EP2AGX45CU17I3G - Arria II GX FPGA 42KLE 358-UBGA | Intel
部品番号: EP2AGX45CU17I3G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $595.28 | $595.28 |
| 10 | $565 | $5,650.00 |
| 100 | $510 | $51,000.00 |
| 250 | $475 | $118,750.00 |
| 500 | $445 | $222,500.00 |
EP2AGX45CU17I3G 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, interconnect, and I/O can be reconfigured by the designer after manufacturing. FPGAs occupy a unique position between general-purpose CPUs and application-specific integrated circuits (ASICs): they offer hardware-level parallelism and deterministic latency, making them essential for high-throughput signal processing, high-speed serial interfacing, and ASIC prototyping. The Arria II GX family sits in the mid-range, providing transceivers and DSP blocks at lower power than equivalent high-end (Stratix) families while delivering far more logic than low-cost (Cyclone) families.
Key features include 42,959 logic elements (LEs), 1,805 logic array blocks (LABs), 3,517,440 embedded RAM bits, 156 user I/Os, up to 8 transceivers operating up to 3.125 Gbps, dedicated DSP blocks for fixed- and floating-point math, and 4 PLLs for clock management. The device supports a 1.0 V core supply with 0.9 V internal operation and is rated for industrial temperature ranges (-40C to +100C case).
Architecturally, EP2AGX45CU17I3G combines an LUT-based logic fabric, M9K memory blocks, MLAB distributed RAM, and hard IP for transceivers, PLLs, and PCI Express. This integration lets designers implement multi-gigabit serial links, parallel DSP pipelines, and memory interfaces on a single device without external PHY silicon, simplifying board design and BOM.
Typical applications include wireless baseband processing, telecom backhaul, video broadcast equipment, military/aerospace signal processing, and high-speed serial protocol bridging. The integrated transceivers are especially useful where PCI Express, Serial RapidIO, or custom serial links are required alongside custom DSP or control logic.
Designers should plan the PCB for a 17x17 mm BGA with 358 balls on a 1.0 mm pitch; this requires HDI stack-up with microvias and length-matched routing for transceiver channels. Power-rail sequencing (1.0 V core before I/O) and proper decoupling are essential to avoid latch-up at startup.
This page synthesizes distributor pricing, 358-UBGA alternatives, and practical BGA layout notes not found in the manufacturer datasheet.
ドロップイン代替品: EP2AGX45CU17I3G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGX45CU17I3G （同一形状・フットプリント） — 相違点: Package, Speed Grade, Device Type, Logic Elements, Embedded Memory Bits.
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGX45CU17I5G
✅ ドロップイン✓ 在庫あり
$526.7882 / 個
データシートを見る →EP2AGX45CU17I5N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP2AGX45CU17I3NAA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP2AGX45CU17C5G
✅ ドロップイン✓ 在庫あり
$228.5 / 個
データシートを見る →EP2AGX45CU17C5N
✅ ドロップイン✓ 在庫あり
$262 / 個
データシートを見る →EP2AGX45CU17C6G
✅ ドロップイン✓ 在庫あり
$178 / 個
データシートを見る →EP2AGX45CU17C4G
✅ ドロップイン✓ 在庫あり
$145.75 / 個
データシートを見る →EP2AGX45CU17I3G 最大定格＆電気的特性
| Family | Arria II GX |
| Logic Elements | 42,959 |
| Logic Array Blocks (LABs) | 1,805 |
| Total RAM Bits | 3,517,440 |
| User I/O Pins | 156 |
| Transceivers | Up to 8 channels |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Process Technology | 40 nm |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) |
| PLLs | 4 |
| DSP Blocks | Yes (variable-precision DSP) |
| 動作温度 | -40C to +100C (Industrial) |
| パッケージ | 358-ball UBGA (FCBGA), 17x17 mm |
| Ball Pitch | 1.0 mm |
| 実装タイプ | Surface Mount (BGA) |
| MSLレベル | 3 (168 hours) |
| RoHS ステータス | Compliant |
EP2AGX45CU17I3G 358-ball ubga (fcbga), 17x17 mm ピン配置ガイド
EP2AGX45CU17I3G (358-ball ubga (fcbga), 17x17 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2AGX45CU17I3G.
詳細は データシート をご参照ください。
主な用途
EP2AGX45CU17I3G の用途: 6 件s: Wireless Baseband Signal Processing, Telecom Backhaul and Fronthaul, Video Broadcast and Studio Equipment, Military and Aerospace Signal Processing, Industrial Imaging and Machine Vision, High-Speed Protocol Bridging and Test Equipment.
Wireless Baseband Signal Processing
The EP2AGX45CU17I3G fits wireless baseband designs because its 42,959 logic elements combined with variable-precision DSP blocks deliver the throughput required for LTE and WiMAX physical-layer processing. The 8 integrated 3.125 Gbps transceivers handle backhaul links to remote radio heads without external PHY silicon, reducing BOM and board area. Designers can implement multi-antenna MIMO FFT/iFFT chains, channel estimation, and turbo decoding all in fabric, while hard PCIe IP connects to a host baseband processor. Compared with a discrete DSP + PHY solution, this FPGA consolidates digital baseband, fronthaul, and control logic on one device, simplifying thermal design. Power consumption at typical 70 percent utilization is around 6 W, manageable with a small heat spreader.
おすすめ
Telecom Backhaul and Fronthaul
In telecom backhaul aggregation equipment, the EP2AGX45CU17I3G serves as a multi-protocol bridge between CPRI/OBSAI fronthaul links and Ethernet backhaul. Its transceivers at 3.125 Gbps map cleanly to CPRI line rates (option 1 to 4), while the FPGA fabric implements serialization, jitter cleanup, and packet processing. The 156 user I/Os allow direct connection to multiple SFP+ cages and external Ethernet PHYs. Compared with a pure ASIC approach, the FPGA lets carriers adapt to evolving CPRI rates without re-spinning silicon. Industrial temperature rating ensures deployment in outdoor or uncontrolled-environment cabinets.
おすすめ
Video Broadcast and Studio Equipment
The EP2AGX45CU17I3G suits broadcast video routers and format converters because of its DSP blocks for color-space conversion and its high I/O count. The 3,517,440 bits of embedded RAM buffer full-HD video frames in real time, while transceivers carry SDI signals at 2.97 Gbps (3G-SDI) or HDMI-over-串行 links. Compared with a dedicated video ASSP, this FPGA allows OEMs to support multiple broadcast standards (SMPTE 424M, 425M, 292M) on a single hardware platform via bitstream updates. The industrial temperature rating supports use in production trucks and outdoor broadcast venues.
おすすめ
Military and Aerospace Signal Processing
Defense integrators value the EP2AGX45CU17I3G for radar signal processing, electronic warfare, and secure communications because it combines DSP throughput with ruggedized industrial-grade reliability. The 40 nm low-power process enables deployment in size, weight, and power-constrained platforms such as unmanned aerial vehicles. On-chip transceivers connect directly to RF downconverters and ADC/DAC back-ends via JESD204B-like serial links, while fabric implements FFT beamforming and pulse compression. The device supports secure bitstream encryption via the Altera/Intel security feature, protecting classified IP. Compared with custom rad-hard ASICs, this FPGA offers much faster development cycles at acceptable SWaP.
おすすめ
Industrial Imaging and Machine Vision
In factory automation and machine vision systems, the EP2AGX45CU17I3G acts as a high-speed image pre-processor, performing Bayer demosaicing, lens distortion correction, and feature extraction at line rates above 1 Gbps. Camera Link, CoaXPress, and GigE Vision protocols are mapped onto the transceiver channels, allowing direct interface to industrial cameras without external protocol chips. The FPGA fabric then forwards processed frames to a host CPU via PCIe Gen2 hard IP. Compared with CPU-only processing, this offloads deterministic pixel processing from the host, reducing latency and CPU load by over 80 percent in typical pipelines.
おすすめ
High-Speed Protocol Bridging and Test Equipment
Test and measurement OEMs deploy the EP2AGX45CU17I3G as a flexible protocol bridge between serial standards such as PCIe, Serial RapidIO, SATA, and custom high-speed links. The 8 transceivers support simultaneous multi-protocol operation, and the FPGA fabric implements pattern generation, error injection, and bit-error-rate testing. Industrial temperature rating ensures lab-to-field reliability. Compared with fixed-function protocol analyzers, this FPGA-based platform lets one hardware chassis support new protocols via bitstream updates, reducing test-equipment capital costs for standards bodies and conformance labs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGX45CU17I3G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGX45CU17I5G | EP2AGX45CU17I3NAA | EP2AGX45CU17C5G | EP2AGX45CU17C6G |
|---|---|---|---|---|---|
| Package | 358-ball UBGA (U17, 17x17 mm) | 358-ball UBGA (U17) - same | 358-ball UBGA (U17) - same | 358-ball UBGA (U17) - same | 358-ball UBGA (U17) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 |
| Speed Grade | I3 | I5 (faster) | I3 (same) | C5 (commercial, faster) | C6 (commercial, slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 channels, up to 3.125 Gbps | 8 channels, up to 3.125 Gbps | 8 channels, up to 3.125 Gbps | 8 channels, up to 3.125 Gbps |
| User I/Os | 156 | 156 | 156 | 156 | 156 |
| Embedded RAM (bits) | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 |
主な差別化要因
- Industrial speed grade with reliable supply （vs EP2AGX45CU17C5G)
- Higher Fmax for tighter timing closure （vs EP2AGX45CU17I5G)
- Lower Fmax option for cost reduction （vs EP2AGX45CU17C6G)
設計ノート
The 358-ball UBGA at 1.0 mm pitch requires HDI PCB stack-up with laser-drilled microvias. Standard 0.4 mm via-in-pad is acceptable for the BGA land pattern, but the PCB fabricator should be qualified for fine-pitch BGA assembly. Per the Arria II GX handbook, the U17 package uses a 17x17 mm body with a 0.8 mm ball diameter; land pad diameter should follow IPC-7351 nominal guidelines. Escape routing must use microvias on the top layer with trace width no greater than 0.1 mm to maintain 50 ohm impedance.
Power sequencing is mandatory for Arria II GX devices: VCC (1.0 V core) must come up before VCCIO and VCCPD. Per the Altera device handbook, failure to sequence properly can trigger latch-up and permanent damage. Recommended practice is to use a power management IC such as the LTM4627 or Enpirion EN6337 with programmable ramp rates, plus a TI UCD90120A or equivalent sequencer. Hold all I/O banks in high-Z until the configuration bitstream is loaded and the device enters user mode.
Estimated: At typical utilization (70 percent LEs, 4 active transceivers at 3.125 Gbps), power dissipation is around 6 W. The U17 package junction-to-ambient thermal resistance is approximately 12 C/W with 1 square inch of copper ground plane and thermal vias; junction temperature at 70C ambient is around 142C, exceeding the 125C limit. A small heat spreader (15x15 mm aluminum) reduces theta_JA to approximately 8 C/W, bringing junction to 118C - within spec. Active cooling is recommended only at full transceiver utilization above 80 percent.
コンプライアンス情報
RoHS compliance per Altera/Intel product page. Not AEC-Q100 qualified - this is an FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in verified data.
