EP3C16F484C6 - Cyclone III FPGA, 16K LE, 484-BGA | Altera
部品番号: EP3C16F484C6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $68.29 | $68.29 |
| 10 | $62.5 | $625.00 |
| 100 | $55.1 | $5,510.00 |
| 500 | $48.75 | $24,375.00 |
| 1,000 | $42.3 | $42,300.00 |
EP3C16F484C6 概要
What is a Cyclone III FPGA? The Cyclone III family is Altera's low-cost, low-power SRAM-based programmable logic family introduced in 2007, positioned between simple CPLDs and high-performance FPGAs such as Stratix. Cyclone III devices target cost-sensitive, high-volume applications where designers need moderate logic density, on-chip memory, and DSP blocks without paying for transceivers or hard processor cores. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor category, used wherever fixed-function ASICs are too expensive or inflexible.
Key features of the EP3C16F484C6 include 56 embedded 18x18 multipliers for DSP, four phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR, DDR2, and QDRII SRAM. The 484-FBGA package exposes the maximum user I/O count of 346 pins, enabling wide parallel buses and high-pin-count peripheral connectivity. Configuration is supported through passive serial (AS), active serial (PS), fast passive parallel (FPP), and JTAG modes.
The Cyclone III architecture uses 4-input look-up tables (LUTs) and embedded M9K memory blocks, providing a balanced resource mix for control-plane logic, state machines, and moderate DSP workloads. Compared to the previous Cyclone II generation, Cyclone III cuts dynamic power by approximately 50 percent and adds dedicated hardware multipliers and improved clock networks.
Typical applications include industrial motor control, video processing and display bridging, telecom baseband glue logic, prototyping ASIC designs, and embedded vision systems. The wide 484-ball package also makes the EP3C16F484C6 suitable for development boards and evaluation platforms where pin access is valuable.
When designing with this part, pay attention to configuration mode pin strapping (MSEL pins), JTAG chain ordering, and bank-based I/O voltage planning. The F484 package is the largest in the EP3C16 family and may require multi-layer PCB stack-ups for fan-out routing.
This page synthesizes distributor pricing, package-compatible same-family alternatives, and design considerations not always collected in one place on the manufacturer datasheet.
ドロップイン代替品: EP3C16F484C6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3C16F484C6 （同一形状・フットプリント） — 相違点: Package, Process Technology, Logic Elements (LE), Mounting Type, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
EP3C16F484C7
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP3C16F484C8
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP3C16F484C6N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$338.75 / 個
データシートを見る →EP3C16F484I7N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$36.4 / 個
データシートを見る →EP3C16F484A7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP4CE16F484C8N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP4CE22F484C8N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP3C16F484C6 最大定格＆電気的特性
| Device Family | Cyclone III |
| Logic Elements (LE) | 15,408 |
| Total Memory Bits | 516,096 |
| Embedded Multipliers (18x18) | 56 |
| PLLs | 4 |
| Maximum User I/O | 346 |
| パッケージ | 484-FBGA (FineLine BGA) |
| Speed Grade | C6 |
| 動作温度 | 0C to +85C (commercial) |
| Process Technology | 65 nm low-power |
| Configuration Modes | AS, PS, FPP, JTAG |
| メモリタイプ | M9K blocks (9 Kbit each) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
EP3C16F484C6 ピン構成
| ピン 1 | I/O Bank 1 — User I/O - bank 1 (refer to pin information PDF for exact ball mapping) |
| ピン 2 | I/O Bank 1 — User I/O - bank 1 |
| ピン 3 | I/O Bank 1 — User I/O - bank 1 |
| ピン 4 | I/O Bank 1 — User I/O - bank 1 |
| ピン 5 | I/O Bank 1 — User I/O - bank 1 |
| ピン 6 | I/O Bank 1 — User I/O - bank 1 |
| ピン 7 | I/O Bank 1 — User I/O - bank 1 |
| ピン 8 | I/O Bank 1 — User I/O - bank 1 |
| ピン 9 | I/O Bank 2 — User I/O - bank 2 |
| ピン 10 | I/O Bank 2 — User I/O - bank 2 |
| ピン 11 | GND — Ground reference |
| ピン 12 | VCCIO1 — I/O bank 1 supply voltage |
| ピン 13 | I/O Bank 2 — User I/O - bank 2 |
| ピン 14 | I/O Bank 2 — User I/O - bank 2 |
| ピン 15 | I/O Bank 2 — User I/O - bank 2 |
| ピン 16 | I/O Bank 2 — User I/O - bank 2 |
| ピン 17 | I/O Bank 3 — User I/O - bank 3 |
| ピン 18 | I/O Bank 3 — User I/O - bank 3 |
| ピン 19 | I/O Bank 3 — User I/O - bank 3 |
| ピン 20 | I/O Bank 3 — User I/O - bank 3 |
主な用途
EP3C16F484C6 の用途: 6 件s: Industrial Motor Control, Video Processing and Display Bridging, Telecom Baseband Glue Logic, ASIC Prototyping Platform, Embedded Vision Systems, Automotive Infotainment and Driver Assist.
Industrial Motor Control
The EP3C16F484C6 fits industrial motor control designs because it combines 15,408 logic elements for state machines and PWM modulators with 56 hardware multipliers for FOC and Clarke/Park transforms. Its 346 user I/O pins accept numerous Hall sensors, encoder inputs, gate driver signals, and isolation interfaces typically found in multi-axis drives. The Cyclone III architecture's low power dissipation (under 1 W typical at low toggle rates) suits fan-less industrial enclosures, while four PLLs generate the precise clock trees required for high-resolution PWM. Compared to a microcontroller + CPLD split, a single EP3C16F484C6 replaces both, reducing BOM cost and PCB area. The 484-FBGA package is appropriate for multi-axis AC drives or servo amplifiers where many control signals converge.
おすすめ
Video Processing and Display Bridging
The EP3C16F484C6 is well matched to video bridge applications such as HDMI-to-LVDS, MIPI-to-RGB, or dual-channel SDI multiplexing. The 516 Kbit of M9K memory is sufficient to buffer at least one full horizontal line of 1080p video (1920x3 = 5,760 bytes per line). The 56 hardware 18x18 multipliers accelerate color space conversion and scaling interpolation. With 346 user I/O, designers can simultaneously drive high-speed LVDS channels (using true-LVDS pairs) and parallel RGB or BT.656 buses without multiplexing. The 65 nm low-power process keeps thermal output acceptable for fan-less settop boxes. Altera's free Video and Image Processing Suite IP cores target exactly these workloads and are verified on Cyclone III silicon.
おすすめ
Telecom Baseband Glue Logic
Telecom baseband cards typically use a high-end ASIC or DSP for PHY processing, but still need abundant glue logic for cell mapping, framing, MAC interfacing, and timing distribution. The EP3C16F484C6 supplies 346 user I/O - more than enough to aggregate multiple SGMII / GMII / SPI / I2C / UART channels from a line card's PHY and framer devices. Its four PLLs synthesize jitter-clean copies of recovered line clocks, while the 56 multipliers handle small DSP tasks such as scrambling, FEC, or PRBS pattern generation. The 65 nm Cyclone III process gives deterministic latency suitable for cell-boundary alignment. Compared to discrete CPLD clusters, one EP3C16F484C6 simplifies layout, reduces standby current, and unifies timing.
おすすめ
ASIC Prototyping Platform
The EP3C16F484C6 is widely used as an ASIC prototype vehicle because it offers 15,408 logic elements at low cost with mature Quartus II tool support. With 346 user I/O, prototype boards can expose virtually all of the target ASIC's signals via headers or high-speed connectors for in-system validation. The 56 hardware multipliers mimic ASIC DSP blocks during bring-up, while 516 Kbit of block memory substitutes for embedded SRAM macros. Multi-FPGA partitioning flows can chain several EP3C16F484C6 devices together to emulate larger ASICs. The 65 nm process gives realistic timing correlation with production ASIC libraries, and the BGA package allows high-speed signal integrity on multi-layer boards.
おすすめ
Embedded Vision Systems
The EP3C16F484C6 is a strong fit for embedded vision applications such as industrial inspection cameras, machine vision lighting controllers, and smart surveillance front-ends. The 56 hardware 18x18 multipliers accelerate Sobel, Laplacian, and simple convolution kernels, while 516 Kbit of block memory holds at least one full QVGA frame (320x240 bytes) for line buffering. Its 346 user I/O easily accommodate parallel image sensor interfaces (DVP / BT.656) plus Ethernet, USB, and GPIO channels. The 65 nm low-power process enables fan-less camera housing designs. The 484-FBGA package suits multi-layer boards that also carry image sensors and power management. Designers can implement custom pixel pipelines without licensing an external DSP.
おすすめ
Automotive Infotainment and Driver Assist
For automotive infotainment head units, instrument clusters, and surround-view driver assist systems, the EP3C16F484C6 provides the logic and I/O density needed to aggregate multiple camera inputs, CAN/LIN buses, and LVDS display outputs. The 346 user I/O accept four parallel camera streams plus touch-controller and audio interfaces. Hardware multipliers handle perspective warp and image blending for surround-view, while 516 Kbit of block memory stores lookup tables and frame buffers. Designers targeting AEC-Q100 environments should choose the EP3C16F484A7N variant (automotive temp grade) rather than the commercial EP3C16F484C6. The 65 nm Cyclone III process has a proven track record in automotive designs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3C16F484C6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3C16F484C7 | EP3C16F484C8 | EP3C16F484I7N | EP3C16F484A7N | EP4CE16F484C8N | EP4CE22F484C8N |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 | 22,320 |
| Embedded Memory (bits) | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 | 608,256 |
| 18x18 Multipliers | 56 | 56 | 56 | 56 | 56 | 56 | 66 |
| Speed Grade | C6 | C7 (faster) | C8 (slower) | I7 (industrial, faster) | A7 (automotive, faster) | C8 | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +125C (automotive) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Family | Cyclone III (65 nm) | Cyclone III (65 nm) | Cyclone III (65 nm) | Cyclone III (65 nm) | Cyclone III (65 nm) | Cyclone IV E (60 nm) | Cyclone IV E (60 nm) |
| User I/O (max) | 346 | 346 | 346 | 346 | 346 | 346 | 346 |
主な差別化要因
- Lowest-cost Cyclone III variant in the 484-FBGA package （vs EP3C16F484C7)
- Industrial temperature option in the same footprint （vs EP3C16F484I7N)
- Automotive AEC-Q100 qualified drop-in option （vs EP3C16F484A7N)
- Modern migration path to Cyclone IV E family （vs EP4CE16F484C8N)
設計ノート
The 484-FBGA package uses a 1.0 mm ball pitch, which typically requires a 4- or 6-layer PCB with 0.5 oz copper and laser-drilled microvias for fan-out routing. Estimated: a 6-layer stack-up with HDI microvia construction is the practical baseline. Use the Cyclone III device package specifications document for the exact ball land pattern and keep all signal escape traces within the recommended width and clearance to avoid shorts during reflow.
Cyclone III FPGAs require multiple supply rails: VCCINT (core, typically 1.2 V), VCCIO (per bank, 1.2 V to 3.3 V), VCCAUX (2.5 V), and VCCPLL (1.2 V for PLL analog). Estimated total power consumption is roughly 0.5 W to 1.5 W depending on toggle rate and resource usage; use the Altera PowerPlay Early Power Estimator before final BOM commitment. Decoupling: place 0.1 uF X7R caps within 100 mil of every VCC pin group and bulk 10 uF to 47 uF tantalum or ceramic caps on each supply rail at the PCB edge.
Do not confuse MSEL pin strapping with user I/O - the MSEL[3:0] inputs select configuration mode (AS, PS, FPP, JTAG) and must be tied to VCCIO or GND through 1 kohm resistors. Pulling MSEL incorrectly can leave the device unable to configure. Also note that the F484 package does not support the Active Parallel (AP) configuration mode on EP3C16, unlike the F256 / F484 in larger Cyclone III devices. Verify configuration mode compatibility before designing the boot memory interface.
Although the EP3C16F484C6 is a low-power part, the 484-FBGA package concentrates thermal dissipation into a small footprint. Estimated: at typical toggle rates the junction temperature rise above ambient is below 20C and no heatsink is required, but at sustained 100% toggle rates on many I/O, junction temperature can rise 30C to 40C. Ensure adequate copper pour on inner layers connected through thermal vias to the BGA balls. For enclosed industrial enclosures, validate with a thermocouple during worst-case testing.
コンプライアンス情報
Commercial temperature grade; not AEC-Q100 qualified - choose EP3C16F484A7N for automotive applications. RoHS and lead-free compliance per distributor product pages.