EP2S90F1508I4N - 90nm Stratix II FPGA, 90960 LE, 1508-FBGA | Intel
부품 번호: EP2S90F1508I4N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $335 | $167,500.00 |
| 1,000 | $310 | $310,000.00 |
EP2S90F1508I4N 개요
A Field-Programmable Gate Array (FPGA) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. Modern high-density FPGAs like the Stratix II sit in the system hierarchy as reconfigurable computing fabric between general-purpose microcontrollers and fixed-function ASICs, delivering ASIC-like performance with the time-to-market advantage of full hardware reprogrammability. The Stratix II family specifically introduced the ALM (Adaptive Logic Module) architecture, replacing traditional 4-input LUTs with 8-input fracturable LUTs to improve logic packing efficiency.
Key features of the EP2S90F1508I4N include up to 12 embedded DSP blocks optimized for high-speed multiply-accumulate operations, support for external memory interfaces including DDR, DDR2, QDR, and QDRII SRAM, dedicated clock management with up to 12 PLLs, and Stratix II's signature high-speed transceiver capability via the device's high-performance I/O structure. The device consumes core voltage of 1.2 V with auxiliary supply rails for I/O banks, enabling flexible mixed-voltage system design.
Architecturally, the Stratix II family adopts a row-based layout with LABs (Logic Array Blocks) of 10 ALMs each, separated by dedicated memory and DSP columns. This column-based architecture provides predictable timing for memory and DSP operations, while the global/local routing hierarchy supports both high-fanout and high-speed datapath nets. The 90 nm process node delivered a 50% performance uplift over the previous Stratix generation at comparable logic density.
Typical applications include high-performance digital signal processing, telecom baseband and line-card processing, high-speed serial protocol bridging, ASIC prototyping and emulation, video processing and broadcast equipment, military and aerospace signal processing, and high-end test and measurement instrumentation. The 1508-BGA package supports board designs requiring maximum logic density with extensive external I/O for parallel bus architectures.
When designing with the EP2S90F1508I4N, pay particular attention to power architecture - the high logic count combined with 902 user I/Os requires robust multi-rail decoupling and thermal management. The exposed-die FC-FBGA package has a low junction-to-ambient thermal resistance on standard PCB stack-ups but demands proper airflow or heatsinking for sustained high utilization.
This page synthesizes drop-in alternatives, real-time distributor pricing, and practical design notes not found in the manufacturer datasheet alone, helping engineers shorten the sourcing and validation cycle for legacy and current Stratix II designs.
드롭인 대체품: EP2S90F1508I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S90F1508I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Mounting Type, Family, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S90F1508I4
✅ 드롭인✓ 재고 있음
$3525.1 / 개
데이터시트 보기 →EP2S90F1508C4N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S90F1508C5N
✅ 드롭인✓ 재고 있음
$3780 / 개
데이터시트 보기 →EP2S90F1508C3N
✅ 드롭인✓ 재고 있음
$3200 / 개
데이터시트 보기 →EP2S130F1508I4N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S180F1508I4N
✅ 드롭인✓ 재고 있음
$445 / 개
데이터시트 보기 →EP2S130F1508I4
✅ 드롭인✓ 재고 있음
$3950 / 개
데이터시트 보기 →EP2S90F1508I4N 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements | 90,960 |
| Embedded Memory Bits | 4,520,488 |
| Maximum User I/O | 902 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| 패키지 | 1508-BBGA (FC-FBGA), Fine-pitch |
| Package Pin Count | 1508 |
| 동작 온도 | -40C to +100C (Industrial, I4 grade) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| Configuration Method | Passive Serial / FPP / JTAG / PPA |
| DSP Blocks | Embedded multiplier/accumulator blocks (Stratix II ALM-based) |
| Memory Interface Support | DDR, DDR2, QDR, QDRII SRAM |
| PLL Count | Up to 12 PLLs (device-family level) |
EP2S90F1508I4N 1508 핀 구성 가이드
EP2S90F1508I4N(1508 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S90F1508I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S90F1508I4N 적합 용도: 6 애플리케이션s: Telecom Line-Card and Baseband Processing, High-Performance DSP and Radar Signal Processing, ASIC Prototyping and Emulation, Broadcast Video Processing and Encoding, Military and Aerospace Signal Processing, High-End Test and Measurement Instrumentation.
Telecom Line-Card and Baseband Processing
The EP2S90F1508I4N fits telecom line-card processing because its 90,960 logic elements and 4,520,488 bits of embedded memory can implement multi-channel framer, MAC, and traffic-management datapaths in a single device. The 902 user I/Os exposed by the 1508-BGA package directly drive parallel SFI/XFI backplane interfaces without external buffer chips, reducing BOM and signal-integrity risk. Dedicated DDR/DDR2 memory controllers interface to external TCAM/QDR for route-table lookup at line rate. Industrial temperature grade supports outdoor cabinet deployments.
추천
High-Performance DSP and Radar Signal Processing
The EP2S90F1508I4N suits high-performance DSP because its embedded multiplier/accumulator blocks implement FFT, FIR, and matrix operations at hundreds of MSPS, while the Stratix II ALM architecture provides the control logic and state machines around them. The 1508-BGA package enables dense board layouts where the FPGA is paired with high-speed ADCs/DACs. The -40C to +100C industrial temperature range supports defense, radar, and SIGINT deployments where commercial-grade parts would fail.
추천
ASIC Prototyping and Emulation
The EP2S90F1508I4N works for ASIC prototyping because 90,960 LEs map a moderate-complexity ASIC (roughly 2-3 million gates of synthesized logic) with predictable timing through the Quartus II TimeQuest closure flow. The 902 user I/Os of the 1508-BGA package expose the full prototype ASIC pinout, while the 1.2 V core voltage and Stratix II ALM fabric emulate target ASIC timing behavior closely. Multiple EP2S90 devices can be partitioned across a large ASIC prototype board.
추천
Broadcast Video Processing and Encoding
The EP2S90F1508I4N addresses broadcast video because its parallel processing fabric handles SD/HD/3G-SDI multi-stream pipelines, while the 4.4 Mbit embedded memory buffers video frames at line-rate without external SDRAM pressure. The 902 user I/Os of the 1508-BGA expose multiple SDI transceiver channels, GPIO for control, and high-speed parallel video interfaces. The industrial temperature grade supports outdoor broadcast head-end and mobile production environments.
추천
Military and Aerospace Signal Processing
The EP2S90F1508I4N is suitable for military and aerospace applications because the industrial -40C to +100C temperature grade meets MIL-STD-810 environmental requirements and supports avionics, EW (electronic warfare), and SIGINT platforms. The high logic density of 90,960 LEs in the 1508-BGA package supports complex channelized receiver designs, while Altera's mature Quartus II toolchain with DO-254 certification evidence accelerates airworthiness qualification.
추천
High-End Test and Measurement Instrumentation
The EP2S90F1508I4N enables high-end test instrumentation because its 90,960 LEs and 902 user I/Os implement deep pattern generators, BERT (bit-error-rate tester) cores, and protocol-aware stimulus/response engines in a single device. The dedicated PLL count supports multiple synchronized clock domains required by high-speed serial protocols (PCIe, SATA, USB 3.0). Industrial temperature grade ensures measurement accuracy in lab and field environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S90F1508I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S90F1508I4 | EP2S90F1508C4N | EP2S90F1508C5N | EP2S130F1508I4N | EP2S180F1508I4N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-BGA (FC-FBGA) | 1508-BGA (FC-FBGA) - same | 1508-BGA (FC-FBGA) - same | 1508-BGA (FC-FBGA) - same | 1508-BGA (FC-FBGA) - same | 1508-BGA (FC-FBGA) - same |
| Logic Elements | 90,960 LE | 90,960 LE | 90,960 LE | 90,960 LE | 130,560 LE | 179,400 LE |
| Embedded Memory | 4,520,488 bits | 4,520,488 bits | 4,520,488 bits | 4,520,488 bits | 6,747,840 bits | 9,383,040 bits |
| User I/O | 902 | 902 | 902 | 902 | 886 | 886 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I4 | I4 | C4 | C5 (faster) | I4 | I4 |
| RoHS Suffix (N) | Yes (Pb-free) | No (legacy non-N suffix) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
주요 차별점
- Highest-density package in the EP2S90 device family (vs EP2S90F1020C4N (1020-BGA package))
- Industrial temperature grade for harsh environments (vs EP2S90F1508C4N (commercial grade))
- Direct upward migration path within same 1508-BGA footprint (vs EP2S130F1508I4N (higher-density Stratix II))
설계 노트
The EP2S90F1508I4N requires multiple power rails: 1.2 V core (VCC), 2.5 V auxiliary (VCCAUX), and per-bank VCCIO for I/O voltage flexibility (1.2 V to 3.3 V). Decoupling must follow Altera's Stratix II PDN (Power Distribution Network) guideline: bulk capacitors on each rail within 1 inch of the BGA, plus 0.1 uF and 0.01 uF high-frequency ceramics distributed under the device. The 90,960-LE device can draw 3-5 W at typical utilization and significantly more at peak logic activity; budget power supply headroom accordingly.
The FC-FBGA 1508-ball package exposes the silicon die directly to the PCB for thermal conduction. At maximum utilization, junction temperature can approach 95C with industrial-grade headroom. Use thermal vias in the BGA land pattern to conduct heat into inner PCB copper planes, and consider a heatsink with thermal interface material for >70C ambient deployments. Verify with the Stratix II thermal modeling spreadsheet published by Altera.
The 1508-ball FC-FBGA requires a high-density PCB stack-up: minimum 4-6-4 layer count with sub-1.0mm BGA pitch escape routing, microvia (laser-drilled) technology, and controlled-impedance layers for high-speed differential pairs (LVDS, DDR). Use the Altera-provided BGA escape pattern in the device handbook's pinout file. Assign JTAG pins (TCK, TMS, TDI, TDO, TRST) to convenient board test points for in-system programming access.
Common design mistakes with the EP2S90F1508I4N include: (1) using the wrong configuration mode - the device defaults to Passive Serial; for fast system boot, use Fast Passive Parallel (FPP) with a parallel flash; (2) leaving unused I/O pins floating - they must be set to inputs with weak pull-ups or driven to a defined state per Quartus II pin planner; (3) underestimating configuration time for 4 Mbit+ bitstreams - budget 200-500 ms for FPP from parallel flash.
규정 준수 정보
RoHS compliant per the 'N' suffix designation in the Altera/Intel part numbering convention. AEC-Q100 is not applicable for FPGAs (this standard targets automotive-grade ICs); industrial temperature grade (-40C to +100C) is met instead. Halogen-free status not explicitly stated in the verified data.
