EP3C40F324C8 - 39600-Cell Cyclone III FPGA | Intel
MPN: EP3C40F324C8 ✗ Tapus ng BuhayEP3C40F324C8 Ulas
An FPGA is a programmable semiconductor whose internal logic, interconnects, and input/output blocks are configured after manufacture. The FPGA and CPLD are branches of programmable logic devices, while the broader hierarchy includes digital logic ICs and semiconductors. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can be reconfigured for protocol bridging, signal processing, test instrumentation, communications, and embedded control applications.
The EP3C40F324C8 belongs to Intel's Cyclone III device family. Its headline resource count is 39,600 logic elements, while the 402 MHz frequency represents the maximum operating frequency associated with the device listing rather than the performance of every embedded design. A 1.2 V core supply reduces the number of core rails commonly required by FPGA designs, although external interfaces still require correctly specified board-level power rails and termination.
The 324-BGA package supports dense PCB integration and high I/O availability, but it also demands careful escape routing, via planning, thermal design, and assembly-process control. The listing identifies 195 I/O positions, package terminals as balls, and a square package form. Exact power, memory, I/O-standard, timing, and differential-capability details must be confirmed in the Cyclone III device documentation before schematic or PCB sign-off.
Typical uses for this device include industrial data acquisition, parallel sensor and actuator interfaces, communications infrastructure, test and measurement systems, embedded signal processing, and general-purpose programmable control. Its 39,600 logic elements provide substantially more parallel hardware capability than a small microcontroller while retaining the flexibility of programmable logic. The 402 MHz device rate also makes time-domain logic and tightly pipelined interface functions practical.
When laying out a board around the EP3C40F324C8, prioritize power-plane integrity, decoupling placement, clock routing, and BGA escape routing. Confirm the exact pinout and pin assignment in the manufacturer device documentation before assigning ball locations. Avoid treating the package ball count as the number of usable user I/O, because dedicated power, ground, configuration, clock, and reserved balls may be present.
This product page consolidates the core device identity, package information, sourcing details, comparison criteria, and practical integration guidance into one engineering reference. It is intended to support initial design selection and procurement planning, while final timing, power, and compatibility decisions remain tied to the official Cyclone III documentation and the selected system design.
Mga alternatibo na pwedeng ilagay na EP3C40F324C8 — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP3C40F324C8 (parehas na form factor at footprint) — pagkakaiba sa Mounting Type, Family, Operating Temperature, Package, Process Technology.
EP3C40F324C6N
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
EP3C40F324C7N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3C40F324C8N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3C40F324C6
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
EP3C40F324C7N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3C40F324C8 Mga Pinakamataas na Rating at Electrical Characteristics
| Device Type | Cyclone III field-programmable gate array (FPGA) |
| Logic Elements | 39,600 elements |
| Maximum Operating Frequency | 402 MHz |
| Core Supply Voltage | 1.2 V |
| I/O Count | 195 I/O |
| Package Type | 324-ball FBGA |
| Terminal Count | 324 balls |
| Package Shape | Square |
| Terminal Form | Ball |
| Uri ng Pagpapasok | Surface mount |
| Device Family | Cyclone III |
| Manufacturer | Intel |
| Packaging | Tray |
Gabay sa Pin Configuration ng EP3C40F324C8 square
Pin configuration para sa EP3C40F324C8 (square package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP3C40F324C8.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP3C40F324C8 ay nararapat para sa 6 aplikasyons: Industrial Data Acquisition, Communications Interface Bridging, Test and Measurement Systems, Embedded Signal Processing, Programmable Industrial Control, LED Lighting and Display Control.
Industrial Data Acquisition
The EP3C40F324C8 is well suited to industrial data-acquisition equipment that must collect several sensor channels and perform timing-sensitive digital processing in parallel. Its 39,600 logic elements can implement acquisition control, trigger logic, filtering, packing, and interface conversion, while the stated 402 MHz operating frequency supports deeply pipelined datapaths. The 324-ball package provides 195 listed I/O positions for converters, digital sensors, memory devices, and synchronization signals. Design the I/O standards around the actual bank requirements, isolate analog acquisition circuitry from digital switching, and validate timing against the selected speed grade.
Inirekomenda
Communications Interface Bridging
The EP3C40F324C8 can bridge or adapt communications peripherals when parallel logic and deterministic throughput matter more than processor overhead. With 39,600 logic elements and a stated 402 MHz device rate, it can implement width converters, FIFO buffers, CRC engines, packetizers, and protocol state machines in parallel. The 324-ball FBGA offers dense connections for external memories, PHY interfaces, and control logic. Engineers should assign pins by bank, verify supported voltage standards, constrain clock-domain crossings, and confirm configuration and memory interfaces against the complete Cyclone III documentation.
Inirekomenda
Test and Measurement Systems
The EP3C40F324C8 is applicable to programmable test and measurement systems requiring concurrent pattern generation, acquisition, and timing control. Its 39,600 logic elements can support multiple channels of counters, comparators, capture logic, and digital stimulus generation, while the 402 MHz stated frequency allows short deterministic processing pipelines. The 324-ball package provides sufficient connectivity for converters, instruments, memory, and communication links. For accurate measurements, use dedicated clocking resources, minimize clock jitter, isolate analog sections, and complete timing closure with all clock and I/O constraints applied.
Inirekomenda
Embedded Signal Processing
The EP3C40F324C8 supports embedded signal-processing designs that benefit from parallel fixed-function hardware rather than a sequential processor. The 39,600 logic elements can host FIR and IIR pipelines, digital down-conversion, decimation filters, correlation, peak detection, and timing recovery at the stated 402 MHz device class. The large 324-ball package helps connect multiple data buses, memories, and converters. Define arithmetic precision before implementation, use DSP-aware coding techniques, pipeline critical paths, and verify metastability or overflow behavior at each numerical boundary.
Inirekomenda
Programmable Industrial Control
The EP3C40F324C8 can implement a deterministic industrial controller when the design combines machine-control sequencing with specialized parallel logic. Its 39,600 logic elements allow motor and sensor timing, state-machine control, diagnostics, and communications handling to coexist in one FPGA. The stated 402 MHz operating frequency supports short real-time response paths, and the 195 listed I/O positions can connect field-level digital signals. Separate safety and non-safety circuitry as required, use registered I/O where appropriate, and validate timing margins across voltage and temperature corners.
Inirekomenda
LED Lighting and Display Control
The EP3C40F324C8 can consolidate multichannel refresh, animation, calibration, and fault monitoring for LED lighting or display systems. Its 39,600 logic elements permit parallel timing generation and data formatting, while the stated 402 MHz device rate provides margin for high-channel-count timing. The 324-ball package supports external drivers, memory, and control interfaces through the listed 195 I/O positions. Account for LED driver timing, output standards, channel current limits external to the FPGA, and synchronization between independently refreshed panels.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP3C40F324C8 — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP3C40F324C6N | EP3C40F324C7 | EP3C40F324C8N | EP3C40F324C6 | EP3C40F324C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-BGA | 324-BGA | 324-BGA | 324-BGA | 324-BGA | 324-BGA |
| Device Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 39,600 elements | 39,600 elements | 39,600 elements | 39,600 elements | 39,600 elements | 39,600 elements |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Terminal Count | 324 balls | 324 balls | 324 balls | 324 balls | 324 balls | 324 balls |
| Ordering Suffix | C8 | C6N | C7 | C8N | C6 | C7N |
| Special Feature | 39,600-cell Cyclone III FPGA | 39,600-cell Cyclone III FPGA | 39,600-cell Cyclone III FPGA | 39,600-cell Cyclone III FPGA | 39,600-cell Cyclone III FPGA | 39,600-cell Cyclone III FPGA |
Pangunahing mga Pagkakaiba
- Matches the 402 MHz ordering class of the target (kumpara saEP3C40F324C6N)
- Uses the same 324-ball FBGA footprint across the comparison family (kumpara saEP3C40F324C7)
- Provides 39,600 logic elements for parallel digital designs (kumpara saEP3C25F324C7)
- Offers 195 listed I/O positions in a dense square BGA (kumpara saEP3C40F324C6N)
Talaan ng Disenyo
Plan the EP3C40F324C8 layout from the exact manufacturer package drawing rather than from the 324-ball count. Reserve all balls for power, ground, configuration, clock, and user functions, and use a manufacturing-capable escape-routing strategy with appropriate microvias, pad sizes, solder-mask openings, and paste apertures. Keep high-speed interfaces away from noisy analog or switching-regulator areas. Because the device can create substantial simultaneous switching current, use uninterrupted reference planes and minimize return-path discontinuities beneath the BGA.
Separate the 1.2 V core rail from the required I/O and auxiliary rails, and follow the manufacturer power-plane, decoupling, and sequencing requirements exactly. Place the smallest recommended bypass capacitors directly at the relevant power balls, with additional bulk capacitance located near the regulator output. Estimate each rail's worst-case current from the actual design utilization and I/O activity rather than from a single typical FPGA value. Validate voltage tolerance, inrush, startup order, and power-supply headroom across temperature before releasing the board.
Use dedicated clock inputs where available and constrain every clock path, including generated and forwarded clocks. Match trace lengths according to the interface's source-synchronous or chip-to-chip timing requirement, control impedance on high-speed nets, and provide termination defined by the external device. For memory interfaces, account for package and board skew in timing closure and keep the escape routing compact. Do not rely on automatic pin placement to resolve pin-bank restrictions or differential-pair topology.
Do not treat EP3C40F324C6N, EP3C40F324C7, or EP3C40F324C8N as automatic replacements merely because they share the Cyclone III name and 324-ball package. Decode every ordering suffix against the manufacturer ordering guide and confirm speed grade, temperature grade, configuration mode, power behavior, and package revision. Also verify that the original design does not exceed the candidate's logic, memory, I/O, and timing resources. A board-level drop-in decision requires both footprint and complete device-ordering equivalence.
Impormasyon ng Pagsunod sa Kautusan
The verified device listings do not explicitly state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 qualification is not applicable to this general-purpose Cyclone III FPGA.
