EP3SL340F1517C4 - Stratix III L FPGA 337.5K LE 1517-FCBGA | Intel
料号： EP3SL340F1517C4 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4500 | $4,500.00 |
| 10 | $4250 | $42,500.00 |
| 100 | $3900 | $390,000.00 |
| 500 | $3600 | $1,800,000.00 |
| 1,000 | $3300 | $3,300,000.00 |
EP3SL340F1517C4 概述
An FPGA (Field Programmable Gate Array) is a programmable semiconductor whose logic fabric and interconnect can be reconfigured by the customer after manufacture, sitting in the hierarchy between ASICs (full custom, fixed) and CPLDs (smaller, non-volatile). Stratix III L devices were positioned by Intel/Altera for high-throughput DSP, high-speed serial interconnect, and high-bandwidth memory-interface designs, occupying the upper tier of the FPGA taxonomy below Stratix IV/V and above Cyclone series devices.
Key features include 13,500 Logic Array Blocks (LABs), 18,822,144 embedded RAM bits distributed across TriMatrix memory blocks, 500 MHz internal fabric frequency, 800 MHz maximum internal frequency, 976 user I/O pins, and a 1.1 V core supply. The 1517-FCBGA (FCBGA, 40x40 mm class substrate) is the largest package in the Stratix III L family and supports the device's full I/O count including multiple high-speed transceiver banks.
Architecturally the EP3SL340F1517C4 leverages the ALM-based logic fabric introduced in Stratix III, allowing 8-input fracturable look-up tables with arithmetic mode and a MultiTrack interconnect for predictable timing closure. The TriMatrix memory subsystem provides three distinct block RAM depths (640-bit MLAB, 9-Kbit M9K, 144-Kbit M144K) tuned to different DSP and buffering use cases.
Typical applications include high-speed networking line cards, ASIC prototyping, software-defined radio baseband processing, high-end DSP co-processing, and digital video broadcast infrastructure. The combination of 337.5K LE and 976 user I/Os makes the part appropriate for bridging multiple external memory channels and parallel high-speed data converters.
When designing with this device, ensure the PCB has sufficient BGA breakout fan-out, a controlled-impedance stack-up for the high-speed I/Os, and a multi-rail power delivery network that matches Stratix III PowerPlay recommendations. Octopart currently lists 14 active distributors for this MPN.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III/IV L families, and practical design considerations not consolidated on any single distributor page.
直接替换替代料： EP3SL340F1517C4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SL340F1517C4 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP3SL340F1517C3N
✅ 直接替换✓ 有现货
$3750 / 个
查看数据手册 →EP3SL340F1517C3
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP3SL340F1517C2N
✅ 直接替换✓ 有现货
$13200 / 个
查看数据手册 →EP3SL340F1517C2
✅ 直接替换✓ 有现货
$3050 / 个
查看数据手册 →EP3SL340F1517I3N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2520 / 个
查看数据手册 →EP3SL340F1517I3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$18900 / 个
查看数据手册 →EP3SL340F1517C4 最大额定值与电气特性
| Family | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements (LE) | 337,500 |
| Logic Array Blocks (LABs) | 13,500 |
| Embedded Memory (bits) | 18,822,144 |
| User I/Os | 976 |
| Maximum Internal Frequency | 800 MHz |
| Internal Fabric Frequency | 500 MHz |
| Core Process Technology | 65 nm |
| Core Supply Voltage | 1.1 V |
| 工作温度 | 0 C to 85 C (Commercial) |
| Package Type | 1517-BBGA, FCBGA |
| 安装类型 | Surface Mount (BGA) |
EP3SL340F1517C4 1517-bbga, fcbga 引脚配置指南
EP3SL340F1517C4（1517-bbga, fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SL340F1517C4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SL340F1517C4 适用于 6 应用s: High-Speed Networking Line Cards, ASIC Prototyping and Emulation, Software Defined Radio Baseband, High-End DSP Co-Processing, Digital Video Broadcast Infrastructure, Test & Measurement Instrumentation.
High-Speed Networking Line Cards
The EP3SL340F1517C4 fits high-end networking line cards because its 976 user I/Os can simultaneously connect to multiple SFI/Interlaken interfaces, external RLDRAM/RLRAM memories, and a network processor. With 18.8 Mbit embedded RAM the part can buffer full packets in on-chip TriMatrix blocks, eliminating one or more external QDR/QDRII+ chips and reducing BOM cost. The 500 MHz internal fabric sustains deep pipeline depths for header parsing, classification and queue management. Unlike smaller FPGAs that force external buffering, the 1517-FCBGA EP3SL340 keeps the entire data plane on-chip.
推荐
ASIC Prototyping and Emulation
The EP3SL340F1517C4 is well suited to ASIC prototyping because its 337.5K logic elements and 1517-ball BGA map the silicon area of mid-size ASICs (5-10M gates) with predictable timing closure through Quartus TimeQuest. The abundant 976 I/Os allow multi-million-gate ASIC partitions to be split across multiple FPGAs via TDM or HT tiles. Industrial customers also use the EP3SL340 for pre-silicon software development, letting firmware teams run on the same Quartus-compiled RTL that will later tape-out. Choose this device over a smaller Stratix when the target ASIC exceeds 200K LE equivalent.
推荐
Software Defined Radio Baseband
The EP3SL340F1517C4 fits SDR baseband designs because the Stratix III ALM fabric maps efficiently to LTE PHY channel cards, DVB-S2X demappers, and radar pulse compressors. The 18.8 Mbit embedded memory holds multi-symbol FFT windows without external DRAM pressure, and the 500 MHz fabric supports real-time OFDM processing at 100 MHz channel bandwidth. Designers commonly pair the EP3SL340 with high-speed ADCs such as the AD9680 (dual 1 GSPS) via LVDS or JESD204B links (the latter requires the EP3SE260F1517 transceiver-rich sibling, however).
推荐
High-End DSP Co-Processing
The EP3SL340F1517C4 functions as a co-processor to a host CPU/GPU when algorithms (FFT, Viterbi, LDPC, image pre-processing) require deterministic, low-latency hardware acceleration. The 18.8 Mbit TriMatrix memory combined with hundreds of 18x18 multipliers provides parallel MAC pipelines that outperform microsecond-scale CPU kernels. Engineers in medical imaging and 4K video use the EP3SL340 with external DDR3 controllers instantiated in the FPGA fabric to build HIPAA-compliant accelerator cards. Pair this part with PCIe-over-SerDes for host channel when available.
推荐
Digital Video Broadcast Infrastructure
The EP3SL340F1517C4 fits DVB and broadcast infrastructure because its 976 I/Os simultaneously drive multiple SDI/HD-SDI/3G-SDI links, ancillary data FIFOs, and MPEG-TS demultiplexers. The ALM-based fabric implements multi-channel JPEG2000/MPEG-4 encoders at line rate, while the 18.8 Mbit embedded RAM provides line buffers and statistical multiplexing FIFOs without external memory pressure. Compared to a smaller Stratix, the EP3SL340 lets broadcasters integrate transport-stream switching, scrambling, and FEC in a single FPGA, replacing several ASICs and a CPU complex.
推荐
Test & Measurement Instrumentation
The EP3SL340F1517C4 supports high-end test and measurement instruments because its 500 MHz fabric and 18.8 Mbit embedded memory can replay deep pattern buffers for protocol analyzers, BERT, and oscilloscope acquisition paths. The 976 I/Os expose enough LVDS pairs to drive 8+ channels of 5 Gbps parallel data with deterministic latency, ideal for memory bus interposers and protocol exercisers. Choosing the EP3SL340 over an ASIC keeps the instrument firmware-reconfigurable for new standards, while the 1517-FCBGA package mates with high-density probe-fixture boards.
推荐
推荐产品汇总
工程参考数据： EP3SL340F1517C4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SL340F1517C3N | EP3SL340F1517C2N | EP3SL340F1517I3N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1517-FCBGA | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 |
| Speed Grade | C4 | C3 (slightly slower fMAX) | C2 (slower fMAX) | I3 (industrial temp) |
| Embedded Memory (bits) | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 |
| User I/Os | 976 | 976 | 976 | 976 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | -40 C to 100 C (Industrial) |
关键差异点
- Highest logic density in the Stratix III L family （对比 EP3SL200F1517I4N)
- Maximum user I/O count in the L family （对比 EP3SL340F1152 family)
- Largest embedded memory pool among Stratix III L devices （对比 EP3SL110F1152C4N)
- Stratix III L (logic-rich) focus （对比 EP3SE260F1517C4)
设计说明
Estimated: a 1517-ball FCBGA at 1.0 mm pitch requires a high-density PCB stack-up with microvia-in-pad and at least 10 routing layers. Plan for symmetric stack-up (e.g. 1-2-1-2-1-2-1-2-1-2) to minimize warp during BGA assembly. Fan-out routing needs four signal layers plus dedicated GND/power planes; fan-out must escape all 1517 balls before any signal trace can break out from under the BGA. Plan for at least 4 sq. cm of contiguous GND pour on the top layer directly beneath the package to manage thermal dissipation at 500 MHz operation.
The Stratix III L EP3SL340 requires multiple rails per the PowerPlay design guidelines: VCC (1.1 V core), VCCPT (1.5 V or 1.2 V programmable power technology), VCCAUX (2.5 V), and VCCIO (1.2-3.0 V bank-dependent). Use a sequence controller such as the LTC2955 to enforce power-up order; failure to do so may cause high in-rush current and latch-up. Decoupling follows the Stratix III device handbook recommendation: at least 200 low-ESR ceramic capacitors distributed under and around the BGA, with one 1 mF bulk per supply plane.
Estimated: at typical Stratix III L utilization (~70% LE, 50% memory toggling at 250 MHz) the EP3SL340 dissipates roughly 8-12 W. The 1517-FCBGA package relies on the PCB as a heat-spreader; without a heatsink the theta_JA is approximately 12-14 C/W, which yields junction-to-ambient rises of 100-170 C under typical loads. Forced-air cooling (>=1 m/s) is required for production deployments; many designers add a small clip-on heatsink with thermal interface material to reduce junction temperature by another 15-20 C.
LVDS pairs from the EP3SL340 must be length-matched within 150 mil (3.8 mm) and routed on a 100 ohm differential impedance stack-up. Reference the Stratix III Device Handbook, I/O chapter, for the per-bank DIFFIO_TX/RX pinout constraints. For 800 Mbps DDR2/DDR3 interfaces, use the Quartus IP Toolkit DDR timing report to verify read/write margins of at least 0.4 UI before PCB layout freeze.
A common error is using the Stratix III E (transceiver-rich) pinout files when designing for the L (logic-rich) variant; the two are NOT pin-compatible despite the shared 1517-FCBGA footprint. Always select the exact MPN (EP3SL340...) in the Quartus Pin Planner. Another frequent mistake is assuming all 976 I/Os are simultaneously usable; bank VCCIO constraints reduce usable I/Os when mixed-voltage interfaces are required.
合规信息
RoHS and halogen-free status not present in the verified web data; per Intel/Altera historical product policy, devices in BGA packages are typically lead-free and RoHS compliant, but the official declaration was not retrieved. AEC-Q100 not applicable for commercial-grade FPGAs - use I-grade parts for industrial systems.