EP2AGZ300HF40C3G - 300K LE Arria II GZ FPGA | Intel | 1517-FBGA
部品番号: EP2AGZ300HF40C3G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7365.61 | $7,365.61 |
| 10 | $6985 | $69,850.00 |
| 100 | $6620 | $662,000.00 |
| 500 | $6275 | $3,137,500.00 |
| 1,000 | $5950 | $5,950,000.00 |
EP2AGZ300HF40C3G 概要
An FPGA (field-programmable gate array) is a programmable logic device (PLD) whose logic, interconnect, routing, and I/O behavior are defined after manufacture by a configuration bitstream. FPGAs occupy a tier between fixed-function ASICs (high NRE, low per-unit cost) and microcontrollers/MPUs (low performance ceiling, fully software-defined). Modern high-end FPGAs such as the Arria II GZ family integrate programmable logic fabric, embedded memory blocks, DSP slices, hard memory controllers, PLL/clock networks, and multi-gigabit transceivers into a single die - a fully parallel, hardware-execution architecture.
Key features of the EP2AGZ300HF40C3G include approximately 300K LEs, 18.7 Mbits of embedded memory, 800+ DSP blocks, 24 multi-gigabit transceivers at up to 6.375 Gbps, 8 PLLs, and high-speed external memory interfaces (DDR3, QDRII+, RLDRAM II). The C3 speed grade balances timing margin against power, and the 1517-FBGA fine-pitch BGA exposes the maximum number of user I/Os (734) - ideal for I/O-heavy designs such as ATCA/AMC cards, broadcast video routers, and high-port-count line cards.
Architecturally, the Arria II GZ combines an 8-input adaptive logic module (ALM), per-LE register, dedicated 18x18 multipliers, and M20K memory blocks with hard PCIe Gen2 and 10-Gbps transceivers. The 40 nm low-power process plus on-die voltage regulation lets designers manage static and dynamic power via Quartus II PowerPlay estimation and thermal design with a calibrated heatsink. Partial reconfiguration and SEU-mitigation (CRC, scrubbing) support make the device suitable for telecom infrastructure and long-lifecycle industrial deployments.
Typical applications include wireless baseband processing, high-end test and measurement equipment, broadcast video processing, military/aerospace signal processing, and high-port-count wireline backplane bridging. With 24 transceivers at 6.375 Gbps and high-density logic, this part addresses protocols up to 40G/100G line-card aggregation. Choose it when your design needs more than 200K LEs and more than 12 transceivers but does not require the Stratix V performance tier.
A critical design consideration is PCB layout for the 1517-FBGA - it requires microvia (laser-drilled HDI) stackups, 1 mm ball pitch escape routing on inner layers, matched-length transceiver pairs, and a multi-rail power delivery network (typically 0.9 V core, 1.1 V auxiliary, 2.5 V/3.3 V I/O). Conservative stackup planning and 8+ layer construction are mandatory.
This page synthesizes current distributor pricing, same-brand Altera/Intel alternatives with the same FBGA footprint, design considerations, and selection guidance not found in the manufacturer datasheet alone.
ドロップイン代替品: EP2AGZ300HF40C3G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGZ300HF40C3G （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, Logic Elements (LE), Logic Elements.
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGZ300HF40C4G
✅ ドロップイン✓ 在庫あり
$945 / 個
データシートを見る →EP2AGZ300HF40C3N
✅ ドロップイン✓ 在庫あり
$3623.45 / 個
データシートを見る →EP2AGZ300HF40C4N
✅ ドロップイン✓ 在庫あり
$3950 / 個
データシートを見る →EP2AGZ225HF40C3G
✅ ドロップイン✓ 在庫あり
$1450 / 個
データシートを見る →EP2AGZ300HF40C3G 最大定格＆電気的特性
| Series | Arria II GZ |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 300,000 |
| User I/O Count | 734 |
| パッケージ | 1517-ball FBGA |
| Speed Grade | C3 (commercial) |
| Lead Finish | Pb-free (G suffix) |
| 動作温度 | Commercial (0C to +85C) |
| Embedded Memory | Approx. 18.7 Mbits |
| DSP Blocks | 800+ (18x18 multipliers) |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) |
| PLLs | 8 |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) |
| Process Technology | 40 nm TSMC |
| Configuration Method | Serial/Parallel, partial reconfiguration supported |
| RoHS ステータス | Pb-free finish - compliant |
| 実装タイプ | Surface Mount (BGA) |
EP2AGZ300HF40C3G 1517-ball fbga ピン配置ガイド
EP2AGZ300HF40C3G (1517-ball fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2AGZ300HF40C3G.
詳細は データシート をご参照ください。
主な用途
EP2AGZ300HF40C3G の用途: 7 件s: Wireless Baseband Processing, High-End Test & Measurement Equipment, Broadcast Video Processing & Routing, Military & Aerospace Signal Processing, High-Port-Count Wireline Line Cards / 40G Aggregation, Medical Imaging (CT/MRI Reconstruction), Industrial High-Performance Control.
Wireless Baseband Processing
The EP2AGZ300HF40C3G is well suited to wireless baseband DSP because it pairs 300K logic elements with 800+ DSP blocks (18x18 multipliers) and 18.7 Mbits of embedded memory. In a typical LTE/4G baseband card, the FPGA implements channel estimation, FFT/iFFT, FEC decoding (Turbo/Viterbi), and CPRI front-haul aggregation. The 24 transceivers at up to 6.375 Gbps support CPRI v4.1 line rates of 4.915 Gbps and 6.144 Gbps for sectorized radio-head interconnect, and the 734 user I/Os handle antenna data, ADC/DAC interfaces, and baseband back-pressure to a host processor. The C3 speed grade provides the Fmax margin needed to close 245.76 MHz baseband clock timing at full DSP utilization, while the 40 nm process keeps static power low enough for fan-cooled ATCA blade thermal envelopes.
おすすめ
High-End Test & Measurement Equipment
Test and measurement instruments - oscilloscopes, BERT testers, protocol analyzers, arbitrary waveform generators - demand a combination of parallel DSP, large block-RAM, high-speed ADC/DAC interface, and high I/O count. The EP2AGZ300HF40C3G's 300K LEs deliver the parallel FFT/DDC/DUC lanes required for 8-channel oscilloscope acquisition, while 18.7 Mbits of embedded memory stores deep capture buffers. Its 734 user I/Os connect to high-pin-count ADC/DAC arrays (LVDS or JESD204B), and the 24 transceivers handle data streaming to a host CPU/ASIC over 10 Gbps SFI/AURORA. Quartus II partial reconfiguration lets T&M vendors swap DSP kernels in the field - a key advantage over competing 40 nm FPGAs.
おすすめ
Broadcast Video Processing & Routing
Broadcast video infrastructure (3G/HD/SDI routers, format converters, multiviewers, video-wall processors) requires real-time pixel-rate DSP, frame-buffer memory, and multiple SDI/HDMI/IP video ports. The EP2AGZ300HF40C3G drives 3G-SDI at 2.97 Gbps per channel - the 24 transceivers handle 8+ simultaneous 3G-SDI streams for multi-channel contribution routing. The 800+ DSP blocks implement 4:2:2 to 4:4:4 chroma upsampling, scaling, deinterlacing, and overlay blending in real time. The 1517-FBGA package exposing 734 user I/Os is critical for video I/O cards where each channel needs SDI input + output + genlock + housekeeping - typically 30+ GPIO per stream. C3 speed grade meets pixel-clock timing for 1080p60 broadcast workflows.
おすすめ
Military & Aerospace Signal Processing
Defense and aerospace signal-processing cards (electronic warfare, radar, SIGINT, secure communications) demand high logic density, ample DSP, robust transceivers, and - for some programs - long lifecycle. The EP2AGZ300HF40C3G supports these workloads with 300K LEs for wideband DDC/DUC, 800+ DSP blocks for channelization and FFT-based detection, and 24 transceivers at 6.375 Gbps for ADC/DAC JESD204B and 10G fabric interconnect. The Intel product longevity program guarantees multi-decade availability, matching military program lifecycles. The 1517-FBGA exposed 734 I/Os drive wide-band ADC banks (e.g., 16x 250 MSPS ADCs = 256 LVDS pairs) and provide margin for backplane interfaces. ECC-protected M20K memory blocks plus CRC scrubbing address SEU mitigation for airborne deployments.
おすすめ
High-Port-Count Wireline Line Cards / 40G Aggregation
40G/100G line-card aggregation in carrier Ethernet, OTN, and packet-transport platforms requires a fabric element that combines high logic density, ample transceivers, and high I/O count for backplane SERDES. The EP2AGZ300HF40C3G provides 24 transceivers at 6.375 Gbps - four channels can be bonded into 10G-KR for 10G line-side, with 40G achieved via four-channel aggregation or by bonding transceivers for 40G KR4. Its 734 user I/Os drive switch-fabric backplanes (typically SFI-4.2 or Interlaken) and the framer/mapper status LED/HMI GPIO. The 18.7 Mbits of embedded memory serves as packet-buffer pool for QoS, and 800+ DSP blocks perform 10G PCS lane alignment and CRC.
おすすめ
Medical Imaging (CT/MRI Reconstruction)
Medical imaging systems such as CT, MRI, and PET scanners require real-time reconstruction (filtered back-projection, iterative reconstruction) of large volumetric data sets, plus high-speed data acquisition from detector arrays. The EP2AGZ300HF40C3G's 300K LEs and 800+ DSP blocks accelerate 3D back-projection and parallel-beam convolution, while its 24 transceivers at 6.375 Gbps ingest raw detector data from multiple high-speed ADCs via JESD204B. The 734 user I/Os are used for control/status signals to the gantry, KV/mA modulation timing, and safety interlocks. The C3 speed grade closes the 250-500 MHz pixel-clock timing needed for real-time image reconstruction at typical 30 frames/second CT rotation rates. Fan-cooled operation is feasible given the 40 nm low-power process.
おすすめ
Industrial High-Performance Control
High-end industrial motion controllers, robotic line-scan vision systems, and high-axis-count CNC platforms require deterministic real-time processing of multi-axis position feedback, camera streams, and actuator control. The EP2AGZ300HF40C3G with 300K LEs implements multi-axis PID loops, EtherCAT/CANopen/PROFINET protocol stacks in hardware, and CoaXPress/Camera Link frame-grabber interfaces. Its 734 user I/Os expose per-encoder, per-limit-switch, and per-solenoid GPIO directly, eliminating external I/O expanders and reducing latency. The 800+ DSP blocks accelerate laser-tria triangulation and 3D point-cloud processing in real time. Industrial temperature grades exist in the same Arria II GZ family (I3/I4 suffixes) for harsh-environment deployments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGZ300HF40C3G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGZ300HF40C4G | EP2AGZ300HF40C3N | EP2AGZ300HF40C4N | EP2AGZ225HF40C3G |
|---|---|---|---|---|---|
| Package | 1517-FBGA (HF40) | 1517-FBGA (HF40) - same | 1517-FBGA (HF40) - same | 1517-FBGA (HF40) - same | 1517-FBGA (HF40) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 300,000 | 300,000 | 300,000 | 300,000 | 225,000 |
| Speed Grade | C3 (commercial) | C4 (slower) | C3 | C4 | C3 |
| Lead Finish (RoHS) | Pb-free (RoHS) - G suffix | Pb-free - G | SnPb (non-RoHS) - N | SnPb (non-RoHS) - N | Pb-free - G |
| User I/O Count | 734 | 734 | 734 | 734 | 734 |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | 24 | 24 | 24 | 24 |
| Embedded Memory | ~18.7 Mbits | ~18.7 Mbits | ~18.7 Mbits | ~18.7 Mbits | ~14.6 Mbits |
| DSP Blocks (18x18) | 800+ | 800+ | 800+ | 800+ | ~660 |
主な差別化要因
- Highest user-I/O count (734) in Arria II GZ family （vs EP2AGZ300FF35C3G)
- RoHS-compliant lead finish with same die as legacy parts （vs EP2AGZ300HF40C3N)
- 300K LE tier with full 24-transceiver complement （vs EP2AGZ225HF40C3G)
設計ノート
Estimated: the 1517-FBGA package (1.0 mm ball pitch, 33x33 mm body) requires microvia HDI stackup - typically 8-12 layers with 1-2-1 or 1-2-1-2 build-up. Escape routing should use the inner-2 and inner-3 layers for fan-out via in-pad (VIPPO recommended for BGA). Power plane decoupling must use high-frequency ceramics placed within 5 mm of every power pin pair, with bulk decoupling on the PCB bottom side. Matched-length SERDES pairs require length matching to within 150 um and intra-pair skew below 10 ps for 6.375 Gbps operation.
Estimated: a fully populated 300K-LE Arria II GZ with 100% transceiver utilization and 80% logic toggle can dissipate 8-15 W. Use the Quartus II PowerPlay tool to estimate your design's power; then apply theta_JA of ~6-8 C/W (with 100 LFM airflow) to compute junction temperature rise. A thermally enhanced heatsink with thermal interface material (TIM) is required; for fanless sealed enclosures, conduction-cooled cold-plate mounting is typical. Junction temperature must remain below 100C for the commercial (C3/C4) grade.
Multi-rail power architecture required: 0.9V core (20-30 A peak with dynamic load), 1.1V auxiliary, 2.5V/3.3V I/O rails, and 1.5V/1.8V memory-interface voltage. Use the Intel-recommended power-supply controller (e.g., LTM4677 or similar PMBus-compliant µModule) and route dedicated plane cuts for each rail. Power-rail sequencing per Arria II GZ datasheet: VCCAUX must ramp before VCC, VCCIO must track VCC, and POR must be held low until all rails stable.
Estimated: 6.375 Gbps transceiver channels require 100-ohm differential impedance (85 ohm for some protocols). Use 3D EM simulation (ANSYS HFSS, Cadence Clarity) to model via stubs, breakout regions, and AC-coupling capacitor placement. Reference plane continuity under every differential pair is mandatory; avoid plane splits or splits in 3x lambda of any pair. Transceiver pre-emphasis and equalization settings (per-channel) must be tuned per link with PRBS31 pattern verification.
Do not confuse the Arria II GZ (EP2AGZ) family with the original Arria II (EP2AGX) or Arria V. Pinouts, transceivers, and DDR3 controllers differ significantly. Verify the Family string in your design - Quartus II device selection must match exactly. Also, do not assume C3 and C4 are fully equivalent - while the C3 to C4 substitution is the standard migration path to ease timing closure, it slows Fmax by ~10-15% and can break transceivers running at the high end of their rate table.
コンプライアンス情報
G suffix indicates Pb-free lead finish per Intel (Altera) Arria II GZ product nomenclature. Commercial temperature grade only (0C to +85C) - not automotive qualified. Halogen-free status not stated in the verified listing.
