EP2SGX30DF780I3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Intel
N.º da peça: EP2SGX30DF780I3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
EP2SGX30DF780I3N Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and embedded resources such as transceivers, memory, and DSP blocks. FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), enabling parallel hardware customization that microcontrollers and DSPs cannot match in throughput.
Key features include embedded high-speed transceivers up to 6.375 Gbps, dedicated DSP blocks for fixed- and floating-point arithmetic, up to 1.4 Mbits of on-chip TriMatrix memory, support for external memory interfaces including DDR2/QDRII+/RLDRAM II, and 361 user I/O pins. The device also includes 8 PLLs for clock synthesis and skew management, hot-socketing support, and SEU detection for soft-error mitigation in mission-critical systems.
The Stratix II GX architecture uses an adaptive logic module (ALM) fabric that improves effective logic utilization versus older 4-LUT architectures. Combined with the embedded transceivers, this makes the EP2SGX30DF780I3N suitable for protocol bridging, baseband processing, and packet classification in line-card and backplane designs.
Typical applications include high-speed serial backplane interfaces (XAUI, PCIe, Serial RapidIO), software-defined radio (SDR) baseband engines, video broadcast and imaging pipelines, and telecom line-card protocol termination. The wide transceiver bandwidth also suits test-and-measurement instrumentation such as protocol analyzers and digitizers.
When designing with this device, plan thermal dissipation carefully - the FBGA-780 package requires a minimum 4-layer PCB with a continuous ground plane under the die for heat spreading. Quartus II is the supported development environment; ensure the design targets the I3N speed grade and industrial temperature range (-40C to +100C junction).
This page synthesizes XAIPART internal pricing, drop-in same-package alternatives, and practical design notes that complement - not duplicate - the manufacturer Stratix II GX Device Handbook.
Alternativas drop-in para EP2SGX30DF780I3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2SGX30DF780I3N (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Mounting Type, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2SGX30DF780I4N
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP2SGX30DF780I5N
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP2SGX30DF780C4N
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP2SGX30DF780C7N
✅ Drop-In✓ Em estoque
$225 / unidade
Ver ficha técnica →EP2SGX30CF780I4N
✅ Drop-In✓ Em estoque
$138 / unidade
Ver ficha técnica →EP2SGX30DF780C3N
✅ Drop-In✓ Em estoque
$95.5 / unidade
Ver ficha técnica →EP2SGX30DF780I3N Classificações máximas e características elétricas
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Logic Cells | 33,380 |
| Configurable Logic Blocks (CLBs) | 33,880 |
| Total Memory Bits | 1,369,728 |
| Maximum Core Frequency | 622.08 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| User I/O Pins | 361 |
| Encapsulamento | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch |
| Tipo de montagem | Surface Mount |
| Operating Temperature Grade | Industrial |
| Lead Free | Yes |
| Status RoHS | Compliant |
| Speed Grade | I3 |
Guia de Configuração de Pinos do EP2SGX30DF780I3N 780-ball fbga (fine-pitch bga), 29 x 29 mm, 1 mm pitch
Configuração de pinos para EP2SGX30DF780I3N (pacote 780-ball fbga (fine-pitch bga), 29 x 29 mm, 1 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2SGX30DF780I3N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2SGX30DF780I3N é adequado para 6 aplicaçãos: High-Speed Serial Backplane (XAUI / PCIe / Serial RapidIO), Software-Defined Radio (SDR) Baseband Processing, Video Broadcast and Imaging Pipelines, Telecom Line Card Protocol Termination, Test & Measurement Instrumentation, Industrial Control & Real-Time Processing.
High-Speed Serial Backplane (XAUI / PCIe / Serial RapidIO)
The EP2SGX30DF780I3N integrates up to 6.375 Gbps embedded transceivers, making it well suited for backplane protocol termination at XAUI (4 x 3.125 Gbps) and PCIe Gen1 rates. The 33,880 logic elements handle MAC-layer processing, CRC generation, and 8b/10b encoding in parallel hardware with deterministic latency. Place the device on a 4-layer PCB with continuous GND under the DF780 BGA; the industrial temperature grade ensures operation in -40C to +100C environments typical of telecom line cards.
Recomendado
Software-Defined Radio (SDR) Baseband Processing
The 33,880 LEs and dedicated DSP blocks of the EP2SGX30DF780I3N deliver the throughput needed for multi-channel SDR baseband engines, including FFT/iFFT pipelines, channelization filters, and digital up/down conversion. Combined with 1,369,728 bits of TriMatrix memory, the device sustains real-time baseband processing at 100+ MHz sample rates without external memory round-trips. The 622 MHz internal Fmax supports wideband modulation schemes (LTE, WiMAX) where fixed-point DSP throughput dominates the BOM.
Recomendado
Video Broadcast and Imaging Pipelines
The EP2SGX30DF780I3N handles HD-SDI and 3G-SDI video processing, color-space conversion, and real-time frame buffering in broadcast equipment. With 361 user I/O pins, the device interfaces directly to multiple parallel video ADCs/DACs and DDR2 memory for line/frame buffers. The embedded transceivers serialize parallel video streams over a single coax, eliminating bulky parallel backplanes. Plan PCB layer stack-up to maintain 100-ohm differential impedance on SERDES lanes.
Recomendado
Telecom Line Card Protocol Termination
In telecom line cards, the EP2SGX30DF780I3N performs framer/mapper functions for OTU2 and SONET/SDH, plus POS-PHY or SFI-4.1 interface bridging between the network processor and SERDES framer ICs. The 8 PLLs synthesize multiple jitter-compliant clocks for tributary aggregation. Industrial temperature rating and NRND lifecycle must be factored into long-deployment programs; verify last-time-buy availability through Intel franchised distributors.
Recomendado
Test & Measurement Instrumentation
Protocol analyzers, BERT testers, and high-speed digitizers use the EP2SGX30DF780I3N for capture/pattern generation at rates up to 6.375 Gbps per lane. The on-chip DSP blocks accelerate real-time eye-diagram analysis and protocol decoding without offloading to a host CPU. The FBGA-780 package supports dense probe-friendly layouts needed for lab instrumentation. Quartus II provides IBIS models for signal-integrity simulation of the high-speed lanes.
Recomendado
Industrial Control & Real-Time Processing
The industrial temperature grade (-40C to +100C junction) of the EP2SGX30DF780I3N makes it deployable in factory automation, motion control, and process control where microcontrollers lack throughput for parallel sensor fusion. The FPGA fabric implements deterministic servo loops at sub-microsecond latency while the embedded transceivers bridge to industrial Ethernet (EtherCAT, PROFINET) backbones. Note the NRND status - lock in long-term supply before committing new industrial designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2SGX30DF780I3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2SGX30DF780I4N | EP2SGX30DF780I5N | EP2SGX30DF780C4N | EP2SGX30DF780C7N | EP2SGX30CF780I4N |
|---|---|---|---|---|---|---|
| Package | 780-ball FBGA (DF780, 29x29mm) | 780-ball FBGA (DF780, 29x29mm) - same | 780-ball FBGA (DF780, 29x29mm) - same | 780-ball FBGA (DF780, 29x29mm) - same | 780-ball FBGA (DF780, 29x29mm) - same | 780-ball FBGA (CF780) - same pin count, different mechanical layout |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Speed Grade | I3 | I4 (faster) | I5 (fastest) | C4 (commercial) | C7 (slowest) | I4 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| User I/O | 361 | 361 | 361 | 361 | 361 | 361 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Industrial temperature grade with I3 speed margin (vs EP2SGX30DF780C7N)
- Faster speed grade timing margin within same FBGA-780 footprint (vs EP2SGX30DF780I3N)
- Same-die drop-in compatibility across speed grades (vs EP2SGX30DF780I4N)
Notas de projeto
The FBGA-780 package requires careful thermal management. Use a minimum 4-layer PCB with a continuous ground plane directly under the BGA, plus thermal vias in the center pad array (per the Stratix II GX package thermal guidelines). For high-utilization designs at industrial temperature, attach a heatsink with thermal interface material rated for the -40C to +100C operating range. Estimated: at 1.0 W internal power dissipation and theta_JA of approximately 12 C/W (with 1 oz copper ground plane), junction temperature rise above ambient is about 12C; verify with your specific board stack-up.
Route all transceiver differential pairs with 100-ohm differential impedance and maintain length matching within 5 mils for lanes within the same group. Use microstrip or stripline geometry consistent across all four SERDES channels; reference the Stratix II GX PCB Design Guidelines for via stub length limits (typically less than 0.25 inch for 6.375 Gbps signals). Power-decoupling requires 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of each VCC pin, plus bulk decoupling at the regulator outputs.
Pinout for the 780-FBGA is published in the Stratix II GX Pin Information file (CSV format). Use Quartus II's Pin Planner to assign pins after compilation - manual pin assignment without re-running fitter will produce unrouted designs. Place the configuration memory (EPCS64 or EPCQ64) within 1 inch of the FPGA's configuration pins (MSEL, nCONFIG, DATA, DCLK) to ensure signal integrity during AS configuration mode.
Do not mix speed grade and temperature grade part numbers when designing - the I3N industrial part cannot be replaced with a C-grade commercial part in industrial environments. Also note that the NRND lifecycle status means Intel/Altera will not accept new orders for this part beyond the final last-time-buy window; for new designs, plan migration to Stratix IV GX (EP4SGX) or Cyclone V families. Confirmed by Altera NRND PCN documentation.
Informações de conformidade
RoHS compliant per Altera/Intel product page (lead-free FBGA-780 package). REACH, halogen-free, and conflict-minerals declarations not verified in provided data - consult Intel product compliance documentation.
