EP3SE110F780C2 - Stratix III E FPGA 107.5K LEs 780-FCBGA | Intel
部品番号: EP3SE110F780C2 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5594.68 | $5,594.68 |
| 10 | $5300 | $53,000.00 |
| 100 | $4950 | $495,000.00 |
| 500 | $4600 | $2,300,000.00 |
| 1,000 | $4350 | $4,350,000.00 |
EP3SE110F780C2 概要
An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks (M9K/M144K), DSP blocks, and high-speed transceivers. In the broader system hierarchy, an FPGA sits between a microcontroller (limited performance, fixed peripherals) and a custom ASIC (fixed function, highest performance, highest NRE cost). The Stratix III E family targets designs that demand far more parallel processing capability and memory bandwidth than an MCU can deliver, while retaining the time-to-market advantage and field-reprogrammability of programmable logic.
Key features of the EP3SE110F780C2 include 107,500 logic elements, 8,936,448 embedded memory bits, 768 18x18 multipliers, four PLLs, 488 maximum user I/Os, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device integrates transceivers suitable for external memory interfacing (DDR/DDR2/DDR3/QDRII) and rich logic density for parallel pipelines, which differentiates it from lower-cost Cyclone III parts in the same family tree.
Architecturally, the Stratix III E uses Altera's adaptive logic module (ALM) and multi-track interconnect for predictable timing closure at 600 MHz internal performance. Hard IP blocks for memory controllers, PCI Express Gen1/Gen2, and 8B/10B serial interfaces reduce soft-logic consumption and allow designers to focus die area on application logic.
Typical applications include high-speed DSP (radar, software defined radio), ASIC prototyping, video processing, high-end test and measurement, military/aerospace signal processing, and wireline backplane bridging. The 488 user I/O count enables connection to multiple parallel data buses and external memory ranks simultaneously.
When designing with this device, ensure the PCB supports the FCBGA-780 ball grid with appropriate via-in-pad, microvia, or HDI stackup. Thermal management is essential: at full logic utilization the device may dissipate several watts and requires a heatsink or high-performance thermal interface material. Use Altera (now Intel) Quartus II software with the Stratix III device support installed for synthesis, place-and-route, and timing analysis.
This page synthesizes distributor inventory, parametric context, and practical design considerations not bundled in the manufacturer datasheet.
ドロップイン代替品: EP3SE110F780C2 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SE110F780C2 （同一形状・フットプリント） — 相違点: Package, Speed Grade, Embedded Memory, Operating Temperature Grade, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SE110F780C3
✅ ドロップイン✓ 在庫あり
$220 / 個
データシートを見る →EP3SE110F780C4
✅ ドロップイン✓ 在庫あり
$2380 / 個
データシートを見る →EP3SE110F780I2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3SE110F780C3N
✅ ドロップイン✓ 在庫あり
$1245 / 個
データシートを見る →EP3SE110F780C2N
✅ ドロップイン✓ 在庫あり
$305 / 個
データシートを見る →EP3SE110F780C2 最大定格＆電気的特性
| Family | Stratix III E (Enhanced) |
| Series | EP3SE110 |
| Logic Elements (LE) | 107,500 |
| Embedded Memory | 8,936,448 bits (8.93 Mbit) |
| Maximum User I/O | 488 |
| Embedded Multipliers | 768 (18x18) |
| PLLs | 4 |
| Process Node | 65 nm |
| Core Voltage (VCCINT) | 1.1 V |
| パッケージ | 780-BBGA, FCBGA (FineLine) |
| 実装タイプ | Surface Mount |
| 動作温度 | 0C to +85C (Commercial) |
| Speed Grade | C2 |
| RoHS ステータス | Compliant |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
EP3SE110F780C2 780-bbga, fcbga (fineline) ピン配置ガイド
EP3SE110F780C2 (780-bbga, fcbga (fineline) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SE110F780C2.
詳細は データシート をご参照ください。
主な用途
EP3SE110F780C2 の用途: 6 件s: High-Performance DSP / Radar Processing, ASIC Prototyping, High-Speed Video Processing, Wireline Backplane / Bridging, Test and Measurement Instrumentation, Military and Aerospace Signal Processing.
High-Performance DSP / Radar Processing
The EP3SE110F780C2 is well suited to multi-channel radar, electronic warfare, and software defined radio signal chains where 768 18x18 multipliers and 107.5K logic elements deliver the parallel MAC throughput required for FFT, FIR, and pulse compression. Its 8.93 Mbit embedded memory buffers large sample windows without external SRAM access stalls. Compared to a DSP processor the FPGA executes these kernels deterministically at fixed latency, and compared to a Cyclone III device the Stratix III E offers significantly higher multiplier count and memory bandwidth for multi-antenna MIMO beamforming and adaptive filtering.
おすすめ
ASIC Prototyping
For ASIC prototyping the EP3SE110F780C2 provides 107.5K LEs and 488 user I/Os which can map complex SoC designs partition-by-partition. The 8.93 Mbit of embedded memory emulates on-chip RAMs, while external DDR2/DDR3 interfaces via the hard memory controller ease pin-muxed prototyping boards. Compared to a discrete ASIC emulation farm, a single Stratix III E board cuts iteration time by delivering in-system debug, JTAG visibility, and Quartus II incremental compile. The industrial-grade EP3SE110F780I2 variant extends the prototyping platform into harsh-temperature environments.
おすすめ
High-Speed Video Processing
The EP3SE110F780C2 drives multi-stream HD video pipelines where 488 user I/Os accept parallel data buses from image sensors and drive HDMI/DVI output stages. 768 dedicated multipliers enable real-time color space conversion, scaling, and sharpening at 1080p60 with line buffers fitting entirely in 8.93 Mbit embedded memory. Compared to a DSP or GPU approach, this FPGA delivers deterministic frame latency and lower system BOM by absorbing scaler, mixer, and timing controller functions in one chip. The 65 nm Stratix III E process sustains the 150 MHz pixel clock required by 1080p60 with timing margin.
おすすめ
Wireline Backplane / Bridging
For telecom backplane bridging the EP3SE110F780C2 acts as a multi-protocol gateway between SGMII, XAUI, and SPI interfaces, leveraging its high-speed serial transceivers and abundant 8.93 Mbit packet buffer memory. The 488 I/Os accommodate multiple parallel RapidIO or PCIe Gen1 lanes while leaving margin for management interfaces. Compared to a discrete PHY + bridge ASIC design, the Stratix III E consolidates PCS, MAC, and protocol stack on one device, reducing board area and BOM. Quartus II IP catalog provides pre-verified IP cores for CPRI, OBSAI, and Ethernet.
おすすめ
Test and Measurement Instrumentation
The EP3SE110F780C2 is a strong fit for digitizer cards, logic analyzer capture engines, and protocol exercisers where 488 user I/Os sample multiple high-speed buses simultaneously. The 107.5K logic elements implement deep state machines for protocol compliance tests, and 8.93 Mbit embedded memory holds multiple frames of capture data. Compared to a microcontroller-based tester the FPGA delivers 100x faster real-time response, and compared to an ASIC it offers the field reprogrammability needed as standards evolve. Industrial-temperature variants extend the platform into factory test cells.
おすすめ
Military and Aerospace Signal Processing
For radar warning receivers, electronic countermeasures, and avionics, the EP3SE110F780C2 in its industrial-temperature variant provides the radiation-tolerant design margin required by MIL-STD-810 environments. 107.5K logic elements and 768 multipliers process wideband IF and pulse-Doppler returns in real time, while 8.93 Mbit embedded memory stages FFT frames. Compared to ASIC-based military processors, the Stratix III E field-reprogrammability supports in-theatre algorithm updates. The 488 user I/Os handle multi-channel ADC interfaces and optical backplane links simultaneously.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SE110F780C2 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SE110F780C3 | EP3SE110F780C4 | EP3SE110F780I2 | EP3SE110F780C3N | EP3SE110F780C2N |
|---|---|---|---|---|---|---|
| Package | 780-BBGA FCBGA | 780-BBGA FCBGA - same | 780-BBGA FCBGA - same | 780-BBGA FCBGA - same | 780-BBGA FCBGA - same | 780-BBGA FCBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Embedded Memory | 8.93 Mbit | 8.93 Mbit | 8.93 Mbit | 8.93 Mbit | 8.93 Mbit | 8.93 Mbit |
| Speed Grade | C2 (commercial) | C3 (faster) | C4 (fastest) | I2 (industrial temp) | C3 (faster, lead-free) | C2 (lead-free variant) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C |
| Maximum User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Embedded Multipliers (18x18) | 768 | 768 | 768 | 768 | 768 | 768 |
主な差別化要因
- Highest-pin-count variant in 107.5K LE density tier （vs EP3SE110F1152C2)
- Mid-range speed grade with best cost/timing balance （vs EP3SE110F780C4)
- Commercial temperature range standard offering （vs EP3SE110F780I2)
設計ノート
The 780-ball FCBGA requires HDI PCB stackup with microvias or via-in-pad (VIPPO) construction. Per Intel layout guidelines, escape the BGA on inner layers first, fan out to a BGA breakout pattern at 1.0 mm pitch, and use 50 ohm controlled impedance for high-speed serial pairs. Place 0.1 uF and 0.01 uF decoupling capacitors within 100 mils of every VCC pin to suppress the 65 nm core switching transients.
Estimated: at full logic utilization (107.5K LEs at typical 100 MHz junction activity), the EP3SE110F780C2 may dissipate 3-6 W. Use the thermal resistance data from the Stratix III E datasheet to size a heatsink or thermal pad. Forced airflow of 200 LFM is recommended for sealed enclosures. Place at least 8 thermal vias in the BGA center array under the exposed die pad for a low thermal resistance path to inner copper planes.
Do not confuse C2/I2/A2 speed grade ordering - in Altera Stratix III a smaller number indicates a FASTER speed grade (C2 is slowest, C4 is fastest of the commercial C grades). Do not mix C2 and C4 in the same design bank if timing closure depends on matched grades. Verify all I/O bank VCCIO voltages match the I/O standard used (LVDS = 2.5 V, LVCMOS = 1.8/2.5/3.3 V per bank) per the datasheet.
The Stratix III E requires multiple power rails: VCCINT (1.1 V core), VCC (2.5 V analog), VCCPD (3.3 V or 2.5 V pre-driver), and VCCIO (per-bank I/O). Per Intel power management guidelines, use a multi-rail sequencing controller to ensure VCCINT rises before VCCPD and VCCIO to avoid I/O latchup. Quartus II Early Power Estimator provides accurate pre-design power estimates within 10 percent of measured silicon.
コンプライアンス情報
RoHS compliant per Intel/Altera product documentation. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC. Lead-free N-suffix variants available. Halogen-free status unknown from provided data.
