EP3C40F324C8 - 39600-Cell Cyclone III FPGA | Intel
部品番号: EP3C40F324C8 ✗ 生産終了EP3C40F324C8 概要
An FPGA is a programmable semiconductor whose internal logic, interconnects, and input/output blocks are configured after manufacture. The FPGA and CPLD are branches of programmable logic devices, while the broader hierarchy includes digital logic ICs and semiconductors. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can be reconfigured for protocol bridging, signal processing, test instrumentation, communications, and embedded control applications.
The EP3C40F324C8 belongs to Intel's Cyclone III device family. Its headline resource count is 39,600 logic elements, while the 402 MHz frequency represents the maximum operating frequency associated with the device listing rather than the performance of every embedded design. A 1.2 V core supply reduces the number of core rails commonly required by FPGA designs, although external interfaces still require correctly specified board-level power rails and termination.
The 324-BGA package supports dense PCB integration and high I/O availability, but it also demands careful escape routing, via planning, thermal design, and assembly-process control. The listing identifies 195 I/O positions, package terminals as balls, and a square package form. Exact power, memory, I/O-standard, timing, and differential-capability details must be confirmed in the Cyclone III device documentation before schematic or PCB sign-off.
Typical uses for this device include industrial data acquisition, parallel sensor and actuator interfaces, communications infrastructure, test and measurement systems, embedded signal processing, and general-purpose programmable control. Its 39,600 logic elements provide substantially more parallel hardware capability than a small microcontroller while retaining the flexibility of programmable logic. The 402 MHz device rate also makes time-domain logic and tightly pipelined interface functions practical.
When laying out a board around the EP3C40F324C8, prioritize power-plane integrity, decoupling placement, clock routing, and BGA escape routing. Confirm the exact pinout and pin assignment in the manufacturer device documentation before assigning ball locations. Avoid treating the package ball count as the number of usable user I/O, because dedicated power, ground, configuration, clock, and reserved balls may be present.
This product page consolidates the core device identity, package information, sourcing details, comparison criteria, and practical integration guidance into one engineering reference. It is intended to support initial design selection and procurement planning, while final timing, power, and compatibility decisions remain tied to the official Cyclone III documentation and the selected system design.
ドロップイン代替品: EP3C40F324C8 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3C40F324C8 （同一形状・フットプリント） — 相違点: Mounting Type, Family, Operating Temperature, Package, Process Technology.
EP3C40F324C6N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3C40F324C7N
✅ ドロップイン価格はお問い合わせください
データシートを見る →EP3C40F324C8N
✅ ドロップイン価格はお問い合わせください
データシートを見る →EP3C40F324C6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3C40F324C7N
✅ ドロップイン価格はお問い合わせください
データシートを見る →EP3C40F324C8 最大定格＆電気的特性
| Device Type | Cyclone III field-programmable gate array (FPGA) |
| Logic Elements | 39,600 elements |
| Maximum Operating Frequency | 402 MHz |
| Core Supply Voltage | 1.2 V |
| I/O Count | 195 I/O |
| Package Type | 324-ball FBGA |
| Terminal Count | 324 balls |
| Package Shape | Square |
| Terminal Form | Ball |
| 実装タイプ | Surface mount |
| Device Family | Cyclone III |
| Manufacturer | Intel |
| Packaging | Tray |
EP3C40F324C8 square ピン配置ガイド
EP3C40F324C8 (square パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3C40F324C8.
詳細は データシート をご参照ください。
主な用途
EP3C40F324C8 の用途: 6 件s: Industrial Data Acquisition, Communications Interface Bridging, Test and Measurement Systems, Embedded Signal Processing, Programmable Industrial Control, LED Lighting and Display Control.
Industrial Data Acquisition
The EP3C40F324C8 is well suited to industrial data-acquisition equipment that must collect several sensor channels and perform timing-sensitive digital processing in parallel. Its 39,600 logic elements can implement acquisition control, trigger logic, filtering, packing, and interface conversion, while the stated 402 MHz operating frequency supports deeply pipelined datapaths. The 324-ball package provides 195 listed I/O positions for converters, digital sensors, memory devices, and synchronization signals. Design the I/O standards around the actual bank requirements, isolate analog acquisition circuitry from digital switching, and validate timing against the selected speed grade.
おすすめ
Communications Interface Bridging
The EP3C40F324C8 can bridge or adapt communications peripherals when parallel logic and deterministic throughput matter more than processor overhead. With 39,600 logic elements and a stated 402 MHz device rate, it can implement width converters, FIFO buffers, CRC engines, packetizers, and protocol state machines in parallel. The 324-ball FBGA offers dense connections for external memories, PHY interfaces, and control logic. Engineers should assign pins by bank, verify supported voltage standards, constrain clock-domain crossings, and confirm configuration and memory interfaces against the complete Cyclone III documentation.
おすすめ
Test and Measurement Systems
The EP3C40F324C8 is applicable to programmable test and measurement systems requiring concurrent pattern generation, acquisition, and timing control. Its 39,600 logic elements can support multiple channels of counters, comparators, capture logic, and digital stimulus generation, while the 402 MHz stated frequency allows short deterministic processing pipelines. The 324-ball package provides sufficient connectivity for converters, instruments, memory, and communication links. For accurate measurements, use dedicated clocking resources, minimize clock jitter, isolate analog sections, and complete timing closure with all clock and I/O constraints applied.
おすすめ
Embedded Signal Processing
The EP3C40F324C8 supports embedded signal-processing designs that benefit from parallel fixed-function hardware rather than a sequential processor. The 39,600 logic elements can host FIR and IIR pipelines, digital down-conversion, decimation filters, correlation, peak detection, and timing recovery at the stated 402 MHz device class. The large 324-ball package helps connect multiple data buses, memories, and converters. Define arithmetic precision before implementation, use DSP-aware coding techniques, pipeline critical paths, and verify metastability or overflow behavior at each numerical boundary.
おすすめ
Programmable Industrial Control
The EP3C40F324C8 can implement a deterministic industrial controller when the design combines machine-control sequencing with specialized parallel logic. Its 39,600 logic elements allow motor and sensor timing, state-machine control, diagnostics, and communications handling to coexist in one FPGA. The stated 402 MHz operating frequency supports short real-time response paths, and the 195 listed I/O positions can connect field-level digital signals. Separate safety and non-safety circuitry as required, use registered I/O where appropriate, and validate timing margins across voltage and temperature corners.
おすすめ
LED Lighting and Display Control
The EP3C40F324C8 can consolidate multichannel refresh, animation, calibration, and fault monitoring for LED lighting or display systems. Its 39,600 logic elements permit parallel timing generation and data formatting, while the stated 402 MHz device rate provides margin for high-channel-count timing. The 324-ball package supports external drivers, memory, and control interfaces through the listed 195 I/O positions. Account for LED driver timing, output standards, channel current limits external to the FPGA, and synchronization between independently refreshed panels.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3C40F324C8 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3C40F324C6N | EP3C40F324C7 | EP3C40F324C8N | EP3C40F324C6 | EP3C40F324C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-BGA | 324-BGA | 324-BGA | 324-BGA | 324-BGA | 324-BGA |
| Device Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 39,600 elements | 39,600 elements | 39,600 elements | 39,600 elements | 39,600 elements | 39,600 elements |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Terminal Count | 324 balls | 324 balls | 324 balls | 324 balls | 324 balls | 324 balls |
| Ordering Suffix | C8 | C6N | C7 | C8N | C6 | C7N |
| Special Feature | 39,600-cell Cyclone III FPGA | 39,600-cell Cyclone III FPGA | 39,600-cell Cyclone III FPGA | 39,600-cell Cyclone III FPGA | 39,600-cell Cyclone III FPGA | 39,600-cell Cyclone III FPGA |
主な差別化要因
- Matches the 402 MHz ordering class of the target （vs EP3C40F324C6N)
- Uses the same 324-ball FBGA footprint across the comparison family （vs EP3C40F324C7)
- Provides 39,600 logic elements for parallel digital designs （vs EP3C25F324C7)
- Offers 195 listed I/O positions in a dense square BGA （vs EP3C40F324C6N)
設計ノート
Plan the EP3C40F324C8 layout from the exact manufacturer package drawing rather than from the 324-ball count. Reserve all balls for power, ground, configuration, clock, and user functions, and use a manufacturing-capable escape-routing strategy with appropriate microvias, pad sizes, solder-mask openings, and paste apertures. Keep high-speed interfaces away from noisy analog or switching-regulator areas. Because the device can create substantial simultaneous switching current, use uninterrupted reference planes and minimize return-path discontinuities beneath the BGA.
Separate the 1.2 V core rail from the required I/O and auxiliary rails, and follow the manufacturer power-plane, decoupling, and sequencing requirements exactly. Place the smallest recommended bypass capacitors directly at the relevant power balls, with additional bulk capacitance located near the regulator output. Estimate each rail's worst-case current from the actual design utilization and I/O activity rather than from a single typical FPGA value. Validate voltage tolerance, inrush, startup order, and power-supply headroom across temperature before releasing the board.
Use dedicated clock inputs where available and constrain every clock path, including generated and forwarded clocks. Match trace lengths according to the interface's source-synchronous or chip-to-chip timing requirement, control impedance on high-speed nets, and provide termination defined by the external device. For memory interfaces, account for package and board skew in timing closure and keep the escape routing compact. Do not rely on automatic pin placement to resolve pin-bank restrictions or differential-pair topology.
Do not treat EP3C40F324C6N, EP3C40F324C7, or EP3C40F324C8N as automatic replacements merely because they share the Cyclone III name and 324-ball package. Decode every ordering suffix against the manufacturer ordering guide and confirm speed grade, temperature grade, configuration mode, power behavior, and package revision. Also verify that the original design does not exceed the candidate's logic, memory, I/O, and timing resources. A board-level drop-in decision requires both footprint and complete device-ordering equivalence.
コンプライアンス情報
The verified device listings do not explicitly state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 qualification is not applicable to this general-purpose Cyclone III FPGA.
