EP4CE75F23C8LN - 75K LE Cyclone IV E FPGA, 484-FBGA | Intel
部品番号: EP4CE75F23C8LN ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $168 | $168.00 |
| 10 | $152 | $1,520.00 |
| 100 | $138 | $13,800.00 |
| 500 | $122 | $61,000.00 |
| 1,000 | $108.5 | $108,500.00 |
EP4CE75F23C8LN 概要
A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LABs), embedded memory, DSP blocks, and programmable I/O on a single semiconductor die. FPGAs belong to the broader programmable logic family, sitting alongside CPLDs and structured ASICs in the hierarchy of reconfigurable digital ICs. The Cyclone IV E family specifically targets low-cost, low-power, high-volume applications where discrete ASICs are uneconomical.
Key features of the EP4CE75F23C8LN include 4 PLLs for clock management, 20 global clock networks, and a hard memory controller block that simplifies external DDR/DDR2 SDRAM interfacing. The 60 nm process technology delivers a static power profile suited to fanless industrial enclosures, and the 8-input adaptive logic module (ALM) structure yields approximately 1.7x the logic capacity of the previous Cyclone III generation at the same die area.
The Cyclone IV E architecture pairs each logic array block with ten ALMs, each containing an 8-input fracturable look-up table, two dedicated adders, and a register file. The embedded multiplier blocks can be configured as 9x9, 18x18, or 27x27 for DSP-style FIR filters and FFT pipelines. Configuration flash is loaded through JTAG, AS, PS, or FPP modes, with built-in AES-128 encryption supported on the EP4CE family.
Typical applications include industrial machine vision controllers, low-cost video processing bridges, motor-control PWM generators, and FPGA-based PCIe endpoint prototyping. The combination of high logic density, generous DSP resources, and a low-power 60 nm process also makes the part attractive for portable test and measurement instruments and telecommunications line cards.
When designing with this device, plan power sequencing so the 1.2 V VCCINT rail rises before or simultaneously with the 2.5 V/3.3 V VCCIO rails to avoid latch-up. Quartus II / Quartus Prime Web Edition supports the entire EP4CE family free of charge for synthesis, place-and-route, and timing closure on Windows and Linux hosts.
This page synthesizes distributor pricing, drop-in speed-grade and density alternatives within the Cyclone IV E family, and practical design notes that go beyond what the manufacturer datasheet alone provides.
ドロップイン代替品: EP4CE75F23C8LN — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4CE75F23C8LN （同一形状・フットプリント） — 相違点: Package, Speed Grade, Embedded 18x18 Multipliers, Process Technology, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EP4CE75F23C8L
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP4CE75F23C8
✅ ドロップイン✓ 在庫あり
$159.4 / 個
データシートを見る →EP4CE75F23C7N
✅ ドロップイン✓ 在庫あり
$136.85 / 個
データシートを見る →EP4CE75F23C6N
✅ ドロップイン✓ 在庫あり
$189.5 / 個
データシートを見る →EP4CE115F29C8N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$38.9 / 個
データシートを見る →EP4CE55F23C8N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$74 / 個
データシートを見る →EP4CE75F23C8LN 最大定格＆電気的特性
| Family | Cyclone IV E |
| Logic Elements | 75,408 |
| Logic Array Blocks (LABs) | 4,713 |
| Total RAM Bits | 2,810,880 |
| Embedded 18x18 Multipliers | 274 |
| User I/O Count (max) | 292 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Speed Grade | 8 (C8, ~8 ns) |
| Process Technology | 60 nm low-power |
| パッケージ | 484-ball FBGA (F23) |
| 動作接合温度 | 0 C to +85 C (commercial) |
| Configuration Modes | JTAG, AS, PS, FPP |
EP4CE75F23C8LN 484-ball fbga (f23) ピン配置ガイド
EP4CE75F23C8LN (484-ball fbga (f23) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP4CE75F23C8LN.
詳細は データシート をご参照ください。
主な用途
EP4CE75F23C8LN の用途: 6 件s: Industrial Machine Vision Controller, Low-Cost Video Processing Bridge, Motor Control PWM Generator, FPGA-Based PCIe Endpoint Prototyping, Portable Test and Measurement Instrument, Telecommunications Line Card.
Industrial Machine Vision Controller
The EP4CE75F23C8LN drives real-time machine vision pipelines in factory automation, where 75,408 logic elements, 274 embedded 18x18 multipliers, and 2,810,880 RAM bits deliver sufficient throughput for Bayer demosaicing, edge detection, and feature extraction at 60 fps on a 2 MP sensor stream. Four PLLs generate independent pixel clock, line-rate, and Ethernet PHY clocks, while 292 user I/O pins interface CMOS sensors, external SDRAM, and isolated GPIO. The 1.2 V VCCINT core and 60 nm low-power process keep junction temperature within commercial 0-85 C limits inside a fanless IP65 enclosure, simplifying mechanical integration. For motion-control overlays, designers add a Nios II/f soft-core to coordinate camera exposure, conveyor encoder feedback, and reject-solenoid actuation.
おすすめ
Low-Cost Video Processing Bridge
The EP4CE75F23C8LN acts as a video format bridge between MIPI CSI-2, BT.656, HDMI, and LVDS sources, leveraging 4,713 LABs to instantiate color-space converters, scalers, and deinterlacers. The 274 dedicated 18x18 multipliers accelerate FIR-style chroma upsampling and sharpness filters without consuming general fabric, while the 2,810,880 RAM bits hold three frame buffers for double-buffered output. Configuration via JTAG during board bring-up and final flash load via AS mode is supported by the device's built-in configuration controller, allowing field updates through a serial flash. The 484-FBGA F23 footprint provides 292 user I/O for direct connection to multiple parallel video buses and sideband control channels.
おすすめ
Motor Control PWM Generator
The EP4CE75F23C8LN implements multi-axis field-oriented control (FOC) PWM generators in industrial drives, where its 4 PLLs synthesize up to 16 high-resolution PWM channels from a single 50 MHz reference clock. The 274 embedded 18x18 multipliers accelerate Park/Clarke transforms and SVPWM modulators in real time, while 2,810,880 RAM bits store per-axis PI controller state, encoder calibration tables, and fault-log history. Designers instantiate a Nios II/e soft-core for CANopen/EtherCAT slave communication over the 292 available user I/O pins. The 1.2 V core and 3.3 V I/O voltage mix supports direct interface to 3.3 V gate drivers and 5 V-tolerant encoder inputs through on-chip PCI-clamp diodes.
おすすめ
FPGA-Based PCIe Endpoint Prototyping
The EP4CE75F23C8LN supports PCIe Gen1 x1 soft IP cores via the Cyclone IV hard transceivers in adjacent device variants, and on this 484-FBGA part provides sufficient logic for endpoint prototyping, enumeration, and DMA engines. The 274 18x18 multipliers accelerate scatter-gather DMA address arithmetic, while 2,810,880 RAM bits buffer inbound TLP payloads before DMA completion. Engineers use 4 PLLs to generate 100 MHz PCIe reference, user-application clock, and DDR2 memory controller clock domains. The 292 user I/O connect to external DDR2-400 SDRAM, Flash, and downstream serial peripherals, with Quartus II / Quartus Prime Web Edition providing free synthesis for cost-sensitive prototyping.
おすすめ
Portable Test and Measurement Instrument
The EP4CE75F23C8LN powers handheld oscilloscopes, logic analyzers, and protocol testers, where its 75,408 logic elements implement deep acquisition memory controllers, trigger logic, and TFT-LCD rasterizers. The 60 nm low-power process keeps active power below 1.5 W even at full logic utilization, allowing battery operation on 18650 Li-ion cells for field service technicians. The 4 PLLs synthesize ADC sample clocks, USB 2.0 reference, and LCD pixel clock from a common 48 MHz crystal, while the 2,810,880 RAM bits store sample buffers. Designers add a Nios II/f soft-core running uClinux for touchscreen UI and USB mass-storage export.
おすすめ
Telecommunications Line Card
The EP4CE75F23C8LN serves as a low-cost forwarding engine for small-form-factor telecommunications line cards, where its 75K logic elements support MAC tables, VLAN processing, and QoS schedulers for 1G Ethernet access. The 274 18x18 multipliers accelerate packet-header checksum offload, and 2,810,880 RAM bits store 32K-entry CAM-shadow for line-rate lookups. The 4 PLLs generate separate domains for SERDES reference, switch fabric clock, and management Ethernet. Designers implement a Nios II/s soft-core for SNMP/HTTP management, exposing 292 user I/O for SFP cage GPIO, fan control, and board-ID EEPROM. The commercial 0-85 C temperature range suits environmentally controlled central-office deployments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4CE75F23C8LN — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4CE75F23C8L | EP4CE75F23C8 | EP4CE75F23C7N | EP4CE75F23C6N | EP4CE55F23C8N |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 | 55,560 (-26%) |
| Speed Grade | 8 (C8) | 8 (C8) | 8 (C8) | 7 (C7) - faster | 6 (C6) - fastest | 8 (C8) |
| Total RAM Bits | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,340,000 (-17%) |
| Embedded 18x18 Multipliers | 274 | 274 | 274 | 274 | 274 | 154 (-44%) |
| User I/O (max) | 292 | 292 | 292 | 292 | 292 | 374 |
主な差別化要因
- Highest-density F23 484-FBGA variant in the Cyclone IV E family （vs EP4CE55F23C8N)
- Slower but more cost-effective than the -C7 speed grade （vs EP4CE75F23C7N)
- Same density as -C7 and -C6 but more available at distributors （vs EP4CE75F23C6N)
設計ノート
Estimated: at typical 50% logic utilization and 100 MHz toggle rate, the EP4CE75F23C8LN draws approximately 0.6-0.9 W from the 1.2 V VCCINT rail. Sequence VCCINT before or simultaneously with VCCIO to avoid I/O latch-up. Use a dedicated LDO (e.g. TI TPS7A4701) with 100 mV or less dropout for VCCINT, and a separate 2.5 V/3.3 V rail for VCCIO. Decouple each VCCINT and VCCIO ball pair with a 0.1 uF X7R plus a 10 uF bulk capacitor placed within 5 mm of the BGA.
The 484-FBGA F23 uses 1.0 mm ball pitch with a 23 x 23 mm body. Use a 4-layer PCB minimum with continuous GND planes on layers 2 and 4 for return-path integrity. Escape all signal balls on the top layer through microvias (0.1 mm drill) to inner stripline layers. Maintain at least 4 via-in-pad for the 64 power/ground balls to keep the thermal pad junction temperature within the 0-85 C commercial range.
Estimated: theta-JA for the 484-FBGA F23 is approximately 12 C/W on a 4-layer JEDEC test board; at 1.0 W total power the junction temperature rises ~12 C above ambient. Keep maximum junction below 85 C (commercial grade) with a thermal pad soldered to a continuous inner copper plane, plus thermal vias. Forced airflow at 1 m/s reduces junction rise to ~7 C. Verify with Quartus PowerPlay early in the design flow.
Do not confuse F23 (484-ball FBGA) with F29 (780-ball FBGA) or F484 (484-ball FBGA with different pinout) - verify the pin map against the Cyclone IV pin connection guidelines PDF for the F23 device. The MSL3 moisture sensitivity requires baking at 125 C for 24 hours before assembly if the sealed bag is opened longer than the floor-life. Also note that the EP4CE75F23C8N is Pb-free (RoHS), while the EP4CE75F23C8L is leaded - confirm which your contract manufacturer accepts before ordering.
コンプライアンス情報
The trailing 'N' in EP4CE75F23C8LN indicates Pb-free / RoHS-compliant lead finish per Altera (now Intel) ordering code conventions. Not AEC-Q100 qualified; for automotive, refer to the Cyclone IV E automotive-grade variants. Halogen-free status not explicitly listed in the verified data - mark as unknown.