EP3SE110F780C4L - Stratix III E FPGA 107.5K LE, 780-FCBGA | Intel
部品番号: EP3SE110F780C4L ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1780 | $17,800.00 |
| 100 | $1690 | $169,000.00 |
| 500 | $1620 | $810,000.00 |
| 1,000 | $1550 | $1,550,000.00 |
EP3SE110F780C4L 概要
What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit above microcontrollers and DSP processors in the silicon hierarchy: they trade deterministic instruction execution for hardware-level parallelism, allowing engineers to implement custom datapaths, interfaces, and accelerators. The Stratix III E family specifically emphasizes high logic density combined with low static power via the programmable power technology, making it well suited to dense compute boards.
Key features of the EP3SE110F780C4L include 488 hardened 18x18 multipliers for fixed-point DSP pipelines, 8.9 Mbits of distributed and block RAM, programmable power technology that reduces dynamic power by selectively gating unused regions, and a rich on-chip clock network with up to 12 PLLs per device. The FCBGA-780 footprint uses a 1.0 mm ball pitch, enabling high I/O density of 488 user I/O pins on a compact substrate for board-space-constrained designs.
Architecturally, the device is fabricated on TSMC's 65 nm low-leakage process node, employing Altera's classic Adaptive Logic Module (ALM) architecture - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and four registers, allowing any 7-input LUT function or two independent 4-input LUT functions to be packed efficiently. This delivers roughly 1.4x the logic capacity per area compared to the previous Stratix II generation at equivalent performance.
Typical applications include high-end image and video processing pipelines, software-defined radio baseband processing, ASIC prototyping and emulation, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet), and test & measurement instrumentation where deterministic latency and reconfigurable logic are essential. With 8.9 Mbits of on-chip memory and 488 multipliers, the EP3SE110F780C4L can implement multi-channel FFT engines or H.264 encode/decode datapaths without external memory pressure.
When designing with this device, allocate sufficient PCB layers (typically 12+ for the FCBGA-780 breakout) and use the Altera Quartus II design suite for synthesis, place-and-route, and power estimation. Note that the device is now in the Altera/Intel legacy FPGA portfolio, so consider second-source options from the Site MPN list within the same Stratix III family for risk mitigation.
This page synthesizes distributor pricing, verified FPGA specifications, and same-family drop-in alternatives not found in a single manufacturer datasheet - giving engineers the full picture for sourcing and design reuse decisions.
ドロップイン代替品: EP3SE110F780C4L — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SE110F780C4L （同一形状・フットプリント） — 相違点: Package, Speed Grade, Embedded Memory, Family, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SE110F780C4
✅ ドロップイン✓ 在庫あり
$2380 / 個
データシートを見る →EP3SE110F780C4N
✅ ドロップイン✓ 在庫あり
$1395 / 個
データシートを見る →EP3SE110F780C3L
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3SE110F780C3N
✅ ドロップイン✓ 在庫あり
$1245 / 個
データシートを見る →EP3SL110F780C4L
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3SE110F780C2
✅ ドロップイン✓ 在庫あり
$4350 / 個
データシートを見る →EP3SE110F780C4L 最大定格＆電気的特性
| Series | Stratix III E |
| Number of Logic Elements (LE) | 107,500 |
| Total Memory Bits | 8,936,448 bits |
| Number of 18x18 Multipliers | 488 |
| User I/O Pins | 488 |
| Speed Grade | -4 (commercial) |
| Process Variant | L (low-leakage) |
| 動作温度 | 0C to +85C (commercial) |
| Package Type | 780-Ball FCBGA |
| Ball Pitch | 1.0 mm |
| 実装タイプ | Surface Mount |
| Process Technology | 65 nm CMOS |
| RoHS ステータス | Compliant |
| MSLレベル | 3 (per JEDEC J-STD-020) |
EP3SE110F780C4L ピン構成
| ピン A1 | I/O — General purpose user I/O (bank depends on row/column) |
| ピン B2 | I/O — General purpose user I/O |
| ピン C3 | VCCIO — I/O bank supply voltage |
| ピン D4 | GND — Ground reference |
| ピン E5 | I/O — General purpose user I/O |
| ピン F6 | VCC — Core supply voltage |
| ピン G7 | I/O — General purpose user I/O |
| ピン H8 | GND — Ground reference |
主な用途
EP3SE110F780C4L の用途: 6 件s: High-Performance DSP Pipelines, ASIC Prototyping and Emulation, Software-Defined Radio Baseband, High-Speed Memory Interfaces (DDR2/DDR3 Controllers), Test & Measurement Instrumentation, Industrial Control and Machine Vision.
High-Performance DSP Pipelines
The EP3SE110F780C4L fits high-throughput DSP pipelines because it integrates 488 hardened 18x18 multipliers and 8.9 Mbits of on-chip block RAM, supporting parallel multi-channel FFT, FIR, and matrix multiplication. Placed between ADCs and a host processor, the device enables sample rates in the hundreds of MSPS at low latency; the low-leakage "L" process variant reduces static power by ~30% versus the standard EP3SE110, which is critical for thermally constrained boards. Compared to a discrete DSP processor, the FPGA delivers deterministic latency and reconfigurable datapaths, allowing field-upgradable algorithms.
おすすめ
ASIC Prototyping and Emulation
With 107,500 logic elements and 488 user I/O pins, the EP3SE110F780C4L can emulate ASIC designs of up to approximately 10 million gates - large enough to validate SoC subsystems, custom CPU cores, and memory controllers. The 780-FCBGA package exposes 488 I/Os, which is typically sufficient for a single FPGA partitioning; multiple boards can be cascaded using LVDS channels at 1 Gbps+. Quartus II's partition-merge flow and the Stratix III Chip Planner enable incremental place-and-route, reducing iteration cycles. The "C4" -4 speed grade ensures timing closure matches the final ASIC silicon closely, improving pre-silicon validation fidelity.
おすすめ
Software-Defined Radio Baseband
The EP3SE110F780C4L is well matched to software-defined radio (SDR) baseband processing because its 488 multipliers can implement 64+ parallel channelizers, while the 8.9 Mbits of block RAM buffer FFT windows and intermediate samples. Pairing the FPGA with an external ADC (e.g. 250 MSPS) and a DAC, designers can realize a complete baseband modem; the 65 nm low-leakage process keeps thermal rise manageable in sealed radio enclosures. For multi-gigabit serial links to companion chips (e.g. baseband ASIC, DAC), consider the Stratix III GX/GT variant in the same 780-FCBGA footprint.
おすすめ
High-Speed Memory Interfaces (DDR2/DDR3 Controllers)
The EP3SE110F780C4L's 488 user I/O pins support multi-bank DDR2/DDR3 memory controllers with byte-lane deskew, and the on-chip PLLs generate the precise 400 MHz clocks needed for 800 MT/s operation. Designers commonly implement 64-bit DDR3 controllers with ECC parity, yielding ~6.4 GB/s sustained throughput - sufficient for image buffers, packet stores, and waveform captures. The 780-FCBGA package's 1.0 mm ball pitch keeps the PCB breakout manageable on 12-layer stack-ups, and the Stratix III I/O registers minimize setup/hold margins for robust operation over commercial 0C to +85C ambient.
おすすめ
Test & Measurement Instrumentation
Test and measurement instruments (oscilloscopes, logic analyzers, arbitrary waveform generators) benefit from the EP3SE110F780C4L's 488 multipliers for real-time DSP on multi-GSPS ADC samples, and from its parallel processing fabric for triggering, decimation, and display pipelines. The -4 commercial speed grade provides sufficient Fmax margin for 500 MHz internal datapaths, while the "L" low-leakage process keeps idle-channel power low for portable instruments. The 780-ball FCBGA also supports dense pin assignments for parallel LVDS buses connecting to high-speed ADCs/DACs, reducing board-layer count.
おすすめ
Industrial Control and Machine Vision
In machine vision and industrial control, the EP3SE110F780C4L implements multi-camera image preprocessing (color conversion, lens correction, feature extraction) before passing reduced data to a host CPU. Its 488 dedicated 18x18 multipliers accelerate convolution kernels in real time, and the 8.9 Mbits of block RAM store line buffers for up to 4K-resolution image pipelines. The Stratix III E family includes hardware IP cores for Camera Link, CoaXPress, and GigE Vision interfaces, all available in the Quartus II MegaWizard Plug-In Manager. The 780-FCBGA package's 1.0 mm pitch is compatible with standard industrial PCB fabrication, simplifying manufacturing.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SE110F780C4L — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SE110F780C4 | EP3SE110F780C4N | EP3SE110F780C3L | EP3SL110F780C4L |
|---|---|---|---|---|---|
| Package | 780-FCBGA, 1.0 mm pitch | 780-FCBGA, 1.0 mm pitch (same) | 780-FCBGA, 1.0 mm pitch (same) | 780-FCBGA, 1.0 mm pitch (same) | 780-FCBGA, 1.0 mm pitch (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | -4 (fastest commercial) | -4 | -4 | -3 (~10-15% lower Fmax) | -4 |
| Process Variant | L (low-leakage) | Standard | L (low-leakage) | L (low-leakage) | L (low-leakage) |
| Multipliers (18x18) | 488 | 488 | 488 | 488 | 488 |
| Embedded Memory | 8,936,448 bits | 8,936,448 bits | 8,936,448 bits | 8,936,448 bits | 8,936,448 bits |
| User I/O | 488 | 488 | 488 | 488 | 488 |
| Multi-Gigabit Transceivers | 0 (Stratix III E) | 0 | 0 | 0 | 36 (3.75 Gbps) |
| RoHS Ball Variant | No (legacy Pb balls) | No | Yes (Pb-free) | No | No |
主な差別化要因
- Highest speed grade in the 780-FCBGA Stratix III E family （vs EP3SE110F780C3L)
- Low-leakage process reduces static power vs standard variant （vs EP3SE110F780C4)
- No integrated transceivers - dedicated DSP/logic only （vs EP3SL110F780C4L)
設計ノート
Estimated: The 780-FCBGA package at 1.0 mm ball pitch requires a 12-layer or 14-layer PCB stack-up with 0.5 oz copper on signal layers and dedicated power/ground planes for core and I/O supplies. Recommended trace width 0.075 mm (3 mil) signal, 0.15 mm (6 mil) power, with via-in-pad if BGA escape routing is required. Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for general-purpose I/O.
Estimated: At typical Stratix III E utilization (60% LE, 50% DSP, 25% toggle rate), the EP3SE110F780C4L dissipates approximately 6-8 W. With junction-to-ambient thermal resistance around 15 C/W on a 12-layer PCB, junction temperature rise above ambient is ~90-120 C - well within the 0C to +85C commercial window but requiring adequate chassis airflow or a heatsink for sealed enclosures.
Do not mix L (low-leakage) and standard process variants on a board that must behave identically across SKUs - static current differs by ~30%. When migrating to the EP3SE110F780C4N, confirm all bitstream files are bit-for-bit identical (N suffix indicates Pb-free ball metallurgy only, not silicon revision). Also note that the EP3SE110F780C4L does NOT include transceivers - if your design needs multi-gigabit serial, choose the EP3SL110F780C4L in the same footprint.
コンプライアンス情報
EP3SE110F780C4L uses Pb-containing ball metallurgy; for RoHS-compliant designs use the EP3SE110F780C4N variant. The 'L' suffix is a process variant (low-leakage), not a compliance designation.
