EP2SGX130GF1508I4N - Stratix II GX FPGA 132K LE 1508-FCBGA | Intel
Référence : EP2SGX130GF1508I4N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2620 | $26 200,00 |
| 100 | $2380 | $238 000,00 |
| 250 | $2210 | $552 500,00 |
| 500 | $2050 | $1 025 000,00 |
EP2SGX130GF1508I4N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated DSP blocks, and on-chip memory that an engineer can re-program in the field after manufacturing. FPGAs sit between general-purpose microcontrollers (software-defined, slower) and application-specific integrated circuits (ASICs, fixed-function, highest performance). The Stratix II GX family extends the generic Stratix II architecture with embedded multi-gigabit transceivers, hardening the device for serial connectivity standards such as PCIe, Serial RapidIO, Gigabit Ethernet, and custom backplane links.
Key features include 6,627 Adaptive Logic Modules (ALMs), dedicated 18x18 multipliers and DSP blocks, TriMatrix embedded memory with up to 6.75 Mbits, eight phase-locked loops (PLLs), and embedded transceiver channels supporting data rates up to 6.375 Gbps. Configuration is supported via passive serial, fast passive parallel, and JTAG modes, and design entry uses the Quartus II development toolchain. The -I4N speed/temperature grade denotes an industrial temperature range and a fast speed bin.
Typical applications include high-speed serial interface bridging, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and high-performance DSP compute nodes. The 1508-ball FCBGA package exposes enough I/O and transceiver channels for multi-port line-card designs where board area is constrained but pin density is essential.
When designing with this device, ensure the PCB stackup can handle the FCBGA ball pitch and provides matched-impedance routing for the transceiver channels. Power sequencing must follow the datasheet ramp order to avoid in-rush damage, and the JTAG chain should be accessible for boundary-scan and in-system programming.
This page synthesizes distributor pricing, package options, and design guidance for engineers evaluating the EP2SGX130GF1508I4N against other Stratix II GX variants and competing high-density FPGAs.
Alternatives de remplacement direct pour EP2SGX130GF1508I4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX130GF1508I4N (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Speed Grade, Mounting Type, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX130GF1508I4
✅ Remplacement direct✓ En stock
$2055 / unité
Voir la fiche technique →EP2SGX130GF1508C5N
✅ Remplacement direct✓ En stock
$3890 / unité
Voir la fiche technique →EP2SGX130GF1508C4N
✅ Remplacement direct✓ En stock
$118 / unité
Voir la fiche technique →EP2SGX130GF1508C3N
✅ Remplacement direct✓ En stock
$1395 / unité
Voir la fiche technique →EP2S130F1508I4N
✅ Remplacement direct✓ En stock
$1390 / unité
Voir la fiche technique →EP2SGX130GF1508I4N Valeurs maximales et caractéristiques électriques
| Series | Stratix II GX |
| Logic Elements (LE) | 132,540 |
| Adaptive Logic Modules (ALMs) | 6,627 |
| Embedded Memory Bits | 6,747,840 |
| User I/O Count | 734 |
| Number of LABs/CLBs | 6,627 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I4 (fast) |
| Boîtier | 1508-ball FCBGA (flip-chip BGA) |
| Type de montage | Surface Mount |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du EP2SGX130GF1508I4N 1508-ball fcbga (flip-chip bga)
Configuration des broches du EP2SGX130GF1508I4N (boîtier 1508-ball fcbga (flip-chip bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX130GF1508I4N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX130GF1508I4N convient pour 6 applications: Telecom Backplane Aggregation, Broadcast Video Processing, ASIC Prototyping, High-Performance DSP Compute Node, Industrial Control and Test Equipment, Aerospace and Defense Signal Processing.
Telecom Backplane Aggregation
The EP2SGX130GF1508I4N is well suited for telecom backplane aggregation cards that must bridge multiple multi-gigabit serial links to a switch fabric ASIC. Its 132,540 logic elements and embedded transceiver channels operating up to 6.375 Gbps support protocols such as Serial RapidIO, XAUI, and PCIe x4/x8, while 6,747,840 bits of TriMatrix embedded memory buffer packets between line and switch ports. The 1508-ball FCBGA exposes 734 user I/Os, enough to drive multiple SFP+ cages and parallel backplane buses simultaneously. Engineers typically pair the device with a line-rate SERDES framer and use the dedicated PLL resources to generate per-channel reference clocks.
Recommandé
Broadcast Video Processing
Broadcast video routers and processing engines benefit from the EP2SGX130GF1508I4N's combination of high logic density, abundant DSP blocks, and multi-gigabit transceivers. The device can perform real-time SD/HD/3G-SDI embedding/de-embedding, color-space conversion, and frame-rate conversion while driving parallel video buses to downstream encoders. With 132,540 logic elements and dedicated 18x18 multipliers, a single FPGA can handle multiple video channels simultaneously, reducing board area versus a discrete DSP-plus-ASIC architecture. The industrial temperature grade supports deployment in uncontrolled equipment-room environments.
Recommandé
ASIC Prototyping
The EP2SGX130GF1508I4N is a popular ASIC prototyping vehicle because its 132,540 logic elements, generous embedded memory, and high I/O count can emulate large multi-million-gate ASIC designs at near-actual speed. Engineers map ASIC RTL to the FPGA using Quartus II synthesis, partition the design across multiple FPGAs when needed, and use the transceiver channels to bridge FPGA-to-FPGA debug links at gigabit rates. The 1508-ball FCBGA provides enough user I/Os (734) to break out ASIC boundary signals to logic analyzers and protocol exercisers.
Recommandé
High-Performance DSP Compute Node
Compute-intensive signal-processing nodes such as radar front-ends, software-defined radio baseband cards, and medical imaging pipelines leverage the EP2SGX130GF1508I4N's dedicated DSP blocks, embedded multipliers, and parallel memory bandwidth. The combination of 132,540 LEs and 6,747,840 memory bits supports simultaneous FIR filtering, FFT computation, and matrix arithmetic on streaming ADC data. Transceivers move digitized RF to and from the FPGA at multi-gigabit rates, eliminating parallel bus bottlenecks on the PCB.
Recommandé
Industrial Control and Test Equipment
Industrial test-and-measurement platforms use the EP2SGX130GF1508I4N for protocol-aware pattern generation, high-speed data acquisition, and real-time waveform analysis. The industrial temperature grade (-40C to +100C) supports deployment in factory-floor and outdoor test cabinets. The 734 user I/Os accommodate parallel LVCMOS/LVDS buses to backplane instruments, while embedded transceivers provide high-speed serial links to DUTs (devices under test). Quartus II-based design entry allows reuse of legacy Stratix II IP across product generations.
Recommandé
Aerospace and Defense Signal Processing
The EP2SGX130GF1508I4N is used in aerospace and defense applications such as electronic-warfare subsystems, radar digitizers, and secure communications modems where high logic density and radiation-tolerant design margins matter. The industrial temperature grade and 1508-ball FCBGA ruggedized package withstand harsh mechanical environments. Embedded transceivers handle high-speed links to RF converters and optical interfaces, while the large memory capacity buffers wideband digitized signals. Note that for true radiation-hardened deployments, the part must be up-screened per mission profile.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX130GF1508I4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX130GF1508I4 | EP2SGX130GF1508C5N | EP2SGX130GF1508C4N | EP2SGX130GF1508C3N | EP2S130F1508I4N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1508-ball FCBGA | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | I4 (fast) | I4 (fast) | C5 (fastest commercial) | C4 | C3 (slowest) | I4 (fast) |
| Embedded Transceivers | Yes (GX series) | Yes (GX series) | Yes (GX series) | Yes (GX series) | Yes (GX series) | No (non-GX Stratix II) |
| Lead-Free (-N suffix) | Yes | No (SnPb) | Yes | Yes | Yes | Yes |
| Lifecycle Status (as of 2026-09-09) | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| Approximate Unit Price (qty 1, USD) | $2,850 | $2,700 (est.) | $2,800 (est.) | $2,650 (est.) | $2,500 (est.) | $2,600 (est.) |
Principaux différenciateurs
- Integrated multi-gigabit transceivers in same package (vs EP2S130F1508I4N)
- Industrial temperature grade for harsh environments (vs EP2SGX130GF1508C5N)
- Lead-free RoHS-compliant termination (vs EP2SGX130GF1508I4)
Notes de conception
Estimated: the 1508-ball FCBGA package has a typical theta_JA of approximately 8-12 C/W with a properly designed thermal via array and heat sink, but Stratix II GX FPGAs can dissipate 15-25W under full logic utilization with active transceivers. At 20W dissipation, junction temperature rises 160-240C above ambient, exceeding the 100C industrial limit. A heat sink with thermal interface material, dedicated PCB thermal pad, and adequate airflow (200 LFM minimum) is mandatory. Always measure junction temperature in-system using the FPGA's on-chip die sensor.
The 1508-ball FCBGA requires a fine-pitch PCB land pattern with microvia or via-in-pad construction. Stackup should be 8+ layers with dedicated ground and power planes adjacent to the BGA footprint. Transceiver channels demand 100-ohm differential routing with length matching within 5 mils (0.127 mm) for data rates above 3 Gbps. Reference the Stratix II GX PCB Design Guidelines and the Altera High-Speed Board Design Guide for via pattern, decoupling, and trace-spacing recommendations.
The Stratix II GX family requires multiple power rails (VCCINT core, VCCIO for I/O banks, VCCA_PLL for PLLs, VCC_TX/RX for transceivers) with strict ramp-order sequencing. Per the Stratix II GX handbook, VCCINT must ramp before VCCIO and transceiver supplies, and the POR (power-on-reset) circuit must hold the device in reset until all rails are stable. Use a dedicated power sequencer IC such as the LTC2923 or TPS650243 rather than discrete RC delay chains.
Do not confuse the EP2SGX130GF1508I4N with the non-GX Stratix II part EP2S130F1508I4N; the GX suffix denotes integrated multi-gigabit transceivers while the non-GX version requires external SERDES. The -N suffix indicates lead-free termination; omitting it (EP2SGX130GF1508I4) yields a SnPb part that may fail RoHS audits. Configuration mode selection (AS, PS, FPP, JTAG) must match the bitstream stored in the configuration flash or download cable.
Informations de conformité
RoHS and lead-free confirmed by Worldway Electronics listing (Rohs Code: Yes, Pb-free Code: Yes). REACH status confirmed compliant per ETEI cross-reference. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Conflict-minerals compliance inherited from Altera/Intel program-level CMRT filings.
