EP2AGX190EF29I5G - Arria II GX FPGA 181K LE | Intel | 780-FBGA
料号： EP2AGX190EF29I5G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2463.09 | $2,463.09 |
| 10 | $2350 | $23,500.00 |
| 100 | $2180 | $218,000.00 |
| 250 | $2050 | $512,500.00 |
| 500 | $1900 | $950,000.00 |
EP2AGX190EF29I5G 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at silicon fab time. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are commonly used to prototype ASICs, accelerate parallel workloads, and implement custom I/O protocols. Arria II GX specifically targets mid-range applications that require integrated multi-gigabit transceivers (up to 6.375 Gbps) and moderate logic density, sitting between the lower-cost Cyclone family and the high-end Stratix family in Intel's FPGA portfolio.
Key features of the EP2AGX190EF29I5G include integrated transceivers supporting PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and multiple CPRI/OBSAI data rates; dedicated on-chip memory blocks (M9K/M144K); embedded DSP blocks for high-performance fixed- and floating-point arithmetic; and 8-input adaptive logic modules (ALMs) that pack twice the effective logic of prior 4-input LUT architectures. The device also includes hard memory controllers, PLLs, and dynamic reconfiguration support.
The Arria II GX architecture combines a logic fabric with hard intellectual-property (IP) blocks such as transceivers, PCIe hard IP, and external memory interfaces. This integration reduces logic overhead typically spent serializing/deserializing data, freeing ALMs for application code while delivering deterministic latency across all six transceiver channels at line rates up to 6.375 Gbps.
Typical applications include wireless baseband processing, broadcast video infrastructure, military secure communications, high-performance DSP for radar/sonar, PCIe Gen2 endpoint/root-port cards, and high-speed serial protocol bridging. The 780-pin FC-FBGA package supports the transceiver channels, 372 user I/Os, and high-density power/ground distribution needed for industrial and defense-grade designs.
When designing with this device, plan power distribution carefully: the 0.9 V core rail can draw tens of amperes under full fabric and transceiver utilization, requiring multi-layer PCB stack-up, low-impedance planes, and bulk decoupling near each transceiver bank. Quartus II software (the legacy IDE) or Intel Quartus Prime is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor stock and pricing, Arria II GX drop-in alternatives in the same 780-FBGA package, and practical PCB power/thermal design notes that go beyond the manufacturer datasheet.
直接替换替代料： EP2AGX190EF29I5G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGX190EF29I5G （相同外形与封装尺寸） ——差异在于 Package, Family, Operating Temperature, Speed Grade, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP2AGX190EF29I3G
✅ 直接替换✓ 有现货
$1195 / 个
查看数据手册 →EP2AGX190EF29C6G
✅ 直接替换✓ 有现货
$1010 / 个
查看数据手册 →EP2AGX190EF29C5G
✅ 直接替换✓ 有现货
$1071.99 / 个
查看数据手册 →EP2AGX190EF29C4G
✅ 直接替换✓ 有现货
$2510 / 个
查看数据手册 →EP2AGX190EF29I5G 最大额定值与电气特性
| Family | Arria II GX |
| Logic Elements | 181,165 |
| On-chip Memory | 10,177,536 bits |
| Maximum User I/O | 372 |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Maximum Fabric Frequency | 500 MHz |
| 封装 | 780-FBGA (flip-chip BGA) |
| 工作温度 | -40C to +100C (industrial) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Lead Free | Yes |
EP2AGX190EF29I5G 780-fbga (flip-chip bga) 引脚配置指南
EP2AGX190EF29I5G（780-fbga (flip-chip bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGX190EF29I5G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGX190EF29I5G 适用于 6 应用s: Wireless Baseband Processing, PCI Express Gen2 Endpoint/Root-Port Card, Broadcast Video Infrastructure, High-Performance DSP for Radar/Sonar, Serial RapidIO Switch Fabric, High-Speed Protocol Bridging.
Wireless Baseband Processing
The EP2AGX190EF29I5G's 181,165 logic elements and integrated transceivers up to 6.375 Gbps make it ideal for 4G/LTE baseband processing cards. Its CPRI/OBSAI support at line rates up to 4.915 Gbps enables fronthaul links between baseband units and remote radio heads, while the 372 user I/Os accommodate high-bandwidth ADC/DAC interfaces common in multi-antenna MIMO designs.
推荐
PCI Express Gen2 Endpoint/Root-Port Card
With hard PCIe Gen2 IP blocks and dedicated transceiver channels, the EP2AGX190EF29I5G can implement endpoint or root-port designs at line rate 5 Gbps without consuming ALM resources for serialization. The 780-FBGA package supports the transceiver pinout required for x4/x8 lane configurations, while 181K logic elements accommodate protocol stacks, DMA engines, and application logic on a single device.
推荐
Broadcast Video Infrastructure
The EP2AGX190EF29I5G supports Serial Digital Interface (SDI) standards up to 3G-SDI through its transceivers, and the 181K logic elements handle video processing, scaling, and format conversion. Its industrial temperature range suits outdoor encoder/decoder installations. The 10 Mbit embedded memory buffers large video frames without external SRAM, simplifying board layout.
推荐
High-Performance DSP for Radar/Sonar
The EP2AGX190EF29I5G's dedicated DSP blocks perform fixed- and floating-point arithmetic for radar pulse compression, beamforming, and sonar signal processing. Combined with high-speed ADC interfaces through transceivers, it can process multiple channels of RF data in parallel. The industrial temperature rating supports ruggedized military environments where Arria II GX is qualified.
推荐
Serial RapidIO Switch Fabric
RapidIO at 3.125 or 5 Gbps line rates is fully supported by the EP2AGX190EF29I5G's transceivers, making it suitable for embedded compute cluster fabrics in defense and aerospace applications. The 372 user I/Os handle local processor links (PowerPC, ARM SoC), and 181K logic elements implement switching logic, DMA, and error-handling without external ASSPs.
推荐
High-Speed Protocol Bridging
The EP2AGX190EF29I5G bridges between incompatible high-speed serial protocols - for example, Serial RapidIO to Gigabit Ethernet, or PCIe to CPRI - using its integrated transceivers and 181K logic elements for protocol translation. The industrial temperature range and proven reliability make it preferred for telecom and industrial control bridging applications.
推荐
推荐产品汇总
工程参考数据： EP2AGX190EF29I5G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGX190EF29I3G | EP2AGX190EF29C6G | EP2AGX190EF29C5G | EP2AGX190EF29C4G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (F29) | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same |
| Logic Elements | 181,165 | 181,165 | 181,165 | 181,165 | 181,165 |
| On-chip Memory | 10,177,536 bits | 10,177,536 bits | 10,177,536 bits | 10,177,536 bits | 10,177,536 bits |
| Speed Grade | I5 (industrial, mid-speed) | I3 (industrial, lower speed) | C6 (commercial, fastest) | C5 (commercial, mid-speed) | C4 (commercial, slower) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Maximum User I/O | 372 | 372 | 372 | 372 | 372 |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
关键差异点
- Industrial temperature range with mid-speed grade （对比 EP2AGX190EF29C6G)
- Balanced speed and power for typical designs （对比 EP2AGX190EF29I3G)
- Mid-cost commercial variant with same speed grade （对比 EP2AGX190EF29C5G)
- No direct cross-brand drop-in equivalent （对比 Xilinx Kintex-7 / Lattice ECP5)
设计说明
The EP2AGX190EF29I5G core rail at 0.9 V can draw 15-25 A under full fabric and transceiver utilization per the Arria II GX power calculator. Use a 6+ layer PCB stack-up with dedicated 0.9 V, 1.2 V (transceiver), and I/O voltage planes. Place bulk decoupling (220 uF polymer + 47 uF ceramic) within 1 cm of the package, with 0.1 uF and 0.01 uF high-frequency capacitors under the BGA balls.
Estimated at 100% transceiver utilization (6 channels at 6.375 Gbps) plus 80% logic utilization, total power dissipation is approximately 12-15 W. The 780-FBGA package thermal resistance is approximately 0.5 C/W with sufficient PCB copper area, requiring a heatsink or thermal pad in enclosed industrial enclosures. Forced-air cooling is recommended above 12 W to keep junction temperature below 100C.
Use 1.0 mm pitch BGA breakout with microvia-in-pad or dog-bone fan-out. Matched-length differential routing (within 5 mil tolerance) is required for all transceiver channels operating above 3 Gbps. Reference plane continuity must be maintained under all high-speed traces to control impedance (100 ohm differential, 50 ohm single-ended per the Arria II GX handbook guidelines).
Transceiver channels require AC-coupling capacitors (0402 size, 100 nF X7R) placed within 200 mil of the BGA ball for each TX/RX pair. Maintain 90 ohm differential impedance on transceiver traces and avoid routing through vias when possible. The reference clock input requires a dedicated low-jitter oscillator with less than 1 ps RMS phase noise for 6.375 Gbps operation.
Do not assume 'same family' means drop-in compatible: the EP2AGX190EF29 package (F29) is pin-compatible across speed grades and temperature variants, but other Arria II GX packages (F35, F25, F29 with different ball counts) use different pinouts. Always verify the F29 designation in the datasheet before substituting. Also note: configuring an Arria II GX device with a Cyclone IV or Stratix IV bitstream will permanently damage the part - always verify JTAG ID before programming.
合规信息
RoHS compliant per Altera/Intel product page. AEC-Q100 is not applicable (FPGA is not an automotive-qualified IC by default; would require specific certification). Industrial temperature grade qualified for harsh environments.
