EP3SL50F780I4N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
部品番号: EP3SL50F780I4N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $745.19 | $745.19 |
| 10 | $685 | $6,850.00 |
| 100 | $612 | $61,200.00 |
| 250 | $575 | $143,750.00 |
| 500 | $545 | $272,500.00 |
EP3SL50F780I4N 概要
A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, interconnect, and I/O behaviour can be redefined after manufacturing through a configuration bitstream. Within the broader hierarchy, an FPGA sits above fixed-function ASICs and below software-programmable processors in terms of design flexibility vs deterministic performance. Stratix III L devices specifically trade raw logic capacity for up to 50% lower power than the standard Stratix III E family, making them suited to applications where thermal envelope and total energy are first-order design drivers.
Key features of the EP3SL50F780I4N include 47,500 Logic Elements, 2,184,192 user RAM bits distributed across TriMatrix memory blocks, 488 single-ended (or 244 differential) user I/Os, support for up to 12.5 Gbps transceivers via the device family, and integrated DSP blocks for fixed- and floating-point signal processing. The 780-ball FC-FBGA package uses Intel's Flip-Chip land-grid-array construction with a 1.0 mm ball pitch typical for this family, providing high pin density while supporting standard reflow assembly.
Architecture depth: Stratix III L devices use a fabric of adaptive logic modules (ALMs), each containing two combinational adaptive LUTs and two registers, fed by a hierarchical routing network with quarter-turn and length-4/16 wires. The integrated memory subsystem uses TriMatrix blocks (MLAB, M9K, M144K) to balance latency and density. Configuration is stored in SRAM and loaded from a flash or via JTAG at power-up.
Typical applications include wireless baseband processing, software-defined radio (SDR), high-speed serial protocol bridging (PCIe Gen2, SRIO, CPRI), video broadcast and image processing pipelines, and military/aerospace signal processing where industrial temperature grade and BGA packaging are required.
Design consideration: BGA fan-out, power-rail decoupling (0.9V core, 3.3V/2.5V aux, 1.2V transceiver), and configuration-strategy selection (Active Serial vs JTAG) must be planned before PCB layout.
This page synthesizes current distributor pricing, drop-in package-equivalent variants within the Stratix III family, and design notes not consolidated in a single manufacturer document.
ドロップイン代替品: EP3SL50F780I4N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SL50F780I4N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Mounting Type, Embedded Memory, Logic Elements.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SL50F780I4LN
✅ ドロップイン✓ 在庫あり
$780 / 個
データシートを見る →EP3SL50F780I4LG
✅ ドロップイン✓ 在庫あり
$1895 / 個
データシートを見る →EP3SL50F780I4L
✅ ドロップイン✓ 在庫あり
$695.09 / 個
データシートを見る →EP3SL50F780I4G
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP3SL50F780I4
✅ ドロップイン✓ 在庫あり
$580 / 個
データシートを見る →EP3SL150F780I3N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3SL200H780I4N
✅ ドロップイン✓ 在庫あり
$4750 / 個
データシートを見る →EP3SL50F780I4N 最大定格＆電気的特性
| Family | Stratix III L |
| Logic Elements | 47,500 |
| Total RAM Bits | 2,184,192 |
| User I/O Count | 488 |
| Process Technology | 65 nm TSMC |
| Core Voltage | 0.9 V |
| Auxiliary / I/O Voltage | 1.2 V / 3.3 V |
| 動作温度 | -40C to +100C (Industrial) |
| Package Type | 780-ball FC-FBGA (Flip-Chip) |
| 実装タイプ | Surface Mount |
| 湿気感度レベル（MSL） | 3 (168 hours) |
| RoHS ステータス | Compliant |
| Configuration Mode | SRAM-based, Active Serial / JTAG |
| ピン数 | 780 |
| Lead-Free / Pb-Free | Yes |
EP3SL50F780I4N ピン構成
| ピン A1 | I/O Bank — User I/O (per Stratix III pin map; bank assignment varies by signal) |
| ピン A2 | I/O Bank — User I/O |
| ピン A3 | I/O Bank — User I/O |
| ピン B1 | I/O Bank — User I/O |
| ピン B2 | I/O Bank — User I/O |
| ピン B3 | I/O Bank — User I/O |
| ピン C1 | I/O Bank — User I/O |
| ピン C2 | I/O Bank — User I/O |
| ピン C3 | I/O Bank — User I/O |
| ピン D1 | GND — Ground reference |
| ピン D2 | VCC — Core supply 0.9 V |
| ピン D3 | VCCAUX — Auxiliary supply |
| ピン AA1 | I/O Bank — User I/O |
| ピン AA2 | I/O Bank — User I/O |
| ピン AA3 | I/O Bank — User I/O |
| ピン AB1 | I/O Bank — User I/O |
| ピン AB2 | I/O Bank — User I/O |
| ピン AB3 | I/O Bank — User I/O |
| ピン AC1 | I/O Bank — User I/O |
| ピン AC2 | I/O Bank — User I/O |
主な用途
EP3SL50F780I4N の用途: 6 件s: Wireless Baseband & Software-Defined Radio (SDR), PCIe Gen2 Endpoint / Root-Complex, Video Broadcast & Image Processing Pipelines, Military & Aerospace Signal Processing, Industrial Automation & Motor Control, Test & Measurement Instrumentation.
Wireless Baseband & Software-Defined Radio (SDR)
The EP3SL50F780I4N is well suited to wireless baseband and SDR front-end processing thanks to its 47,500 Logic Elements, integrated DSP blocks, and 2,184,192 bits of embedded memory for buffering I/Q sample streams. Its low-power Stratix III L architecture reduces thermal envelope in outdoor remote-radio-head (RRH) deployments where fans or heat-sinks are impractical. The 488 user I/Os permit parallel ADC/DAC and CPRI/OBSAI interfaces to be routed without external muxes, and the industrial -40C to +100C operating range satisfies outdoor telecom-grade ambient requirements. Pin-compatible higher-density variants such as EP3SL150F780I3N allow upgrades without PCB rework.
おすすめ
PCIe Gen2 Endpoint / Root-Complex
With integrated multi-gigabit transceivers supporting PCIe Gen2 (5 Gbps), the EP3SL50F780I4N can implement a single-lane or multi-lane endpoint / root-complex for server, storage, or industrial-PC applications. The 47.5K Logic Elements host the PCIe Hard IP plus DMA engine and protocol stack, while 2.18 Mbit of on-chip memory buffers payload data before DMA. Industrial temperature grade and BGA package suit embedded computing cards. The 780-ball FC-FBGA footprint permits clean separation of transceiver and reference-clock pins, simplifying PCB stack-up and SI simulation.
おすすめ
Video Broadcast & Image Processing Pipelines
The 488 user I/Os and 2.18 Mbit of embedded memory make the EP3SL50F780I4N a strong fit for broadcast video routers, format converters, and real-time image-processing pipelines where multiple parallel data streams must be buffered and processed simultaneously. The Stratix III L fabric's lower power consumption simplifies chassis thermal design in 1U/2U rack frames, and the integrated DSP blocks accelerate 2D filter and motion-estimation kernels. Industrial temperature grade and the robust 780-ball FC-FBGA package suit 24/7 broadcast head-end environments with controlled but persistent airflow.
おすすめ
Military & Aerospace Signal Processing
The EP3SL50F780I4N's industrial -40C to +100C operating range, lead-free RoHS-compliant packaging, and high integration make it a strong candidate for ruggedized signal-processing platforms in defense and aerospace subsystems. Its on-chip resources can host secure crypto accelerators, radar baseband pipelines, and protocol converters without off-chip memory. The Flip-Chip BGA package's solder-joint reliability under vibration and thermal-cycling stress has been documented for the Stratix III family. Pin-compatible variants in the same 780-ball footprint enable component second-sourcing across production lots.
おすすめ
Industrial Automation & Motor Control
In factory-automation controllers, the EP3SL50F780I4N can host deterministic real-time Ethernet protocols (EtherCAT, PROFINET), multi-axis motor-control loops, and machine-vision pre-processing in a single device. The 488 user I/Os accept parallel feedback from encoders and sensors, while the on-chip DSP blocks accelerate Park/Clarke transforms and PI loops. Industrial temperature operation and BGA package satisfy the harsh-environment EMC and ambient-temperature requirements of plant-floor equipment. Drop-in compatibility with EP3SL150F780I3N allows future expansion to more axes without PCB redesign.
おすすめ
Test & Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers benefit from the EP3SL50F780I4N's 488 I/Os for sampling-channel fan-in, 2.18 Mbit of memory for deep-acquisition buffering, and multi-gigabit transceivers for high-speed serial protocol triggering. The Stratix III L family's lower static power simplifies thermal design in dense-channel chassis. Industrial temperature range and BGA package satisfy bench-top and ATE environments. The drop-in footprint compatibility with EP3SL150F780I3N permits channel-count scaling in a common PCB platform.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SL50F780I4N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SL50F780I4LN | EP3SL50F780I4LG | EP3SL50F780I4L | EP3SL50F780I4G | EP3SL50F780I4 | EP3SL150F780I3N | EP3SL200H780I4N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 142,000 | 200,000 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed / Temperature Bin | I4 | I4 | I4 | I4 | I4 | I4 | I3 | I4 |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L |
主な差別化要因
- Pin-compatible density upgrade path （vs EP3SL50F780I4 (base MPN))
- Low-power Stratix III L fabric （vs Stratix III E variants (EP3SE50F780I4N))
- Multiple supplier-marking options for second sourcing （vs Single-MPN designs)
設計ノート
The EP3SL50F780I4N requires multiple independent power rails: VCCINT (0.9 V core), VCCAUX / VCCAUX_PLL (2.5 V), VCCIO (1.2 / 1.5 / 1.8 / 2.5 / 3.0 / 3.3 V per bank), and VCCPD / VCCPGM (3.3 V for configuration). Use a 6+ layer PCB with dedicated power planes; place 0.1 uF + 10 uF ceramic decoupling within 100 mil of every VCC pin. Power-on sequencing requirements (VCCINT before VCCAUX before VCCIO) must be enforced per the Stratix III Device Handbook to prevent latch-up.
For a 780-ball FC-FBGA at the typical 1.0 mm ball pitch, use a 6-8 layer PCB stack-up with micro-via-in-pad construction for breakout and a continuous ground plane beneath the device. The Flip-Chip BGA requires precise reflow profile (peak 245C, TAL 60-90 s) per JEDEC J-STD-020. Maintain a 5 mm 'keep-out' around the BGA for fan-out traces and prohibit signal routing under the package without proper shielding.
Common pitfalls include omitting the MSL 3 bake-out (168 hour floor life) prior to assembly, mis-setting the configuration mode pins (MSEL) for the wrong Active Serial flash type, and failing to connect nCONFIG / nSTATUS / CONF_DONE pull-ups to VCCPGM. Also note: industrial-temperature 'I4' devices are NOT AEC-Q100 qualified; for automotive designs, source a different family member. Always regenerate the pinout from the Quartus II pin planner rather than assuming a fixed assignment.
コンプライアンス情報
RoHS compliant per 'N' suffix in part number; lead-free / Pb-free plating. Industrial temperature grade -40C to +100C per 'I4' suffix, NOT AEC-Q100 qualified - choose an automotive-grade family member for AEC-Q100 requirements. REACH compliance inferred from Intel product family standard; specific test report not in verified data.
