Intel

EP3SL340H1152C2N - Stratix III L FPGA, 337.5K LE, 1152-BGA | Intel

部品番号: EP3SL340H1152C2N ⚠ ラストタイムバイ

在庫あり 1〜3営業日以内に発送

0.9 V Vdss 1152-Ball FC-HFBGA (flip-chip) Package 600 MHz Speed 18,822,144 Memory

開始価格 $3400 USD / 個

MOQ: 1 |

価格更新日: 2026-09-09

ボリューム価格

数量	単価	小計
1	$4250	$4,250.00
10	$4037.5	$40,375.00
100	$3825	$382,500.00
500	$3612.5	$1,806,250.00
1,000	$3400	$3,400,000.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

EP3SL340H1152C2N 概要

The Intel (formerly Altera) EP3SL340H1152C2N is a high-density Stratix III L Field Programmable Gate Array (FPGA) offering 337,500 logic elements, 18,822,144 bits of embedded memory, and 744 18x18 multipliers, housed in a 1152-ball FineLine BGA (FCBGA / HBGA) package with flip-chip construction. Built on a 65 nm CMOS process, it operates from a 0.9 V core / 1.1 V auxiliary supply and supports performance up to 600 MHz fabric speed, targeting high-throughput DSP, telecom, and signal-processing designs.

A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed after manufacturing. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs, microcontrollers, and DSPs as building blocks of modern digital systems. The Stratix III L family specifically emphasizes low-power, high-logic-density designs with dedicated DSP blocks, embedded TriMatrix memory, and high-speed serial transceivers, occupying the high-end tier of Intel's (formerly Altera's) programmable logic portfolio.

Key differentiating features include 337,500 logic elements (LEs) for fine-grained parallel processing, 18,822,144 embedded memory bits for wide data buffering without external SRAM, 744 dedicated hardware multipliers (18x18) for fixed- and floating-point DSP acceleration, and integrated PLLs for multi-domain clock management. The flip-chip 1152-BGA package exposes the full I/O count and high-performance serial interface pins while delivering a low-inductance power distribution network.

Architecturally, the EP3SL340H1152C2N combines LUT-based adaptive logic modules (ALMs), TriMatrix memory blocks (MLAB, M9K, M144K), DSP blocks, and clock networks routed across a multi-tier interconnect. The 65 nm process and Stratix III L variant minimize dynamic power via programmable power technology, allowing unused fabric regions to be put into a low-power state without losing state. Compared with discrete processor-plus-DSP solutions, the integrated fabric yields deterministic latency and far higher parallel throughput.

Typical applications include high-end telecommunications baseband and backhaul cards, real-time digital signal processing for radar and medical imaging, ASIC prototyping, high-performance computing accelerators, and broadcast video processing. Designers choose this device when the design exceeds the logic, memory, or DSP budget of smaller FPGAs or when deterministic parallel throughput is required.

A practical design consideration is power delivery: the 1152-BGA package requires a multi-rail PDN with bulk decoupling at each supply island and high-frequency ceramics under the BGA via field. PCB stack-up should target 1-oz copper inner planes with microvia access to inner pads to meet the simultaneous-switching output (SSO) noise budget.

This page synthesizes distributor pricing, drop-in Stratix III L alternatives from the Site MPN catalog, and practical design notes not found in the manufacturer datasheet alone, enabling faster BOM selection and PCB reuse across related part numbers.

ドロップイン代替品: EP3SL340H1152C2N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP3SL340H1152C2N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, Embedded Memory Bits, Family.

EP3SE260F1152C2N

Intel

Family: FPGA - Field Programmable Gate Array

比較対象 EP3SL340H1152C2N →

EP3SE260H780C2N

Intel

Package: 780-BGA FCBGA

Speed Grade: C2

比較対象 EP3SL340H1152C2N →

EP3SL110F1152C4N

Intel

Package: 1152-BBGA, FCBGA

Operating Temperature: 0C to +85C (Commercial)

Embedded Memory Bits: 4992000

比較対象 EP3SL340H1152C2N →

EP3SL200H780C2N

Intel

Package: 780-ball HBGA / FCBGA

Speed Grade: C2

Operating Temperature: Commercial (0C to +85C)

比較対象 EP3SL340H1152C2N →

EP3SL340F1760I4N

Intel

Package: 1760-ball FC-BGA

Speed Grade: I4

Operating Temperature: -40C to +100C (Industrial)

比較対象 EP3SL340H1152C2N →

EP3SL340H1152C2

Intel

Speed Grade: C2

比較対象 EP3SL340H1152C2N →

EP3SL340H1152C3

Intel

Package: 1152-ball FCBGA (HBGA)

Speed Grade: C3

比較対象 EP3SL340H1152C2N →

EP3SL340H1152C3N

Intel

Package: 1152-BBGA, FCBGA

Speed Grade: 3

Operating Temperature: 0C to +85C (Commercial)

比較対象 EP3SL340H1152C2N →

EP3SL340H1152C4

Intel

Package: 1152-pin FCBGA (Flip-Chip BGA)

Speed Grade: C4 (commercial, speed grade 4)

Operating Temperature: 0C to 85C (commercial)

比較対象 EP3SL340H1152C2N →

EP3SL340H1152C4L

Altera

Package: 1152-BBGA, FCBGA (HBGA)

Speed Grade: C4L (L-suffix low power)

Operating Temperature: 0 C to +85 C (commercial)

比較対象 EP3SL340H1152C2N →

EP3SL340H1152C4LN

Intel

Package: 1152-BBGA, FCBGA (flip-chip)

Speed Grade: C4

Operating Temperature: 0C to +85C (commercial)

比較対象 EP3SL340H1152C2N →

✅ ドロップイン

Intel

📦 1152-BGA

Stratix III L · Stratix III · 107500 · 4992000 · 744 · 432 · 12 · 12 (3.125 Gbps)

✓ 在庫あり

$3500 / 個

データシートを見る →

EP3SL340H1152C2N 最大定格＆電気的特性

Family	Stratix III L
Logic Elements	337,500
Embedded Memory Bits	18,822,144
DSP Blocks (18x18 multipliers)	744
Process Technology	65 nm CMOS
Core Voltage	0.9 V
Auxiliary / I/O Supply	1.1 V
Maximum Fabric Frequency	600 MHz
パッケージ	1152-Ball FC-HFBGA (flip-chip)
実装タイプ	Surface Mount (BGA)
Lead-Free / RoHS	Lead-free (per distributor listing)
Operating Temperature Grade	Commercial
Speed Grade	C2 (moderate)
JTAG Support	IEEE Std 1149.1 Boundary-Scan
メモリタイプ	TriMatrix (MLAB + M9K + M144K)

EP3SL340H1152C2N 1152-ball fc-hfbga (flip-chip) ピン配置ガイド

EP3SL340H1152C2N (1152-ball fc-hfbga (flip-chip) パッケージ) のピン配置。このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP3SL340H1152C2N の 1152-ball fc-hfbga (flip-chip) パッケージピン配置図

詳細なピン配置データはありません: EP3SL340H1152C2N.

詳細はデータシートをご参照ください。

主な用途

EP3SL340H1152C2N の用途: 6 件s: Telecommunications Baseband Processing, Real-Time DSP for Radar and Imaging, ASIC Prototyping and Emulation, High-Performance Computing Acceleration, Broadcast Video Processing, Industrial Automation and Control.

🌐

Telecommunications Baseband Processing

The EP3SL340H1152C2N fits high-throughput baseband and backhaul cards where 337,500 logic elements and 744 dedicated 18x18 hardware multipliers enable multi-channel FFT, channel coding, and modulation in a single device. Its 18 Mbits of TriMatrix embedded memory buffers large symbol maps without external SRAM, while the 1152-BGA exposes enough user pins to interface multiple SFP+/QSFP links. Designers route the 0.9V core and 1.1V auxiliary through a multi-rail PDN with bulk ceramics under each supply island to meet SSN budgets.

おすすめ

✈️

Real-Time DSP for Radar and Imaging

With 744 hardware multipliers and deterministic parallel fabric, the EP3SL340H1152C2N is well matched to real-time radar, sonar, and medical-imaging pipelines. Pulse compression, beamforming, and FFT stages map cleanly onto the DSP block array, and the 18 Mbit embedded memory holds sample windows at full ADC rate. The flip-chip 1152-BGA offers low inductance for the simultaneous-switching ADC/DAC interfaces, preserving SNR at hundreds of MHz sample rates.

おすすめ

EP3SL340H1152C2 · Intel EP3SL200H780C2N · Intel

🖥️

ASIC Prototyping and Emulation

Designers use the EP3SL340H1152C2N as an ASIC prototype target because the 337.5K LE, 18 Mbit memory, and 744 multipliers map cleanly onto mid-complexity ASIC RTL. The device supports multi-FPGA partitioning via LVDS and SERDES links, and the JTAG IEEE 1149.1 boundary scan plus SignalTap logic analyzer instances provide real-time debug without external probes. Pin-compatible Stratix III siblings let a prototype re-spin re-use the same PCB while increasing or reducing logic capacity.

おすすめ

EP3SL340H1152C2 · Intel EP3SE260H780C2N · Intel

🖥️

High-Performance Computing Acceleration

The EP3SL340H1152C2N serves as a compute accelerator for HPC and financial workloads where massive bit-level parallelism outperforms CPUs. 337,500 logic elements run many parallel arithmetic units per clock, while 744 hardware multipliers deliver sustained GMACs for Monte Carlo or option-pricing kernels. The 1152-BGA exposes PCIe-like edge pinout patterns and high-speed LVDS lanes for host-link integration, and the Stratix III L fabric targets low dynamic power relative to earlier Stratix families.

おすすめ

EP3SL110F1152C4N · Intel EP3SE80F1152C2N · Altera

📺

Broadcast Video Processing

The EP3SL340H1152C2N is used in broadcast video routers, format converters, and multi-channel encoders. Its 337,500 logic elements implement multiple parallel video pipelines at 3G-SDI / 6G-SDI rates, while 18 Mbits of embedded memory line-buffer video frames without external DDR. The 1152-BGA's high user-pin count connects to multiple SDI transceivers simultaneously. Designers pick this part over smaller FPGAs to consolidate multiple video channels onto one silicon device.

おすすめ

EP3SE260F1152C2N · Intel EP3SL200F1517C3N (alternate BGA package, higher pin count)

🏭

Industrial Automation and Control

The EP3SL340H1152C2N supports high-channel-count industrial automation where many sensors, actuators, and communication interfaces are processed in parallel. 337,500 logic elements implement EtherCAT, Profinet, and EtherNet/IP stacks, while 744 multipliers handle real-time control loops. The Stratix III L family offers Programmable Power Technology for unused fabric to reduce dynamic power in long-running factory installations. The 1152-BGA integrates cleanly onto backplanes with high pin-count sensor headers.

おすすめ

EP3SL340F1760I4N · Intel EP3SL110F1152C4N · Intel

おすすめ製品の概要

EP3SL340F1760I4N Intel 使用用途: Telecommunications Baseband Processing, Industrial Automation and Control EP3SE260F1152C2N Intel 使用用途: Telecommunications Baseband Processing, Broadcast Video Processing EP3SL340H1152C2 Intel 使用用途: Real-Time DSP for Radar and Imaging, ASIC Prototyping and Emulation EP3SL200H780C2N Intel 使用用途: Real-Time DSP for Radar and Imaging EP3SE260H780C2N Intel 使用用途: ASIC Prototyping and Emulation EP3SL110F1152C4N Intel 使用用途: High-Performance Computing Acceleration, Industrial Automation and Control EP3SE80F1152C2N Altera 使用用途: High-Performance Computing Acceleration EP3SL200F1517C3N alternate BGA package, higher pin count 使用用途: Broadcast Video Processing

What is the EP3SL340H1152C2N?

The EP3SL340H1152C2N is an Intel (formerly Altera) Stratix III L high-density FPGA. It contains 337,500 logic elements, 18,822,144 bits of embedded memory, and 744 dedicated 18x18 hardware multipliers, fabricated on a 65 nm CMOS process. The part is housed in a 1152-ball flip-chip BGA package, targets commercial temperature, and runs the C2 speed grade with a 600 MHz maximum fabric clock.

What core and I/O voltages does EP3SL340H1152C2N require?

According to the Stratix III device handbook, the EP3SL340H1152C2N requires a 0.9 V VCC core supply and a 1.1 V VCCAUX auxiliary supply. The I/O banks operate at common logic levels (e.g., 1.2V, 1.5V, 1.8V, 2.5V, 3.3V) selectable per bank. A multi-rail decoupling network with bulk and high-frequency ceramic capacitors under the package is required to meet the simultaneous-switching noise budget.

How many logic elements, memory bits, and DSP blocks does the EP3SL340H1152C2N have?

The EP3SL340H1152C2N integrates 337,500 logic elements (LEs), 18,822,144 bits of TriMatrix embedded memory distributed across MLAB, M9K, and M144K blocks, and 744 dedicated 18x18 hardware multipliers for DSP. This combination supports high-throughput parallel signal processing with deterministic latency, eliminating the need for an external DSP or ASIC in many designs.

Is the EP3SL340H1152C2N obsolete or still in production?

According to the latest Intel product status data, the EP3SL340H1152C2N is classified as Last Time Buy. Stratix III silicon production has been discontinued in favor of newer Intel Agilex and Stratix 10 families. Existing inventory remains available through authorized distributors like DigiKey until stock is exhausted, after which this part will transition to obsolete status.

Where can I download the EP3SL340H1152C2N datasheet PDF?

The Stratix III device family handbook is published by Intel at https://www.intel.com/content/www/us/en/programmable/documentation/lit-hb/stratix-iii/lh-stratix-iii.html. For pinout, package, and ball-map details, refer to the device-specific addendum in the same documentation portal. Third-party distributor listings such as DigiKey and TrustedParts also link to PDF datasheets for the EP3SL340H1152C2N.

What is the price of EP3SL340H1152C2N in single-unit quantity?

As of 2026-09-09, the EP3SL340H1152C2N lists at approximately $4,250 USD per single unit at distributors carrying remaining stock. Volume breaks reduce the unit price: 10 pieces around $4,037, 100 pieces near $3,825, and 1,000 pieces as low as $3,400. Because the part is Last Time Buy, pricing is highly volatile and quote-based for large orders.

What is the lead time and stock status for EP3SL340H1152C2N?

As of 2026-09-09, EP3SL340H1152C2N stock is limited because the part is Last Time Buy and Stratix III production has ended. Authorized distributors such as DigiKey and TrustedParts show small quantities with immediate shipment when in stock, but for larger volumes buyers should request a quote and expect 4-12 week lead times from secondary-market brokers.

Where to buy EP3SL340H1152C2N online?

The EP3SL340H1152C2N can be sourced online through authorized distributors including DigiKey (digikey.ca / digikey.in) and TrustedParts.com, as well as secondary-market brokers such as Xecor, Kynix, Bettlink, Avaq, Veswin, Ampheo, and Partstack. For volume or traceable orders, prefer distributors with documented quality testing to avoid counterfeit Stratix III parts.

What is the best drop-in replacement for EP3SL340H1152C2N?

The closest drop-in alternatives are same-package Stratix III L variants sharing the 1152-BGA footprint, including the EP3SL340H1152C2 (no N suffix designation) and other EP3SL340H1152* speed-grade versions. These share pinout, voltage rails, and JTAG mapping. A functional upgrade is the Stratix IV EP4SE230 or EP4SE530 family, but those require PCB redesign.

Is EP3SL340H1152C2N pin-compatible with EP3SL340H1152C2?

Yes. The EP3SL340H1152C2N and EP3SL340H1152C2 are both Stratix III L EP3SL340 devices in the same 1152-ball FC-HFBGA package. They share identical ballout, voltage rails, and JTAG pin assignments, so they are drop-in compatible at the PCB level. The trailing 'N' in the MPN typically designates a specific lead-free or shipping-media variant rather than a functional difference.

EP3SL340H1152C2N vs EP3SL340F1760I4N - which is better for low-power telecom?

Both are Stratix III L EP3SL340 logic-density FPGAs, but they differ in package and speed grade. The EP3SL340H1152C2N uses a 1152-BGA package at commercial temperature and C2 speed grade, while the EP3SL340F1760I4N uses a 1760-BGA package at industrial temperature and a faster I4 speed grade. For higher fabric frequency in industrial environments, choose EP3SL340F1760I4N; for lower-cost commercial telecom, prefer EP3SL340H1152C2N.

When should I choose EP3SL340H1152C2N over a newer Stratix 10?

Choose the EP3SL340H1152C2N when you are maintaining an existing Stratix III design and want a known-good drop-in, when your design only consumes a fraction of the 337.5K LE fabric, or when you want to avoid re-qualifying firmware for a new toolchain. For new designs where Stratix III firmware is unavailable, migrate to Stratix 10 or Intel Agilex for active support, faster transceivers, and longer lifecycle.

Can the EP3SL340H1152C2N be used for ASIC prototyping?

Yes. The EP3SL340H1152C2N is well-suited for ASIC prototyping because of its 337,500 logic elements, 18 Mbits of embedded memory, and 744 hardware multipliers. Designers can partition a target ASIC across one or more Stratix III L devices and use the JTAG IEEE 1149.1 boundary-scan chain for bring-up. SignalTap logic analyzer instances provide real-time debug visibility equivalent to a logic-analyzer probe.

What are the key specifications of EP3SL340H1152C2N that engineers should know?

According to the Stratix III device handbook, the EP3SL340H1152C2N provides 337,500 logic elements, 18,822,144 embedded memory bits, 744 18x18 multipliers, 600 MHz maximum fabric frequency, 0.9V core / 1.1V auxiliary supplies, JTAG IEEE 1149.1 boundary scan, and a 1152-ball flip-chip BGA package. It targets commercial temperature with C2 speed grade and is Last Time Buy as of 2026.

What is the best Intel (Altera) equivalent for EP3SL340H1152C2N?

The best same-manufacturer drop-in equivalents are other Stratix III L EP3SL340 variants in the 1152-BGA package, such as EP3SL340H1152C2 (no N suffix) and other speed-grade versions sharing the same ballout. These are pin-to-pin compatible at the PCB level. The Stratix IV EP4SE530 is the closest functional upgrade but is in a larger BGA package requiring PCB redesign.

エンジニアリング参考データ: EP3SL340H1152C2N — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose EP3SL340H1152C2N when your design requires 200K+ logic elements, more than 500 hardware multipliers, and ~18 Mbit embedded memory in a single FPGA - typical for high-end telecom baseband, radar processing, and ASIC prototyping. Pick EP3SL340H1152C2 as a drop-in same-package alternate when the 'N' suffix is unavailable. Select EP3SL340F1760I4N when you need industrial-temperature operation and more user pins. Use EP3SL200H780C2N or EP3SL110F1152C4N if your design fits a smaller density. Avoid Stratix III entirely for new designs; migrate to Stratix 10 or Intel Agilex for active support and longer lifecycle.

代替品との比較

パラメータ	この製品	EP3SL340H1152C2	EP3SL200H780C2N	EP3SE260H780C2N	EP3SL340F1760I4N	EP3SE260F1152C2N	EP3SL110F1152C4N
Package	1152-BGA (FC-HFBGA)	1152-BGA (FC-HFBGA) - same	780-BGA	780-BGA	1760-BGA	1152-BGA	1152-BGA
Brand	Intel	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	337,500	337,500	200,000	256,000	337,500	256,000	107,500
Embedded Memory (bits)	18,822,144	18,822,144	9,663,744	13,475,712	18,822,144	13,475,712	5,810,688
DSP Blocks (18x18 multipliers)	744	744	384	384	744	384	192
Family / Sub-Series	Stratix III L	Stratix III L	Stratix III L	Stratix III E	Stratix III L	Stratix III E	Stratix III L
Core Voltage	0.9 V	0.9 V	0.9 V	0.9 V	0.9 V	0.9 V	0.9 V
Lifecycle Status	Last Time Buy	Last Time Buy	Last Time Buy	Last Time Buy	Last Time Buy	Last Time Buy	Last Time Buy

主な差別化要因

Higher logic density at 337,500 LEs （vs EP3SL200H780C2N)
Higher DSP block count （vs EP3SE260F1152C2N)
Compact 1152-BGA with full I/O access （vs EP3SL340F1760I4N)
Stratix III L low-power architecture （vs EP3SE260H780C2N)

設計ノート

The EP3SL340H1152C2N requires a multi-rail power distribution network: 0.9 V VCC core, 1.1 V VCCAUX/PLL analog, and per-bank VCCIO rails. Place bulk electrolytic or polymer capacitors at the BGA edge with at least one 10 uF X5R ceramic per supply island. High-frequency decoupling should use 0.1 uF and 1 nF X7R ceramics under the BGA via field. Decoupling budgets of ~30-50 bulk + 100+ ceramic caps per device are typical for dense 1152-BGA designs.

Estimated: at 100% fabric utilization with 600 MHz clock, the EP3SL340H1152C2N can dissipate 8-12 W. The flip-chip 1152-BGA requires a thermal pad or top-side heatsink attached to the lid. Ensure PCB stack-up routes thermal vias (0.3 mm pitch, 12+ vias under BGA center) to an internal copper plane. Without thermal management, junction temperature can exceed 100 C in poorly ventilated enclosures.

The 1152-ball flip-chip BGA requires microvia or via-in-pad construction to escape the inner rows. Recommended PCB stack-up is at least 8 layers with 1-oz copper inner planes and a high-Tg FR-4 dielectric. Match BGA pad pitch (1.0 mm typical for this package) to the PCB fab capability. Maintain a continuous reference plane under the BGA via field to control impedance of high-speed SERDES and LVDS lanes.

Do not confuse the Stratix III L (low-power) sub-series with the Stratix III E (enhanced logic/memory) sub-series - they differ in DSP/memory ratios and power. Verify pinout against the device-specific handbook addendum, not the family handbook, because BGA ball maps vary by density grade. Confirm all VCCIO banks match the I/O voltage of attached peripherals before board bring-up to avoid I/O damage.

Route SERDES differential pairs (TX/RX) with 100 ohm differential impedance and keep lengths matched within 150 mil. Separate clock inputs from switching I/O by at least 3x the trace spacing rule. Place JTAG TDI/TDO/TMS/TCK at the BGA edge to allow easy test header access. Keep PLLs powered by quiet 1.1 V with a pi-filter (ferrite bead + capacitors) to minimize jitter.

コンプライアンス情報

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

鉛フリー

Yes

ハロゲンフリー

Unknown

紛争鉱物

Compliant

Lead-free per distributor listing. RoHS compliant. AEC-Q100 not applicable for FPGAs (different qualification standard). Halogen-free status not stated in available data. Conflict-minerals compliance per Intel standard policy.

データ検証日: 2026-09-09 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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