EP2AGZ300HF40I3N - Arria II GZ FPGA 298K LE 1517-FCBGA | Intel
部品番号: EP2AGZ300HF40I3N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4576.95 | $4,576.95 |
| 10 | $4430 | $44,300.00 |
| 25 | $4280 | $107,000.00 |
| 100 | $4050 | $405,000.00 |
| 250 | $3820 | $955,000.00 |
EP2AGZ300HF40I3N 概要
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines configurable logic blocks (LBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit at the top of the programmable logic hierarchy, below ASICs (Application-Specific Integrated Circuits) and above CPLDs (Complex Programmable Logic Devices), and belong to the broader integrated circuit family. Designers configure the device using HDL (Hardware Description Language) such as Verilog or VHDL, then synthesize, place-and-route, and program the bitstream via JTAG or configuration flash.
Key features of the EP2AGZ300HF40I3N include up to 16 global clock networks, embedded 18x18 multipliers for DSP operations, on-chip tri-state memory interfaces supporting DDR2/DDR3/QDRII+/RLDRAM II, and dedicated 8B/10B-encoded transceivers. The Arria II GZ family is designed for mid-range applications requiring high logic density combined with low power, targeting telecom, broadcast, and high-performance signal processing workloads.
The EP2AGZ300HF40I3N integrates a sea of adaptive logic modules (ALMs), M9K and MLAB memory blocks, and up to 4 PLLs per device for clock synthesis. Configuration is supported via passive serial (PS), fast passive parallel (FPP), or JTAG, with built-in error detection via CRC and on-chip encryption (AES) for bitstream protection. The HF40 package designation specifies a 1.0 mm pitch FCBGA optimized for high-density PCB routing.
Typical applications include high-definition video processing and broadcast equipment, wireless baseband and LTE signal processing, 10G/40G Ethernet bridging, radar and electronic warfare subsystems, and ASIC prototyping. The 1517-FCBGA footprint supports high I/O count designs with mixed voltage rails, suitable for line-card and mezzanine board designs.
Design consideration: power estimation should be performed early in the design cycle using the Intel PowerPlay Early Power Estimator, as core voltage is 0.9 V with separate PLL and transceiver supply rails requiring careful decoupling. Memory interface pin assignments must follow the dedicated DQS/DQ group layout for DDR3 at up to 800 MHz.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same Arria II GZ family, and practical design notes that go beyond the manufacturer datasheet alone.
ドロップイン代替品: EP2AGZ300HF40I3N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGZ300HF40I3N （同一形状・フットプリント） — 相違点: Package, Logic Elements (LE), RoHS Status, Speed Grade, Family.
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGZ300HF40I3G
✅ ドロップイン✓ 在庫あり
$1995 / 個
データシートを見る →EP2AGZ300HF40C3N
✅ ドロップイン✓ 在庫あり
$3623.45 / 個
データシートを見る →EP2AGZ300HF40C4N
✅ ドロップイン✓ 在庫あり
$3950 / 個
データシートを見る →EP2AGZ300HF40C4G
✅ ドロップイン✓ 在庫あり
$945 / 個
データシートを見る →EP2AGZ300HF40C3G
✅ ドロップイン✓ 在庫あり
$5950 / 個
データシートを見る →EP2AGZ300HF40I3N 最大定格＆電気的特性
| Series | Arria II GZ |
| Family | EP2AGZ |
| Logic Elements (LE) | 298,000 |
| Embedded Memory Bits | 18,854,912 |
| User I/O Count | 734 |
| パッケージ | 1517-BBGA, FCBGA (HF40) |
| Ball Pitch | 1.0 mm |
| Supply Voltage (Core) | 0.9 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Process Technology | 40 nm |
| Number of PLLs | 4 |
| Configuration Interface | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | AES-256 |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount |
EP2AGZ300HF40I3N 1517-bbga, fcbga (hf40) ピン配置ガイド
EP2AGZ300HF40I3N (1517-bbga, fcbga (hf40) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2AGZ300HF40I3N.
詳細は データシート をご参照ください。
主な用途
EP2AGZ300HF40I3N の用途: 7 件s: High-Definition Video Processing, Wireless Baseband Signal Processing, 10G/40G Ethernet Bridging, ASIC Prototyping, Radar and Electronic Warfare Signal Processing, Medical Imaging Equipment, Industrial Motor Control and Servo Drives.
High-Definition Video Processing
The EP2AGZ300HF40I3N suits HD and 4K video processing pipelines where 298,000 LEs and 734 user I/O pins drive parallel pixel-domain computation. Its 18,854,912 bits of embedded SRAM buffer line and frame memory for deinterlacing, scaling, and color-space conversion, while 4 PLLs generate the multiple pixel clocks required by HDMI 2.0, DisplayPort, and 12G-SDI inputs. The 0.9 V core and 40 nm process keep board thermal budget compatible with broadcast-rail chassis without forced-air cooling at typical video workloads.
おすすめ
Wireless Baseband Signal Processing
LTE and 5G baseband subsystems use the EP2AGZ300HF40I3N for PHY-layer processing where its embedded 18x18 multipliers accelerate FFT, channel coding, and MIMO matrix operations. The 298K logic elements handle multiple antenna streams in parallel, while 18.85 Mbit of embedded memory provides the working buffer for soft-decision Viterbi and Turbo decoder paths. Industrial temperature grade supports outdoor radio units and small-cell base stations exposed to uncontrolled thermal environments.
おすすめ
10G/40G Ethernet Bridging
Network aggregation switches use the EP2AGZ300HF40I3N to bridge between 10 GbE SFP+ and 40 GbE QSFP+ ports in hybrid line cards. The 734 user I/O pins accommodate multiple SFI/XFI SERDES lanes and parallel SGMII interfaces to companion switch ASICs, while 18.85 Mbit of memory serves as shared packet buffer. AES-256 bitstream encryption protects firmware from reverse engineering in carrier-grade deployments where tamper-resistance is required.
おすすめ
ASIC Prototyping
ASIC verification teams use the EP2AGZ300HF40I3N as a building block in multi-FPGA prototyping platforms because its 298K LEs approximate mid-range ASIC gate counts. The 1517-FCBGA package supports high-speed debug probe interfaces, while 18.85 Mbit of on-chip memory preserves ASIC SRAM behavior without timing penalties. Industrial temperature grade allows operation in accelerated stress test chambers during bring-up and corner-case validation campaigns.
おすすめ
Radar and Electronic Warfare Signal Processing
Phased-array radar front-ends deploy the EP2AGZ300HF40I3N for beamforming and pulse-compression DSP where 298,000 LEs execute parallel FIR filter chains. The 18.85 Mbit embedded memory buffers raw ADC samples, while 4 PLLs derive the coherent LO clocks required for I/Q demodulation. Industrial temperature range supports ground-mobile and shipboard deployments with extended ambient temperature swings between -40C and +100C.
おすすめ
Medical Imaging Equipment
Ultrasound and CT image reconstruction systems leverage the EP2AGZ300HF40I3N for beamforming and back-projection DSP, where 298K LEs handle 64-channel parallel processing and 18.85 Mbit of embedded memory holds line buffers and coefficient LUTs. The 734 user I/O pins interface multiple LVDS ADC channels (16-bit, 80 MSPS class), while 4 PLLs derive the ADC sample clocks and DDR3 controller clocks for image buffer management. Industrial temperature grade supports portable cart-mounted diagnostic systems.
おすすめ
Industrial Motor Control and Servo Drives
Multi-axis servo drive controllers use the EP2AGZ300HF40I3N to run field-oriented control (FOC) loops across multiple motors simultaneously. The 298K LEs handle parallel current, velocity, and position loops at 32 kHz per axis, while 4 PLLs synchronize switching-frequency PWM generation to encoder feedback. The 734 I/O pins drive high-resolution PWM outputs, capture encoder quadrature inputs, and interface to industrial EtherCAT or PROFIBUS slave controllers.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGZ300HF40I3N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGZ300HF40I3G | EP2AGZ300HF40C3N | EP2AGZ300HF40C4N | EP2AGZ300HF40C4G | EP2AGZ300HF40C3G |
|---|---|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA (HF40) | 1517-BBGA, FCBGA (HF40) - same | 1517-BBGA, FCBGA (HF40) - same | 1517-BBGA, FCBGA (HF40) - same | 1517-BBGA, FCBGA (HF40) - same | 1517-BBGA, FCBGA (HF40) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 298,000 | 298,000 - same | 298,000 - same | 298,000 - same | 298,000 - same | 298,000 - same |
| Embedded Memory (bits) | 18,854,912 | 18,854,912 - same | 18,854,912 - same | 18,854,912 - same | 18,854,912 - same | 18,854,912 - same |
| User I/O Count | 734 | 734 - same | 734 - same | 734 - same | 734 - same | 734 - same |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) - same | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 3 | 3 - same | 3 - same | 4 (slower) | 4 (slower) | 3 - same |
| RoHS / Lead-Free | Lead-free (RoHS) | Lead-free (RoHS) - same | Lead-free (RoHS) - same | Lead-free (RoHS) - same | Lead-free (RoHS) - same | Lead-free (RoHS) - same |
主な差別化要因
- Highest logic density in the Arria II GZ family at 298,000 LEs （vs EP2AGZ225HF40I3N)
- Industrial temperature grade for harsh-environment deployments （vs EP2AGZ300HF40C3N)
- Pin-compatible with faster and slower speed grades for design margin tuning （vs EP2AGZ300HF40C4N)
設計ノート
Estimated: at typical utilization (~70% LEs, ~50% memory toggling at 250 MHz), the EP2AGZ300HF40I3N core consumes approximately 6-9 W from its 0.9 V rail. Add 1.5-2 W for PLL and configuration logic. Design the core supply with at least 25% margin and use a synchronous buck converter with ceramic output caps. Add bulk decoupling (220 uF) on each side of the package and 0.1 uF + 10 nF decoupling at every VCCINT and VCCPD pin pair.
The 1517-ball FCBGA with 1.0 mm pitch requires a high-density interconnect PCB stack-up with laser-drilled microvias for inner-row escape. Use at least a 6-layer stack-up with 2 signal layers above and 2 below the core. Maintain a continuous GND reference plane under all high-speed SERDES and DDR3 traces; split planes around the device create return-path discontinuities that degrade signal integrity above 500 MHz.
Do not assume commercial-temperature parts can substitute directly for industrial builds - the EP2AGZ300HF40C3N will fail above +85C. Likewise, mixing speed grades (C4N vs C3N) within the same timing budget will break timing closure for paths near the fMAX boundary. Always re-run Quartus II fitter and TimeQuest timing analysis when substituting temperature or speed grade.
DDR3 memory interfaces require length-matching within +/-25 mils across the byte lane, with DQS centered to its DQ group. Use the Quartus II pin planner to assign DDR3 pins only from the dedicated DQS/DQ groups; assigning a DQ pin outside its DQS group causes write-capture failures. For LVDS pairs, maintain 100 ohm differential impedance with intra-pair skew below 5 ps.
At 8 W typical dissipation in the HF40 package with theta_JA of approximately 8-10 C/W (depending on PCB design), junction-to-ambient temperature rise is 64-80C. For industrial grade parts rated to +100C ambient, no heatsink is required, but ensure at least 4 thermal vias in the package center ball array and connect to internal GND plane for heat spreading. Forced-air cooling is recommended if chassis ambient exceeds +70C.
コンプライアンス情報
RoHS compliant per Intel product page. Lead-free (Pb-free) per the 'N' suffix in MPN. AEC-Q100 not applicable - FPGAs are typically not AEC-Q100 qualified at the component level; system-level automotive qualification is performed by the integrator. Halogen-free status not stated in provided data - flagged as unknown.
