EP3SE260F1152C2N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
部品番号: EP3SE260F1152C2N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $16967.12 | $16,967.12 |
| 10 | $15200 | $152,000.00 |
| 100 | $13500 | $1,350,000.00 |
| 500 | $12100 | $6,050,000.00 |
| 1,000 | $11000 | $11,000,000.00 |
EP3SE260F1152C2N 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy the programmable-logic tier of the broader integrated-circuit hierarchy: IC > digital IC > programmable logic > FPGA. Unlike ASICs, FPGAs are reconfigurable in the field via SRAM-based configuration cells, allowing rapid design iteration and post-deployment upgrades without respinning silicon.
Key features of the EP3SE260F1152C2N include up to 600 MHz core fabric performance, sixteen global clock networks, and Stratix III E-series enhanced DSP blocks that support high-precision multiply-accumulate operations. The device integrates high-speed serial transceivers supporting multi-gigabit serial protocols and dedicated external memory interfaces supporting DDR/DDR2/QDRII+ SRAM. A rich mixture of PLL resources and high-performance I/O standards (LVDS, HSTL, SSTL) suits parallel high-bandwidth chip-to-chip links.
Architecturally, the Stratix III E family combines adaptive logic modules (ALMs) with 8-input fracturable look-up tables, distributed MLAB memory, and dedicated DSP slices that each support 9-bit, 18-bit, and 36-bit arithmetic. The 65 nm process and 1.1 V core voltage deliver a favorable performance-per-watt ratio versus the prior Stratix II generation, while the high pin-count package supports wide parallel buses and multiple transceiver channels.
Typical applications include high-end wireless baseband processing, video broadcast infrastructure, military radar prototyping, high-speed networking ASIC prototyping, and medical imaging accelerators. Designers select this part when their design requires >250K logic elements, hundreds of I/Os, and abundant DSP throughput.
When designing with the EP3SE260F1152C2N, ensure the PCB provides a sufficient copper area and via array under the FCBGA to manage thermal dissipation, and follow Intel's pinout guidelines for power-decoupling and transceiver reference-clock routing.
This page consolidates distributor stock, price tiers, drop-in Stratix III E siblings, and design guidance not found in a single manufacturer document, giving procurement and design teams a single decision-ready reference.
ドロップイン代替品: EP3SE260F1152C2N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SE260F1152C2N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, Process Technology, Series.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SE260F1152C2G
✅ ドロップイン✓ 在庫あり
$2050 / 個
データシートを見る →EP3SE260F1152C2
✅ ドロップイン✓ 在庫あり
$2400 / 個
データシートを見る →EP3SE260F1152C3
✅ ドロップイン✓ 在庫あり
$12500 / 個
データシートを見る →EP3SE260F1152C4
✅ ドロップイン✓ 在庫あり
$8900 / 個
データシートを見る →EP3SE110F1152C2N
✅ ドロップイン✓ 在庫あり
$1925 / 個
データシートを見る →EP3SE260F1152C2N 最大定格＆電気的特性
| Series | Stratix III E |
| Family | FPGA - Field Programmable Gate Array |
| Number of Logic Elements | 255000 |
| Number of LABs/CLBs | 10200 |
| Total Memory Bits | 16672768 |
| Number of I/O | 744 |
| Voltage - Supply | 1.1 V |
| 実装タイプ | Surface Mount |
| パッケージ / ケース | 1152-BBGA, FCBGA |
| Process Technology | 65 nm |
| Maximum Frequency | 600 MHz |
| Supplier Device Package | 1152-FCBGA |
| RoHS ステータス | Compliant |
| Lead Free | Yes (per EP3SE260F1152C2G comparison) |
EP3SE260F1152C2N 1152-fcbga ピン配置ガイド
EP3SE260F1152C2N (1152-fcbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SE260F1152C2N.
詳細は データシート をご参照ください。
主な用途
EP3SE260F1152C2N の用途: 6 件s: Wireless Baseband Processing, ASIC Prototyping, Video Broadcast Infrastructure, High-Speed Networking ASIC Prototyping, Military Radar Signal Processing, Medical Imaging Accelerator.
Wireless Baseband Processing
The EP3SE260F1152C2N's 255,000 logic elements and dedicated DSP slices make it a strong fit for wireless baseband signal processing, where hundreds of multiply-accumulate operations must complete per sample. With 600 MHz fabric performance and abundant block RAM (16.6 Mbit), it can implement channel cards, FFT/iFFT pipelines, and turbo-decoder accelerators on a single die. Compared with ASIC alternatives, the FPGA enables rapid PHY-level updates as 3G/4G standards evolved. Quartus II IP cores for FFT, Viterbi, and Turbo decoding are pre-validated on this device family.
おすすめ
ASIC Prototyping
Designers use the EP3SE260F1152C2N to validate >250K-logic ASIC RTL in real silicon before tape-out, leveraging its 1152-FCBGA package and 744 user I/Os to expose nearly the full ASIC pin-out to logic analyzers. Its 600 MHz fabric and Stratix III E DSP blocks model gate-level timing with high fidelity. The same Quartus II project flow used for FPGA deployment becomes the prototype platform, reducing bring-up time. Use multiple EP3SE260 devices partitioned with a multi-FPGA flow when the ASIC exceeds 255K logic elements.
おすすめ
Video Broadcast Infrastructure
The EP3SE260F1152C2N supports real-time processing of uncompressed SDI/HD-SDI/3G-SDI video streams, leveraging 744 I/Os to receive parallel video buses and its DSP blocks for chroma upsampling, scaling, and overlay blending. The 16.6 Mbit embedded memory buffers line stores for deinterlacing and frame-rate conversion. Compared with ASSP video processors, the FPGA enables custom overlay graphics and codec pre-processing on the same chip. Designers use it in production broadcast switchers and contribution encoders.
おすすめ
High-Speed Networking ASIC Prototyping
In high-speed networking, the EP3SE260F1152C2N's 1152-FCBGA exposes multi-lane transceiver I/O for 10G/40G Ethernet MAC prototyping, packet classification, and traffic-manager RTL validation. Its abundant block RAM implements deep packet buffers at line rate. The FPGA fabric allows designers to iterate on header-processing algorithms without respinning ASIC silicon. Multi-FPGA flows partition larger switch ASICs across several EP3SE260 devices.
おすすめ
Military Radar Signal Processing
The EP3SE260F1152C2N's high logic density and DSP throughput support phased-array radar pulse compression, beamforming, and CFAR detection in defense electronic-warfare systems. Designers exploit its 600 MHz fabric plus parallel LVDS I/O for ADCs/DACs in radar front ends. The 1152-FCBGA package supports the high pin count required for multi-channel ADC interfacing. Designers often use extended-temperature-screened variants of this device for ruggedized programs.
おすすめ
Medical Imaging Accelerator
The EP3SE260F1152C2N accelerates CT/MRI image reconstruction algorithms such as filtered back-projection and iterative reconstruction, with 255K logic elements supporting concurrent processing pipelines. Its DSP blocks deliver high-precision floating-point arithmetic when paired with floating-point IP, and 744 I/Os interface to high-resolution image sensors and memory. Compared with GPU-based reconstruction, FPGA-based reconstruction can deliver lower-latency, deterministic performance suitable for real-time interventional imaging. The 1152-FCBGA package supports the high I/O count for multi-channel sensor input.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SE260F1152C2N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SE260F1152C2G | EP3SE260F1152C2 | EP3SE260F1152C3 | EP3SE260F1152C4 | EP3SE110F1152C2N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same |
| Logic Elements | 255000 | 255000 | 255000 | 255000 | 255000 | 110000 (-57%) |
| Number of LABs/CLBs | 10200 | 10200 | 10200 | 10200 | 10200 | 4400 (-57%) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Speed Grade | -2 (fastest) | -2 | -2 | -3 (slower) | -4 (slowest) | -2 |
| Lead Free / RoHS | No (leaded) | Yes | No | No | No | No |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Highest-density Stratix III E family member （vs EP3SE110F1152C2N)
- Fastest speed grade in the family （vs EP3SE260F1152C3)
- Lead-free drop-in alternative available （vs EP3SE260F1152C2G)
設計ノート
Estimated: at a typical Stratix III E utilization of 70% logic and 50% DSP activity, the EP3SE260F1152C2N can dissipate 8-12 W. The 1152-FCBGA package's typical theta_JA is around 12-15 C/W on a standard 8-layer JEDEC test board, so junction temperature can rise 100-180 C above ambient at full load. Designers must provide a full ball-grid via array and substantial top/bottom copper pour, and should consider a heatsink or thermal interface material for industrial or military operating environments.
Place all decoupling capacitors as close as possible to the EP3SE260F1152C2N power balls, using the Stratix III pin connection guidelines for ball map reference. Use a 1-2-3 capacitor distribution (bulk, mid-frequency, high-frequency) on each power rail (VCC, VCCIO, VCCAUX, VCCPGM) to suppress switching transients. Route high-speed transceiver differential pairs with 100 ohm differential impedance and keep length matching within the tolerances specified by the protocol being implemented.
Do not assume the EP3SE260F1152C2N is still in production - it is obsolete per Heisener and EOLSEMI as of 2026-09-09. New designs should target Stratix V E-series or later for long-term supply, and only use the EP3SE260 for legacy maintenance, ASIC prototyping, or defense programs with existing design freezes. Also note that the EP3SE260F1152C2N requires Quartus II software (legacy version) for programming; modern Quartus Prime versions may have limited support.
コンプライアンス情報
Per the EP3SE260F1152C2G cross-reference, the EP3SE260F1152C2N is the leaded variant (RoHS non-compliant) and the EP3SE260F1152C2G is the lead-free RoHS-compliant variant. REACH and conflict-mineral status were not stated in the verified web data and are marked unknown.