EP3SL340F1517C4 - Stratix III L FPGA 337.5K LE 1517-FCBGA | Intel
部品番号: EP3SL340F1517C4 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4500 | $4,500.00 |
| 10 | $4250 | $42,500.00 |
| 100 | $3900 | $390,000.00 |
| 500 | $3600 | $1,800,000.00 |
| 1,000 | $3300 | $3,300,000.00 |
EP3SL340F1517C4 概要
An FPGA (Field Programmable Gate Array) is a programmable semiconductor whose logic fabric and interconnect can be reconfigured by the customer after manufacture, sitting in the hierarchy between ASICs (full custom, fixed) and CPLDs (smaller, non-volatile). Stratix III L devices were positioned by Intel/Altera for high-throughput DSP, high-speed serial interconnect, and high-bandwidth memory-interface designs, occupying the upper tier of the FPGA taxonomy below Stratix IV/V and above Cyclone series devices.
Key features include 13,500 Logic Array Blocks (LABs), 18,822,144 embedded RAM bits distributed across TriMatrix memory blocks, 500 MHz internal fabric frequency, 800 MHz maximum internal frequency, 976 user I/O pins, and a 1.1 V core supply. The 1517-FCBGA (FCBGA, 40x40 mm class substrate) is the largest package in the Stratix III L family and supports the device's full I/O count including multiple high-speed transceiver banks.
Architecturally the EP3SL340F1517C4 leverages the ALM-based logic fabric introduced in Stratix III, allowing 8-input fracturable look-up tables with arithmetic mode and a MultiTrack interconnect for predictable timing closure. The TriMatrix memory subsystem provides three distinct block RAM depths (640-bit MLAB, 9-Kbit M9K, 144-Kbit M144K) tuned to different DSP and buffering use cases.
Typical applications include high-speed networking line cards, ASIC prototyping, software-defined radio baseband processing, high-end DSP co-processing, and digital video broadcast infrastructure. The combination of 337.5K LE and 976 user I/Os makes the part appropriate for bridging multiple external memory channels and parallel high-speed data converters.
When designing with this device, ensure the PCB has sufficient BGA breakout fan-out, a controlled-impedance stack-up for the high-speed I/Os, and a multi-rail power delivery network that matches Stratix III PowerPlay recommendations. Octopart currently lists 14 active distributors for this MPN.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III/IV L families, and practical design considerations not consolidated on any single distributor page.
ドロップイン代替品: EP3SL340F1517C4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SL340F1517C4 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SL340F1517C3N
✅ ドロップイン✓ 在庫あり
$3750 / 個
データシートを見る →EP3SL340F1517C3
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP3SL340F1517C2N
✅ ドロップイン✓ 在庫あり
$13200 / 個
データシートを見る →EP3SL340F1517C2
✅ ドロップイン✓ 在庫あり
$3050 / 個
データシートを見る →EP3SL340F1517I3N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2520 / 個
データシートを見る →EP3SL340F1517I3
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$18900 / 個
データシートを見る →EP3SL340F1517C4 最大定格＆電気的特性
| Family | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements (LE) | 337,500 |
| Logic Array Blocks (LABs) | 13,500 |
| Embedded Memory (bits) | 18,822,144 |
| User I/Os | 976 |
| Maximum Internal Frequency | 800 MHz |
| Internal Fabric Frequency | 500 MHz |
| Core Process Technology | 65 nm |
| Core Supply Voltage | 1.1 V |
| 動作温度 | 0 C to 85 C (Commercial) |
| Package Type | 1517-BBGA, FCBGA |
| 実装タイプ | Surface Mount (BGA) |
EP3SL340F1517C4 1517-bbga, fcbga ピン配置ガイド
EP3SL340F1517C4 (1517-bbga, fcbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SL340F1517C4.
詳細は データシート をご参照ください。
主な用途
EP3SL340F1517C4 の用途: 6 件s: High-Speed Networking Line Cards, ASIC Prototyping and Emulation, Software Defined Radio Baseband, High-End DSP Co-Processing, Digital Video Broadcast Infrastructure, Test & Measurement Instrumentation.
High-Speed Networking Line Cards
The EP3SL340F1517C4 fits high-end networking line cards because its 976 user I/Os can simultaneously connect to multiple SFI/Interlaken interfaces, external RLDRAM/RLRAM memories, and a network processor. With 18.8 Mbit embedded RAM the part can buffer full packets in on-chip TriMatrix blocks, eliminating one or more external QDR/QDRII+ chips and reducing BOM cost. The 500 MHz internal fabric sustains deep pipeline depths for header parsing, classification and queue management. Unlike smaller FPGAs that force external buffering, the 1517-FCBGA EP3SL340 keeps the entire data plane on-chip.
おすすめ
ASIC Prototyping and Emulation
The EP3SL340F1517C4 is well suited to ASIC prototyping because its 337.5K logic elements and 1517-ball BGA map the silicon area of mid-size ASICs (5-10M gates) with predictable timing closure through Quartus TimeQuest. The abundant 976 I/Os allow multi-million-gate ASIC partitions to be split across multiple FPGAs via TDM or HT tiles. Industrial customers also use the EP3SL340 for pre-silicon software development, letting firmware teams run on the same Quartus-compiled RTL that will later tape-out. Choose this device over a smaller Stratix when the target ASIC exceeds 200K LE equivalent.
おすすめ
Software Defined Radio Baseband
The EP3SL340F1517C4 fits SDR baseband designs because the Stratix III ALM fabric maps efficiently to LTE PHY channel cards, DVB-S2X demappers, and radar pulse compressors. The 18.8 Mbit embedded memory holds multi-symbol FFT windows without external DRAM pressure, and the 500 MHz fabric supports real-time OFDM processing at 100 MHz channel bandwidth. Designers commonly pair the EP3SL340 with high-speed ADCs such as the AD9680 (dual 1 GSPS) via LVDS or JESD204B links (the latter requires the EP3SE260F1517 transceiver-rich sibling, however).
おすすめ
High-End DSP Co-Processing
The EP3SL340F1517C4 functions as a co-processor to a host CPU/GPU when algorithms (FFT, Viterbi, LDPC, image pre-processing) require deterministic, low-latency hardware acceleration. The 18.8 Mbit TriMatrix memory combined with hundreds of 18x18 multipliers provides parallel MAC pipelines that outperform microsecond-scale CPU kernels. Engineers in medical imaging and 4K video use the EP3SL340 with external DDR3 controllers instantiated in the FPGA fabric to build HIPAA-compliant accelerator cards. Pair this part with PCIe-over-SerDes for host channel when available.
おすすめ
Digital Video Broadcast Infrastructure
The EP3SL340F1517C4 fits DVB and broadcast infrastructure because its 976 I/Os simultaneously drive multiple SDI/HD-SDI/3G-SDI links, ancillary data FIFOs, and MPEG-TS demultiplexers. The ALM-based fabric implements multi-channel JPEG2000/MPEG-4 encoders at line rate, while the 18.8 Mbit embedded RAM provides line buffers and statistical multiplexing FIFOs without external memory pressure. Compared to a smaller Stratix, the EP3SL340 lets broadcasters integrate transport-stream switching, scrambling, and FEC in a single FPGA, replacing several ASICs and a CPU complex.
おすすめ
Test & Measurement Instrumentation
The EP3SL340F1517C4 supports high-end test and measurement instruments because its 500 MHz fabric and 18.8 Mbit embedded memory can replay deep pattern buffers for protocol analyzers, BERT, and oscilloscope acquisition paths. The 976 I/Os expose enough LVDS pairs to drive 8+ channels of 5 Gbps parallel data with deterministic latency, ideal for memory bus interposers and protocol exercisers. Choosing the EP3SL340 over an ASIC keeps the instrument firmware-reconfigurable for new standards, while the 1517-FCBGA package mates with high-density probe-fixture boards.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SL340F1517C4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SL340F1517C3N | EP3SL340F1517C2N | EP3SL340F1517I3N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1517-FCBGA | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 |
| Speed Grade | C4 | C3 (slightly slower fMAX) | C2 (slower fMAX) | I3 (industrial temp) |
| Embedded Memory (bits) | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 |
| User I/Os | 976 | 976 | 976 | 976 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | -40 C to 100 C (Industrial) |
主な差別化要因
- Highest logic density in the Stratix III L family （vs EP3SL200F1517I4N)
- Maximum user I/O count in the L family （vs EP3SL340F1152 family)
- Largest embedded memory pool among Stratix III L devices （vs EP3SL110F1152C4N)
- Stratix III L (logic-rich) focus （vs EP3SE260F1517C4)
設計ノート
Estimated: a 1517-ball FCBGA at 1.0 mm pitch requires a high-density PCB stack-up with microvia-in-pad and at least 10 routing layers. Plan for symmetric stack-up (e.g. 1-2-1-2-1-2-1-2-1-2) to minimize warp during BGA assembly. Fan-out routing needs four signal layers plus dedicated GND/power planes; fan-out must escape all 1517 balls before any signal trace can break out from under the BGA. Plan for at least 4 sq. cm of contiguous GND pour on the top layer directly beneath the package to manage thermal dissipation at 500 MHz operation.
The Stratix III L EP3SL340 requires multiple rails per the PowerPlay design guidelines: VCC (1.1 V core), VCCPT (1.5 V or 1.2 V programmable power technology), VCCAUX (2.5 V), and VCCIO (1.2-3.0 V bank-dependent). Use a sequence controller such as the LTC2955 to enforce power-up order; failure to do so may cause high in-rush current and latch-up. Decoupling follows the Stratix III device handbook recommendation: at least 200 low-ESR ceramic capacitors distributed under and around the BGA, with one 1 mF bulk per supply plane.
Estimated: at typical Stratix III L utilization (~70% LE, 50% memory toggling at 250 MHz) the EP3SL340 dissipates roughly 8-12 W. The 1517-FCBGA package relies on the PCB as a heat-spreader; without a heatsink the theta_JA is approximately 12-14 C/W, which yields junction-to-ambient rises of 100-170 C under typical loads. Forced-air cooling (>=1 m/s) is required for production deployments; many designers add a small clip-on heatsink with thermal interface material to reduce junction temperature by another 15-20 C.
LVDS pairs from the EP3SL340 must be length-matched within 150 mil (3.8 mm) and routed on a 100 ohm differential impedance stack-up. Reference the Stratix III Device Handbook, I/O chapter, for the per-bank DIFFIO_TX/RX pinout constraints. For 800 Mbps DDR2/DDR3 interfaces, use the Quartus IP Toolkit DDR timing report to verify read/write margins of at least 0.4 UI before PCB layout freeze.
A common error is using the Stratix III E (transceiver-rich) pinout files when designing for the L (logic-rich) variant; the two are NOT pin-compatible despite the shared 1517-FCBGA footprint. Always select the exact MPN (EP3SL340...) in the Quartus Pin Planner. Another frequent mistake is assuming all 976 I/Os are simultaneously usable; bank VCCIO constraints reduce usable I/Os when mixed-voltage interfaces are required.
コンプライアンス情報
RoHS and halogen-free status not present in the verified web data; per Intel/Altera historical product policy, devices in BGA packages are typically lead-free and RoHS compliant, but the official declaration was not retrieved. AEC-Q100 not applicable for commercial-grade FPGAs - use I-grade parts for industrial systems.