EP2AGZ350HF40I4G - Arria II GZ FPGA 350K LE | Intel
部品番号: EP2AGZ350HF40I4G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3680 | $36,800.00 |
| 25 | $3520 | $88,000.00 |
| 50 | $3380 | $169,000.00 |
| 100 | $3240 | $324,000.00 |
EP2AGZ350HF40I4G 概要
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that lets designers configure digital logic blocks, routing, and I/O after manufacture. FPGAs sit hierarchically within the broader semiconductor family: FPGA -> programmable logic -> logic ICs -> integrated circuits. Arria II GZ devices use a 40nm process, embed dedicated transceivers, DSP blocks, on-chip memory, and PLL/clock networks, and are SRAM-based so configuration must be loaded from external flash at each power-up.
Key features include transceiver speeds up to 6.375 Gbps supporting CPRI, PCIe Gen1, SATA, and Serial RapidIO, an extensive DSP block fabric for high-precision fixed- and floating-point arithmetic, hard memory controllers, and a rich I/O mix that supports DDR3, LVDS, and SERDES. Industrial-grade parts (I4 suffix) operate from -40C to +100C junction temperature and are Pb-free/RoHS compliant. The device is typically paired with EPCQ configuration memory for autonomous boot.
Architecturally, the Arria II GZ family uses a logic-element granularity optimized for register-rich designs, 8-input adaptive LUTs, dedicated 18x18 multipliers plus hard floating-point DSP blocks, and a clock network with up to 16 PLLs per device. The HF40 (FBGA-1517) package exposes the maximum I/O count and full transceiver count for this die, making it suitable for line-card designs with high I/O and SERDES density.
Typical applications include telecom line cards with CPRI backhaul, military secure communications, video broadcast processing (e.g., 3G-SDI routing), high-channel-count DSP for radar and medical imaging, and ASIC-prototyping platforms that need 350K LEs of headroom. Its combination of transceivers and DSP blocks makes it a common choice for protocol-bridging and baseband processing designs.
Designers should plan power architecture carefully because Arria II GZ FPGAs can draw tens of amps during configuration and dynamic operation; multiple decoupling rails (VCC, VCCA, VCCT, VCCPT) are required. Quartus II software with the Arria II device support is required for synthesis, place-and-route, and timing closure.
ドロップイン代替品: EP2AGZ350HF40I4G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGZ350HF40I4G （同一形状・フットプリント） — 相違点: Package, Logic Elements (LE), RoHS Status, Speed Grade, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGZ350HF40I4N
✅ ドロップイン✓ 在庫あり
$2280 / 個
データシートを見る →EP2AGZ350HF40I3G
✅ ドロップイン✓ 在庫あり
$3565 / 個
データシートを見る →EP2AGZ350HF40I3N
✅ ドロップイン✓ 在庫あり
$1985 / 個
データシートを見る →EP2AGZ300HF40I4G
✅ ドロップイン✓ 在庫あり
$2260 / 個
データシートを見る →EP2AGZ225HF40I4G
✅ ドロップイン✓ 在庫あり
$925 / 個
データシートを見る →EP2AGZ350HF40I4G 最大定格＆電気的特性
| Family | Arria II GZ |
| Logic Elements | 350000 |
| パッケージ | FBGA-1517 (HF40) |
| 動作温度 | -40C to +100C (Industrial, I4 grade) |
| Process Node | 40 nm |
| Configuration Method | SRAM, requires external EPCQ flash |
| Max Transceiver Data Rate | 6.375 Gbps |
| Memory Controller | Hard DDR3 controller |
| Supported Protocols | PCIe Gen1, CPRI, SATA, Serial RapidIO, SFI, 3G-SDI |
| 実装タイプ | Surface Mount (BGA) |
| Pb-Free / RoHS | Compliant |
| Design Software | Quartus II (Arria II device support) |
| Configuration Device | EPCQ (recommended) |
EP2AGZ350HF40I4G fbga-1517 (hf40) ピン配置ガイド
EP2AGZ350HF40I4G (fbga-1517 (hf40) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2AGZ350HF40I4G.
詳細は データシート をご参照ください。
主な用途
EP2AGZ350HF40I4G の用途: 6 件s: Telecom Line Card with CPRI Backhaul, Military Secure Communications, Video Broadcast Processing / 3G-SDI Routing, High-Channel-Count DSP for Radar / Medical Imaging, ASIC Prototyping Platform, PCIe Card for Industrial Servers.
Telecom Line Card with CPRI Backhaul
The EP2AGZ350HF40I4G fits telecom line-card designs because it integrates 6.375 Gbps transceivers that natively support CPRI up to 6.144 Gbps for fronthaul to remote radio heads. Its 350K logic elements accommodate CPRI framing, deframing, and IQ data routing, while the hard DSP fabric handles uplink/downlink baseband filtering and FFT/iFFT blocks. The hard DDR3 controller provides high-bandwidth sample buffering without consuming logic fabric, and the industrial temperature grade (-40C to +100C junction) ensures reliable operation in outdoor base-station enclosures. Compared with general-purpose microcontrollers, this FPGA offloads PHY-layer processing in deterministic hardware with sub-microsecond latency.
おすすめ
Military Secure Communications
The EP2AGZ350HF40I4G is widely deployed in defense and secure communications because the 350K logic capacity supports complex encryption, bulk ciphers, and protocol stacks with room for custom waveforms. The transceivers up to 6.375 Gbps accommodate tactical link standards and proprietary RF data paths, while the industrial temperature grade meets MIL-STD-810 environmental screening at the PCB level. The Arria II GZ family is supported by Quartus II with logic-lock regions, allowing secure module-level IP reuse and partial reconfiguration. Designers benefit from deterministic latency for time-critical crypto offload that microprocessors cannot guarantee.
おすすめ
Video Broadcast Processing / 3G-SDI Routing
The EP2AGZ350HF40I4G supports broadcast video routers because the transceiver set handles multiple 3G-SDI streams at 2.97 Gbps each, with the 350K LE fabric providing cross-point switching, genlock, and ancillary data insertion. Hard DSP blocks process video scaling, color space conversion, and frame-rate conversion in real time without taxing the logic array. The FBGA-1517 (HF40) package exposes sufficient I/O for hundreds of SDI inputs and outputs on a single chip, reducing board complexity. Industrial temperature grade suits 24/7 broadcast plant operation. Designers typically pair the FPGA with external retiming devices to clean up long-reach SDI paths.
おすすめ
High-Channel-Count DSP for Radar / Medical Imaging
The EP2AGZ350HF40I4G suits radar and medical imaging pipelines because the hard DSP blocks accelerate FIR filtering, beamforming, and FFT/iFFT operations in parallel - tasks that would otherwise consume hundreds of general-purpose DSP chips. The 350K logic elements handle control logic, packet formation, and image reconstruction, while the DDR3 controller streams high-bandwidth sample data between the FPGA and external memory. Transceivers move raw sensor data into the device at line rates up to 6.375 Gbps. Industrial temperature grade supports diagnostic imaging carts and outdoor radar installations, where fanless thermal design is required.
おすすめ
ASIC Prototyping Platform
The EP2AGZ350HF40I4G is a common ASIC prototyping target because its 350K logic elements map directly to mid-complexity ASIC netlists, and the abundant transceiver count provides realistic I/O modeling. Quartus II supports multi-FPGA partitioning for designs that exceed 350K LE, with the FBGA-1517 (HF40) package delivering high I/O count for daughter-board connections. Industrial temperature grade lets the same prototype board serve both lab validation and field trials. Designers leverage logic-lock regions to lock per-FPGA blocks, reducing debug time when bridging multiple devices on a prototyping platform.
おすすめ
PCIe Card for Industrial Servers
The EP2AGZ350HF40I4G suits PCIe accelerator cards because it integrates PCIe Gen1 hard IP blocks that operate over the device's transceivers, eliminating external bridge chips. The 350K logic elements host custom accelerators (compression, packet processing, financial analytics) while the DDR3 controller manages large working data sets in external DRAM. Industrial temperature grade supports rack-mounted servers in uncontrolled cooling environments. Compared to GPU-based acceleration, this FPGA offers deterministic latency and lower per-watt performance for many integer and fixed-point workloads, especially streaming data pipelines.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGZ350HF40I4G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGZ350HF40I4N | EP2AGZ350HF40I3G | EP2AGZ350HF40I3N | EP2AGZ300HF40I4G | EP2AGZ225HF40I4G |
|---|---|---|---|---|---|---|
| Package | FBGA-1517 (HF40) | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 350K | 350K (identical) | 350K | 350K | 300K (-14%) | 225K (-36%) |
| Speed Grade | I4 (fastest) | I4 (fastest) | I3 (10-15% slower Fmax) | I3 (10-15% slower Fmax) | I4 | I4 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Transceiver Speed | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ |
| Packaging Format | G (Pb-free tray) | N (Pb-free tape-and-reel) | G (Pb-free tray) | N (Pb-free tape-and-reel) | G (Pb-free tray) | G (Pb-free tray) |
| Typical 1-Unit Price (USD, as of 2026-09-08) | 3850.00 | ~3850.00 | ~3500.00 | ~3500.00 | ~2750.00 | ~1950.00 |
主な差別化要因
- Highest LE density in FBGA-1517 (HF40) package with I4 speed grade （vs EP2AGZ300HF40I4G)
- Fastest speed grade in Arria II GZ HF40 family （vs EP2AGZ350HF40I3G)
- Same pin-compatible footprint as the entire Arria II GZ HF40 family （vs EP2AGZ225HF40I4G)
設計ノート
Arria II GZ FPGAs require multiple separate supply rails (VCCINT, VCCA, VCCPT, VCCT, VCCIO banks) with strict sequencing and monotonic ramp. Estimated: at typical utilization a fully-loaded 350K LE design can draw 15-25A on VCCINT plus several amps on transceiver supplies. Use a multi-rail controller with parallel load switches and a 50ms or longer POR delay. Bulk decoupling of at least 4x470uF polymer plus 22uF/0.1uF ceramic per rail is recommended. Voltage droop on VCCINT during configuration can cause configuration failures - check the PowerPlay early-power estimator in Quartus II before committing to a design.
The FBGA-1517 (HF40) package requires a heatsink or top-side heat-spreader for industrial temperature operation at high utilization. Estimated: the package theta-JA is roughly 0.5-0.8 C/W with a 6x6 cm FR4 board and minimal airflow, but the die's hotspot-to-case thermal resistance is much higher than the package value, so case-attach measurement is essential. Without airflow, expect to derate to 70-80% of rated logic activity. Place 8-12 thermal vias in the central ball-grid array under the die and use a 1oz copper pour on inner layers to spread heat to a top-side heatsink.
The FBGA-1517 (HF40) ball pitch is 1.0 mm. Use a stack-up with at least 8 layers to fan out BGA signals; microvia (laser-drilled) stack-up is mandatory for clean escape routing. Each transceiver lane requires matched-length routing with skew control under 5 ps; place AC-coupling capacitors within 8 mm of the receiver balls. Differential pairs must be 100 ohm differential with controlled-impedance trace geometry validated with a 3D EM solver. Use the Arria II GZ device handbook ball-out table to plan the breakout before schematic capture.
Three common pitfalls for Arria II GZ designs: (1) selecting a smaller density device (e.g., 225K LE) after synthesis but before place-and-route - utilization peaks during routing and the design may fail to fit; reserve 15-25% headroom. (2) Forgetting to specify the MSEL pins correctly - they select the configuration mode and must be tied to the correct voltage for FPP or AS mode. (3) Using too-small configuration memory - EPCQ64 supports up to a 64-Mbit config stream; larger designs may need EPCQ128 or EPCQ256.
コンプライアンス情報
Pb-free per the G suffix in the MPN. RoHS compliance verified by the G suffix in Altera/Intel MPN encoding. Not AEC-Q100 qualified (FPGA used as industrial/commercial component).
