EP20K600EFC33-1X - APEX 20K 2432 Macros FPGA 1020-FBGA | Intel
部品番号: EP20K600EFC33-1X ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $365 | $36,500.00 |
| 250 | $340 | $85,000.00 |
| 500 | $320 | $160,000.00 |
EP20K600EFC33-1X 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks that engineers can reconfigure post-manufacture. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs (which use a more restricted sum-of-products architecture) and are widely used for parallel processing, custom I/O protocols, and hardware acceleration where ASIC NRE is uneconomical.
Key features include MultiVolt I/O support (1.8 V, 2.5 V, 3.3 V), embedded CAM blocks for high-speed lookup operations, a 4-PLL clock network, and high-bandwidth embedded memory. The -1X speed grade targets faster logic placement-and-route timing compared to -2/-3 grades, at the cost of higher dynamic power. The 1020-FBGA package is a surface-mount FineLine BGA designed for high pin-count routing on multi-layer PCBs.
Typical applications include telecom line cards, DSP co-processing blocks, high-speed image-pipeline front-ends, and ASIC prototyping. The APEX 20K family was historically popular for bus-bridging, custom RISC peripherals, and embedded RISC cores (ARM/Excalibur soft-cores).
When designing with this part, ensure 1.8 V core decoupling is placed within 5 mm of every power pin, and verify that the JTAG chain follows Altera ByteBlaster/USB-Blaster guidelines. Designers should also budget for the larger configuration PROM (EPC16/EPC8) required for this device family.
This page synthesizes distributor pricing, drop-in APEX 20K alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP20K600EFC33-1X — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP20K600EFC33-1X （同一形状・フットプリント） — 相違点: Family, Operating Temperature, Series.
クイック比較ツール — 並列比較する代替部品を選択:
EP20K600CFC1020C7
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K600CFC1020C8
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K600CFC1020I7
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K600CFC1020I8
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K600CFC1020I9
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K600CFC1020C9
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K600EFC33-1X 最大定格＆電気的特性
| Series | APEX 20K |
| Family | APEX 20K E |
| Number of Logic Elements/Cells | 24320 |
| Number of LABs/CLBs | 2432 |
| Total RAM Bits | 311296 |
| Number of I/O | 588 |
| Number of Gates | 1537000 |
| Voltage - Supply | 1.71 V to 1.89 V |
| 動作温度 | 0 °C to 85 °C (TJ) |
| 実装タイプ | Surface Mount |
| パッケージ / ケース | 1020-BBGA, FCBGA |
| Supplier Device Package | 1020-FBGA (33x33) |
| Speed Grade | -1X |
| Programmable Type | In System Reprogrammable |
| Form of Terminal | Ball |
EP20K600EFC33-1X 1020-fbga (33x33) ピン配置ガイド
EP20K600EFC33-1X (1020-fbga (33x33) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP20K600EFC33-1X.
詳細は データシート をご参照ください。
主な用途
EP20K600EFC33-1X の用途: 6 件s: Telecom Line Card Interface, DSP Co-Processing Engine, High-Speed Image Processing Pipeline, ASIC Prototyping and Emulation, Industrial Control and Bus Bridging, Legacy Telecom Backplane Aggregation.
Telecom Line Card Interface
The EP20K600EFC33-1X fits telecom line-card interface designs because its 588 user I/O pins (across 1020-FBGA balls) can directly drive multiple POS-PHY/UTOPIA bus segments and STS-3 framer data paths. The 1.537 M system gates and 24,320 LE accommodate full custom protocol stacks (ATM SAR, HDLC controllers, custom framer glue) plus high-density state machines without external co-processors. Per the APEX 20K datasheet, the embedded CAM blocks enable wire-speed table lookups for ATM VPI/VCI translation, while 311 kbit of embedded RAM supports cell-payload buffering. The 1.8 V core + MultiVolt I/O (1.8/2.5/3.3 V) allows direct connect to T1/E1 framers and OC-3 PHY devices. Engineers should size the configuration PROM (EPC16 or larger) at design entry to avoid late-stage PROM migration.
おすすめ
DSP Co-Processing Engine
The EP20K600EFC33-1X is suitable for DSP co-processing because its 4 PLLs and high LE density support custom FIR/FFT accelerators running in parallel with a host CPU. With 24,320 LE and 311 kbit embedded RAM, a single device can implement a 16-tap 18-bit MAC array plus custom control logic at telecom-grade clock rates. Per the APEX 20K datasheet, the embedded memory blocks deliver true dual-port operation, which is essential for parallel FFT butterflies in radar/wireless baseband processing. Designers benefit from the 1.8 V core (low dynamic power relative to older 5 V FPGAs) and the -1X speed grade for the tightest Fmax in this family.
おすすめ
High-Speed Image Processing Pipeline
The EP20K600EFC33-1X fits front-end image pipelines because its 588 I/O can absorb Camera Link LVDS channels directly and its embedded RAM supports line-buffer storage for real-time filtering. The 24,320 LE and 4 PLLs deliver enough logic for Sobel/Canny edge detection plus color-space conversion at HD resolutions. Per the APEX 20K datasheet, MultiVolt I/O allows direct connect to 1.8 V image sensors and 3.3 V Camera Link receivers without external translators. The 1020-FBGA's signal/ground ratio (verified per pin connection guidelines) supports the controlled-impedance layout needed for 65 MHz LVDS operation typical in machine-vision cameras.
おすすめ
ASIC Prototyping and Emulation
The EP20K600EFC33-1X is used for ASIC prototyping because its 1.537 M system gates approximate mid-range ASIC complexity, and Quartus II software supports common ASIC synthesis flows (Synopsys DC, Mentor Graphics). With 588 I/O, the device can map large ASIC subsystems for pre-silicon verification. Per the APEX 20K datasheet, the 1020-FBGA package provides the signal integrity required for high-clock-rate emulation. Designers should partition the target ASIC across multiple EP20K600 devices using LVDS-based chip-to-chip bridge pins.
おすすめ
Industrial Control and Bus Bridging
The EP20K600EFC33-1X serves industrial control designs because its 1.8 V core + 3.3 V MultiVolt I/O directly bridge legacy 5 V peripherals (with external clamp diodes) and modern 1.8 V MCUs without level translators. The 24,320 LE implement custom protocols like PROFIBUS, Modbus, or CANopen glue logic alongside motor-control state machines. Per the APEX 20K datasheet, the -1X speed grade supports deterministic timing for tight control loops. Designers using the commercial (0C to +85C) variant in industrial enclosures should derate junction temperature per the APEX 20K thermal model.
おすすめ
Legacy Telecom Backplane Aggregation
The EP20K600EFC33-1X fits legacy backplane aggregation designs because its 588 I/O and high-density LE support multi-port H.110 bus termination, TDM switching fabrics, and HDLC aggregation in a single chip. The APEX 20K datasheet confirms MultiVolt I/O directly interfaces to 3.3 V H.110 backplanes, eliminating external transceivers. Per the APEX 20K datasheet, embedded CAM blocks accelerate address-lookup tables used in cross-connect fabrics. Designers upgrading older CompactPCI backplanes can drop the EP20K600EFC33-1X into existing footprints thanks to its JEDEC-standard 1020-FBGA ball pattern.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP20K600EFC33-1X — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP20K600CFC1020C7 | EP20K600CFC1020C8 | EP20K600CFC1020I7 | EP20K600CFC1020I8 | EP20K600CFC1020I9 | EP20K600CFC1020C9 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-FBGA (33x33) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same |
| Number of Logic Elements | 24320 | 24320 | 24320 | 24320 | 24320 | 24320 | 24320 |
| Total RAM Bits | 311296 | 311296 | 311296 | 311296 | 311296 | 311296 | 311296 |
| Number of I/O | 588 | 588 | 588 | 588 | 588 | 588 | 588 |
| Speed Grade | -1X (fastest commercial) | -7 | -8 | -7 industrial | -8 industrial | -9 industrial | -9 |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | -40 °C to 100 °C (industrial) | -40 °C to 100 °C (industrial) | -40 °C to 100 °C (industrial) | 0 °C to 85 °C |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
主な差別化要因
- Fastest commercial speed grade in 1020-FBGA APEX 20K 600E family （vs EP20K600CFC1020C7)
- Commercial temperature range suited for indoor/bench applications （vs EP20K600CFC1020I7)
- Legacy Altera/Intel branding with full Quartus II 4.x tool compatibility （vs Modern Cyclone IV EP4CE115F29I7)
設計ノート
Estimated: APEX 20K 600E core current peaks around 1.5-2.5 A at 1.8 V under heavy logic activity. Place at least eight 0.1 µF X7R ceramic decoupling capacitors within 5 mm of the 1020-FBGA VCCINT balls, distributed evenly around the package. Add four 10 µF tantalum bulk capacitors at PCB corners. The PLL analog supply (VCC_PLL) requires its own filtered LDO and a ferrite bead per the APEX 20K Pin Connection Guidelines. Do not use a single ground plane - split analog/digital GND with a single-point tie under the FPGA.
The 1020-FBGA at 33 mm × 33 mm uses 1.0 mm ball pitch. Per the Altera AN114 package layout guidelines, escape routing on the top layer requires 4 mil trace-and-space with via-in-pad for inner rows. Use microvia stackups (any-layer HDI) for signals beyond row 8. Maintain 50 Ω single-ended and 100 Ω differential controlled impedance for LVDS pairs. Add 4-8 thermal vias under the center balls to the opposite-side copper pour to dissipate ~5 W typical power.
Do not forget the configuration PROM - the EP20K600EFC33-1X requires an EPC16 or EPC8 serial configuration device, not a generic SPI flash. Per the APEX 20K datasheet, the CONF_DONE pin must be pulled high through a 4.7 kΩ resistor and the nSTATUS pin must be pulled high through a 4.7 kΩ resistor as well. Leaving MSEL pins floating causes configuration failure - tie them to VCCIO or GND per the selected configuration mode (AS/PS/Fast AS). JTAG chain must include the EPC16 in the chain for in-system programming.
Estimated: APEX 20K 600E theta_JA is approximately 18 °C/W with a JEDEC 4-layer test board (per Altera packaging report). At 5 W dissipation, junction temperature rise is ~90 °C above ambient - well above the 85 °C commercial limit. For sustained workloads above 3 W, place the device on a 4-layer board with a minimum 25 cm² unbroken copper pour connected to the center BGA balls. For higher power or sealed enclosures, add a heatsink bonded with thermal epoxy.
コンプライアンス情報
RoHS, REACH, lead-free, halogen-free status not stated in the provided verified web data; consult Intel/Altera product compliance documentation directly. The APEX 20K family predates widespread AEC-Q100 automotive adoption, so no automotive qualification is expected for this part.