EP2AGX65DF29C6 - Arria II GX FPGA, 60K LE, 364 I/O, 780-FCBGA | Intel
部品番号: EP2AGX65DF29C6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $631.11 | $631.11 |
| 10 | $580 | $5,800.00 |
| 100 | $520 | $52,000.00 |
| 250 | $475 | $118,750.00 |
| 500 | $440 | $220,000.00 |
EP2AGX65DF29C6 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LEs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, DSP blocks, and PLLs. FPGAs sit in the programmable-logic hierarchy alongside CPLDs and are used as alternative silicon paths when ASIC NRE cost or time-to-market makes custom logic impractical. The Arria II GX family targets mid-range applications that require transceivers and moderate logic density without the cost of Stratix-class devices.
Key features of the EP2AGX65DF29C6 include a 364-pin maximum user I/O count, 312 (18x18) multiplier blocks for DSP, 4 PLLs, 6.553 Gbps maximum transceiver data rate per the Arria II GX family spec, and a 0.9 V core voltage. Industrial temperature grade is denoted by the suffix 'I'; the 'C6' speed grade indicates the device's transceiver and logic performance bin. The 780-FCBGA package uses flip-chip technology for high signal integrity at multi-Gbps rates.
Typical applications include wireless infrastructure baseband processing, video broadcast equipment, industrial imaging and machine vision, high-speed serial backplane bridging, and ASIC prototyping. The combination of moderate logic density, integrated transceivers, and a flip-chip BGA makes it well suited for line-card designs that need multi-gigabit serial I/O without the higher cost of Stratix IV/V devices.
When designing with this device, allocate PCB layers for the flip-chip BGA fanout and follow Intel's power-supply decoupling reference (multiple decoupling caps per rail). Quartus II (legacy) or Quartus Prime (current) is required for synthesis, place-and-route, and bitstream generation. For new designs, evaluate the newer Cyclone V or Arria V families for lower power and improved tool flow.
ドロップイン代替品: EP2AGX65DF29C6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGX65DF29C6 （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, Transceivers, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGX65DF29C5N
✅ ドロップイン✓ 在庫あり
$1380 / 個
データシートを見る →EP2AGX65DF29C4N
✅ ドロップイン✓ 在庫あり
$605 / 個
データシートを見る →EP2AGX65DF29C3N
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP2AGX65DF29I3N
✅ ドロップイン✓ 在庫あり
$175 / 個
データシートを見る →EP2AGX65DF29C5G
✅ ドロップイン✓ 在庫あり
$245 / 個
データシートを見る →EP2AGX65DF29C6 最大定格＆電気的特性
| Family | Arria II GX |
| Logic Elements (LE) | 60,214 |
| Logic Array Blocks (LABs) | 2,530 |
| Embedded Memory (bits) | 5,371,904 |
| Maximum User I/O | 364 |
| Transceivers | 8 (up to 3.75 Gbps per Arria II GX family spec) |
| PLLs | 4 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Speed Grade | 6 (C6) |
| 動作温度 | Commercial (0C to +85C) |
| パッケージ | 780-ball FC-FBGA (29x29 mm) |
| 実装タイプ | Surface Mount (flip-chip BGA) |
| RoHS ステータス | Compliant |
EP2AGX65DF29C6 780-ball fc-fbga (29x29 mm) ピン配置ガイド
EP2AGX65DF29C6 (780-ball fc-fbga (29x29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2AGX65DF29C6.
詳細は データシート をご参照ください。
主な用途
EP2AGX65DF29C6 の用途: 6 件s: Wireless Infrastructure Baseband Processing, Video Broadcast and Imaging Equipment, Industrial Machine Vision and Image Processing, ASIC and ASSP Prototyping, High-Speed Serial Backplane Bridging, Medical Imaging and Diagnostic Equipment.
Wireless Infrastructure Baseband Processing
The EP2AGX65DF29C6 is well suited to wireless baseband processing line cards in 3G/4G radio units. With 60,214 logic elements the device absorbs multi-antenna baseband signal processing, while the 8 integrated transceivers up to 3.75 Gbps connect directly to CPRI or OBSAI fronthaul links without external PHYs. The 0.9 V core and 40 nm process keep board power within typical RRH thermal budgets, and the 780-FCBGA's flip-chip construction preserves signal integrity for multi-gigabit serial lanes. Designers use the FPGA's DSP blocks for crest-factor reduction and digital pre-distortion loops.
おすすめ
Video Broadcast and Imaging Equipment
Broadcast video routers, format converters, and professional cameras benefit from EP2AGX65DF29C6's combination of 5,371,904 embedded-memory bits and 364 user I/Os. Video pipelines need wide parallel data paths (often 10-20 bits at 148.5 MHz for SDI); the device's abundant LVDS-capable I/Os simplify multi-channel SDI interfacing. The 60k-LE fabric handles real-time color space conversion, scaling, and frame-buffer arbitration. Using a flip-chip BGA also helps the design meet EMI/ESD targets mandated for broadcast installations, since the package provides superior ground-return paths.
おすすめ
Industrial Machine Vision and Image Processing
Industrial vision systems running multi-megapixel Camera Link or CoaXPress cameras can leverage EP2AGX65DF29C6's 8 transceivers to interface with CoaXPress up to 3.125 Gbps per lane, aggregating four cameras into a single FPGA. The device's DSP blocks accelerate 2D filtering and convolution kernels; embedded memory buffers full-resolution frames between the sensor front-end and the image-processing pipeline. The 780-FCBGA's fine-pitch flip-chip BGA also reduces the PCB footprint versus a wire-bond equivalent, important when embedding vision into compact industrial inspection heads.
おすすめ
ASIC and ASSP Prototyping
Design teams use EP2AGX65DF29C6 as a fast-turnaround prototype vehicle for mid-complexity ASICs in the 30k-50k gate-equivalent range. Quartus II supports rapid RTL bring-up, and the 780-FCBGA exposes the full Arria II GX transceiver and I/O set, letting engineers validate PCIe, Serial RapidIO, or custom SERDES protocols before committing to ASIC mask costs. The 60k-LE device typically runs at 50-70% utilization in prototype mode, providing headroom for debug logic and in-system probes that get removed before tape-out.
おすすめ
High-Speed Serial Backplane Bridging
Communications backplanes often need protocol bridging between legacy serial interfaces and newer fabrics. EP2AGX65DF29C6's 8 transceivers can simultaneously terminate multiple backplane lanes and aggregate traffic into a higher-speed uplink, offloading the system processor. The 5.3 Mbit embedded memory is sufficient to buffer full-sized Ethernet frames, and the device's 4 PLLs generate independent clock domains for each bridge port. Designers also use the FPGA to implement custom SerDes PCS functions when standard PHY devices cannot meet protocol requirements.
おすすめ
Medical Imaging and Diagnostic Equipment
Ultrasound and digital X-ray systems benefit from EP2AGX65DF29C6's parallel-processing capability and multi-gigabit transceivers. The 60k-LE fabric supports beamforming across 64-128 channels in mid-range ultrasound carts, while embedded memory stores raw RF sample lines for Doppler and harmonic imaging. The 780-FCBGA's compact footprint fits within portable cart enclosures, and commercial temperature grade (C6) suits controlled clinical environments. Designers can also leverage the FPGA's PCI Express hard IP to connect to host PCs for image rendering and storage.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGX65DF29C6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGX65DF29C5N | EP2AGX65DF29C4N | EP2AGX65DF29C3N | EP2AGX65DF29I3N | EP2AGX65DF29C5G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Logic Elements | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 |
| Embedded Memory (bits) | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 |
| Maximum User I/O | 364 | 364 | 364 | 364 | 364 | 364 |
| Transceivers | 8 | 8 | 8 | 8 | 8 | 8 |
| Speed Grade | C6 | C5 (lower) | C4 (lower) | C3 (lowest) | I3 (industrial, lower) | C5 (lower) |
| Operating Temperature | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Commercial |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
主な差別化要因
- Fastest commercial speed grade in the 60k-LE Arria II GX DF29 family （vs EP2AGX65DF29C5N)
- Largest Arria II GX 60k-LE device in the DF29 (780-ball) footprint （vs EP2AGX45DF29C6N)
- Mid-range Arria II GX positioning vs Stratix IV/V （vs EP2S180F1508C3 (Stratix II))
- Commercial temperature grade optimized for controlled environments （vs EP2AGX65DF29I3N)
設計ノート
EP2AGX65DF29C6 requires a multi-rail power supply (typically 0.9 V core, 1.1/1.2 V transceiver PLLs, 2.5/3.0 V analog AUX, and 1.4-3.0 V I/O). Follow Intel's PowerPlay early power estimator before PCB layout and re-verify with PowerPlay post-fit once placement is known. Power-on sequence must respect the datasheet order to avoid latch-up; use a sequencer IC (e.g., LTC2923) or the FPGA's built-in POR. Decoupling: at least 30 low-ESL capacitors near the package, plus bulk caps per rail at the board edge.
The 780-ball FC-FBGA package requires 1.0 mm ball pitch (verify against Arria II GX device-specific pinout) and microvia-friendly stack-up. Use at least 8 PCB layers: 4 signal layers for transceiver routing (top/bottom stripline for TX/RX pairs) and 4 for power/ground. Each transceiver lane needs a 100-ohm differential microstrip/stripline pair with intra-pair skew below 1 ps and length-matching to the reference clock. Maintain solid ground reference beneath each lane.
Estimated: at typical 60% utilization with all 8 transceivers active, the FPGA may dissipate 6-10 W. The FC-FBGA package relies heavily on the PCB for heat removal. Ensure a thermal pad array under the BGA and connect to inner ground planes with thermal vias (0.3 mm drill, 1.2 mm pitch, filled or capped per assembly house). For convection-cooled enclosures, add a heatsink with thermal interface material rated for 1-2 C/W or better. Use the Arria II GX thermal model to compute theta-JA per the user's application note AN 542.
Do not reuse the EP2AGX65DF25 (572-ball) symbol for the EP2AGX65DF29 (780-ball) device - the pinout and ball map differ and Quartus will refuse the assignment. Confirm the board's JTAG chain order matches the Quartus programmer file before taping out, since flip-chip BGA rework is costly. Avoid long parallel routes between adjacent transceiver lanes; crosstalk will close the eye diagram. Use Intel's Transceiver Toolkit during bring-up to validate eye height/width against the 3.75 Gbps mask.
Transceiver reference clocks must use a low-jitter oscillator (<300 fs RMS) with the VCCIO and VCCAUX rails filtered by ferrite beads and bypassed with 0.1 uF + 10 uF caps. PCB microstrip to stripline transition should occur within 5 mm of the BGA pad to avoid stub resonances. For multi-lane protocols (PCIe, XAUI), use the FPGA's dynamic reconfiguration to deskew lanes at link-up.
コンプライアンス情報
RoHS and lead-free per Altera/Intel product marking. Not AEC-Q100 qualified; not intended for automotive safety-critical applications. Reach and conflict-minerals compliance per Intel supplier declarations.
