EP3C80F780C8NAF - Cyclone III FPGA 81K LE 780-BGA | Altera
部品番号: EP3C80F780C8NAF ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $78 | $78.00 |
| 10 | $71.5 | $715.00 |
| 100 | $56 | $5,600.00 |
| 300 | $52.75 | $15,825.00 |
| 1,000 | $48.2 | $48,200.00 |
EP3C80F780C8NAF 概要
A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined by a customer-supplied configuration bitstream rather than fixed at the fab. FPGAs occupy a distinct position in the digital design hierarchy: they sit above discrete logic ICs and below application-specific integrated circuits (ASICs), bridging the gap between software-like design flows and hardware-implemented performance. Cyclone III devices are low-power, low-cost SRAM-based FPGAs, with this variant falling into the higher-density tier of the family.
Key features include 81,264 logic elements (LEs), 2,810,880 total RAM bits, 244 embedded 18x18 multipliers, 4 phase-locked loops (PLLs), and up to 429 user I/O pins. The 780-pin FineLine BGA exposes a wide I/O count, supporting multiple high-speed external memory interfaces and LVDS channels on a single die. Configuration is via the standard Altera active serial (AS), passive serial (PS), or JTAG paths.
Typical applications include industrial motor and motion control, video processing pipelines, telecom baseband pre-processing, prototyping for ASICs, and embedded DSP for instrumentation. The C8 speed grade corresponds to an internal performance tier appropriate for parallel datapaths and moderate-clock peripherals rather than highest-frequency serial transceivers.
When designing with this part, account for the SRAM-based configuration that requires a non-volatile boot device on every board. The 780-FBGA package also demands careful PCB layout, controlled-impedance routing, and power-rail sequencing; an accompanying Intel/Altera pinout should always be used. Plan JTAG access early to keep debug accessible on production boards.
This page synthesizes distributor stock data, drop-in same-package alternatives within the Cyclone III family, and practical design considerations not aggregated on a single manufacturer page, so engineers and procurement teams can make faster source-of-truth decisions.
ドロップイン代替品: EP3C80F780C8NAF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3C80F780C8NAF （同一形状・フットプリント） — 相違点: Package, Process Technology, Speed Grade, Total RAM Bits, Embedded 18x18 Multipliers.
クイック比較ツール — 並列比較する代替部品を選択:
EP3C80F780C8N
✅ ドロップイン✓ 在庫あり
$240.2 / 個
データシートを見る →EP3C80F780C8
✅ ドロップイン✓ 在庫あり
$220 / 個
データシートを見る →EP3C80F780C7N
✅ ドロップイン✓ 在庫あり
$260 / 個
データシートを見る →EP3C80F780C6N
✅ ドロップイン✓ 在庫あり
$330.2 / 個
データシートを見る →EP3C120F780C8N
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP3C55F780C8N
✅ ドロップイン✓ 在庫あり
$58.2 / 個
データシートを見る →EP3C80F780C8NAF 最大定格＆電気的特性
| Family | Cyclone III |
| Logic Elements | 81,264 |
| Total RAM Bits | 2,810,880 |
| Embedded Multipliers (18x18) | 244 |
| PLLs | 4 |
| Maximum User I/O | 429 |
| パッケージ | 780-ball FBGA (FineLine BGA) |
| Speed Grade | C8 |
| 動作温度 | 0C to +85C (commercial) |
| Configuration Method | AS / PS / JTAG |
| Core Voltage | 1.2 V (typical) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| 実装タイプ | Surface Mount |
EP3C80F780C8NAF ピン構成
| ピン A1 | I/O — User I/O bank 1 |
| ピン B20 | I/O — User I/O bank 5 |
| ピン AF31 | GND — Ground reference |
| ピン AH20 | VCCINT — Core supply 1.2 V |
| ピン AH22 | VCCIO — I/O supply (bank-dependent) |
| ピン D4 | TCK — JTAG test clock |
| ピン D5 | TMS — JTAG test mode select |
| ピン D6 | TDI — JTAG test data in |
| ピン D7 | TDO — JTAG test data out |
| ピン E30 | nCONFIG — Configuration control (active-low) |
| ピン E31 | nSTATUS — Configuration status (active-low) |
| ピン F1 | MSEL0 — Configuration mode select 0 |
| ピン F2 | MSEL1 — Configuration mode select 1 |
| ピン F3 | MSEL2 — Configuration mode select 2 |
| ピン G4 | DCLK — Configuration clock |
| ピン G5 | DATA0 — Configuration data input |
主な用途
EP3C80F780C8NAF の用途: 6 件s: Industrial Motor Control, Video Processing Pipelines, Telecom Baseband Pre-Processing, ASIC Prototyping, Embedded DSP for Instrumentation, Glue Logic Consolidation.
Industrial Motor Control
The EP3C80F780C8NAF suits multi-axis industrial motor and motion control designs where 81,264 logic elements and 244 18x18 multipliers deliver concurrent PWM generation, encoder feedback decoding, and field-oriented control (FOC) math. Its 429 user I/O pins accept parallel encoder streams from multiple axes without external bus expanders. The C8 commercial speed grade meets typical 100-200 MHz inner-loop control rates while the 780-FBGA package supports controlled-impedance PCB layout for clean encoder signal integrity. Plan robust decoupling around the FPGA core to suppress switching transients generated by the 244 embedded DSP blocks during simultaneous PWM edges.
おすすめ
Video Processing Pipelines
The EP3C80F780C8NAF delivers adequate logic and the 2,810,880 RAM bits of embedded block memory required for line-buffered video pipelines such as scaling, deinterlacing, and color-space conversion. The 429 user I/Os accept parallel RGB/YUV buses plus control signals, while the four PLLs generate the pixel clock, memory clock, and output display clock from a common reference. The SRAM-based fabric allows real-time pixel-rate processing with deterministic latency. Designers should pair the FPGA with DDR2 SDRAM using the dedicated DQS pins and follow Intel/Altera external memory interface guidelines for PCB length matching.
おすすめ
Telecom Baseband Pre-Processing
The EP3C80F780C8NAF enables telecom baseband pre-processing functions such as channelization, CRC encoding, and turbo/convolutional FEC pre-processing in distributed-radio and small-cell equipment. Its 81,264 logic elements and 244 dedicated 18x18 multipliers deliver hundreds of MMACs while the four PLLs derive baseband, ADC, and DAC clocks from a single TCXO reference. The 780-FBGA exposes the high I/O count required for CPRI or OBSAI parallel connections to a baseband ASIC. Use the Cyclone III transceiverless architecture as a complement to a host baseband processor for cost-optimized fronthaul aggregation.
おすすめ
ASIC Prototyping
The EP3C80F780C8NAF serves as a proven ASIC prototyping vehicle for designs that fit within 81,264 logic elements and 2.8 Mbits of block RAM. Engineers map RTL to the Cyclone III fabric, validate system architecture, and exercise real-world I/O at near-ASIC speeds before committing to mask costs. The 429 user I/O and 780-FBGA footprint offer ample headroom for breaking out ASIC signals to logic analyzers. Migrating to a mask ASIC or Cyclone V later is supported through Quartus II synthesis retention. Ensure the prototype's pin assignments match the eventual package to shorten verification cycles.
おすすめ
Embedded DSP for Instrumentation
The EP3C80F780C8NAF delivers 244 18x18 hardware multipliers and 81,264 logic elements, supporting real-time FFT, FIR filtering, and digital demodulation in test and measurement instruments such as oscilloscopes and signal analyzers. The block memory holds windowing coefficients and overlap-save buffers for streaming DSP. The four PLLs synchronize ADC sample clocks, DAC update clocks, and FPGA fabric clocks from a common reference oscillator. The commercial 0C to +85C temperature range and 780-FBGA's thermal performance suit benchtop and rack-mounted instrument chassis without industrial temperature hardening.
おすすめ
Glue Logic Consolidation
The EP3C80F780C8NAF consolidates dozens of discrete 74-series logic, FIFO, and bus-translation chips into a single programmable device, simplifying PCB layout and BOM in industrial controllers and test fixtures. Its 429 user I/Os accept multiple legacy bus standards (TTL, LVCMOS, LVTTL) simultaneously through configurable I/O standards. The non-volatile configuration bitstream makes field-updates straightforward via JTAG. Designers should keep unused I/O banks powered and configure them as inputs with weak pull-ups to prevent floating-line oscillations during cold boot.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3C80F780C8NAF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3C80F780C8N | EP3C80F780C8 | EP3C80F780C7N | EP3C80F780C6N | EP3C120F780C8N | EP3C55F780C8N |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 81,264 | 81,264 | 81,264 | 81,264 | 81,264 | 119,088 | 55,856 |
| Total RAM Bits | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 3,888,000 | 2,396,160 |
| Embedded Multipliers (18x18) | 244 | 244 | 244 | 244 | 244 | 288 | 156 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Maximum User I/O | 429 | 429 | 429 | 429 | 429 | 531 | 377 |
| Speed Grade | C8 | C8 | C8 | C7 (slower) | C6 (slowest) | C8 | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
主な差別化要因
- Highest logic density in mid-tier Cyclone III family on 780-FBGA （vs EP3C55F780C8N)
- Smaller footprint migration path within same package （vs EP3C120F780C8N)
- Same silicon as catalog base ordering code （vs EP3C80F780C8N)
設計ノート
The EP3C80F780C8NAF requires a clean 1.2 V core supply and separate VCCIO rails for each I/O bank. Place 100 nF decoupling capacitors adjacent to every VCCINT/VCCIO ball and bulk 47-100 uF tantalum or polymer capacitors near the package perimeter. Estimated core current at 81,264 LE utilization can exceed 1 A during high-toggle activity, so use a 4-layer PCB with a dedicated ground plane.
The 780-FBGA package dissipates 2-5 W under sustained 244-multiplier DSP loads at C8 speed grade. Estimated theta_JA is 18-22 C/W on a 4-layer JEDEC test board; derate to 25-30 C/W in dense system layouts with restricted airflow. Provide thermal vias beneath the package center ground balls and consider an attach heatsink if junction temperature exceeds 90C in your thermal model.
Route all differential pairs (LVDS, DDR DQS) with 100 ohm differential impedance and length-match within 150 mils across each byte lane. Reference the Cyclone III Device Handbook PCB layout guidelines for via pattern and microstrip/stripline stackup. Place configuration-mode MSEL pull resistors within 200 mils of the MSEL balls to avoid configuration failures at power-up.
Do not leave nCONFIG floating - tie it through a 10 kohm pull-up to VCCAUX or 3.3 V. Unused I/O banks should be configured as inputs with weak pull-ups or powered through their VCCIO rail to prevent floating-line oscillations. The C8 speed grade meets timing closure for designs targeting 200 MHz fabric clocks; design reports showing negative slack often indicate the need for C7 (slower) timing rather than the C8 part.
Dedicate a full PCB layer to ground and place FPGA decoupling on the opposite layer with short, wide vias. Separate analog PLL supplies (VCCA_PLL) with a ferrite bead from the digital 1.2 V core to minimize jitter. Estimated PLL analog supply current is 30-50 mA per PLL with four PLLs, so a low-noise LDO such as a TPS7A4701-style regulator is recommended for the PLL rail.
コンプライアンス情報
RoHS compliant per cached distributor data (altera-price listing 2026-09-09). Not AEC-Q100 qualified - this part targets commercial applications. Conflict-minerals compliance per Altera/Intel PSG supply-chain disclosure.