EP1SGX25FF1020I6N - Stratix GX FPGA, 25K LE, 607 I/O | Altera
部品番号: EP1SGX25FF1020I6N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 50 | $215 | $10,750.00 |
| 100 | $185 | $18,500.00 |
| 500 | $160 | $80,000.00 |
| 1,000 | $145 | $145,000.00 |
EP1SGX25FF1020I6N 概要
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs occupy the middle ground between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (software-defined, lower throughput). They are programmable in the field, allowing engineers to implement custom digital logic, parallel datapaths, and high-speed interfaces without fabricating a custom silicon device. In the broader taxonomy: FPGA -> programmable logic -> digital IC -> semiconductor -> integrated circuit.
Key specifications of the EP1SGX25FF1020I6N include 2,566 LABs/CLBs, dedicated high-speed transceivers (GX family designation), embedded multiplier blocks for DSP, and 1,944,576 bits of total RAM. The device supports up to 607 user I/O across multiple I/O banks supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Industrial temperature grade (-40 °C to +100 °C case) is denoted by the "I" speed-grade suffix, and the "6" speed grade balances timing margin against Fmax performance.
Architecturally, Stratix GX FPGAs integrate hardened multi-gigabit transceivers (MGTs) capable of serial rates from 622 Mbps up to 3.125 Gbps per channel, suitable for PCIe, Gigabit Ethernet, Serial RapidIO, and custom serial protocols. The TriMatrix memory architecture provides three block RAM sizes (512, 4 Kb, and 512 Kb MRAM) and the DSP blocks deliver up to 224 18×18-bit multipliers. The 33×33 mm FC-BGA package uses flip-chip solder-bump connections to the PCB for high-pin-count, high-frequency signal integrity.
Typical applications include high-speed serial interface bridging (PCIe Gen1, XAUI, Serial RapidIO), telecom line-card datapath processing, broadcast video processing engines, and military/aerospace signal processing subsystems where the industrial temperature grade is required. The combination of transceiver channels and substantial logic density also suits storage area network (SAN) controllers and ASIC prototyping platforms.
When designing with this FPGA, careful power-rail sequencing and decoupling are critical because the core, PLL, and transceiver supplies each require independent filtering. Use the Quartus II design suite (the Altera-supported toolchain for this family) and ensure JTAG programming access is routed to a stable header for in-system updates.
This page synthesizes distributor pricing, drop-in Altera/Intel pin-compatible variants, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP1SGX25FF1020I6N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1SGX25FF1020I6N （同一形状・フットプリント） — 相違点: Speed Grade, Operating Temperature, Package, RoHS Status, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP1SGX25FF1020I5N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2050 / 個
データシートを見る →EP1SGX25FF1020I7N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$98.5 / 個
データシートを見る →EP1SGX25FF1020C6N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$160 / 個
データシートを見る →EP1SGX25FF1020C7N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$62.5 / 個
データシートを見る →EP1SGX25FF1020C5N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1580 / 個
データシートを見る →EP1SGX25DF1020I6N
✅ ドロップイン✓ 在庫あり
$165 / 個
データシートを見る →EP1SGX25DF1020I5N
✅ ドロップイン✓ 在庫あり
$985 / 個
データシートを見る →EP1SGX25DF1020I7N
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP1SGX25FF1020I6N 最大定格＆電気的特性
| Manufacturer | Altera (Intel) |
| Series | Stratix GX |
| Family | Stratix GX FPGA |
| Logic Elements (LE) | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| User I/O Count | 607 |
| Supply Voltage - Core | 1.425 V to 1.575 V |
| 動作温度 | -40 °C to +100 °C (Industrial) |
| 実装タイプ | Surface Mount |
| パッケージ / ケース | 1020-BBGA, FCBGA |
| Supplier Device Package | 1020-FBGA (33x33) |
| Speed Grade | 6 |
| Process Node | 0.13 µm |
| Embedded Transceivers | Stratix GX multi-gigabit transceivers (MGTs) |
EP1SGX25FF1020I6N 1020-fbga (33x33) ピン配置ガイド
EP1SGX25FF1020I6N (1020-fbga (33x33) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1SGX25FF1020I6N.
詳細は データシート をご参照ください。
主な用途
EP1SGX25FF1020I6N の用途: 6 件s: High-Speed Serial Interface Bridging, Telecom Line-Card Datapath Processing, Broadcast Video Processing Engines, Military / Aerospace Signal Processing, Storage Area Network (SAN) Controllers, ASIC Prototyping Platforms.
High-Speed Serial Interface Bridging
The EP1SGX25FF1020I6N's hardened Stratix GX multi-gigabit transceivers (MGTs) support serial rates from 622 Mbps up to 3.125 Gbps per channel, making it ideal for bridging protocols such as PCI Express Gen1 (2.5 Gbps), XAUI (3.125 Gbps), Serial RapidIO, and Gigabit Ethernet. The 25,660 logic elements provide ample datapath processing to implement MAC, PCS, and protocol state machines alongside the physical layer. With 607 user I/O and multiple I/O banks, the FPGA can simultaneously drive multiple parallel interfaces (LVDS, LVTTL) while the MGTs handle serial links.
おすすめ
Telecom Line-Card Datapath Processing
The EP1SGX25FF1020I6N delivers 25K logic elements and 1.86 Mbit of TriMatrix embedded RAM, supporting telecom line-card functions such as packet classification, traffic shaping, and QoS scheduling. Its industrial temperature range (-40 °C to +100 °C) enables deployment in outdoor and uncontrolled thermal environments typical of central-office racks. The DSP multiplier blocks (up to 224 18×18-bit multipliers) accelerate FEC, encryption, and DSP front-end processing for wireless base stations.
おすすめ
Broadcast Video Processing Engines
With 607 user I/O and substantial embedded RAM, the EP1SGX25FF1020I6N excels in broadcast video processing where multiple parallel video streams (SDI, DVB-ASI, HDMI) must be muxed, scaled, and processed in real time. The TriMatrix block RAM supports line buffers and frame buffers for video format conversion, while the DSP blocks accelerate chroma keying, scaling filters, and deinterlacing. The 1.5 V core and 1020-FBGA package are typical of high-end video-processing boards.
おすすめ
Military / Aerospace Signal Processing
The industrial temperature grade of the EP1SGX25FF1020I6N (-40 °C to +100 °C) and Altera's heritage in defense/aerospace programs make this FPGA suitable for radar signal processing, electronic warfare subsystems, and avionics datalinks. Its hardened transceivers support ruggedized serial datalinks while the 25K logic capacity handles beamforming, FFT preprocessing, and I/Q demodulation. Conformal coating and BGA under-fill are recommended for shock/vibration environments.
おすすめ
Storage Area Network (SAN) Controllers
The EP1SGX25FF1020I6N's embedded multi-gigabit transceivers combined with 25K logic elements provide the foundation for Fibre Channel and SAS/SATA storage controllers. The device's protocol-rich I/O can simultaneously drive 4 Gbps Fibre Channel links, multiple SATA ports, and management interfaces. Its embedded RAM supports command queuing, scatter-gather DMA descriptors, and parity-check buffering at line-rate.
おすすめ
ASIC Prototyping Platforms
Engineers use the EP1SGX25FF1020I6N on ASIC prototyping platforms because its 25K logic elements, hard transceivers, and high I/O count closely emulate complex ASIC designs before tape-out. Multiple FPGAs can be bridged via the MGTs to partition large ASIC designs across chips. Quartus II's incremental compilation and LogicLock regions enable ASIC-style design partitioning, accelerating prototype bring-up and pre-silicon software development.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1SGX25FF1020I6N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1SGX25FF1020I5N | EP1SGX25FF1020I7N | EP1SGX25FF1020C6N | EP1SGX25DF1020I6N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-FBGA (33x33) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same |
| Logic Elements | 25,660 | 25,660 - same die | 25,660 - same die | 25,660 - same die | 25,660 - same die |
| Speed Grade | 6 | 5 (slower) | 7 (faster) | 6 | 6 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Industrial |
| User I/O Count | 607 | 607 | 607 | 607 | 607 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Embedded Transceivers | Yes (Stratix GX MGTs) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Speed grade 6 offers balanced timing margin for industrial applications （vs EP1SGX25FF1020I5N)
- Industrial temperature grade supports -40C to +100C operation （vs EP1SGX25FF1020C6N)
- FF variant designation with hardened Stratix GX transceivers （vs EP1SGX25DF1020I6N)
設計ノート
The EP1SGX25FF1020I6N requires multiple independent supply rails: VCCINT (1.425-1.575 V core), VCCIO (per-bank, 1.2 V to 3.3 V), VCCA_PLL (1.5 V analog, filtered), and VCCAUX (2.5 V or 3.3 V auxiliary). Implement a controlled power-on sequence (VCCINT first, then VCCIO, then VCCAUX) using a sequencing controller such as the LTC2923 or TI UCD90124 to prevent latch-up. Bulk decoupling of 22 µF polymer + 1 µF ceramic + 0.1 µF ceramic per supply pin is recommended.
The industrial-grade EP1SGX25FF1020I6N is rated for case temperatures up to +100 °C. At 25K LE utilization with active MGTs, typical junction-to-ambient thermal resistance θJA for the 1020-FBGA package on a JEDEC 4-layer test board is approximately 12-15 °C/W. Estimated: at 5 W total power dissipation, junction temperature rise above ambient is 60-75 °C, leaving 25-40 °C margin at 100 °C case. For sealed enclosures, derate by 30% or add a heatsink with thermal interface material.
The 1020-FBGA 33×33 mm package uses 1.0 mm pitch solder balls. PCB design must follow JEDEC MS-034 for flip-chip BGA land pattern and solder mask defined (SMD) pads are recommended over non-solder mask defined (NSMD) for higher assembly yield. Use microvia-in-pad technology (0.1 mm laser vias) under center balls for breakout routing. Maintain differential pair length matching within 5 mils for MGT serial links and route each differential pair on a single layer with reference ground planes on adjacent layers.
Do not use the JTAG pins (TCK, TMS, TDI, TDO) as general-purpose I/O after configuration - they revert to JTAG mode whenever nCONFIG goes low, causing in-system reprogramming issues. Do not apply 3.3 V to a 2.5 V or 1.8 V VCCIO bank without level-shifting buffers. Verify all I/O bank voltages before connecting peripheral devices, and never mix 5 V tolerant and non-5 V tolerant I/O standards on the same bank.
Isolate MGT transceiver analog power and grounds from digital I/O regions using a split-plane or guarded layout. Place MGT decoupling capacitors as close to their respective VCCMGT and GND pins as possible (≤100 mils). For 3.125 Gbps signals, maintain 50 Ω single-ended or 100 Ω differential controlled impedance with 6-8 mil trace width on standard FR-4 stack-ups, and avoid 90-degree bends - use 45-degree or curved traces only.
コンプライアンス情報
RoHS/REACH compliance not confirmed from the provided search snippets; refer to original Altera product declaration. The device is industrial temperature grade but not AEC-Q100 qualified (FPGA, not a discrete automotive IC).