EP3SL70F780I4G - Stratix III L FPGA 67.5K LE, 488 I/O, 780-FBGA
部品番号: EP3SL70F780I4G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1540 | $154,000.00 |
| 250 | $1455 | $363,750.00 |
EP3SL70F780I4G 概要
A Field Programmable Gate Array (FPGA) is a programmable logic device that uses an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a position in the system hierarchy between discrete logic/microcontrollers and ASICs: they offer far higher parallelism and throughput than a microcontroller, and far lower non-recurring engineering (NRE) cost than an ASIC. The Stratix III L variant is optimized for low static and dynamic power versus the standard Stratix III family, allowing denser boards without exceeding thermal envelopes.
Key features of the EP3SL70F780I4G include the 780-ball FineLine BGA package supporting 488 user I/Os, 67,500 logic elements, 2,699,264 embedded memory bits, a core architecture built on TSMC's 40nm process, and industrial-grade operation. The 780-FBGA FineLine BGA footprint enables vertical migration across Stratix III L densities within the same package outline, simplifying PCB reuse between EP3SL50, EP3SL70, and EP3SL110 devices.
Typical applications include high-performance DSP co-processing, ASIC prototyping, video broadcast infrastructure, software-defined radio front-ends, and high-speed serial protocol bridging. The high logic-element count combined with embedded memory and DSP blocks makes it well suited to parallel filter banks, FFT pipelines, and multi-channel baseband processing.
When designing with this device, allocate FPGA I/O banks to voltage domains before pin assignment, and follow Intel/Altera's decoupling and PCB stack-up guidelines for the 780-FBGA package. Vertical migration within the 780-pin package allows board reuse across EP3SL50/EP3SL70/EP3SL110 densities without PCB rework, reducing platform cost. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP3SL70F780I4G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SL70F780I4G （同一形状・フットプリント） — 相違点: Package, Logic Elements, Speed Grade, Embedded Memory, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SL70F780I4
✅ ドロップイン✓ 在庫あり
$1850 / 個
データシートを見る →EP3SL70F780I3G
✅ ドロップイン✓ 在庫あり
$990 / 個
データシートを見る →EP3SL70F780C4G
✅ ドロップイン✓ 在庫あり
$835 / 個
データシートを見る →EP3SL50F780I4G
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP3SL110F780I4G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3SE80F780I4N
✅ ドロップイン✓ 在庫あり
$3400 / 個
データシートを見る →EP3SE50F780I4G
✅ ドロップイン✓ 在庫あり
$1320 / 個
データシートを見る →EP3SL70F780I4G 最大定格＆電気的特性
| Family | Stratix III L |
| Series | EP3SL70 |
| Logic Elements | 67,500 |
| Embedded Memory Bits | 2,699,264 |
| User I/O Count | 488 |
| パッケージ | 780-ball FineLine BGA (FBGA) |
| 実装タイプ | Surface Mount (BGA) |
| 動作温度範囲 | -40C to +100C (Industrial) |
| Speed Grade | I4 (Industrial, mid-speed) |
| Process Technology | TSMC 40 nm |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| MSLレベル | 3 (168 hours) |
EP3SL70F780I4G 780-ball fineline bga (fbga) ピン配置ガイド
EP3SL70F780I4G (780-ball fineline bga (fbga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SL70F780I4G.
詳細は データシート をご参照ください。
主な用途
EP3SL70F780I4G の用途: 6 件s: High-Performance DSP Co-Processing, ASIC Prototyping and Emulation, Video Broadcast Infrastructure, Software-Defined Radio (SDR) Front-End, High-Speed Serial Protocol Bridging, Industrial Test & Measurement Equipment.
High-Performance DSP Co-Processing
The EP3SL70F780I4G's 67,500 logic elements combined with embedded DSP blocks and 2,699,264 bits of block RAM make it a strong fit for DSP co-processing engines. In radar and telecom baseband designs, the device hosts multi-channel FFT pipelines, FIR filter banks, and digital down-converters operating at hundreds of MSPS. The 780-FBGA package's 488 user I/Os provide ample parallel LVDS/CMOS interconnect to companion ADC and DAC devices, while the 40 nm Stratix III L process keeps dynamic power lower than the standard Stratix III family.
おすすめ
ASIC Prototyping and Emulation
The EP3SL70F780I4G is widely deployed as a single-FPGA or multi-FPGA ASIC prototyping vehicle. Its 67,500 LEs, abundant block RAM, and Quartus II/III design flow allow engineers to map moderate ASIC netlists directly into the device with minimal partitioning. Industrial-grade temperature support (-40C to +100C) means the same board can be used for lab bring-up and field trials. The 780-FBGA FineLine BGA footprint is shared with EP3SL50 and EP3SL110, enabling density scaling without board rework.
おすすめ
Video Broadcast Infrastructure
Broadcast video routers, multi-format converters, and SDI-over-IP bridges benefit from the EP3SL70F780I4G's parallel processing capability and high I/O count. The 488 user I/Os support multiple SDI/HDMI/SMPTE 2022 streams in parallel, while the embedded memory buffers multiple video frames simultaneously. The I4 industrial speed grade offers the timing margin needed for long-trace FR4 backplanes, and the 780-FBGA's thermal envelope accommodates sustained broadcast workloads with standard airflow.
おすすめ
Software-Defined Radio (SDR) Front-End
Software-defined radio platforms place the EP3SL70F780I4G between wideband ADCs and host processors to perform channelization, decimation, and modulation/demodulation. The 67,500 LEs and dedicated DSP blocks enable parallel polyphase filter banks and digital up/down conversion at sample rates above 100 MSPS. The industrial temperature grade and 780-FBGA package suit outdoor base-station and military SDR deployments where vibration and thermal stress are routine.
おすすめ
High-Speed Serial Protocol Bridging
The EP3SL70F780I4G can act as a custom protocol bridge between PCIe, Serial RapidIO, SATA, and 10G Ethernet domains in telecom and storage equipment. Its combination of general-purpose I/Os, embedded transceivers, and block RAM provides the elasticity to manage multiple lane widths and packet sizes. Industrial-grade operation permits deployment in telco central offices and edge-node enclosures.
おすすめ
Industrial Test & Measurement Equipment
Modular oscilloscope, logic analyzer, and protocol exerciser platforms use the EP3SL70F780I4G to manage high-speed acquisition channels and pattern generation. Its 488 user I/Os support wide parallel front-ends, while the embedded memory buffers deep captures before offload to a host processor. The -40C to +100C industrial range suits factory-floor and field-test deployment where temperature extremes are routine.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SL70F780I4G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SL70F780I4 | EP3SL70F780I3G | EP3SL70F780C4G | EP3SL50F780I4G | EP3SL110F780I4G |
|---|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 67,500 | 67,500 | 67,500 | 47,500 (-30%) | 107,500 (+59%) | 79,500 (+18% Stratix III E) |
| Speed Grade | I4 (Industrial) | I4 (Industrial) | I3 (Industrial, faster) | C4 (Commercial) | I4 (Industrial) | I4 (Industrial) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 | 2,214,144 (-18%) | 4,097,664 (+52%) | 3,153,408 (+17%) | |
| User I/Os | 488 | 488 | 488 (same package) | 488 (same package) | ||
| Family Variant | Stratix III L (low power) | Stratix III L | Stratix III E (enhanced DSP/memory) | Stratix III E |
主な差別化要因
- Vertical migration path within 780-FBGA （vs EP3SL50F780I4G)
- Higher LE count than Stratix III E entry-level （vs EP3SE50F780I4G)
- Industrial-grade speed grade at full density （vs EP3SL70F780C4G)
設計ノート
The 780-ball FineLine BGA has a relatively small die-to-package ratio, so for sustained high-utilization workloads (>70% LE toggle rate, hot climate, sealed enclosure) design with a thermal pad and per-ball ground/power via array. Use Intel/Altera's thermal model for Stratix III L to estimate theta_JA against your PCB stack-up. Forced airflow of 200-300 LFM is recommended for industrial-grade continuous operation at full I/O utilization.
Use the Stratix III Device Family Overview (stx3_siii51001) as the authoritative reference for the 780-FBGA ball map and recommended PCB stack-up. Decoupling requirements call for multiple bulk capacitors and a dense network of 0402/0201 ceramics under the device's power rails; place them on the bottom side of the PCB if BGA breakout density forces routing on the top. Maintain solid reference planes beneath all high-speed signal traces.
Take advantage of vertical migration across the 780-FBGA: route the board once and populate EP3SL50, EP3SL70, or EP3SL110 based on capacity needs. Verify dedicated-pin, configuration-pin, and power-pin compatibility across all SKUs in your BOM. Pin-swappable I/O banks must be assigned to the same voltage domain across all target devices, otherwise bank re-assignment is required.
Do not mix Stratix III L and Stratix III E SKUs on the same board without re-validating timing closure and IP support - although they share the same 780-FBGA footprint, the E variant has enhanced DSP/memory resources that may change Quartus fitter results. Always cross-check Quartus pin assignment files before tape-out and confirm the chosen speed grade (I4/I3/C4) meets timing across all corners before committing to a build.
コンプライアンス情報
RoHS and lead-free compliance from Intel/Altera product page. AEC-Q100 is not applicable to FPGAs; automotive applications should use AEC-Q100-qualified parts. Halogen-free status not stated in provided data.
