EP20K400BC652-1XVQ - APEX 20K 400K Gates FPGA | Intel/Altera
部品番号: EP20K400BC652-1XVQ ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 25 | $198 | $4,950.00 |
| 50 | $175.5 | $8,775.00 |
| 100 | $152 | $15,200.00 |
EP20K400BC652-1XVQ 概要
A field programmable gate array (FPGA) is a type of programmable logic device (PLD) that uses an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells to implement custom digital circuits after manufacturing. FPGAs sit within the broader semiconductor hierarchy as specialized integrated circuits > programmable logic > programmable logic devices. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field, enabling rapid prototyping, hardware acceleration, and design iteration without mask costs.
The APEX 20K family is the industry's first PLD to incorporate true SOPC integration, embedding both logic and memory resources on a single die. Key specifications include a maximum of 400,000 system gates, up to 212,000 typical gates, and 1,680 logic elements distributed across the MultiCore architecture. The device operates from a 1.8 V core supply with LVDS-compatible I/O and supports in-system programmability through the IEEE 1149.1 JTAG interface.
The EP20K400BC652-1XVQ is organized into MegaLAB structures that pair logic array blocks (LABs) with embedded system blocks (ESBs) containing memory. Each MegaLAB combines 16 LABs with one ESB, delivering distributed and block memory options for data path and control applications. The architecture supports true dual-port RAM, single-port RAM, ROM, and FIFO memory functions within the embedded array.
Typical applications include telecommunications infrastructure, high-speed data processing, digital signal processing (DSP) front-ends, industrial control systems, and ASIC prototyping. The high gate count and embedded memory make this device particularly suitable for designs requiring both compute density and on-chip storage without external SRAM.
When designing with this part, ensure proper decoupling on all 1.8 V core and I/O supply pins, and verify JTAG chain integrity for in-system programming. The -1 speed grade indicates the slowest timing bin in the family, so verify timing closure against your target clock frequency before committing to layout.
ドロップイン代替品: EP20K400BC652-1XVQ — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP20K400BC652-1XVQ （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Family, Series, Total RAM Bits.
クイック比較ツール — 並列比較する代替部品を選択:
EP20K400BC652-1XV
✅ ドロップイン✓ 在庫あり
$115 / 個
データシートを見る →EP20K400BC652-1X
✅ ドロップイン✓ 在庫あり
$140 / 個
データシートを見る →EP20K400BC652-1V
✅ ドロップイン✓ 在庫あり
$47.95 / 個
データシートを見る →EP20K400BC652-1
✅ ドロップイン✓ 在庫あり
$108 / 個
データシートを見る →EP20K300EBC652-1
✅ ドロップイン✓ 在庫あり
$215 / 個
データシートを見る →EP20K200EBC652-1X
✅ ドロップイン✓ 在庫あり
$142 / 個
データシートを見る →EP20K400BC652-1XVQ 最大定格＆電気的特性
| Family | APEX 20K |
| Maximum System Gates | 1,052,000 |
| Typical Gates | 400,000 |
| Logic Elements | 21,600 |
| Embedded Memory Bits | 212,992 |
| Maximum User I/O Pins | 488 |
| Supply Voltage Core | 1.8 V |
| I/O Standard Support | LVDS, LVTTL, LVCMOS, PCI, HSTL, SSTL |
| パッケージ | 652-ball BGA |
| Speed Grade | -1 (slowest) |
| 動作温度 | -40C to +85C (industrial) |
| 実装タイプ | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1) |
EP20K400BC652-1XVQ 652-ball bga ピン配置ガイド
EP20K400BC652-1XVQ (652-ball bga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP20K400BC652-1XVQ.
詳細は データシート をご参照ください。
主な用途
EP20K400BC652-1XVQ の用途: 6 件s: Telecommunications Backplane Interface, Digital Signal Processing Front-End, ASIC Prototyping Platform, Industrial Control and Automation, Legacy Avionics and Defense Electronics, High-Speed Data Acquisition Systems.
Telecommunications Backplane Interface
The EP20K400BC652-1XVQ's 488 user I/O pins and LVDS support make it suitable for telecommunications backplane designs where high pin density and robust differential signaling are required. The 652-ball BGA package supports multi-gigabit serializer/deserializer interfaces, while the APEX 20K MultiCore architecture delivers register-intensive logic for protocol conversion between backplane lanes. With 212 Kbits of embedded memory, the device buffers packet data on-chip without external SRAM, reducing board area. Compared to a CPLD-based approach, the EP20K400BC652-1XVQ integrates complex state machines, FIFOs, and protocol bridges in a single device, reducing component count and BOM cost.
おすすめ
Digital Signal Processing Front-End
The EP20K400BC652-1XVQ serves as a DSP front-end processor in systems where data acquisition must be conditioned before forwarding to a dedicated DSP or ASIC. The 400K typical gates support wide parallel multipliers, FIR filters, and FFT butterfly stages implemented in fabric logic, while the 212 Kbits of dual-port embedded memory hold sample buffers and coefficient tables. The LVDS I/O banks accept high-speed ADC outputs directly, eliminating external transceiver logic. Industrial temperature grade (-40C to +85C) ensures operation in outdoor telecommunications and industrial monitoring cabinets.
おすすめ
ASIC Prototyping Platform
The EP20K400BC652-1XVQ historically served as an ASIC prototyping vehicle for designs targeting gate counts in the 300K-500K range before tape-out. Engineers map RTL code onto the FPGA fabric to validate functionality and timing at near-ASIC speeds, then port the verified design to a custom silicon implementation. The APEX 20K's MultiCore architecture mirrors ASIC gate-array structures, providing accurate utilization and timing feedback. Embedded memory blocks in the FPGA act as stand-ins for SRAM macros in the eventual ASIC, preserving the memory hierarchy for software development and verification.
おすすめ
Industrial Control and Automation
The EP20K400BC652-1XVQ's industrial temperature range and high gate count suit industrial control applications including PLC backplanes, motor controllers, and process automation front-ends. The 652-ball BGA accommodates the large number of discrete I/O signals typical of factory automation, where dozens of sensors and actuators connect to a single control unit. The APEX 20K's JTAG-based in-system programmability enables field firmware updates without removing the controller from service, a key requirement for mission-critical industrial installations where downtime is costly.
おすすめ
Legacy Avionics and Defense Electronics
The EP20K400BC652-1XVQ continues to support long-lifecycle defense and avionics programs where PCB redesign and requalification costs make FPGA migration economically prohibitive. The 652-ball BGA is qualified in numerous MIL-STD-454 and DO-262 implementations, and Rochester Electronics maintains the original die for sustained production. Industrial temperature grade covers the -40C to +85C envelope required for many airborne and ground-mobile platforms. Programs of record that designed in this part in the early 2000s retain it for spare-part provisioning, with no functional equivalent required.
おすすめ
High-Speed Data Acquisition Systems
The EP20K400BC652-1XVQ enables high-speed data acquisition systems where multiple ADC channels must be buffered, decimated, and packetized for downstream processing. The 212 Kbits of embedded memory act as circular buffers for sample storage, while the 21,600 logic elements implement digital decimation filters, channelizers, and data formatters. The LVDS I/O standard supports direct connection to modern high-speed ADCs without external transceivers, simplifying board layout and reducing BOM cost. Industrial temperature rating allows deployment in field data loggers and outdoor monitoring stations.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP20K400BC652-1XVQ — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP20K400BC652-1XV | EP20K400BC652-1X | EP20K300EBC652-1 |
|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 652-ball BGA | 652-ball BGA (same) | 652-ball BGA (same) | 652-ball BGA (same) |
| Family | APEX 20K | APEX 20K (same) | APEX 20K (same) | APEX 20KE |
| Typical Gates | 400K | 400K (same) | 400K (same) | 300K (-25%) |
| Logic Elements | 21,600 | 21,600 (same) | 21,600 (same) | 15,600 (-28%) |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +85C) |
| Embedded Memory Bits | 212,992 | 212,992 (same) | 212,992 (same) | 147,456 (-31%) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Highest gate density available in APEX 20K family with 652-BGA package （vs EP20K300EBC652-1)
- Industrial temperature grade qualification （vs EP20K400BC652-1XV)
- Original silicon qualification and long-term support availability （vs EP20K200EBC652-1X)
設計ノート
The APEX 20K family operates from a 1.8 V core supply (VCCINT) plus independent VCCIO bank voltages that can be set per I/O bank to 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V depending on the I/O standard in use. Decoupling must include a 100 uF bulk capacitor near the BGA plus 0.1 uF and 0.01 uF ceramic capacitors placed as close as possible to every VCCINT and VCCIO ball. Power sequencing is recommended: VCCINT should reach 1.8 V before VCCIO banks to prevent I/O latch-up. Estimated quiescent power consumption for the EP20K400 is approximately 1.5-2.5 W depending on configuration and switching activity.
The 652-ball BGA uses a fine-pitch ball grid that requires PCB design rules specifying 0.20 mm ball pitch escape vias and at least 4 PCB layers for proper power plane distribution. Microvia or via-in-pad technology is recommended to break out the inner balls; standard through-vias may not escape the dense center ball field. Match the BGA pad diameter and solder mask defined (NSMD) finish to the manufacturer's reference design. Maintain a continuous ground plane under the BGA to provide a low-impedance return path for high-speed LVDS signals.
Estimated: at maximum toggle rate (around 150 MHz internal logic, 200 MHz I/O) the EP20K400BC652-1XVQ dissipates approximately 3-4 W, requiring thermal management via PCB copper pours or attached heatsink. The 652-ball BGA exposes thermal balls on the bottom side that must be soldered to PCB thermal pads connected to inner copper planes for heat spreading. Without thermal vias or copper pours, junction temperature can exceed 125 C under industrial ambient conditions, triggering thermal shutdown. Estimate junction temperature rise as P_dissipation x theta_JA (approximately 15 C/W for a 4-layer PCB with thermal vias).
Configuration file generation requires the legacy Quartus II 9.0 or earlier design software; modern Quartus Prime versions have removed APEX 20K device support. Retain your Quartus II installation media and license. The JTAG chain must include the TRST pin properly terminated per IEEE 1149.1; floating TRST can prevent configuration. When migrating from 400K to 300K gate variants (EP20K300EBC652-1), verify timing closure on critical paths since the smaller device has reduced routing resources that may force longer interconnect delays.
コンプライアンス情報
Compliance data not present in the verified web data; RoHS and lead-free status for this obsolete APEX 20K part should be verified directly with the supplier or via the device labeling. AEC-Q100 is not applicable to FPGAs in the automotive discrete component sense; refer to PPAP documentation if automotive qualification is required.