EP2S30F484I5N - Stratix II FPGA 33,880 LE FC-FBGA-484 | Intel
部品番号: EP2S30F484I5N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP2S30F484I5N 概要
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) within the broader integrated circuit taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs combine configurable logic blocks (LCLBs / ALMs), programmable routing, embedded memory blocks (M4K/M512), DSP blocks, and high-speed I/O transceivers, allowing designers to implement custom digital signal processing, control, and interconnect functions that are re-programmable in-system. The Stratix II family specifically introduced the ALM (Adaptive Logic Module) architecture that improves logic packing efficiency over the original Stratix ALM-predecessor ALMs and made the family well-suited for ASIC prototyping and high-performance DSP.
Key features of the EP2S30F484I5N include 33,880 logic elements, 13,552 Adaptive Logic Modules (ALMs), up to 1,369,728 bits of embedded memory, dedicated DSP blocks for high-throughput multipliers, multi-gigabit transceiver support on equivalent package variants, and a flexible I/O structure supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The FC-FBGA-484 package exposes 484 balls in a fine-pitch array that supports high I/O count and short signal paths for high-speed designs.
Architecturally, Stratix II FPGAs use a 90 nm, 1.2 V CMOS process with 9-layer routing, dedicated on-chip termination (OCT), and a structured ASIC-like column-based DSP and memory layout. The internal TriMatrix memory subsystem supports three memory block sizes (M512, M4K, M-RAM) optimized for different buffer and lookup table applications. The 33,880-LE device sits in the mid-density tier of the Stratix II family (below EP2S60, EP2S90, EP2S130, EP2S180), making it appropriate for designs that need more capacity than Cyclone II but less than the largest Stratix II.
Typical applications include ASIC prototyping, high-speed digital signal processing, telecom baseband processing, video and image processing pipelines, military and aerospace signal processing, and industrial control systems. The -I5N industrial temperature grade (-40C to +100C ambient, +125C junction) supports designs that must operate in harsh thermal environments such as outdoor telecom, transportation, and defense systems.
When designing with the EP2S30F484I5N, plan the power distribution network carefully: Stratix II devices can exceed 20 W in high-utilization designs, requiring a multi-rail core and I/O supply with extensive decoupling. Use the Altera/Intel Quartus II design software (legacy versions support Stratix II) for synthesis, place-and-route, power analysis, and timing closure. Verify signal integrity on the FC-FBGA-484 footprint using controlled-impedance traces and matched-length routing, especially for DDR memory interfaces.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: EP2S30F484I5N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2S30F484I5N （同一形状・フットプリント） — 相違点: Speed Grade, Package, Maximum Internal Frequency, PLLs, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP2S30F484I4N
✅ ドロップイン✓ 在庫あり
$305 / 個
データシートを見る →EP2S30F484C5N
✅ ドロップイン✓ 在庫あり
$367.48 / 個
データシートを見る →EP2S30F484C4N
✅ ドロップイン✓ 在庫あり
$480 / 個
データシートを見る →EP2S30F484C3N
✅ ドロップイン✓ 在庫あり
$797.9622 / 個
データシートを見る →EP2S15F484C5N
✅ ドロップイン✓ 在庫あり
$144.8 / 個
データシートを見る →EP2S30F484I5N 最大定格＆電気的特性
| Family | Stratix II |
| Logic Elements | 33,880 |
| Adaptive Logic Modules (ALMs) | 13,552 |
| Maximum Operating Frequency | 609.76 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| パッケージ | 484-ball FC-FBGA |
| Number of Pins/Balls | 484 |
| Speed Grade | I5 (industrial) |
| Temperature Grade | Industrial (-40C to +100C ambient) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| Cell Count | 33,880 cells |
EP2S30F484I5N 484-ball fc-fbga ピン配置ガイド
EP2S30F484I5N (484-ball fc-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2S30F484I5N.
詳細は データシート をご参照ください。
主な用途
EP2S30F484I5N の用途: 6 件s: ASIC Prototyping, Telecom Baseband Processing, High-Speed Digital Signal Processing (DSP), Video and Image Processing, Industrial Control Systems, Military and Aerospace Signal Processing.
ASIC Prototyping
The EP2S30F484I5N's 33,880 logic elements, 1,369 Kbits of embedded memory, and DSP blocks make it a strong ASIC prototyping vehicle. Mid-density designs (e.g., a complete SoC subsystem with processor cores, peripherals, and interconnect fabric) map efficiently to this device with margin for design-for-test and debug instrumentation. The industrial temperature grade ensures validation of prototypes that will deploy in harsh environments. Quartus II provides ASIC prototype flows including partitioning across multiple FPGAs and gate-level netlist ingestion. Compared with simulation, real-time FPGA prototyping reveals timing bugs and integration issues that pure simulation misses.
おすすめ
Telecom Baseband Processing
Telecommunication baseband processing demands parallel DSP throughput, and the EP2S30F484I5N delivers this through dedicated DSP blocks and 13,552 ALMs. With 33,880 logic elements and high embedded memory bandwidth, the device can implement multiple channels of QAM/QPSK modulation, channel coding (Viterbi, Turbo), and FFT/iFFT pipelines. The FC-FBGA-484 package provides sufficient I/O for parallel LVDS data paths to companion ADCs/DACs. Industrial temperature grade supports outdoor base station and backhaul equipment. Designers typically pair this device with a high-speed ADC such as the AD9230 for receive paths and a DAC such as the AD9779 for transmit paths.
おすすめ
High-Speed Digital Signal Processing (DSP)
The EP2S30F484I5N's dedicated DSP blocks implement hardened 18x18 multipliers and accumulator chains that accelerate FIR filters, FFTs, and matrix operations. With 33,880 logic elements, the device handles parallel DSP pipelines used in radar, sonar, software-defined radio, and medical imaging systems. The 1.2 V core and 90 nm process provide a favorable performance-per-watt ratio for portable DSP applications. Designers typically use the Altera DSP Builder tool to translate MATLAB/Simulink DSP designs into optimized FPGA implementations. Industrial temperature grade allows deployment in field-deployed radar and remote sensing systems.
おすすめ
Video and Image Processing
Video processing pipelines for broadcast, surveillance, and machine vision require large amounts of parallel logic and embedded memory - exactly the EP2S30F484I5N's strengths. The 33,880 logic elements and TriMatrix memory (M512/M4K/M-RAM blocks) support real-time HD video processing including scaling, deinterlacing, color space conversion, and motion estimation. The device interfaces to external DDR/DDR2 memory via dedicated PHY blocks for frame buffering. The 484-ball FC-FBGA exposes enough LVDS pairs for parallel camera interfaces (Camera Link) and HDMI/DVI connectivity through external bridge chips.
おすすめ
Industrial Control Systems
Industrial control applications including PLCs, motor drives, and SCADA systems benefit from the EP2S30F484I5N's industrial temperature range, robust I/O standards, and flexible logic capacity. The 33,880 logic elements handle multi-axis motor control loops (FOC, PWM generation, encoder feedback) and complex communication protocols (EtherCAT, PROFINET, Modbus). The FC-FBGA-484 package supports 12 I/O banks with mix-and-match voltage standards, simplifying interfaces to legacy 5V and modern 3.3V/2.5V peripherals. The 90 nm process and 1.2 V core deliver predictable performance across the industrial temperature range of -40C to +100C.
おすすめ
Military and Aerospace Signal Processing
The EP2S30F484I5N's industrial temperature grade (-40C to +100C ambient, +125C junction) and rugged FC-FBGA-484 packaging make it suitable for military and aerospace signal processing applications including electronic warfare, radar, and secure communications. With 33,880 logic elements and high DSP throughput, the device implements channelized receivers, matched filters, and cryptographic accelerators. Designers targeting defense programs should verify part qualification status with the manufacturer; some military programs require specific part screening beyond the standard industrial grade. Lead times and obsolescence planning are critical - the NRND status of Stratix II requires proactive migration planning.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2S30F484I5N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2S30F484I4N | EP2S30F484C5N | EP2S30F484C4N | EP2S30F484C3N | EP2S15F484C5N |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-484 | FC-FBGA-484 (same) | FC-FBGA-484 (same) | FC-FBGA-484 (same) | FC-FBGA-484 (same) | FC-FBGA-484 (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 15,600 |
| Adaptive Logic Modules | 13,552 | 13,552 | 13,552 | 13,552 | 13,552 | 6,240 |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | I5 | I4 (faster) | C5 | C4 (faster) | C3 (fastest) | C5 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
主な差別化要因
- Industrial temperature grade option in same package （vs EP2S30F484C5N)
- Mid-density capacity with industrial temperature grade （vs EP2S15F484C5N)
- Slower speed bin (I5) for cost reduction （vs EP2S30F484I4N)
設計ノート
Stratix II FPGAs can exceed 20 W in high-utilization designs. Use the Quartus II PowerPlay Power Analyzer early in the design flow to estimate worst-case power dissipation, then plan a thermal solution (heatsink, thermal vias, or forced airflow) accordingly. The FC-FBGA-484 package's exposed die (flip-chip construction) provides a direct thermal path; the PCB top layer thermal via array under the package should be sized for the target theta-JA. Industrial temperature grade parts are rated for -40C to +100C ambient and +125C junction.
The FC-FBGA-484 package uses a 1.0 mm ball pitch with controlled-impedance signal paths required for high-speed LVDS and DDR interfaces. Use 4 to 6 PCB layers minimum with continuous ground and power planes adjacent to the BGA fanout. Fanout traces should escape between BGA balls using via-in-pad or dog-bone patterns; verify with the Stratix II device handbook's recommended PCB design guidelines. Decoupling capacitors (0.1 uF, 1 uF, and bulk 22-47 uF) must be placed close to each power pin per the Pin Connection Guidelines.
The 'I5' suffix indicates an industrial temperature grade in the slowest speed bin. If timing closure fails, consider moving to an I4 or C4 speed grade (EP2S30F484I4N or EP2S30F484C4N) without changing PCB layout. Additionally, verify that Quartus II (legacy version) is the design software - modern Quartus Prime releases do NOT support Stratix II. For new designs, consider migrating to Cyclone IV or Stratix IV to avoid legacy tool dependency and end-of-life risk.
コンプライアンス情報
RoHS compliant per 'N' suffix in MPN and per Altera/Intel product documentation. Industrial temperature grade (-40C to +100C) per 'I' prefix in speed grade. AEC-Q100 not applicable as this is an FPGA rather than an automotive-grade IC.