EP2SGX130GF1508I4N - Stratix II GX FPGA 132K LE 1508-FCBGA | Intel
部品番号: EP2SGX130GF1508I4N ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2380 | $238,000.00 |
| 250 | $2210 | $552,500.00 |
| 500 | $2050 | $1,025,000.00 |
EP2SGX130GF1508I4N 概要
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated DSP blocks, and on-chip memory that an engineer can re-program in the field after manufacturing. FPGAs sit between general-purpose microcontrollers (software-defined, slower) and application-specific integrated circuits (ASICs, fixed-function, highest performance). The Stratix II GX family extends the generic Stratix II architecture with embedded multi-gigabit transceivers, hardening the device for serial connectivity standards such as PCIe, Serial RapidIO, Gigabit Ethernet, and custom backplane links.
Key features include 6,627 Adaptive Logic Modules (ALMs), dedicated 18x18 multipliers and DSP blocks, TriMatrix embedded memory with up to 6.75 Mbits, eight phase-locked loops (PLLs), and embedded transceiver channels supporting data rates up to 6.375 Gbps. Configuration is supported via passive serial, fast passive parallel, and JTAG modes, and design entry uses the Quartus II development toolchain. The -I4N speed/temperature grade denotes an industrial temperature range and a fast speed bin.
Typical applications include high-speed serial interface bridging, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and high-performance DSP compute nodes. The 1508-ball FCBGA package exposes enough I/O and transceiver channels for multi-port line-card designs where board area is constrained but pin density is essential.
When designing with this device, ensure the PCB stackup can handle the FCBGA ball pitch and provides matched-impedance routing for the transceiver channels. Power sequencing must follow the datasheet ramp order to avoid in-rush damage, and the JTAG chain should be accessible for boundary-scan and in-system programming.
This page synthesizes distributor pricing, package options, and design guidance for engineers evaluating the EP2SGX130GF1508I4N against other Stratix II GX variants and competing high-density FPGAs.
ドロップイン代替品: EP2SGX130GF1508I4N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2SGX130GF1508I4N （同一形状・フットプリント） — 相違点: Package, RoHS Status, Speed Grade, Mounting Type, Family.
クイック比較ツール — 並列比較する代替部品を選択:
EP2SGX130GF1508I4
✅ ドロップイン✓ 在庫あり
$2055 / 個
データシートを見る →EP2SGX130GF1508C5N
✅ ドロップイン✓ 在庫あり
$3890 / 個
データシートを見る →EP2SGX130GF1508C4N
✅ ドロップイン✓ 在庫あり
$118 / 個
データシートを見る →EP2SGX130GF1508C3N
✅ ドロップイン✓ 在庫あり
$1395 / 個
データシートを見る →EP2S130F1508I4N
✅ ドロップイン✓ 在庫あり
$1390 / 個
データシートを見る →EP2SGX130GF1508I4N 最大定格＆電気的特性
| Series | Stratix II GX |
| Logic Elements (LE) | 132,540 |
| Adaptive Logic Modules (ALMs) | 6,627 |
| Embedded Memory Bits | 6,747,840 |
| User I/O Count | 734 |
| Number of LABs/CLBs | 6,627 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I4 (fast) |
| パッケージ | 1508-ball FCBGA (flip-chip BGA) |
| 実装タイプ | Surface Mount |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
EP2SGX130GF1508I4N 1508-ball fcbga (flip-chip bga) ピン配置ガイド
EP2SGX130GF1508I4N (1508-ball fcbga (flip-chip bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2SGX130GF1508I4N.
詳細は データシート をご参照ください。
主な用途
EP2SGX130GF1508I4N の用途: 6 件s: Telecom Backplane Aggregation, Broadcast Video Processing, ASIC Prototyping, High-Performance DSP Compute Node, Industrial Control and Test Equipment, Aerospace and Defense Signal Processing.
Telecom Backplane Aggregation
The EP2SGX130GF1508I4N is well suited for telecom backplane aggregation cards that must bridge multiple multi-gigabit serial links to a switch fabric ASIC. Its 132,540 logic elements and embedded transceiver channels operating up to 6.375 Gbps support protocols such as Serial RapidIO, XAUI, and PCIe x4/x8, while 6,747,840 bits of TriMatrix embedded memory buffer packets between line and switch ports. The 1508-ball FCBGA exposes 734 user I/Os, enough to drive multiple SFP+ cages and parallel backplane buses simultaneously. Engineers typically pair the device with a line-rate SERDES framer and use the dedicated PLL resources to generate per-channel reference clocks.
おすすめ
Broadcast Video Processing
Broadcast video routers and processing engines benefit from the EP2SGX130GF1508I4N's combination of high logic density, abundant DSP blocks, and multi-gigabit transceivers. The device can perform real-time SD/HD/3G-SDI embedding/de-embedding, color-space conversion, and frame-rate conversion while driving parallel video buses to downstream encoders. With 132,540 logic elements and dedicated 18x18 multipliers, a single FPGA can handle multiple video channels simultaneously, reducing board area versus a discrete DSP-plus-ASIC architecture. The industrial temperature grade supports deployment in uncontrolled equipment-room environments.
おすすめ
ASIC Prototyping
The EP2SGX130GF1508I4N is a popular ASIC prototyping vehicle because its 132,540 logic elements, generous embedded memory, and high I/O count can emulate large multi-million-gate ASIC designs at near-actual speed. Engineers map ASIC RTL to the FPGA using Quartus II synthesis, partition the design across multiple FPGAs when needed, and use the transceiver channels to bridge FPGA-to-FPGA debug links at gigabit rates. The 1508-ball FCBGA provides enough user I/Os (734) to break out ASIC boundary signals to logic analyzers and protocol exercisers.
おすすめ
High-Performance DSP Compute Node
Compute-intensive signal-processing nodes such as radar front-ends, software-defined radio baseband cards, and medical imaging pipelines leverage the EP2SGX130GF1508I4N's dedicated DSP blocks, embedded multipliers, and parallel memory bandwidth. The combination of 132,540 LEs and 6,747,840 memory bits supports simultaneous FIR filtering, FFT computation, and matrix arithmetic on streaming ADC data. Transceivers move digitized RF to and from the FPGA at multi-gigabit rates, eliminating parallel bus bottlenecks on the PCB.
おすすめ
Industrial Control and Test Equipment
Industrial test-and-measurement platforms use the EP2SGX130GF1508I4N for protocol-aware pattern generation, high-speed data acquisition, and real-time waveform analysis. The industrial temperature grade (-40C to +100C) supports deployment in factory-floor and outdoor test cabinets. The 734 user I/Os accommodate parallel LVCMOS/LVDS buses to backplane instruments, while embedded transceivers provide high-speed serial links to DUTs (devices under test). Quartus II-based design entry allows reuse of legacy Stratix II IP across product generations.
おすすめ
Aerospace and Defense Signal Processing
The EP2SGX130GF1508I4N is used in aerospace and defense applications such as electronic-warfare subsystems, radar digitizers, and secure communications modems where high logic density and radiation-tolerant design margins matter. The industrial temperature grade and 1508-ball FCBGA ruggedized package withstand harsh mechanical environments. Embedded transceivers handle high-speed links to RF converters and optical interfaces, while the large memory capacity buffers wideband digitized signals. Note that for true radiation-hardened deployments, the part must be up-screened per mission profile.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2SGX130GF1508I4N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2SGX130GF1508I4 | EP2SGX130GF1508C5N | EP2SGX130GF1508C4N | EP2SGX130GF1508C3N | EP2S130F1508I4N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1508-ball FCBGA | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | I4 (fast) | I4 (fast) | C5 (fastest commercial) | C4 | C3 (slowest) | I4 (fast) |
| Embedded Transceivers | Yes (GX series) | Yes (GX series) | Yes (GX series) | Yes (GX series) | Yes (GX series) | No (non-GX Stratix II) |
| Lead-Free (-N suffix) | Yes | No (SnPb) | Yes | Yes | Yes | Yes |
| Lifecycle Status (as of 2026-09-09) | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| Approximate Unit Price (qty 1, USD) | $2,850 | $2,700 (est.) | $2,800 (est.) | $2,650 (est.) | $2,500 (est.) | $2,600 (est.) |
主な差別化要因
- Integrated multi-gigabit transceivers in same package （vs EP2S130F1508I4N)
- Industrial temperature grade for harsh environments （vs EP2SGX130GF1508C5N)
- Lead-free RoHS-compliant termination （vs EP2SGX130GF1508I4)
設計ノート
Estimated: the 1508-ball FCBGA package has a typical theta_JA of approximately 8-12 C/W with a properly designed thermal via array and heat sink, but Stratix II GX FPGAs can dissipate 15-25W under full logic utilization with active transceivers. At 20W dissipation, junction temperature rises 160-240C above ambient, exceeding the 100C industrial limit. A heat sink with thermal interface material, dedicated PCB thermal pad, and adequate airflow (200 LFM minimum) is mandatory. Always measure junction temperature in-system using the FPGA's on-chip die sensor.
The 1508-ball FCBGA requires a fine-pitch PCB land pattern with microvia or via-in-pad construction. Stackup should be 8+ layers with dedicated ground and power planes adjacent to the BGA footprint. Transceiver channels demand 100-ohm differential routing with length matching within 5 mils (0.127 mm) for data rates above 3 Gbps. Reference the Stratix II GX PCB Design Guidelines and the Altera High-Speed Board Design Guide for via pattern, decoupling, and trace-spacing recommendations.
The Stratix II GX family requires multiple power rails (VCCINT core, VCCIO for I/O banks, VCCA_PLL for PLLs, VCC_TX/RX for transceivers) with strict ramp-order sequencing. Per the Stratix II GX handbook, VCCINT must ramp before VCCIO and transceiver supplies, and the POR (power-on-reset) circuit must hold the device in reset until all rails are stable. Use a dedicated power sequencer IC such as the LTC2923 or TPS650243 rather than discrete RC delay chains.
Do not confuse the EP2SGX130GF1508I4N with the non-GX Stratix II part EP2S130F1508I4N; the GX suffix denotes integrated multi-gigabit transceivers while the non-GX version requires external SERDES. The -N suffix indicates lead-free termination; omitting it (EP2SGX130GF1508I4) yields a SnPb part that may fail RoHS audits. Configuration mode selection (AS, PS, FPP, JTAG) must match the bitstream stored in the configuration flash or download cable.
コンプライアンス情報
RoHS and lead-free confirmed by Worldway Electronics listing (Rohs Code: Yes, Pb-free Code: Yes). REACH status confirmed compliant per ETEI cross-reference. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Conflict-minerals compliance inherited from Altera/Intel program-level CMRT filings.
