EP2S90F1508I4N - 90nm Stratix II FPGA, 90960 LE, 1508-FBGA | Intel
部品番号: EP2S90F1508I4N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $335 | $167,500.00 |
| 1,000 | $310 | $310,000.00 |
EP2S90F1508I4N 概要
A Field-Programmable Gate Array (FPGA) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. Modern high-density FPGAs like the Stratix II sit in the system hierarchy as reconfigurable computing fabric between general-purpose microcontrollers and fixed-function ASICs, delivering ASIC-like performance with the time-to-market advantage of full hardware reprogrammability. The Stratix II family specifically introduced the ALM (Adaptive Logic Module) architecture, replacing traditional 4-input LUTs with 8-input fracturable LUTs to improve logic packing efficiency.
Key features of the EP2S90F1508I4N include up to 12 embedded DSP blocks optimized for high-speed multiply-accumulate operations, support for external memory interfaces including DDR, DDR2, QDR, and QDRII SRAM, dedicated clock management with up to 12 PLLs, and Stratix II's signature high-speed transceiver capability via the device's high-performance I/O structure. The device consumes core voltage of 1.2 V with auxiliary supply rails for I/O banks, enabling flexible mixed-voltage system design.
Architecturally, the Stratix II family adopts a row-based layout with LABs (Logic Array Blocks) of 10 ALMs each, separated by dedicated memory and DSP columns. This column-based architecture provides predictable timing for memory and DSP operations, while the global/local routing hierarchy supports both high-fanout and high-speed datapath nets. The 90 nm process node delivered a 50% performance uplift over the previous Stratix generation at comparable logic density.
Typical applications include high-performance digital signal processing, telecom baseband and line-card processing, high-speed serial protocol bridging, ASIC prototyping and emulation, video processing and broadcast equipment, military and aerospace signal processing, and high-end test and measurement instrumentation. The 1508-BGA package supports board designs requiring maximum logic density with extensive external I/O for parallel bus architectures.
When designing with the EP2S90F1508I4N, pay particular attention to power architecture - the high logic count combined with 902 user I/Os requires robust multi-rail decoupling and thermal management. The exposed-die FC-FBGA package has a low junction-to-ambient thermal resistance on standard PCB stack-ups but demands proper airflow or heatsinking for sustained high utilization.
This page synthesizes drop-in alternatives, real-time distributor pricing, and practical design notes not found in the manufacturer datasheet alone, helping engineers shorten the sourcing and validation cycle for legacy and current Stratix II designs.
ドロップイン代替品: EP2S90F1508I4N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2S90F1508I4N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Mounting Type, Family, Configuration Method.
クイック比較ツール — 並列比較する代替部品を選択:
EP2S90F1508I4
✅ ドロップイン✓ 在庫あり
$3525.1 / 個
データシートを見る →EP2S90F1508C4N
✅ ドロップイン✓ 在庫あり
$1390 / 個
データシートを見る →EP2S90F1508C5N
✅ ドロップイン✓ 在庫あり
$3780 / 個
データシートを見る →EP2S90F1508C3N
✅ ドロップイン✓ 在庫あり
$3200 / 個
データシートを見る →EP2S130F1508I4N
✅ ドロップイン✓ 在庫あり
$1390 / 個
データシートを見る →EP2S180F1508I4N
✅ ドロップイン✓ 在庫あり
$445 / 個
データシートを見る →EP2S130F1508I4
✅ ドロップイン✓ 在庫あり
$3950 / 個
データシートを見る →EP2S90F1508I4N 最大定格＆電気的特性
| Family | Stratix II |
| Logic Elements | 90,960 |
| Embedded Memory Bits | 4,520,488 |
| Maximum User I/O | 902 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| パッケージ | 1508-BBGA (FC-FBGA), Fine-pitch |
| Package Pin Count | 1508 |
| 動作温度 | -40C to +100C (Industrial, I4 grade) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| Configuration Method | Passive Serial / FPP / JTAG / PPA |
| DSP Blocks | Embedded multiplier/accumulator blocks (Stratix II ALM-based) |
| Memory Interface Support | DDR, DDR2, QDR, QDRII SRAM |
| PLL Count | Up to 12 PLLs (device-family level) |
EP2S90F1508I4N 1508 ピン配置ガイド
EP2S90F1508I4N (1508 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2S90F1508I4N.
詳細は データシート をご参照ください。
主な用途
EP2S90F1508I4N の用途: 6 件s: Telecom Line-Card and Baseband Processing, High-Performance DSP and Radar Signal Processing, ASIC Prototyping and Emulation, Broadcast Video Processing and Encoding, Military and Aerospace Signal Processing, High-End Test and Measurement Instrumentation.
Telecom Line-Card and Baseband Processing
The EP2S90F1508I4N fits telecom line-card processing because its 90,960 logic elements and 4,520,488 bits of embedded memory can implement multi-channel framer, MAC, and traffic-management datapaths in a single device. The 902 user I/Os exposed by the 1508-BGA package directly drive parallel SFI/XFI backplane interfaces without external buffer chips, reducing BOM and signal-integrity risk. Dedicated DDR/DDR2 memory controllers interface to external TCAM/QDR for route-table lookup at line rate. Industrial temperature grade supports outdoor cabinet deployments.
おすすめ
High-Performance DSP and Radar Signal Processing
The EP2S90F1508I4N suits high-performance DSP because its embedded multiplier/accumulator blocks implement FFT, FIR, and matrix operations at hundreds of MSPS, while the Stratix II ALM architecture provides the control logic and state machines around them. The 1508-BGA package enables dense board layouts where the FPGA is paired with high-speed ADCs/DACs. The -40C to +100C industrial temperature range supports defense, radar, and SIGINT deployments where commercial-grade parts would fail.
おすすめ
ASIC Prototyping and Emulation
The EP2S90F1508I4N works for ASIC prototyping because 90,960 LEs map a moderate-complexity ASIC (roughly 2-3 million gates of synthesized logic) with predictable timing through the Quartus II TimeQuest closure flow. The 902 user I/Os of the 1508-BGA package expose the full prototype ASIC pinout, while the 1.2 V core voltage and Stratix II ALM fabric emulate target ASIC timing behavior closely. Multiple EP2S90 devices can be partitioned across a large ASIC prototype board.
おすすめ
Broadcast Video Processing and Encoding
The EP2S90F1508I4N addresses broadcast video because its parallel processing fabric handles SD/HD/3G-SDI multi-stream pipelines, while the 4.4 Mbit embedded memory buffers video frames at line-rate without external SDRAM pressure. The 902 user I/Os of the 1508-BGA expose multiple SDI transceiver channels, GPIO for control, and high-speed parallel video interfaces. The industrial temperature grade supports outdoor broadcast head-end and mobile production environments.
おすすめ
Military and Aerospace Signal Processing
The EP2S90F1508I4N is suitable for military and aerospace applications because the industrial -40C to +100C temperature grade meets MIL-STD-810 environmental requirements and supports avionics, EW (electronic warfare), and SIGINT platforms. The high logic density of 90,960 LEs in the 1508-BGA package supports complex channelized receiver designs, while Altera's mature Quartus II toolchain with DO-254 certification evidence accelerates airworthiness qualification.
おすすめ
High-End Test and Measurement Instrumentation
The EP2S90F1508I4N enables high-end test instrumentation because its 90,960 LEs and 902 user I/Os implement deep pattern generators, BERT (bit-error-rate tester) cores, and protocol-aware stimulus/response engines in a single device. The dedicated PLL count supports multiple synchronized clock domains required by high-speed serial protocols (PCIe, SATA, USB 3.0). Industrial temperature grade ensures measurement accuracy in lab and field environments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2S90F1508I4N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2S90F1508I4 | EP2S90F1508C4N | EP2S90F1508C5N | EP2S130F1508I4N | EP2S180F1508I4N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-BGA (FC-FBGA) | 1508-BGA (FC-FBGA) - same | 1508-BGA (FC-FBGA) - same | 1508-BGA (FC-FBGA) - same | 1508-BGA (FC-FBGA) - same | 1508-BGA (FC-FBGA) - same |
| Logic Elements | 90,960 LE | 90,960 LE | 90,960 LE | 90,960 LE | 130,560 LE | 179,400 LE |
| Embedded Memory | 4,520,488 bits | 4,520,488 bits | 4,520,488 bits | 4,520,488 bits | 6,747,840 bits | 9,383,040 bits |
| User I/O | 902 | 902 | 902 | 902 | 886 | 886 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I4 | I4 | C4 | C5 (faster) | I4 | I4 |
| RoHS Suffix (N) | Yes (Pb-free) | No (legacy non-N suffix) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
主な差別化要因
- Highest-density package in the EP2S90 device family （vs EP2S90F1020C4N (1020-BGA package))
- Industrial temperature grade for harsh environments （vs EP2S90F1508C4N (commercial grade))
- Direct upward migration path within same 1508-BGA footprint （vs EP2S130F1508I4N (higher-density Stratix II))
設計ノート
The EP2S90F1508I4N requires multiple power rails: 1.2 V core (VCC), 2.5 V auxiliary (VCCAUX), and per-bank VCCIO for I/O voltage flexibility (1.2 V to 3.3 V). Decoupling must follow Altera's Stratix II PDN (Power Distribution Network) guideline: bulk capacitors on each rail within 1 inch of the BGA, plus 0.1 uF and 0.01 uF high-frequency ceramics distributed under the device. The 90,960-LE device can draw 3-5 W at typical utilization and significantly more at peak logic activity; budget power supply headroom accordingly.
The FC-FBGA 1508-ball package exposes the silicon die directly to the PCB for thermal conduction. At maximum utilization, junction temperature can approach 95C with industrial-grade headroom. Use thermal vias in the BGA land pattern to conduct heat into inner PCB copper planes, and consider a heatsink with thermal interface material for >70C ambient deployments. Verify with the Stratix II thermal modeling spreadsheet published by Altera.
The 1508-ball FC-FBGA requires a high-density PCB stack-up: minimum 4-6-4 layer count with sub-1.0mm BGA pitch escape routing, microvia (laser-drilled) technology, and controlled-impedance layers for high-speed differential pairs (LVDS, DDR). Use the Altera-provided BGA escape pattern in the device handbook's pinout file. Assign JTAG pins (TCK, TMS, TDI, TDO, TRST) to convenient board test points for in-system programming access.
Common design mistakes with the EP2S90F1508I4N include: (1) using the wrong configuration mode - the device defaults to Passive Serial; for fast system boot, use Fast Passive Parallel (FPP) with a parallel flash; (2) leaving unused I/O pins floating - they must be set to inputs with weak pull-ups or driven to a defined state per Quartus II pin planner; (3) underestimating configuration time for 4 Mbit+ bitstreams - budget 200-500 ms for FPP from parallel flash.
コンプライアンス情報
RoHS compliant per the 'N' suffix designation in the Altera/Intel part numbering convention. AEC-Q100 is not applicable for FPGAs (this standard targets automotive-grade ICs); industrial temperature grade (-40C to +100C) is met instead. Halogen-free status not explicitly stated in the verified data.
