EP3SL50F780I4L - 47.5K Logic Elements Stratix III L FPGA | Intel
部品番号: EP3SL50F780I4L ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $953.46 | $953.46 |
| 10 | $905.79 | $9,057.90 |
| 100 | $838.1 | $83,810.00 |
| 500 | $762.77 | $381,385.00 |
| 1,000 | $695.09 | $695,090.00 |
EP3SL50F780I4L 概要
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that contains an array of programmable logic blocks, embedded memory, DSP blocks, and high-speed transceivers all wired together through a programmable interconnect fabric. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers: they deliver ASIC-class throughput and parallelism while remaining field-updatable through their SRAM-based configuration memory. Within the broader semiconductor taxonomy, an FPGA sits at the top of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit). Stratix III devices target high-performance DSP, communications, and signal-processing applications that require a balance of logic density, embedded memory bandwidth, and transceiver I/O.
Key features of the EP3SL50F780I4L include 488 user I/O pins, 2,184,192 bits of embedded RAM, integrated DSP blocks, and support for multiple I/O standards such as LVDS, LVTTL, LVCMOS, and HSTL through 8 I/O banks. The 'L' suffix identifies the device as the low-power member of the Stratix III family, with reduced static and dynamic power versus the Stratix III E variant. The 'I4' speed grade and 'L' package suffix place the device in the industrial temperature range (-40C to +100C) in a lead-free 780-ball FCBGA.
Typical applications include high-speed data acquisition, telecom baseband processing, military/aerospace signal processing, medical imaging, and ASIC prototyping. The wide I/O count and large embedded memory make the EP3SL50F780I4L well-suited to designs that aggregate multiple data streams or implement deep packet buffers.
When designing with this FPGA, plan for multi-rail power (typically 0.9 V core, 1.1 V/1.2 V PLL, 1.5 V/1.8 V/2.5 V/3.3 V I/O), controlled-impedance PCB routing for transceiver channels, and adequate thermal management for the FCBGA substrate. Quartus II is the supported design suite; legacy projects should migrate to the latest Quartus Prime release that retains Stratix III device support.
This page consolidates distributor inventory, drop-in Stratix III alternatives, and engineering design notes that go beyond what the manufacturer datasheet alone provides for legacy device sourcing.
ドロップイン代替品: EP3SL50F780I4L — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SL50F780I4L （同一形状・フットプリント） — 相違点: Logic Elements, Package, Process Technology, Mounting Type, Family.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SL50F780I4
✅ ドロップイン✓ 在庫あり
$580 / 個
データシートを見る →EP3SL50F780I4G
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP3SE50F780I4L
✅ ドロップイン✓ 在庫あり
$1198.5 / 個
データシートを見る →EP3SE80F780I4L
✅ ドロップイン✓ 在庫あり
$2850 / 個
データシートを見る →EP3SE260H780I4L
✅ ドロップイン✓ 在庫あり
$1395 / 個
データシートを見る →EP3SL50F780I4L 最大定格＆電気的特性
| Family | Stratix III L |
| Logic Elements | 47,500 |
| Embedded Memory (bits) | 2,184,192 |
| User I/O Count | 488 |
| I/O Banks | 8 |
| パッケージ | 780-BBGA, FCBGA (29 mm) |
| Process Technology | 65 nm CMOS |
| Core Voltage | 0.9 V |
| 動作温度 | -40C to +100C (Industrial) |
| Lead-Free / RoHS | Yes (L suffix) |
| Speed Grade | I4 |
| 実装タイプ | Surface Mount (BGA) |
| Configuration Memory | SRAM-based, volatile |
| Design Suite | Quartus II / Quartus Prime (Stratix III support) |
| Device Sub-Family | Low-Power (L) |
EP3SL50F780I4L 780-bbga, fcbga (29 mm) ピン配置ガイド
EP3SL50F780I4L (780-bbga, fcbga (29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SL50F780I4L.
詳細は データシート をご参照ください。
主な用途
EP3SL50F780I4L の用途: 6 件s: High-Speed Data Acquisition Systems, Telecom Baseband and Protocol Processing, Military and Aerospace Signal Processing, Medical Imaging Equipment, ASIC Prototyping and Emulation, Industrial Automation and Machine Vision.
High-Speed Data Acquisition Systems
The EP3SL50F780I4L fits high-speed data acquisition systems because its 47,500 logic elements and 2.1 Mbit embedded memory aggregate multiple ADC data streams without external SRAM. Placed on the digitizer card between the ADC front-end and a host CPU/FPGA fabric, the device buffers bursts of LVDS samples and applies real-time DSP filtering. The 488 user I/Os accommodate wide parallel ADC buses plus downstream connectivity (PCIe, Gigabit Ethernet, DDR3). The L (low-power) variant keeps thermal load manageable in dense multi-channel chassis. Compared with smaller FPGAs in the same FCBGA class, the EP3SL50 provides roughly 2x the logic headroom for scaling to higher channel counts.
おすすめ
Telecom Baseband and Protocol Processing
In telecom baseband designs, the EP3SL50F780I4L implements LTE PHY layer functions, CPRI front-haul, and custom MAC protocols. Its 488 I/O banks support SRIO, CPRI, and standard LVDS links to RF front-ends, while 2.1 Mbit embedded RAM provides fast lookup tables for channel estimation and rate matching. Quartus II DSP IP cores run on the device to accelerate FFT/iFFT and turbo decoding. The industrial temperature grade lets the part serve outdoor small-cell and backhaul equipment. Compared with newer Cyclone or Arria families, Stratix III L remains attractive for legacy base-station platforms that already have Quartus II IP libraries qualified.
おすすめ
Military and Aerospace Signal Processing
Defense signal-processing subsystems - radar, electronic warfare, and SIGINT - rely on the EP3SL50F780I4L because it combines 47.5K logic elements, industrial temperature grade, and lead-free FCBGA packaging rated for harsh environments. The 0.9 V core on 65 nm CMOS keeps inrush current predictable for airborne power budgets. The device integrates DSP blocks that accelerate pulse compression and beamforming math. Designers pair the FPGA with ADC/DAC companion parts and use the 488 I/Os to fan out to multiple RF digitizer channels. Compared with commercial-grade Cyclone parts, the Stratix III L delivers the ruggedization and logic density required for mission-critical military electronics.
おすすめ
Medical Imaging Equipment
Medical imaging platforms - ultrasound beamformers, MRI reconstruction engines, and CT image processors - deploy the EP3SL50F780I4L because of its real-time DSP throughput and deterministic latency. The 47.5K logic elements implement parallel beamforming pipelines, while 2.1 Mbit embedded RAM holds channel-coefficient tables and intermediate scan-line buffers. The 488 I/Os accept high-speed ADC streams (LVDS) and drive display/encoder interfaces. The industrial temperature grade and lead-free FCBGA meet IEC 60601 reliability expectations for medical equipment. The L power profile is critical for portable ultrasound carts where battery life matters. Compared with microcontrollers, the FPGA delivers 100x the parallel compute density per watt for image reconstruction.
おすすめ
ASIC Prototyping and Emulation
ASIC prototyping and logic emulation platforms use the EP3SL50F780I4L as a building block - multiple FPGAs are stitched together to emulate multi-million-gate ASICs before tape-out. The 47.5K logic elements represent a known partitioning slice, and the 780-ball FCBGA exposes enough I/Os to chain neighbor FPGAs in a prototyping mesh. Quartus II supports incremental compile flows that map RTL onto multi-FPGA partitions, while embedded memory provides per-FPGA trace buffers for debug. The L variant's lower static power keeps the chassis thermal budget reasonable when dozens of FPGAs are stacked. Compared with newer Stratix 10 or Agilex parts, Stratix III L is widely available on the secondary market for cost-sensitive emulation farms.
おすすめ
Industrial Automation and Machine Vision
Factory automation lines and machine-vision inspection systems use the EP3SL50F780I4L to run multi-camera image-processing pipelines in real time. The 488 I/Os accept Camera Link, CoaXPress, or gigabit-Ethernet sensor streams; the 2.1 Mbit embedded RAM acts as line-scan and frame buffers; and 47.5K logic elements run defect-detection and classification algorithms. The industrial temperature grade tolerates the cabinet environment, and the lead-free FCBGA survives the high-vibration mounting conditions of factory floors. The L power profile simplifies the cabinet cooling design. Compared with DSP processors, the FPGA delivers deterministic sub-frame latency required by high-speed inspection lines.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SL50F780I4L — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SL50F780I4 | EP3SL50F780I4G | EP3SE50F780I4L | EP3SE80F780I4L | EP3SE260H780I4L |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA (29 mm) | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same |
| Family / Sub-Family | Stratix III L (low-power) | Stratix III L | Stratix III L | Stratix III E (performance) | Stratix III E (performance) | Stratix III E with transceivers |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 80,000 | 254,400 |
| Speed Grade | I4 (industrial) | I4 | I4 | I4 | I4 | I4 |
| Temperature Range | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Unit Price (qty 1) | USD 953.46 | Similar tier, may differ by ball finish | Similar tier | Higher (E family premium) | Higher (more logic) | Highest (transceivers + highest density) |
主な差別化要因
- Same exact ball grid as multiple Stratix III family siblings （vs EP3SE50F780I4L)
- Industrial temperature grade on a low-power architecture （vs EP3SL50F780C4N)
- Lead-free ball finish (L suffix) （vs EP3SL50F780I4)
- Mature Quartus II / Quartus Prime support （vs Newer Agilex or Stratix 10 families)
設計ノート
Plan a multi-rail power tree for the EP3SL50F780I4L: 0.9 V core, 1.1 V/1.2 V PLL analog, and per-bank VCCIO at 1.2 V to 3.3 V. Use a sequencer to enforce safe power-up/power-down order (core before I/O) to avoid latch-up. Decoupling follows the Stratix III handbook: bulk capacitors per rail plus 0.1 uF and 0.01 uF ceramics near every supply pin pair.
The 780-ball FCBGA at 29 mm has a thermal resistance in the 4 to 8 C/W range depending on PCB stack-up. For continuous operation near 100C junction, use at least 8 thermal vias in the ball grid connected to inner-plane copper and provide 25 to 50 CFM airflow across the BGA. Estimate: at 3 W dissipation and theta_JA = 6 C/W, the junction rises 18C above ambient - well within industrial limits.
Use a minimum 8-layer PCB stack-up with dedicated ground and power planes. FCBGA escape routing on the top layer requires 4-mil trace/space with microvias on the breakout layers; reference the Stratix III handbook pin connection guidelines for unused and JTAG pin termination. Series resistors on high-speed LVDS pairs reduce reflections.
Assign clock pins to dedicated clock input pads near the center of the package to minimize skew. Place DDR/DDR2/DDR3 memory interfaces on banks adjacent to the FPGA core region to reduce routing length. Match differential-pair lengths within 20 mil and keep impedance at 100 ohm differential for LVDS.
Common pitfalls: (1) Skipping MSL handling for the FCBGA - the device absorbs moisture and can crack during reflow if baked improperly; (2) Driving JTAG TCK faster than 33 MHz before configuration is complete; (3) Forgetting to strap MSEL pins for the correct configuration mode; (4) Using non-Intel-supported Quartus versions that drop Stratix III device files - always use a Quartus build with Stratix III support.
コンプライアンス情報
Lead-free RoHS compliant per L suffix. Not AEC-Q100 qualified - this is an FPGA, not an automotive analog IC. Halogen-free status not confirmed in source data. Conflict-minerals disclosure per Intel standard supply-chain policy.