Intel

EP3C80F484C8 - Cyclone III FPGA 81K LE 484-FBGA | Intel (Altera)

部品番号: EP3C80F484C8 ✓ 生産中
在庫あり 1〜3営業日以内に発送
1.2 V Vdss 484-ball FBGA (23x23 mm, 1.0 mm pitch) Package 402 MHz Speed 2,810,880 bits (2810 Kb) Memory
開始価格 $182.76 USD / 個
MOQ: 1 |
価格更新日: 2026-09-09
ボリューム価格
数量 単価 小計
1 $304.59 $304.59
10 $274.13 $2,741.30
100 $243.67 $24,367.00
500 $213.21 $106,605.00
1,000 $182.76 $182,760.00
ℹ️ すべての価格はUSDです

EP3C80F484C8 概要

The Intel (formerly Altera) Cyclone III EP3C80F484C8 is a low-power, high-volume Field Programmable Gate Array built on a 65 nm CMOS process and housed in a 484-ball FineLine BGA (FBGA-484, 23x23 mm, 1.0 mm pitch) package. The device delivers 81,264 logic elements (LEs), 2,810,880 bits of embedded memory (2810 Kb), and 295 maximum user I/O pins, with a core voltage of 1.2 V and internal operating performance up to 402 MHz per published Cyclone III family specifications.

A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets engineers implement arbitrary digital logic - from glue logic and state machines to entire processor subsystems - via a programmable fabric of logic elements, embedded memory blocks, DSP blocks, and programmable I/O. FPGAs sit hierarchically under programmable logic devices (PLDs), alongside complex programmable logic devices (CPLDs), within the broader integrated circuit (IC) taxonomy, and are widely used as prototyping, low-volume production, and DSP/parallel-processing alternatives to ASICs and microcontrollers.

Key features of the EP3C80F484C8 include 244 embedded 18x18 multipliers (DSP blocks) for high-throughput fixed-point arithmetic, four phase-locked loops (PLLs) for clock synthesis and skew management, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and a low-power architecture that targets consumer, industrial, and communications applications. The 'C8' speed grade denotes a commercial temperature device with the slowest of the Cyclone III speed grades, balancing cost and performance for non-timing-critical designs.

Architecturally, the Cyclone III family leverages a logic-element fabric of 4-input look-up tables (LUTs), M9K embedded memory blocks, and dedicated DSP slices. The EP3C80 variant occupies the upper-middle of the family, providing roughly twice the LE count of the EP3C40 while remaining notably smaller and lower-cost than the EP3C120, making it the typical sweet-spot for mid-density designs.

Typical applications include industrial motor control, video processing pipelines, software-defined radio (SDR) front ends, telecommunications baseband processing, and embedded control systems. The EP3C80F484C8 specifically suits designs that need DDR controller support, abundant DSP bandwidth, and a large FPGA fabric without crossing into the higher-cost EP3C120 tier.

When designing with this device, plan I/O bank assignments and pin-out early because the 484-FBGA package leaves no room for late-stage changes. Use the Altera/Intel Quartus II design suite (Cyclone III device support) for synthesis, place-and-route, and timing closure; signal-integrity and power-integrity analysis are recommended for DDR interfaces.

This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family (same brand Intel/Altera), and practical design notes not collected on a single manufacturer or distributor page.

ドロップイン代替品: EP3C80F484C8 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP3C80F484C8 (同一形状・フットプリント) — 相違点: Package, Operating Temperature, Speed Grade, Process Technology, Family.

Intel
Package: 484-ball FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch
Process Technology: 65 nm
比較対象 EP3C80F484C8 →
Altera
Package: 484-FBGA (23×23 mm, 1.0 mm pitch)
Operating Temperature: -40C to +85C (industrial)
Speed Grade: 8 (commercial)
比較対象 EP3C80F484C8 →
Altera
Package: 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch
比較対象 EP3C80F484C8 →
Altera
Package: 484-ball FBGA (FineLine BGA)
比較対象 EP3C80F484C8 →
Altera
Package: 484-ball FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch
Operating Temperature: 0C to +85C (Commercial, 'C' speed grade)
Speed Grade: 6 (medium speed bin)
比較対象 EP3C80F484C8 →
Intel
Package: 484-FBGA
Operating Temperature: 0 C to +85 C (commercial)
Speed Grade: 8
比較対象 EP3C80F484C8 →
Intel
Package: 484-FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch
Operating Temperature: -40C to +100C (Industrial grade, "I7" suffix)
Process Technology: 65 nm low-power CMOS
比較対象 EP3C80F484C8 →
Intel
Package: 484-ball FBGA
Operating Temperature: 0 C to +85 C (commercial)
Speed Grade: C8
比較対象 EP3C80F484C8 →
Intel
Package: 484-ball FCBGA (F484), 1.0 mm pitch
Operating Temperature: 0C to +85C (commercial, "C")
Speed Grade: C3
比較対象 EP3C80F484C8 →

クイック比較ツール — 並列比較する代替部品を選択:

EP3C80F484C7N

✅ ドロップイン
Altera
📦 FBGA-484 (23x23 mm, 1.0 mm pitch)
FPGA - Field Programmable Gate Array · Cyclone III · 81264 LE · 295 I/O · 2.68 Mbit · 472.5 MHz · 1.15 V to 1.25 V · 0 C

✓ 在庫あり

$306.54 / 個

データシートを見る →

EP3C80F484C7

✅ ドロップイン
Altera
📦 FBGA-484 (23x23 mm, 1.0 mm pitch)
Field Programmable Gate Array (FPGA) · Cyclone III · 81264 cells · 2810880 bit · 295 I/O · 5079 LABs · 65 nm · 437.5 MHz

✓ 在庫あり

$215 / 個

データシートを見る →

EP3C80F484C6N

✅ ドロップイン
Altera
📦 FBGA-484 (23x23 mm, 1.0 mm pitch)
Cyclone III · Cyclone III FPGA (Low Power) · 81,264 · 2,810,880 (4 Mbits) · 295 · 484-ball FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch · Surface Mount (SMT) · 4

✓ 在庫あり

$369.38 / 個

データシートを見る →

EP3C80F484C6

✅ ドロップイン
Altera
📦 FBGA-484 (23x23 mm, 1.0 mm pitch)
Cyclone III · 81,264 · 2,810,880 · 81,264 · 81,264 · 295 · 472.5 MHz · 488

✓ 在庫あり

$102.5 / 個

データシートを見る →

EP3C120F484C7N

✅ ドロップイン
Intel
📦 FBGA-484 (23x23 mm, 1.0 mm pitch)
Cyclone III · 119,088 · 3,981,312 · 283 · 472 MHz · 4 · 20 · 65 nm

✓ 在庫あり

$185 / 個

データシートを見る →

EP3C55F484C8N

✅ ドロップイン
Altera
📦 FBGA-484 (23x23 mm, 1.0 mm pitch)
Cyclone III · 55,856 · 327 · 2,396,160 · 260 · 260 · 4 · 472 MHz

✓ 在庫あり

$58.5 / 個

データシートを見る →

EP3C40F484C8N

✅ ドロップイン
Altera
📦 FBGA-484 (23x23 mm, 1.0 mm pitch)
Cyclone III · 39,600 · 2,475 · 1,161,216 bits (1134 Kbit M9K RAM) · 126 · 331 · 4 · 20

✓ 在庫あり

$21.4 / 個

データシートを見る →

EP3C80F484C8 最大定格&電気的特性

Family Cyclone III
Logic Elements (LE) 81,264
Total Memory Bits 2,810,880 bits (2810 Kb)
Embedded 18x18 Multipliers 244
PLLs 4
Maximum User I/O 295
Process Technology 65 nm CMOS
Core Voltage (Vccint) 1.2 V
Maximum Operating Frequency 402 MHz
パッケージ 484-ball FBGA (23x23 mm, 1.0 mm pitch)
実装タイプ Surface Mount
Speed Grade C8 (commercial, slowest Cyclone III grade)
動作温度 0C to +85C (commercial)
RoHS ステータス Compliant
Lead-Free Yes
Memory Interfaces Supported DDR, DDR2, QDRII SDRAM

EP3C80F484C8 ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン A1 I/O — User I/O - bank assignment depends on Quartus pin-out file
ピン A2 I/O — User I/O - bank assignment depends on Quartus pin-out file
ピン B1 I/O — User I/O - bank assignment depends on Quartus pin-out file
ピン B2 I/O — User I/O - bank assignment depends on Quartus pin-out file
ピン AB22 I/O — User I/O - bank assignment depends on Quartus pin-out file
ピン AB23 I/O — User I/O - bank assignment depends on Quartus pin-out file
ピン VCCINT VCCINT — Core supply 1.2 V (multiple balls across the package)
ピン VCCIO VCCIO — I/O bank supply 1.2 V to 3.3 V (multiple balls, per bank)
ピン GND GND — Ground (multiple balls across the package)

主な用途

EP3C80F484C8 の用途: 6 件s: Industrial Motor Control, Video Processing Pipeline, Software-Defined Radio (SDR) Baseband, Telecommunications Baseband Processing, Embedded Control and Industrial Automation, Test and Measurement Instrumentation.

🏭

Industrial Motor Control

The EP3C80F484C8 fits industrial motor control applications because its 81,264 LEs and 244 dedicated 18x18 hardware multipliers provide the parallel fixed-point arithmetic required for field-oriented control (FOC) loops on three-phase PMSM and AC induction drives. The 4 PLLs allow precise generation of the high-frequency PWM carrier and the encoder-capture clock, while 295 user I/Os in the FBGA-484 package expose enough channels to interface to Hall/encoder feedback, gate drivers, and isolation barriers. The 65 nm low-power Cyclone III architecture helps designers hit industrial thermal budgets without active cooling, and Quartus II DSP Builder accelerates time-to-prototype for the Clarke/Park and PID transforms central to FOC.

📺

Video Processing Pipeline

The EP3C80F484C8 is well-matched to mid-resolution video processing pipelines because its 2,810,880 bits of embedded M9K memory comfortably buffer several video lines at 720p/1080p, and 244 18x18 multipliers handle real-time pixel-domain operations such as color-space conversion, scaling, and edge detection. The device's LVDS-capable I/O banks and external DDR/DDR2 memory controller support the bandwidth needed to ingest ITU-R BT.656 or parallel RGB streams and emit processed video to a display controller. Designers can prototype a full de-interlacer, scaler, or on-screen-display overlay in a single FPGA without resorting to external frame buffers, lowering BOM cost for surveillance and broadcast equipment.

🌐

Software-Defined Radio (SDR) Baseband

The EP3C80F484C8 suits SDR baseband signal processing because its 244 hardware 18x18 multipliers implement the digital down-conversion (DDC) and channelization filters that would otherwise demand a DSP or ASIC, and its 81K LEs absorb the state machine, FFT, and protocol glue logic in a single fabric. The 4 PLLs synthesize the precise sample-rate clocks from a single external reference, while the embedded M9K blocks store FFT twiddle factors and channelization filter coefficients. The 65 nm Cyclone III low-power architecture is attractive for portable and field-deployable SDR platforms where thermal dissipation is constrained.

📱

Telecommunications Baseband Processing

The EP3C80F484C8 addresses telecom baseband processing because its 81,264 LEs and 244 hardware multipliers deliver the throughput required for forward-error-correction (Viterbi, Turbo), digital up-/down-conversion, and framing logic, while 295 user I/Os in the FBGA-484 package connect cleanly to ADC/DAC converters and CPRI/OBSAI framer PHYs. The dedicated DDR/DDR2 memory controller and 2.7 Mb of embedded memory enable line-rate buffering for baseband sample streams without external SRAM. Designers benefit from the Quartus II SOPC Builder flow that integrates Nios II soft-core processors for MAC-layer scheduling in the same FPGA.

🧩

Embedded Control and Industrial Automation

The EP3C80F484C8 fits embedded industrial controllers because its 81K LEs can host a Nios II soft-core processor, custom peripherals, and multiple industrial communication stacks (Modbus, EtherCAT slave, PROFINET IRT) on a single device, while its 244 DSP blocks handle real-time closed-loop control math. The 295 I/Os in the FBGA-484 package accommodate multi-protocol field-bus transceivers and parallel sensor arrays, and the dedicated PLL block synthesizes the deterministic clocks required by industrial Ethernet PHYs. Designers can collapse MCU + ASIC glue logic into one Cyclone III, simplifying the BOM and shortening the design cycle versus discrete solutions.

🖥️

Test and Measurement Instrumentation

The EP3C80F484C8 is suitable for test and measurement instruments because its 81,264 LEs can implement arbitrary stimulus generation, deep pattern sequencing, and protocol-aware decoding, while 295 user I/Os in the FBGA-484 package support high-pin-count logic analyzer or protocol exerciser front ends. The 4 PLLs and DDR memory controller deliver the deterministic timing and bulk capture memory that automated test equipment requires, and 244 hardware multipliers handle on-chip FFT, FIR filtering, or statistical signal processing. Engineers can re-use one PCB across multiple test standards by reprogramming the FPGA, lowering per-instrument NRE cost.

What is the logic element count of EP3C80F484C8?
The EP3C80F484C8 contains 81,264 logic elements (LEs) per the Intel Cyclone III device handbook. This LE density places the EP3C80 in the upper-middle tier of the Cyclone III family - roughly 2x the LE count of the EP3C40 and about two-thirds of the EP3C120, making it well suited to mid-complexity digital designs.
What package does EP3C80F484C8 use?
The EP3C80F484C8 ships in a 484-ball FineLine BGA (FBGA-484) measuring 23x23 mm with a 1.0 mm ball pitch, per the Altera/Intel Cyclone III handbook. The 'F484' suffix in the MPN is the package code, and 'C8' identifies the speed grade - these two fields together fully specify the device variant and footprint.
How much embedded memory does EP3C80F484C8 have?
The EP3C80F484C8 integrates 2,810,880 bits (approximately 274 Kb / 2810 Kb / ~2.74 Mb) of embedded SRAM organized as M9K blocks per the Cyclone III handbook. This is sufficient for buffer memories, FIFO queues, line buffers for video, and lookup-table-driven DSP, reducing the need for external SRAM in many designs.
What is the difference between EP3C80F484C8 and EP3C80F484C7?
EP3C80F484C8 and EP3C80F484C7 share the same die, FBGA-484 package, and 81,264 LEs; the only difference is speed grade. C7 is a faster speed grade than C8 - choose C7 if your timing closure is borderline, choose C8 if you want lower cost and your design has timing slack.
What is the operating voltage of EP3C80F484C8?
The EP3C80F484C8 uses a 1.2 V core supply (Vccint) per the Cyclone III handbook. I/O banks operate independently at 1.2 V to 3.3 V depending on bank standard. A typical power design uses a switching regulator for Vccint and an LDO or switching regulator for each unique I/O bank voltage.
Where can I buy EP3C80F484C8 online?
As of 2026-09-09, the EP3C80F484C8 is in stock at authorized distributors listed on Octopart and DigiKey. Unit price is around $304.59 for qty 1 (Heisener 2026-09-09), with lead time to be confirmed. For prototype quantities, Mouser and DigiKey are typical first-call distributors; for production volumes request a quote from Intel-authorized channels.
What is the lead time for EP3C80F484C8?
According to Heisener distributor data dated 2026-09-09, the EP3C80F484C8 lead time is 'to be confirmed' with estimated delivery 2026-07-29 to 2026-08-03 from expedited-shipping stock. The Cyclone III family has been in production since 2007, and inventory is generally available, but exact lead time varies by distributor and quantity tier.
Is EP3C80F484C8 in stock today?
According to the Heisener listing dated 2026-09-09, the EP3C80F484C8 is in stock with 5,296 pieces available. DigiKey also lists the part. Inventory fluctuates, so re-confirm availability on the distributor's website before placing a purchase order for production.
EP3C80F484C8 vs EP3C120F484C8 - which should I choose?
EP3C80F484C8 and EP3C120F484C8 share the FBGA-484 footprint but the EP3C120 has ~119,088 LEs vs the EP3C80's 81,264 LEs (about 47% more logic). Choose EP3C80 if 81K LEs is enough - it saves cost and power. Choose EP3C120 if your design exceeds 81K LEs or you need the extra DSP/memory resources.
When should I choose EP3C80F484C8 over EP3C40F484C8?
EP3C80F484C8 has 81,264 LEs vs EP3C40F484C8's 39,600 LEs - roughly twice the logic and 2x DSP/memory. Choose EP3C80 if your design exceeds 40K LEs or you want headroom for future feature growth. Choose EP3C40 if 40K LEs meets your spec and you prefer the lower price and lower power.
What is the best drop-in replacement for EP3C80F484C8?
The best drop-in alternatives are same-package EP3C80 family members that share the FBGA-484 footprint: EP3C80F484C7N (faster speed grade, same LEs), EP3C80F484C6N, and EP3C80F484C7. These parts share pinout, ball map, and fabric; only the speed grade differs, so they are true drop-in replacements at the PCB level.
Can a Cyclone IV E replace EP3C80F484C8?
A Cyclone IV E device of matching LE density can replace EP3C80F484C8, but only with PCB redesign - the FBGA-484 footprint, ball map, and pinout are not identical between Cyclone III and Cyclone IV E, so it is not a true drop-in. Use the Cyclone IV handbook migration guide and Quartus pin-translation tool, then re-spin the PCB if footprint mismatch is unacceptable.
Where can I download the EP3C80F484C8 datasheet PDF?
The EP3C80F484C8 datasheet is part of the Cyclone III Device Handbook, available from Intel (formerly Altera) at intel.com. FindIC also hosts a PDF (~837 KB, dated 2007-02-15). Use the Cyclone III handbook section covering EP3C80 specifications and the device-specific pin-out file (.pin) for Quartus II.
Where do I find the EP3C80F484C8 pinout?
The EP3C80F484C8 pinout is published as a Quartus II pin-out file (.pin) and rendered in the Cyclone III Device Handbook pin tables for the F484 package. The F484 ball grid follows the standard 484-FBGA 23x23 mm 1.0 mm pitch map - 22x22 balls minus depopulated corners - and is shared across EP3C40/55/80/120 in F484.
What are the key specifications of EP3C80F484C8 that engineers should know?
The EP3C80F484C8 key specs are 81,264 logic elements, 2,810,880 bits of embedded memory, 244 18x18 hardware multipliers, 4 PLLs, 295 maximum user I/O, 65 nm CMOS process, 1.2 V core supply, FBGA-484 package, and C8 commercial speed grade. These specs cover the four engineering axes: logic capacity, memory, DSP throughput, and I/O bandwidth.

エンジニアリング参考データ: EP3C80F484C8 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP3C80F484C8 when your design needs roughly 60-80K logic elements, several hundred 18x18 multipliers for fixed-point DSP, and ample I/O in the FBGA-484 footprint, and you are cost-conscious but do not need the absolute fastest speed grade. If timing closure is borderline, substitute EP3C80F484C7N (faster speed grade, same die/package) without PCB rework. If 81K LEs is insufficient, upgrade to EP3C120F484C7N in the same FBGA-484 ball map for +47% logic. If 81K LEs is overkill, downgrade to EP3C55F484C8N (-31% logic) or EP3C40F484C8N (-51% logic) to save cost and power. Cross-brand alternatives are not available in the same FBGA-484 footprint, so migration beyond the Cyclone III family requires a PCB redesign.

代替品との比較

パラメータ この製品 EP3C80F484C7N EP3C80F484C6N EP3C120F484C7N EP3C55F484C8N
Package FBGA-484 (23x23 mm, 1.0 mm pitch) FBGA-484 (23x23 mm, 1.0 mm pitch) - same FBGA-484 (23x23 mm, 1.0 mm pitch) - same FBGA-484 (23x23 mm, 1.0 mm pitch) - same FBGA-484 (23x23 mm, 1.0 mm pitch) - same
Brand Intel (formerly Altera) Intel Intel Intel Intel
Logic Elements 81,264 81,264 (same) 81,264 (same) 119,088 (+47%) 55,856 (-31%)
Total Memory Bits 2,810,880 bits 2,810,880 (same) 2,810,880 (same) 3,888,384 (+38%) 2,396,160 (-15%)
Embedded 18x18 Multipliers 244 244 (same) 244 (same) 288 (+18%) 156 (-36%)
Maximum User I/O 295 295 (same) 295 (same) 295 (same FBGA-484) 295 (same FBGA-484)
Speed Grade C8 C7 (faster, ~10% fMAX margin) C6 (fastest Cyclone III grade) C7 C8 (same)
PLLs 4 4 (same) 4 (same) 4 (same) 4 (same)

主な差別化要因

  • Highest LE density within typical FBGA-484 footprint reuse across the EP3C40/55/80 family (vs EP3C55F484C8N)
  • Same-package upgrade path to EP3C120 for headroom without PCB redesign (vs EP3C120F484C7N)
  • Faster speed-grade drop-in alternatives available on the same die (vs EP3C80F484C6N)

設計ノート

Estimated: Cyclone III FPGAs dissipate roughly 0.5-3 W depending on utilization and toggle rate. For an EP3C80 at typical 70% utilization and 100 MHz, VCCINT at 1.2 V draws ~1.5 A core current. Use at least a 4-layer PCB with a continuous ground plane, and provide thermal vias beneath the FBGA-484 die to keep junction temperature below 85C commercial. Avoid placing the FPGA directly above a heat source.

The FBGA-484 1.0 mm ball pitch requires PCB fabrication with laser-drilled micro-vias (HDI) or 4-mil trace/space rules. Escape routing on the top layer should fan out to inner layers via dogbone fan-out; use the Intel/Altera FBGA-484 breakout reference in the Cyclone III handbook for stack-up and via dimensions. Maintain a continuous reference ground plane under the FPGA to control return paths for LVDS and DDR signals.

Assign I/O bank voltages (VCCIO) per signal standard: 1.8 V for DDR2, 2.5 V for LVDS, 3.3 V for GPIO. Group clocks and high-speed differential pairs near their PLL pins to minimize skew. Use the Quartus II Pin Planner early in the design cycle because the FBGA-484 ball map constrains routing once the PCB is laid out - late bank reassignment can be impossible.

Do not connect MSEL[3:0] configuration-mode pins randomly - they select AS, AP, PS, JTAG, or Fast Passive Parallel modes. Leave unused user I/O pins set as tri-stated inputs with weak pull-ups to avoid floating-input oscillation. Ensure the configuration flash (EPCS) is sized for the uncompressed .sof or use compression to fit the bitstream. Verify the JTAG chain order matches the Quartus BSDL before board bring-up.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

RoHS-compliant FBGA-484 package per Altera/Intel product family. Not AEC-Q100 qualified - the commercial C8 grade targets consumer/industrial, not automotive. Halogen-free status not explicitly listed in the supplied data; marked 'unknown' rather than assumed.

データ検証日: 2026-09-09 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

EP3C80F484C8 EP3C80F484C8 datasheet EP3C80F484C8 price Altera Cyclone III EP3C80 Intel FPGA Cyclone III 81K logic elements Cyclone III FBGA-484 footprint upgrade EP3C80 vs EP3C120 EP3C80F484C8 drop-in replacement buy EP3C80F484C8 online stock what is the logic element count of EP3C80F484C8 Cyclone III FBGA-484 pinout Cyclone III DSP 18x18 multipliers Cyclone III SDR baseband FPGA EP3C80F484C8 vs EP3C55F484C8 Quartus II Cyclone III device support

関連部品&用語

Intel Altera EP3C80F484C8 Cyclone III FPGA Field Programmable Gate Array PLD CPLD FBGA-484 FineLine BGA Logic Element M9K memory block DSP block 18x18 multiplier PLL Quartus II Nios II DDR2 LVDS RoHS 65 nm CMOS speed grade C8 industrial motor control software-defined radio
クイック見積RFQ
詳細をすべてご記入ください — 営業チームが24時間以内にご返信いたします
部品番号 メーカー パッケージ QTY 目標価格 小計
合計: $0.00 USD
✓
見積を送信しました!

24時間以内にメールでご返信いたします

1
RFQ送信済み
2
見積受領
3
注文済み
4
お支払い
5
発送済み
6
配達済み
RFQの詳細を表示