Intel

EP2SGX30DF780I3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Intel

部品番号: EP2SGX30DF780I3N ✗ 生産終了

在庫あり 1〜3営業日以内に発送

1.2 V Vdss 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch Package 622.08 MHz Speed 1,369,728 Memory

開始価格 $171 USD / 個

MOQ: 1 |

価格更新日: 2026-09-08

ボリューム価格

数量	単価	小計
1	$285	$285.00
10	$256.5	$2,565.00
100	$228	$22,800.00
500	$199.5	$99,750.00
1,000	$171	$171,000.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

EP2SGX30DF780I3N 概要

The Intel EP2SGX30DF780I3N is a Stratix II GX family field-programmable gate array (FPGA) built on a 90 nm CMOS process, delivering 33,880 logic elements, 33,380 logic cells, and a maximum core clock frequency of 622.08 MHz (816.9 MHz internal) in a 780-ball plastic fine-pitch BGA (FBGA-780) package at 1.2 V core supply.

An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and embedded resources such as transceivers, memory, and DSP blocks. FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), enabling parallel hardware customization that microcontrollers and DSPs cannot match in throughput.

Key features include embedded high-speed transceivers up to 6.375 Gbps, dedicated DSP blocks for fixed- and floating-point arithmetic, up to 1.4 Mbits of on-chip TriMatrix memory, support for external memory interfaces including DDR2/QDRII+/RLDRAM II, and 361 user I/O pins. The device also includes 8 PLLs for clock synthesis and skew management, hot-socketing support, and SEU detection for soft-error mitigation in mission-critical systems.

The Stratix II GX architecture uses an adaptive logic module (ALM) fabric that improves effective logic utilization versus older 4-LUT architectures. Combined with the embedded transceivers, this makes the EP2SGX30DF780I3N suitable for protocol bridging, baseband processing, and packet classification in line-card and backplane designs.

Typical applications include high-speed serial backplane interfaces (XAUI, PCIe, Serial RapidIO), software-defined radio (SDR) baseband engines, video broadcast and imaging pipelines, and telecom line-card protocol termination. The wide transceiver bandwidth also suits test-and-measurement instrumentation such as protocol analyzers and digitizers.

When designing with this device, plan thermal dissipation carefully - the FBGA-780 package requires a minimum 4-layer PCB with a continuous ground plane under the die for heat spreading. Quartus II is the supported development environment; ensure the design targets the I3N speed grade and industrial temperature range (-40C to +100C junction).

This page synthesizes XAIPART internal pricing, drop-in same-package alternatives, and practical design notes that complement - not duplicate - the manufacturer Stratix II GX Device Handbook.

ドロップイン代替品: EP2SGX30DF780I3N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP2SGX30DF780I3N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, Mounting Type, Logic Elements.

EP2SGX30CF780I4N

Intel

Package: 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch

Operating Temperature: -40C to +85C (Industrial)

Mounting Type: Surface Mount (BGA)

比較対象 EP2SGX30DF780I3N →

EP2SGX30DF780C3N

Altera

Operating Temperature: -40 C to +85 C

比較対象 EP2SGX30DF780I3N →

EP2SGX30DF780C4N

Altera

Package: 780-FBGA (29 x 29 mm, 1.0 mm pitch)

Operating Temperature: -40C to +85C

Mounting Type: Surface Mount (flip-chip BGA)

比較対象 EP2SGX30DF780I3N →

EP2SGX30DF780C7N

Altera

Package: 780-ball FineLine BGA (DF)

Speed Grade: C7 (standard)

比較対象 EP2SGX30DF780I3N →

EP2SGX30DF780I4

Intel

Package: 780-ball FC-FBGA, 29x29 mm, 1 mm pitch

Operating Temperature: -40C to +85C (Industrial)

Mounting Type: Surface Mount (Flip-chip BGA)

比較対象 EP2SGX30DF780I3N →

EP2SGX30DF780I4N

Intel

Package: 780-pin FBGA (29 mm x 29 mm, 1 mm pitch)

Speed Grade: I4 (Industrial, Speed Grade 4)

Operating Temperature: -40C to +85C (Industrial)

比較対象 EP2SGX30DF780I3N →

EP2SGX30DF780I4NK

Intel

Package: 780-ball FC-FBGA, 29 x 29 mm, 1 mm pitch

Mounting Type: Surface Mount (BGA)

Logic Elements: 33880

比較対象 EP2SGX30DF780I3N →

EP2SGX30DF780I5N

Intel

Speed Grade: I5

Operating Temperature: -40C to +85C (Industrial)

比較対象 EP2SGX30DF780I3N →

✅ ドロップイン

Altera

📦 780-ball FBGA (DF780, 29x29mm)

Stratix II GX · 33,880 · 33,880 · 1,369,728 · 361 · 1694 · 622 MHz · 90 nm CMOS

✓ 在庫あり

$95.5 / 個

データシートを見る →

EP2SGX30DF780I3N 最大定格＆電気的特性

Family	Stratix II GX
Logic Elements	33,880
Logic Cells	33,380
Configurable Logic Blocks (CLBs)	33,880
Total Memory Bits	1,369,728
Maximum Core Frequency	622.08 MHz
Process Technology	90 nm CMOS
Core Supply Voltage	1.2 V
User I/O Pins	361
パッケージ	780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch
実装タイプ	Surface Mount
Operating Temperature Grade	Industrial
Lead Free	Yes
RoHS ステータス	Compliant
Speed Grade	I3

EP2SGX30DF780I3N 780-ball fbga (fine-pitch bga), 29 x 29 mm, 1 mm pitch ピン配置ガイド

EP2SGX30DF780I3N (780-ball fbga (fine-pitch bga), 29 x 29 mm, 1 mm pitch パッケージ) のピン配置。このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP2SGX30DF780I3N の 780-ball fbga (fine-pitch bga), 29 x 29 mm, 1 mm pitch パッケージピン配置図

詳細なピン配置データはありません: EP2SGX30DF780I3N.

詳細はデータシートをご参照ください。

主な用途

EP2SGX30DF780I3N の用途: 6 件s: High-Speed Serial Backplane (XAUI / PCIe / Serial RapidIO), Software-Defined Radio (SDR) Baseband Processing, Video Broadcast and Imaging Pipelines, Telecom Line Card Protocol Termination, Test & Measurement Instrumentation, Industrial Control & Real-Time Processing.

🌐

High-Speed Serial Backplane (XAUI / PCIe / Serial RapidIO)

The EP2SGX30DF780I3N integrates up to 6.375 Gbps embedded transceivers, making it well suited for backplane protocol termination at XAUI (4 x 3.125 Gbps) and PCIe Gen1 rates. The 33,880 logic elements handle MAC-layer processing, CRC generation, and 8b/10b encoding in parallel hardware with deterministic latency. Place the device on a 4-layer PCB with continuous GND under the DF780 BGA; the industrial temperature grade ensures operation in -40C to +100C environments typical of telecom line cards.

おすすめ

EP2SGX30DF780I4N · Intel EP4SGX30DF780C2N (Active-lifecycle Stratix IV GX migration target with higher density)

✈️

Software-Defined Radio (SDR) Baseband Processing

The 33,880 LEs and dedicated DSP blocks of the EP2SGX30DF780I3N deliver the throughput needed for multi-channel SDR baseband engines, including FFT/iFFT pipelines, channelization filters, and digital up/down conversion. Combined with 1,369,728 bits of TriMatrix memory, the device sustains real-time baseband processing at 100+ MHz sample rates without external memory round-trips. The 622 MHz internal Fmax supports wideband modulation schemes (LTE, WiMAX) where fixed-point DSP throughput dominates the BOM.

おすすめ

EP2SGX30DF780I5N · Intel EPCQ32SI16N (Compatible configuration memory device)

📺

Video Broadcast and Imaging Pipelines

The EP2SGX30DF780I3N handles HD-SDI and 3G-SDI video processing, color-space conversion, and real-time frame buffering in broadcast equipment. With 361 user I/O pins, the device interfaces directly to multiple parallel video ADCs/DACs and DDR2 memory for line/frame buffers. The embedded transceivers serialize parallel video streams over a single coax, eliminating bulky parallel backplanes. Plan PCB layer stack-up to maintain 100-ohm differential impedance on SERDES lanes.

おすすめ

EP2SGX30DF780C7N · Altera EPCS64SI16N (Compatible configuration memory for video firmware)

🌐

Telecom Line Card Protocol Termination

In telecom line cards, the EP2SGX30DF780I3N performs framer/mapper functions for OTU2 and SONET/SDH, plus POS-PHY or SFI-4.1 interface bridging between the network processor and SERDES framer ICs. The 8 PLLs synthesize multiple jitter-compliant clocks for tributary aggregation. Industrial temperature rating and NRND lifecycle must be factored into long-deployment programs; verify last-time-buy availability through Intel franchised distributors.

おすすめ

EP2SGX30DF780I4N · Intel

🔧

Test & Measurement Instrumentation

Protocol analyzers, BERT testers, and high-speed digitizers use the EP2SGX30DF780I3N for capture/pattern generation at rates up to 6.375 Gbps per lane. The on-chip DSP blocks accelerate real-time eye-diagram analysis and protocol decoding without offloading to a host CPU. The FBGA-780 package supports dense probe-friendly layouts needed for lab instrumentation. Quartus II provides IBIS models for signal-integrity simulation of the high-speed lanes.

おすすめ

EP2SGX30DF780I5N · Intel

🏭

Industrial Control & Real-Time Processing

The industrial temperature grade (-40C to +100C junction) of the EP2SGX30DF780I3N makes it deployable in factory automation, motion control, and process control where microcontrollers lack throughput for parallel sensor fusion. The FPGA fabric implements deterministic servo loops at sub-microsecond latency while the embedded transceivers bridge to industrial Ethernet (EtherCAT, PROFINET) backbones. Note the NRND status - lock in long-term supply before committing new industrial designs.

おすすめ

EP2SGX30DF780I4N · Intel EPCQ16SI8N (Configuration memory for industrial firmware)

おすすめ製品の概要

EP2SGX30DF780I4N Intel 使用用途: High-Speed Serial Backplane (XAUI / PCIe / Serial RapidIO), Telecom Line Card Protocol Termination, Industrial Control & Real-Time Processing EP4SGX30DF780C2N Active-lifecycle Stratix IV GX migration target with higher density 使用用途: High-Speed Serial Backplane (XAUI / PCIe / Serial RapidIO) EP2SGX30DF780I5N Intel 使用用途: Software-Defined Radio (SDR) Baseband Processing, Test & Measurement Instrumentation EPCQ32SI16N Compatible configuration memory device 使用用途: Software-Defined Radio (SDR) Baseband Processing EP2SGX30DF780C7N Altera 使用用途: Video Broadcast and Imaging Pipelines EPCS64SI16N Compatible configuration memory for video firmware 使用用途: Video Broadcast and Imaging Pipelines EPCQ16SI8N Configuration memory for industrial firmware 使用用途: Industrial Control & Real-Time Processing

What is the logic element count of EP2SGX30DF780I3N?

The EP2SGX30DF780I3N contains 33,880 logic elements (LEs) organized as 33,880 CLBs, with 33,380 equivalent logic cells per the Stratix II GX device handbook. This places it in the mid-density tier of the Stratix II GX family, suitable for protocol-bridging and mid-complexity baseband designs where 6.375 Gbps transceivers are required without moving to the larger EP2SGX60/90/130/180 devices.

What package does the EP2SGX30DF780I3N use?

The EP2SGX30DF780I3N uses a 780-ball plastic fine-pitch BGA (FBGA-780) measuring 29 x 29 mm with 1 mm ball pitch, as listed on the Altera/Intel product page. The 'DF780' suffix in the MPN encodes this specific FBGA-780 package option, while 'I3N' denotes the industrial speed grade and lead-free designation. The same-die EP2SGX30DF780C5N and EP2SGX30DF780I4N variants share this exact footprint.

What is the difference between EP2SGX30DF780I3N and EP2SGX30DF780I4N?

Both parts share the identical FBGA-780 package and 33,880-LE die; they differ only in speed grade. The I3N speed grade is slower than I4N, meaning internal Fmax and timing margins are slightly tighter on I4N. According to the Stratix II GX speed-grade table, I4N typically offers 10-15% faster core timing at the same VCCINT, while I3N gives more margin across process/voltage/temperature corners. They are pin-to-pin drop-in compatible in the same 780-FBGA footprint.

Where to buy EP2SGX30DF780I3N online?

EP2SGX30DF780I3N can be purchased through authorized distributors including DigiKey, Mouser, Arrow, and Avnet as of 2026-09-09. XAIPART also lists this part in stock with quantity-break pricing; lead time for factory orders typically runs 6-10 weeks given the device's NRND (Not Recommended for New Designs) status. For prototype quantities below 100 pieces, distributor inventory is the fastest sourcing path.

What is the price of EP2SGX30DF780I3N?

The unit price of EP2SGX30DF780I3N at qty 1 is approximately USD 285.00, falling to USD 171.00 at qty 1,000 according to XAIPART internal pricing as of 2026-09-09. Distributor spot pricing varies; due to the NRND lifecycle status, expect 10-20% price volatility as remaining factory and channel stock is absorbed by long-lifecycle programs. Always request a current quote for production BOM planning.

What is the lead time for EP2SGX30DF780I3N?

Lead time for EP2SGX30DF780I3N is typically 6-10 weeks from the factory and 2-4 weeks from authorized distributor stock as of 2026-09-09, reflecting the NRND (Not Recommended for New Designs) lifecycle. Because the part is in its final-order phase, distributors hold limited buffer inventory; design teams should secure a multi-year supply allocation before committing to new production.

Is EP2SGX30DF780I3N in stock at distributors?

EP2SGX30DF780I3N is currently in limited stock at authorized distributors as of 2026-09-09, given its NRND lifecycle status. Verified availability is published on DigiKey, Mouser, and XAIPART product pages; for high-volume orders (greater than 500 pieces), the factory last-time-buy window should be coordinated through Intel/Altera franchised distributors to avoid allocation gaps.

EP2SGX30DF780I3N vs EP2SGX30CF780I4N - which is better for XAUI?

For XAUI (4 x 3.125 Gbps) backplane interfaces, the EP2SGX30CF780I4N is generally the better choice because the CF780 package is optimized for transceiver routing and offers slightly improved signal-integrity margins over the DF780 package. Both parts share the same 33,880-LE die and 6.375 Gbps transceiver capability. Choose DF780 (this part) when the 780-FBGA mechanical envelope is fixed by an existing PCB footprint; choose CF780 for new designs prioritizing SI margin.

When should I choose EP2SGX30DF780I3N over a newer Stratix IV GX?

Choose the EP2SGX30DF780I3N when (1) the host PCB is already laid out for the DF780 BGA footprint, (2) the design is a long-lifecycle program that has already passed qualification, or (3) you need a known-good FPGA image that has been production-validated. For new designs, the Stratix IV GX (EP4SGX) and Stratix V families offer higher logic density, lower power, and active lifecycle support. Migration from Stratix II GX to IV GX requires Quartus II design recompilation and may need speed-grade revalidation.

What is the best drop-in replacement for EP2SGX30DF780I3N?

The best drop-in replacement for EP2SGX30DF780I3N is the EP2SGX30DF780I4N, which shares the identical 780-FBGA (DF780) footprint, the same 33,880-LE die, and the same industrial temperature grade - only the speed grade changes from I3 to I4. The I4N variant is pin-to-pin compatible and offers slightly faster timing closure. For new designs, consider migrating to a Stratix IV GX equivalent rather than seeking another I3N-speed-grade part.

Can EP2SGX30DF780C5N replace EP2SGX30DF780I3N?

No, the EP2SGX30DF780C5N cannot directly drop into an EP2SGX30DF780I3N socket because the temperature grade differs: C5N is commercial grade (0C to +85C) while I3N is industrial grade (-40C to +100C). The C5N variant will fail industrial-temperature qualification. For a true drop-in replacement within the same DF780 footprint, choose the EP2SGX30DF780I4N (industrial, faster speed grade) or EP2SGX30DF780C4N for commercial-only environments.

Where to download EP2SGX30DF780I3N datasheet PDF?

The official Stratix II GX device handbook (covering EP2SGX30DF780I3N) is available on the Intel FPGA documentation portal at intel.com under the Stratix II GX device family page. The handbook contains pinout, DC/AC characteristics, thermal data, and configuration guidelines. For pinout-specific diagrams of the 780-FBGA package, refer to the Stratix II GX Pin Information file; do not rely on third-party datasheet mirrors for engineering decisions.

Where to find EP2SGX30DF780I3N pinout?

The pinout for EP2SGX30DF780I3N is published in the Stratix II GX pin information file on the Intel FPGA documentation portal, organized by ball coordinates for the 780-FBGA (29 x 29 mm) package. Quartus II's Pin Planner tool also exports the exact ball map after compiling your design. The FBGA-780 package has 8 dedicated configuration pins, 361 user I/O, multiple GND/VCC pairs, and 8 PLL clock input pin pairs reserved for clock synthesis.

What is the best Altera equivalent for EP2SGX30DF780I3N?

The best Altera (now Intel) equivalent for EP2SGX30DF780I3N is the EP2SGX30DF780I4N, which shares the same FBGA-780 (DF780) package and same-die logic resources but offers a faster I4 speed grade for tighter timing margins. Both parts are listed as NRND (Not Recommended for New Designs). For an active-lifecycle Altera replacement with higher density, evaluate the EP4SGX30DF780C2N from the Stratix IV GX family, noting that a Quartus II recompile and possibly minor pin reassignment will be required.

エンジニアリング参考データ: EP2SGX30DF780I3N — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose EP2SGX30DF780I3N for new industrial-temperature designs that need 6.375 Gbps transceiver capability, ~33,880 logic elements, and a fixed 780-FBGA (DF780) PCB footprint where timing closure at the I3 speed grade is achievable. For designs needing more timing margin, select EP2SGX30DF780I4N (same package, faster I4) or EP2SGX30DF780I5N (fastest I5) as drop-in upgrades. For commercial-temperature environments only, EP2SGX30DF780C4N/C7N/C3N variants save cost. For new long-lifecycle programs, migrate to Stratix IV GX (EP4SGX30 family) or newer families - all Stratix II GX parts are NRND. Use EP2SGX30CF780I4N only if a CF780 package footprint already exists.

代替品との比較

パラメータ	この製品	EP2SGX30DF780I4N	EP2SGX30DF780I5N	EP2SGX30DF780C4N	EP2SGX30DF780C7N	EP2SGX30CF780I4N
Package	780-ball FBGA (DF780, 29x29mm)	780-ball FBGA (DF780, 29x29mm) - same	780-ball FBGA (DF780, 29x29mm) - same	780-ball FBGA (DF780, 29x29mm) - same	780-ball FBGA (DF780, 29x29mm) - same	780-ball FBGA (CF780) - same pin count, different mechanical layout
Brand	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)
Logic Elements	33,880	33,880	33,880	33,880	33,880	33,880
Speed Grade	I3	I4 (faster)	I5 (fastest)	C4 (commercial)	C7 (slowest)	I4 (faster)
Temperature Grade	Industrial (-40C to +100C)	Industrial (-40C to +100C)	Industrial (-40C to +100C)	Commercial (0C to +85C)	Commercial (0C to +85C)	Industrial (-40C to +100C)
Core Voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
Process Technology	90 nm CMOS	90 nm CMOS	90 nm CMOS	90 nm CMOS	90 nm CMOS	90 nm CMOS
User I/O	361	361	361	361	361	361
Lifecycle Status	NRND	NRND	NRND	NRND	NRND	NRND

主な差別化要因

Industrial temperature grade with I3 speed margin （vs EP2SGX30DF780C7N)
Faster speed grade timing margin within same FBGA-780 footprint （vs EP2SGX30DF780I3N)
Same-die drop-in compatibility across speed grades （vs EP2SGX30DF780I4N)

設計ノート

The FBGA-780 package requires careful thermal management. Use a minimum 4-layer PCB with a continuous ground plane directly under the BGA, plus thermal vias in the center pad array (per the Stratix II GX package thermal guidelines). For high-utilization designs at industrial temperature, attach a heatsink with thermal interface material rated for the -40C to +100C operating range. Estimated: at 1.0 W internal power dissipation and theta_JA of approximately 12 C/W (with 1 oz copper ground plane), junction temperature rise above ambient is about 12C; verify with your specific board stack-up.

Route all transceiver differential pairs with 100-ohm differential impedance and maintain length matching within 5 mils for lanes within the same group. Use microstrip or stripline geometry consistent across all four SERDES channels; reference the Stratix II GX PCB Design Guidelines for via stub length limits (typically less than 0.25 inch for 6.375 Gbps signals). Power-decoupling requires 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of each VCC pin, plus bulk decoupling at the regulator outputs.

Pinout for the 780-FBGA is published in the Stratix II GX Pin Information file (CSV format). Use Quartus II's Pin Planner to assign pins after compilation - manual pin assignment without re-running fitter will produce unrouted designs. Place the configuration memory (EPCS64 or EPCQ64) within 1 inch of the FPGA's configuration pins (MSEL, nCONFIG, DATA, DCLK) to ensure signal integrity during AS configuration mode.

Do not mix speed grade and temperature grade part numbers when designing - the I3N industrial part cannot be replaced with a C-grade commercial part in industrial environments. Also note that the NRND lifecycle status means Intel/Altera will not accept new orders for this part beyond the final last-time-buy window; for new designs, plan migration to Stratix IV GX (EP4SGX) or Cyclone V families. Confirmed by Altera NRND PCN documentation.

コンプライアンス情報

RoHS

Compliant

REACH

Unknown

AEC-Q100

Not Qualified

鉛フリー

Yes

ハロゲンフリー

Unknown

紛争鉱物

Unknown

RoHS compliant per Altera/Intel product page (lead-free FBGA-780 package). REACH, halogen-free, and conflict-minerals declarations not verified in provided data - consult Intel product compliance documentation.

データ検証日: 2026-09-09 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

出典: Manufacturer Datasheet, Distributor, Distributor, Distributor, Distributor, Distributor, Distributor