EP4CE10F17C8L - 10,320-Cell 60 nm Cyclone IV E FPGA | Altera
部品番号: EP4CE10F17C8L ✓ 生産中EP4CE10F17C8L 概要
A field-programmable gate array, or FPGA, is a programmable digital logic device that belongs to the semiconductor and programmable-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured for control, communications, signal processing, prototyping, and embedded-system functions. The Cyclone IV E family targets designs requiring moderate logic density, low-power operation, and a broad range of I/O capabilities.
The EP4CE10F17C8L uses 60 nm fabrication technology and provides 10,320 logic cells organized into 645 configurable logic blocks. Its stated maximum frequency is 362 MHz, while its supply voltage is 1.2 V. The F17 designation identifies this device variant within the EP4CE10 family, and the complete ordering code also identifies the C8 speed and temperature grade and L package option.
The device is supplied in a 256-ball fine-pitch BGA package measuring 17 mm by 17 mm with 1 mm pitch. Listings also identify the Cyclone IV E package family as FBGA-256, LBGA-256, PBGA-256, or TFBGA-256 depending on the ordering variant. Such packages provide many signal connections in a compact area, but they require careful PCB escape routing, via-in-pad or fanout strategies, and assembly-process control to avoid solder-ball bridging and thermal stress.
Typical applications include industrial control, instrumentation, communications interfaces, embedded processing, sensor acquisition, and FPGA-based prototyping. The 10,320-cell device is appropriate when a design needs deterministic programmable logic and sufficient parallel I/O without moving to a larger FPGA. Quartus Prime software supports device configuration and design implementation for this Cyclone IV E device.
For a new PCB, use the official pinout and recommended land pattern for the exact package variant rather than assigning BGA balls from a generic pinout. Account for all power, ground, configuration, clock, and I/O balls when planning the board stack-up. A functional upgrade must also be checked for I/O-standard compatibility, supported clock resources, configuration-pin requirements, memory interfaces, and system-level timing closure.
This page combines device specifications, verified source links, application guidance, package considerations, and practical replacement-selection criteria. It is intended to help engineers establish whether the EP4CE10F17C8L fits the required logic capacity, package, speed grade, toolchain, and board constraints before committing to a production design.
ドロップイン代替品: EP4CE10F17C8L — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4CE10F17C8L （同一形状・フットプリント） — 相違点: Mounting Type, Process Technology, Device Type, Package Type.
EP4CE10F17C8N
✅ ドロップイン価格はお問い合わせください
データシートを見る →EP4CE10F17C8LN
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP4CE10F17C9L
✅ ドロップイン価格はお問い合わせください
データシートを見る →EP4CE10F17I7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP4CE10F17C8N
✅ ドロップイン価格はお問い合わせください
データシートを見る →EP4CE10F17C8L 最大定格＆電気的特性
| Device Type | Cyclone IV E field-programmable gate array (FPGA) |
| Logic Cells | 10,320 cells |
| Configurable Logic Blocks | 645 CLBs |
| Reported Logic Blocks or Cells | 47 logic blocks |
| Maximum Frequency | 362 MHz |
| 電源電圧 | 1.2 V |
| Process Technology | 60 nm |
| FPGA Family | Cyclone IV E |
| Number of Pins or Balls | 256 balls |
| Package Type | FBGA-256 |
| Package Family | 256-pin TFBGA / LBGA / PBGA family |
| Package Dimensions | 17 mm x 17 mm |
| Ball Pitch | 1.0 mm |
| 実装タイプ | Surface mount |
EP4CE10F17C8L 17 mm x 17 mm ピン配置ガイド
EP4CE10F17C8L (17 mm x 17 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP4CE10F17C8L.
詳細は データシート をご参照ください。
主な用途
EP4CE10F17C8L の用途: 6 件s: Industrial Control Systems, Data Acquisition and Instrumentation, Communications and Protocol Bridging, Embedded Sensor and IoT Edge Processing, Video and Image Processing, FPGA-Based Rapid Prototyping.
Industrial Control Systems
The EP4CE10F17C8L fits compact industrial controllers that coordinate sensors, actuators, interlocks, and machine-state logic. Its 10,320 logic cells and 645 configurable logic blocks provide substantial parallel processing capacity, while the listed 362 MHz maximum frequency supports faster control and communication paths than a low-end microcontroller can implement purely in hardware. The 256-ball package also offers many external connections for digital I/O and field-bus interfaces. Before committing to the device, confirm the exact operating-temperature grade in the ordering table and implement the PCB using the official 17 mm by 17 mm, 1.0 mm-pitch land pattern. Quartus Prime timing and resource reports should be reviewed against the final control architecture.
おすすめ
Data Acquisition and Instrumentation
The EP4CE10F17C8L is suitable for parallel acquisition, timing, and signal-conditioning systems that need deterministic programmable logic. Its 645 CLBs can implement counters, state machines, trigger logic, digital filters, and interface protocols, while the listed 362 MHz device-class frequency supports demanding timing paths. The 256-ball package provides substantial I/O connectivity for multi-channel converters, sensors, and test equipment. Because pin-level electrical limits depend on the selected I/O standard, designers should assign pins through Quartus Prime and consult the exact device documentation. Power distribution and ground partitioning should be planned alongside the signal-routing requirements, especially when converters and digital control logic share the same board.
おすすめ
Communications and Protocol Bridging
The EP4CE10F17C8L can implement concurrent protocol conversion, packet filtering, framing, and interface isolation in communications equipment. Ten thousand logic cells provide room for parallel datapaths and state machines, and the 362 MHz listed maximum frequency allows implementations to target clock rates above what a sequential microcontroller-based bridge may achieve. The 256-ball package supports numerous transceiver connections and user I/O. Signal-integrity work should include controlled impedance routing, assigned I/O standards, and verified termination networks. Use Quartus Prime timing analysis for every crossing between external transceiver signals and the FPGA core, and confirm configuration-pin behavior so the device starts predictably after power restoration.
おすすめ
Embedded Sensor and IoT Edge Processing
The EP4CE10F17C8L is appropriate for IoT edge devices that must combine sensor conditioning, event detection, local filtering, and protocol generation without relying entirely on a processor. The 10,320-cell Cyclone IV E device can execute parallel acquisition and decision logic, while its 645 CLBs support multi-stage pipelines and control state machines. The 256-ball package allows direct connections to sensors, memories, and communications transceivers, although fine-pitch assembly adds cost and complexity for compact products. Designers should minimize state transitions when battery life matters, partition the FPGA core and I/O supplies according to the device architecture, and verify the temperature grade against the enclosure environment. The same development flow can support a prototype before the design is consolidated into a more integrated solution.
おすすめ
Video and Image Processing
The EP4CE10F17C8L can be used for modest parallel image-processing pipelines that require programmable logic, such as pixel formatting, thresholding, line detection, or test-pattern generation. Its 645 configurable logic blocks and listed 362 MHz maximum frequency allow multiple datapaths to operate in parallel, and the 256-ball package exposes the substantial I/O count needed for parallel sensor or display interfaces. The device is better suited to deterministic parallel functions than to general-purpose high-resolution video encoding. Video timing constraints should be entered as explicit clock-domain requirements, and output timing must be checked against the selected display or camera interface. Careful ball-escape routing and return-path continuity are particularly important when high-speed parallel data crosses the package boundary.
おすすめ
FPGA-Based Rapid Prototyping
The EP4CE10F17C8L is well suited to FPGA-based rapid prototyping because Quartus Prime provides an established design, compilation, simulation, and programming flow for the Cyclone IV E family. Engineers can use its 10,320 logic cells to develop parallel algorithms, custom interfaces, or protocol logic before committing to an ASIC or application-specific FPGA. The listed 362 MHz maximum frequency supports meaningful performance exploration, but real timing margins depend on logic depth and placement. A development board should be considered when its package, clock resources, memory interfaces, and I/O standards align with the intended design. The 256-ball production package also provides a path from prototype logic to a compact embedded implementation, subject to independent BGA assembly and thermal qualification.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4CE10F17C8L — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4CE10F17C8N | EP4CE10F17C8LN | EP4CE10F17C9L | EP4CE10F17I7N | EP4CE10F17C8 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| FPGA Family | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E |
| Logic Cells | 10,320 cells | 10,320 cells | 10,320 cells | 10,320 cells | 10,320 cells | 10,320 cells |
| Configurable Logic Blocks | 645 CLBs | 645 CLBs | 645 CLBs | 645 CLBs | 645 CLBs | 645 CLBs |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 60 nm | 60 nm | 60 nm | 60 nm | 60 nm | 60 nm |
| Package Dimensions | 17 mm x 17 mm | 17 mm x 17 mm | 17 mm x 17 mm | 17 mm x 17 mm | 17 mm x 17 mm | 17 mm x 17 mm |
| Ball Pitch | 1.0 mm | 1.0 mm | 1.0 mm | 1.0 mm | 1.0 mm | 1.0 mm |
| Number of Pins or Balls | 256 balls | 256 balls | 256 balls | 256 balls | 256 balls | 256 balls |
| Development Software | Quartus Prime | Quartus Prime | Quartus Prime | Quartus Prime | Quartus Prime | Quartus Prime |
主な差別化要因
- Same 10,320-cell logic capacity and 645-CLB architecture across the identified EP4CE10F17 ordering variants （vs EP4CE10F17C8N)
- Direct same-family migration path with the listed 362 MHz device-class frequency retained （vs EP4CE10F17C8LN)
- Production pin compatibility without changing the 256-ball package geometry （vs EP4CE10F17C9L)
- Common Cyclone IV E software and design flow （vs EP3C25F324C7)
設計ノート
Design the PCB from the official 256-ball land pattern rather than from a generic BGA footprint. The package is listed as 17 mm by 17 mm with 1.0 mm pitch, so power, ground, configuration, clock, and user-I/O balls must all be considered during escape routing. Use the manufacturer pin-description table to assign every ball, and preserve continuous return paths beneath high-speed routes. Validate the stack-up, solder-mask and paste geometry, via strategy, assembly profile, and X-ray inspection requirements with the chosen board manufacturer before release.
Plan a dedicated 1.2 V supply rail for the FPGA and follow the exact core and I/O power requirements in the manufacturer device documentation. Decoupling must be placed directly at the relevant package balls using the values and layout specified by Altera; larger bulk capacitance should supplement rather than replace local high-frequency decoupling. Separate noisy external circuitry from the FPGA power path, keep ground-plane returns continuous, and verify startup current, voltage tolerance, sequencing, and heat rise across the intended operating range.
Assign user I/O standards only in Quartus Prime and observe each bank’s permitted voltage, drive strength, and termination rules. The listed 362 MHz maximum frequency is a device-class figure, not a guarantee for every path. Create explicit clock-domain and interface constraints, analyze external timing with the board-level delay budget, and verify setup and hold margins after placement and routing. High-speed signals crossing package escape regions should use matched reference planes and an assembly process capable of maintaining the 1.0 mm-pitch FBGA connections.
Do not treat a shared EP4CE10F17 device family as proof that every ordering suffix is interchangeable. Before substituting EP4CE10F17C8N, EP4CE10F17C8LN, EP4CE10F17C9L, or EP4CE10F17I7N, compare the complete ordering table for speed grade, temperature grade, package, qualification, and lifecycle status. Then confirm the configuration file, device identifiers, pinout, I/O limits, and Quartus Prime compilation results. This prevents a suffix mismatch from becoming an unplanned board respin or field-temperature risk.
コンプライアンス情報
The available device and distributor listings do not provide explicit compliance conclusions in their visible text. Confirm RoHS, REACH, lead-free, halogen-free, conflict-minerals, and automotive qualification status against the exact Altera ordering-part-number documentation and current manufacturer declarations.
