EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
部品番号: EP2SGX30CF780I3 ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP2SGX30CF780I3 概要
What is a Stratix II GX FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory blocks, DSP blocks, and high-speed serial interfaces on a single die. Stratix II GX sits in Altera's high-end transceiver-equipped FPGA hierarchy (Stratix II -> Stratix II GX -> Stratix III GX), built on a 90 nm CMOS process with 1.2 V core voltage. The 'GX' suffix specifically denotes integrated multi-gigabit transceivers, which differentiate this family from logic-only Stratix II devices.
Key features include 33,880 logic cells, 361 user I/O pins, embedded 6.375 Gbps transceivers, dedicated DSP blocks for high-speed arithmetic, and 90 nm CMOS process technology. The 'I3' suffix indicates an industrial temperature grade (–40 °C to +85 °C ambient), while 'CF780' designates the 780-ball flip-chip BGA package.
The architecture combines ALM (Adaptive Logic Module) blocks with TriMatrix memory, supporting both distributed and block RAM. The integrated transceivers support common serial protocols including PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet, while the 90 nm process balances die size and dynamic power for high-density designs. Total internal memory and DSP block counts scale with the 33,880-cell capacity.
Typical applications include telecommunications line cards, high-end test and measurement equipment, broadcast video processing, and PCI Express-based add-in cards. The transceiver capability also makes it suitable for backplane aggregation and high-speed serial bridging between FPGAs.
When designing with this device, pay close attention to the transceiver reference clock architecture, power-sequencing requirements (1.2 V core, separate transceiver and I/O rails), and signal-integrity guidelines for the 1.0 mm-pitch BGA. A multi-layer PCB with controlled-impedance routing is required to meet transceiver performance targets.
This page synthesizes distributor availability, drop-in same-package alternatives from the Stratix II GX lineup, and practical design considerations that go beyond the manufacturer datasheet, helping engineers evaluate the part against newer Cyclone and Stratix families.
ドロップイン代替品: EP2SGX30CF780I3 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2SGX30CF780I3 （同一形状・フットプリント） — 相違点: Package, Speed Grade, Logic Elements, Operating Temperature, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
EP2SGX30CF780C3
✅ ドロップイン✓ 在庫あり
$175.5 / 個
データシートを見る →EP2SGX30CF780C3N
✅ ドロップイン✓ 在庫あり
$195 / 個
データシートを見る →EP2SGX30CF780C4
✅ ドロップイン✓ 在庫あり
$138 / 個
データシートを見る →EP2SGX30CF780C4N
✅ ドロップイン✓ 在庫あり
$379 / 個
データシートを見る →EP2SGX30CF780C5
✅ ドロップイン✓ 在庫あり
$248 / 個
データシートを見る →EP2SGX30CF780C5N
✅ ドロップイン✓ 在庫あり
$160 / 個
データシートを見る →EP2SGX30CF780C6
✅ ドロップイン✓ 在庫あり
$165 / 個
データシートを見る →EP2SGX30CF780C7
✅ ドロップイン✓ 在庫あり
$171 / 個
データシートを見る →EP2SGX30CF780I3 最大定格＆電気的特性
| Family | Stratix II GX |
| Logic Cells | 33,880 |
| Logic Array Blocks (LABs) | 33,880 |
| Maximum Internal Frequency | 622.08 MHz |
| Number of User I/O Pins | 361 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) |
| パッケージ | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Terminal Pitch | 1.0 mm |
| 動作温度 | -40 °C to +85 °C (Industrial) |
| Temperature Grade Suffix | I3 (Industrial) |
| 実装タイプ | Surface Mount (BGA) |
| Total Terminals | 780 |
| Package Code | BGA, square shape |
EP2SGX30CF780I3 bga, square shape ピン配置ガイド
EP2SGX30CF780I3 (bga, square shape パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2SGX30CF780I3.
詳細は データシート をご参照ください。
主な用途
EP2SGX30CF780I3 の用途: 6 件s: Telecommunications Line Cards, PCI Express Endpoint Cards, High-Speed Test & Measurement Equipment, Broadcast Video Processing, Industrial Automation Backplanes, Aerospace & Defense Signal Processing.
Telecommunications Line Cards
The EP2SGX30CF780I3 fits telecom line-card designs through its combination of 33,880 logic cells and embedded multi-gigabit transceivers rated up to 6.375 Gbps. The transceivers support standard backplane protocols including SPI-4.2, Serial RapidIO, and XAUI, eliminating external PHY chips and reducing board area. With 361 user I/Os available on the 780-ball FC-FBGA, designers can connect to network processors, TCAMs, and external memory buses without multiplexing concerns. The industrial temperature grade (-40 °C to +85 °C) supports outdoor cabinet deployments. Compared to a discrete SERDES-plus-FPGA solution, this part integrates transceiver hard IP directly, cutting BOM cost and simplifying PCB routing.
おすすめ
PCI Express Endpoint Cards
The EP2SGX30CF780I3's embedded transceivers implement PCI Express Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps) hard IP, making it a natural fit for PCIe endpoint add-in cards. Altera's PCIe IP core in Quartus II bundles the physical layer, data link, and transaction layers directly on the transceiver, freeing the 33,880 logic cells for application logic. The 780-ball FC-FBGA package exposes enough I/O to drive PCIe edge connectors, on-card memory (DDR2/DDR3 via soft controller), and application-specific peripherals. Engineers evaluating this part for new PCIe designs should weigh Stratix IV GX or Cyclone V GX for longer-term availability as of 2026-09-09.
おすすめ
High-Speed Test & Measurement Equipment
The EP2SGX30CF780I3 serves in oscilloscope, logic analyzer, and protocol-analyzer platforms where its 6.375 Gbps transceivers capture and process high-speed serial data streams in real time. The 33,880 logic cells accommodate deep capture buffers and parallel DSP processing paths, while the 361 user I/Os route analog front-end samples into on-chip memory and out to display interfaces. Industrial temperature grading is valuable for portable test instruments used in field environments. The 90 nm process gives predictable timing closure for multi-channel correlation logic. For new designs, Cyclone V GX or Stratix 10 provide higher transceiver rates and better power efficiency.
おすすめ
Broadcast Video Processing
The EP2SGX30CF780I3 fits broadcast video processing cards handling SD-SDI, HD-SDI, and 3G-SDI streams through its integrated transceivers, which natively support the data rates required by SMPTE 259M, 292M, and 424M standards. The 33,880 logic cells run multi-stream processing, format conversion, and overlay/blending pipelines, while the 361 user I/Os connect to external DDR2 memory, video DACs, and HDMI/DisplayPort bridge chips. Industrial temperature supports broadcast equipment deployed in uncontrolled venues. Designers targeting 4K/UHD workflows should evaluate newer Cyclone V GX or Arria 10 parts, which offer higher transceiver rates and dedicated video processing IP.
おすすめ
Industrial Automation Backplanes
The EP2SGX30CF780I3 integrates into industrial backplane controllers thanks to its multi-gigabit transceivers, which can drive proprietary backplane serial links, SERCOS III, or EtherCAT-over-serdes implementations. The 780-ball FC-FBGA provides 361 user I/Os for digital I/O expansion cards, while 33,880 logic cells run real-time control loops and protocol stacks concurrently. The -40 °C to +85 °C industrial temperature grade supports factory-floor deployment without additional thermal conditioning. The 1.2 V core voltage and 90 nm process yield acceptable power dissipation for sealed enclosures. Migration to Cyclone V GX or Cyclone 10 LP is recommended for new industrial platforms.
おすすめ
Aerospace & Defense Signal Processing
The EP2SGX30CF780I3 supports defense signal-processing applications such as radar front-end preprocessing, software-defined radio baseband, and electronic-warfare subsystems where its integrated transceivers handle digitized RF data at multi-gigabit rates. The 33,880 logic cells accommodate FFT, channelization, and modulation pipelines, while 361 user I/Os interface to ADC/DAC devices and high-speed memory. The industrial temperature rating supports avionics bay environments. The 780-ball FC-FBGA's 1.0 mm pitch is PCB-friendly for ruggedized board builds. For new defense programs, designers should evaluate Stratix V GX, Arria V GX, or Microsemi/Microchip radiation-tolerant FPGAs for supply continuity.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2SGX30CF780I3 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2SGX30CF780C3 | EP2SGX30CF780C4 | EP2SGX30CF780C5 | EP2SGX30CF780C6 | EP2SGX30CF780C7 |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (29x29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) | 780-ball FC-FBGA (same) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Cells | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) |
| Speed Grade | I3 (industrial speed bin) | C3 (slower) | C4 | C5 | C6 (faster) | C7 (fastest) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Transceivers | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps |
| User I/O Pins | 361 | 361 | 361 | 361 | 361 | 361 |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
主な差別化要因
- Industrial temperature rating for harsh environments （vs EP2SGX30CF780C3)
- Integrated multi-gigabit transceivers on a 33,880-cell die （vs EP2S60F672C5)
- Same-package drop-in compatibility within the Stratix II GX family （vs EP4SGX230KF40C2N (Stratix IV GX))
設計ノート
Estimated: The Stratix II GX EP2SGX30CF780I3 requires three primary rails — 1.2 V core, 2.5 V/3.3 V auxiliary, and 1.2 V/2.5 V transceiver analog — plus PLLs and I/O banks. Power sequencing must follow Altera's recommended order (transceiver analog -> PLL -> core -> I/O) to prevent latch-up. Estimated quiescent dissipation is approximately 1-2 W for core only at zero toggle, scaling up to 5-8 W at full utilization with active transceivers. Designers should budget 10 W total per device for thermal and supply sizing.
The 780-ball FC-FBGA uses 1.0 mm ball pitch, which requires PCB microvia (laser-drilled or plasma-etched) stack-up with at least 6 layers for clean transceiver routing. Transceiver channels must use 100 Ω differential impedance with length matching within 0.13 mm (5 mil) per the Altera Stratix II GX Handbook guidelines. Reference clock routing must be isolated from data lines and guarded by ground vias. Decoupling capacitors should be placed adjacent to every power ball pair.
Estimated: With a 1.0 mm FC-FBGA and typical 90 nm Stratix II GX power dissipation of 5-8 W, the junction-to-ambient thermal resistance (theta_JA) on a 6-layer JEDEC test board is roughly 15-20 °C/W. This yields a junction temperature rise of 75-160 °C above ambient at full load, which approaches the 125 °C maximum. A heatsink or aggressive thermal via array under the package thermal balls is recommended for industrial deployments where ambient can reach 85 °C.
Common pitfalls include: (1) failing to assign unused transceiver channels to a defined state (tie RX high, leave TX floating) per Altera's recommendations; (2) using a non-Altera-recommended configuration device, which can corrupt the Stratix II GX bitstream during warm reset; (3) ignoring pull-up requirements on configuration pins (nCONFIG, nSTATUS, CONF_DONE); and (4) selecting commercial-grade EP2SGX30CF780C3/C5 in place of I3 for outdoor deployments where ambient falls below 0 °C. Always validate the device tree in Quartus II before fabrication.
コンプライアンス情報
Compliance data (RoHS, REACH, lead-free, halogen-free) was not present in the verified web data; marked unknown per Data Authenticity Rule 1. AEC-Q100 is not applicable to FPGAs (automotive discrete IC standard). Intel/Altera product environmental compliance should be verified directly via Intel's Product Compliance Declarations portal.
