EP4CE55F23C8N - Cyclone IV E 55K LE FPGA, 484-FBGA | Intel
部品番号: EP4CE55F23C8N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $89.5 | $895.00 |
| 100 | $84.25 | $8,425.00 |
| 500 | $79.1 | $39,550.00 |
| 1,000 | $74 | $74,000.00 |
EP4CE55F23C8N 概要
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, multipliers, and programmable I/O cells interconnected by a programmable routing fabric. FPGAs belong to the broader class of programmable logic devices (PLDs) and occupy the high-performance tier above CPLDs, enabling hardware-level parallelism for digital signal processing, custom interfaces, and glue-logic consolidation. Cyclone IV E is a low-power, cost-optimized family within Intel's Cyclone IV portfolio, positioned for high-volume, cost-sensitive applications.
Key differentiating features include the dedicated 18x18 multipliers supporting DSP applications at up to 200 MHz, embedded memory blocks (M9K) totaling 2,340 Kbits for FIFO and buffer designs, up to four general-purpose PLLs per device for clock synthesis, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 324 user I/O pins support LVDS, SSTL, and LVCMOS I/O standards for direct interface to modern memory and high-speed peripherals.
The Cyclone IV E architecture combines the 60 nm process with a low-leakage SRAM cell to deliver low static and dynamic power consumption, typically 30 percent lower than the prior Cyclone III generation. This makes the EP4CE55F23C8N well suited for thermally constrained or fanless industrial enclosures where the 31x31 mm FBGA package offers efficient board area utilization with full signal-integrity performance.
Typical applications span industrial motor control and factory automation (PLL-driven encoder feedback), video processing and image-pipeline preprocessing, communication protocol bridging (PCI Express endpoint, Ethernet MAC, UART/SPI bridges), test and measurement instrumentation (custom trigger logic, high-speed data acquisition), and display controllers for industrial HMI panels. The 55K LE capacity also supports DSP co-processing for audio codecs and software-defined radio front-ends.
When designing with this device, plan FPGA I/O bank voltage assignment carefully; the EP4CE55F23C8N supports up to eight I/O banks each requiring independent VCCIO rails. For DDR2 interfaces, observe the 1.8 V VCCIO constraint and place decoupling capacitors per the Cyclone IV Device Handbook recommendations. Quartus Prime design software is the primary development toolchain.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a one-stop reference for the EP4CE55F23C8N in 484-FBGA.
ドロップイン代替品: EP4CE55F23C8N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4CE55F23C8N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, Embedded Memory, Logic Elements.
クイック比較ツール — 並列比較する代替部品を選択:
EP4CE55F23C8LN
✅ ドロップイン✓ 在庫あり
$105 / 個
データシートを見る →EP4CE55F23C8L
✅ ドロップイン✓ 在庫あり
$112.9 / 個
データシートを見る →EP4CE55F23C8
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →EP4CE55F23C7N
✅ ドロップイン✓ 在庫あり
$56.4 / 個
データシートを見る →EP4CE55F23C6N
✅ ドロップイン✓ 在庫あり
$54.92 / 個
データシートを見る →EP4CE55F23A7N
✅ ドロップイン✓ 在庫あり
$134.4 / 個
データシートを見る →EP4CE55F23C8N 最大定格＆電気的特性
| Family | Cyclone IV E |
| Logic Elements | 55,856 LE |
| Embedded Memory | 2,340 Kbit (M9K blocks) |
| Embedded Multipliers | 156 (18x18) |
| Maximum User I/O Pins | 324 |
| パッケージ | 484-ball FBGA (F23) |
| Process Technology | 60 nm low-power CMOS |
| Core Voltage | 1.2 V |
| 動作温度 | 0 C to +85 C (Commercial, C8) |
| Speed Grade | 8 (Commercial) |
| PLLs | 4 general-purpose |
| Global Clock Networks | 20 |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant (Pb-free) |
| Lead-Free Finish | Yes (N suffix) |
EP4CE55F23C8N 484-ball fbga (f23) ピン配置ガイド
EP4CE55F23C8N (484-ball fbga (f23) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP4CE55F23C8N.
詳細は データシート をご参照ください。
主な用途
EP4CE55F23C8N の用途: 6 件s: Industrial Motor Control, Video Processing and Image Pipeline, Communication Protocol Bridging, Test and Measurement Instrumentation, Industrial HMI Display Controllers, Audio DSP Co-Processing.
Industrial Motor Control
The EP4CE55F23C8N fits industrial motor control because it integrates 156 18x18 hardware multipliers running up to 200 MHz, enough throughput for field-oriented control (FOC) loops in PMSM and induction motor drives. The four on-chip PLLs cleanly derive high-resolution PWM carrier frequencies and encoder sample clocks from a single crystal, while the 324 user I/O pins accept multiple quadrature encoder inputs, Hall sensors, and gate-driver signals. Compared with a DSP-plus-MCU architecture, a single Cyclone IV E 55K eliminates inter-processor latency and lets the control loop run as parallel hardware. Use the M9K memory blocks for current/torque lookup tables and PI controller state retention between PWM ticks.
おすすめ
Video Processing and Image Pipeline
The EP4CE55F23C8N is well matched to video processing because its 2,340 Kbits of M9K memory buffer at least one full 720p frame plus line buffers, and the 156 multipliers handle real-time color-space conversion, scaling, and 2D filtering. The Cyclone IV E family supports DDR/DDR2 SDRAM controllers in core logic, so the FPGA streams pixel data into external memory for downstream display panels or compression blocks. Its 324 I/O pins accommodate parallel RGB/TTL camera inputs or LVDS display outputs without an external bridge chip. Compared with a micro-DSP approach, the FPGA offers deterministic latency for synchronized multi-camera capture.
おすすめ
Communication Protocol Bridging
The EP4CE55F23C8N is widely deployed in protocol bridging because its 55,856 LE accommodate concurrent Ethernet MAC, UART, SPI, I2C, and PCIe soft cores without timing closure issues. The four PLLs synthesize independent reference clocks for each interface domain, while 20 global clock networks distribute them across the fabric with low skew. Industrial protocols such as EtherCAT, PROFINET, and Modbus TCP fit comfortably in the available logic and M9K FIFO memory. Compared with a microcontroller, the FPGA's hardware parallelism handles line-rate traffic on multiple ports simultaneously.
おすすめ
Test and Measurement Instrumentation
The EP4CE55F23C8N fits test and measurement because its 55K LE implement custom trigger logic, deep pattern generators, and high-speed data acquisition state machines that fixed-function ASICs cannot match. The 156 dedicated multipliers accelerate FFT and digital down-conversion blocks used in spectrum analysis. M9K memory blocks serve as deep sample buffers, and the four PLLs provide fine-frequency resolution for clock synthesis. Compared with benchtop instruments built from commercial FPGAs, the Cyclone IV E 55K reduces unit cost while preserving the determinism needed for repeatable measurements.
おすすめ
Industrial HMI Display Controllers
The EP4CE55F23C8N suits HMI display controllers because it can drive LVDS or parallel RGB panels directly through its 324 user I/O pins, run a soft display controller and touch-screen interface core concurrently, and still leave logic headroom for application-layer glue logic. The 2,340 Kbits of embedded RAM hold multiple frame buffers without external memory for smaller QVGA/WVGA panels, while DDR2 SDRAM controllers handle larger 1080p HMI displays. Compared with an ARM Cortex-A SoC, the FPGA offers deterministic refresh timing critical for industrial operator panels.
おすすめ
Audio DSP Co-Processing
The EP4CE55F23C8N is appropriate for audio DSP co-processing because the 156 hardware 18x18 multipliers deliver roughly 50 GMACs of FIR/IIR throughput, sufficient for multi-channel audio sample-rate conversion, EQ, and active noise cancellation. M9K memory blocks implement delay lines and ring buffers with deterministic latency. Compared with a dedicated DSP chip, the FPGA allows parameter updates in real time and supports multiple audio standards (I2S, TDM, S/PDIF) as soft cores. The 1.2 V core keeps power dissipation low for fanless audio products.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4CE55F23C8N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4CE55F23C8LN | EP4CE55F23C8L | EP4CE55F23C8 | EP4CE55F23C7N | EP4CE55F23A7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Logic Elements | 55,856 LE | 55,856 LE | 55,856 LE | 55,856 LE | 55,856 LE | 55,856 LE |
| Embedded Memory | 2,340 Kbit | 2,340 Kbit | 2,340 Kbit | 2,340 Kbit | 2,340 Kbit | 2,340 Kbit |
| Embedded Multipliers | 156 (18x18) | 156 | 156 | 156 | 156 | 156 |
| Maximum User I/O | 324 | 324 | 324 | 324 | 324 | 324 |
| Speed Grade | 8 (Commercial) | 8 | 8 | 8 | 7 | 7 |
| Operating Temperature | 0 C to +85 C (C suffix) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | Automotive grade |
| RoHS / Pb-free | Pb-free (N suffix) | Pb-free | Pb-free | Pb-finish (no N) | Pb-free | Pb-free |
| Approx. Unit Price (USD, qty 100) | 84.25 | 84.25 | 84.25 | 83.50 | 76.40 | 92.10 |
主な差別化要因
- Speed grade 8 offers highest Fmax in the Cyclone IV E 55K family （vs EP4CE55F23C7N)
- Commercial temperature grade is lowest-cost 484-FBGA 55K option （vs EP4CE55F23A7N)
- Maximum logic capacity at this price point in Cyclone IV E （vs EP4CE40F23C8N)
設計ノート
The 484-FBGA F23 package uses a 1.0 mm ball pitch requiring a minimum of 4 routing layers with microvia HDI construction (per IPC-2222). Estimated via-in-pad microvia cost adds 10-15 percent to PCB fabrication compared with a 0.8 mm pitch QFP. Maintain at least 6 mil trace width and 4 mil dielectric spacing for reliable 1.2 V core power distribution. Source: Cyclone IV Device Handbook PCB design guidelines chapter.
Estimated: at typical utilization (60 percent LE, 50 percent RAM, 156 multipliers active at 200 MHz), the EP4CE55F23C8N consumes approximately 1.5 W from the 1.2 V VCCINT rail and 0.3 W from each active VCCIO bank. Total worst-case static plus dynamic power typically remains below 3 W. Use a low-dropout regulator such as the TI TPS74401 for VCCINT and bulk decoupling of at least 220 uF polymer plus 0.1 uF + 10 nF ceramic per pin-pair. Per the Cyclone IV pin connection guidelines, all VCC pins must connect even if not used, or quiescent current rises unpredictably.
Do not assume the C8 and C7 speed grades are interchangeable without timing re-analysis - approximately 15 percent Fmax difference can break pipelined DSP designs. Estimated: a 200 MHz multiplier chain on C8N may fail timing closure on C7N. Per Cyclone IV device datasheet, MSL3 moisture sensitivity requires dry-bag storage and reflow within the rated floor life. The 484-FBGA also requires X-ray inspection of solder joints since the joints are not visually accessible.
Place all eight VCCIO bank supplies close to their respective bank balls to minimize IR drop on high-current outputs. Estimated: a 50 mA fast-switching LVDS output pair can induce 50 mV ripple on a poorly-decoupled VCCIO. Use guard rings around clock PLL power pins (VCC_PLL, VSSA_PLL) and isolate analog PLL ground from digital ground with a single-point connection at the PCB ground plane. Per the Cyclone IV handbook, all PLL filter components (R, C) must be placed within 5 mm of the PLL power pins.
コンプライアンス情報
RoHS compliant per Altera/Intel product page. N suffix denotes Pb-free finish. C8N is commercial temperature grade - not AEC-Q100; use EP4CE55F23A7N for automotive AEC-Q100 applications.