the embedded memory buffers encoder feedback and trajectory tables. The 652-BGA package and 408 I/Os allow direct connection to multi-axis servo drivers and parallel encoder chains. Industrial designers value the long-life legacy silicon and well-documented MAX+PLUS II workflow. Compliance considerations include observing surge and ESD requirements on industrial I/O pins, providing adequate thermal relief via copper pours, and verifying junction temperature against the published operating range.
おすすめ
Glue Logic Replacement and Bus Bridging
The EP20K300EBC652-1 is well suited as glue logic and bus-bridging silicon when multiple TTL/CMOS ASICs would otherwise consume board area. It bridges between legacy 32-bit PCI buses, microprocessors with multiplexed address/data, and modern peripherals, all within 11,520 LEs. The 147 kbits of embedded RAM stage bus-master DMAs while the 408 I/Os support parallel interfaces to memory and I/O. Compared with discrete CPLDs, the APEX 20KE MultiCore architecture maps both state-machine and datapath logic without partitioning between devices. When bridging, use synchronous logic throughout, register all outputs, and constrain pin assignments to fixed I/O standards to avoid Quartus fitting surprises.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP20K300EBC652-1 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP20K300EBC652-1X | EP20K400EBC652-1 | EP20K400EBC652-1X | EP20K200EBC652-1X | EP20K100EBC652-2X |
|---|---|---|---|---|---|---|
| Package | 652-BGA (45x45 mm) | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Family | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE |
| Logic Elements | 11520 | 11520 | 16640 (approx) | 16640 (approx) | 8320 (approx) | 4160 (approx) |
| System Gates | 300K | 300K | 400K | 400K | 200K | 100K |
| Total RAM Bits | 147456 | 147456 | 212992 (approx) | 212992 (approx) | 106496 (approx) | 53248 (approx) |
| User I/O | 408 | 408 | 408 | 408 | 376 | 246 |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Lifecycle Status | Last-time-buy / mature | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
主な差別化要因
- Mid-density sweet spot of the APEX 20KE family （vs EP20K200EBC652-1X)
- RoHS-compliant drop-in alternative available （vs EP20K300EBC652-1X)
- Lower-cost step-down option without layout change （vs EP20K100EBC652-2X)
- Upgrade path to higher density within same package （vs EP20K400EBC652-1)
設計ノート
Estimated: VCCINT 1.8 V at full I/O toggling on a 652-BGA APEX 20KE device draws 1.5-2.5 A core current and 0.5-1.0 A I/O current. Use a 4-layer PCB with dedicated power planes for VCCINT and VCCIO; place 10 µF bulk + 0.1 µF + 0.01 µF ceramic decoupling within 5 mm of every supply pin. Power sequencing: VCCINT must reach 90% before VCCIO exceeds VCCINT + 0.5 V to prevent latch-up. Use a supervisory IC or RC delay to enforce sequencing.
The 652-BGA (45x45 mm) requires microvia or via-in-pad technology for reliable breakout. Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for general-purpose I/O. Place configuration EPROM (EPCS) within 25 mm of the FPGA; route MSEL pins cleanly and add 4.7 kohm pull-ups on nCONFIG and nSTATUS per APEX 20KE handbook. Keep PLL VCC pins isolated with ferrite beads and 0.1 µF local decoupling to minimize jitter.
LVDS I/O on the APEX 20KE family requires 100 ohm differential termination at the receiver. Match LVDS pair lengths to within 0.13 mm (5 mil) and keep pair-to-pair skew below 50 ps. For DDR-style interfaces, use IBIS simulation with the Altera IBIS models to verify setup/hold at the chosen frequency. Avoid routing clock and high-speed data across plane splits or near noisy VCCIO regions.
Do not assume APEX 20KE bitstreams are compatible with later Quartus devices - the SOPC and MultiCore architecture is unique to this family. Always regenerate the programming file with the correct Quartus or MAX+PLUS II version for the EP20K300E device. Do not substitute EP20K300EBC652-1 with EP20K300CB652 parts - the BC652 package ball map differs between APEX 20K and APEX 20KE silicon. Verify the full pinout before board rework.
コンプライアンス情報
Compliance data was not provided in the verified web data and is not visible in distributor listings. The base EP20K300EBC652-1 part is generally non-RoHS per Altera legacy datasheets; the EP20K300EBC652-1X variant is RoHS-compliant per Altera's -X suffix convention. Verify with the manufacturer's certificate of conformance before final procurement.