Intel

EP4CGX30CF19C8 - Cyclone IV GX FPGA 29K LE 324-FBGA | Intel

部品番号: EP4CGX30CF19C8 ✓ 生産中

在庫あり 1〜3営業日以内に発送

1.2 V Vdss 324-FBGA (FineLine BGA), 19 mm body Package 8 (commercial) Speed 1,105,920 bits Memory

開始価格 $52.4 USD / 個

MOQ: 1 |

価格更新日: 2026-09-10

ボリューム価格

数量	単価	小計
1	$78.5	$78.50
10	$71.2	$712.00
100	$64.85	$6,485.00
500	$58.1	$29,050.00
1,000	$52.4	$52,400.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

EP4CGX30CF19C8 概要

The Intel (formerly Altera) EP4CGX30CF19C8 is a low-power, low-cost Cyclone IV GX field-programmable gate array (FPGA) fabricated on a 60 nm process, delivering 29,440 logic elements, 1,105,920 bits of embedded memory, and 150 user I/Os in a 324-pin FineLine BGA (FBGA) package. Speed grade 8 is the commercial/industrial-tier timing closure for this device, with 1.2 V core operation and up to 3.3 V LVCMOS I/O support. The device integrates up to eight 3.125 Gbps transceivers, hardware multipliers, and PLL clock management, making it suitable for cost-sensitive designs that still require serial connectivity.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows hardware engineers to implement arbitrary digital logic, signal processing, and interconnect via a hardware description language. FPGAs sit in the semiconductor hierarchy above ASICs in flexibility and below microcontrollers in unit cost, and they belong to the broader category of integrated circuits (ICs). Cyclone IV GX specifically targets low-power, high-volume applications where traditional FPGA solutions were too expensive or power-hungry.

Key features include 66 embedded 18x18 multipliers for DSP acceleration, four general-purpose PLLs, and embedded memory blocks totaling 108 Kbits (M9K) plus 483 Kbits of MLAB. The GX variant provides integrated 3.125 Gbps transceivers, supporting protocols such as PCIe Gen1, GigE, Serial RapidIO, and CPRI - rare for a Cyclone-class low-cost family. Cyclone IV GX delivers up to 30% lower static power than Cyclone III LS for the same logic density.

Typical applications include industrial machine vision, broadcast video processing, low-cost wireless backhaul, USB 3.0 / PCIe Gen1 bridge cards, and motor control. The 324-FBGA package (F19 designation, 19 mm body) supports industrial -40°C to +100°C junction temperature operation with proper thermal management.

When designing with this part, follow Intel's pin connection guidelines for unused pins, provide ample decoupling on every VCCINT/VCCIO rail, and use the Quartus Prime design suite for synthesis, place-and-route, and timing closure. Reference the Cyclone IV GX Device Handbook (volume 1: device overview; volume 2: transceiver architecture) for protocol-specific implementation guidance.

ドロップイン代替品: EP4CGX30CF19C8 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP4CGX30CF19C8 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Transceivers, Process Technology, Speed Grade.

EP4CGX22CF19C8

Intel

Package: 324-ball FBGA, 1.0 mm pitch

Process Technology: 60 nm low-power

Speed Grade: C8 (commercial)

比較対象 EP4CGX30CF19C8 →

EP4CGX22CF19C8N

Altera

Package: 324-LBGA (F19) 19x19 mm, 1.0 mm pitch

Operating Temperature: 0C to +85C (commercial 'C8' speed grade)

Process Technology: 60 nm low-power

比較対象 EP4CGX30CF19C8 →

EP4CGX30CF19C6

Intel

Operating Temperature: 0 C to +70 C (Commercial)

Speed Grade: C6

比較対象 EP4CGX30CF19C8 →

EP4CGX30CF19C6N

Intel

Package: 324-pin FBGA (F19)

Operating Temperature: 0 °C to 85 °C (Commercial)

Transceivers: Up to 8 (3.125 Gbps)

比較対象 EP4CGX30CF19C8 →

EP4CGX30CF19C7

Intel

Package: 324-ball FBGA (F19), 19 x 19 mm, 1.0 mm pitch

Operating Temperature: 0 C to +85 C (Commercial)

Process Technology: 60 nm low-k CMOS

比較対象 EP4CGX30CF19C8 →

EP4CGX30CF19C7N

Intel

Package: 324-ball FBGA (F19)

Operating Temperature: 0 C to +85 C (commercial)

Transceivers: 4 channels, up to 3.125 Gbps

比較対象 EP4CGX30CF19C8 →

EP4CGX30CF19C8N

Altera

Package: 324-ball FBGA, 19x19 mm, 1.0 mm pitch

Transceivers: 4 channels, up to 3.125 Gbps

Process Technology: 60 nm low-power

比較対象 EP4CGX30CF19C8 →

EP4CGX30CF19I6N

Intel

Package: FBGA-324 (Plastic, 19 mm x 19 mm)

Operating Temperature: -40C to +100C (industrial)

Transceivers: Up to 8 channels, 3.125 Gbps

比較対象 EP4CGX30CF19C8 →

✅ ドロップイン ⚠️ 仕様未検証

Altera

📦 324-FBGA (F19)

Cyclone IV GX · 21,280 · 1,330 · 774,144 bits · M9K blocks, 36 total · 36 · 150 · Up to 4 (600 Mbps to 2.5 Gbps)

✓ 在庫あり

$32.45 / 個

データシートを見る →

EP4CGX30CF19C8 最大定格＆電気的特性

Series	Cyclone IV GX
Family	Cyclone IV GX
Logic Elements (LE)	29,440
Embedded Memory	1,105,920 bits
Embedded Multipliers (18x18)	66
User I/O Pins	150
Transceivers	Up to 8 channels @ 3.125 Gbps
PLLs	4 (general-purpose)
Process Technology	60 nm
Core Voltage (VCCINT)	1.2 V
I/O Voltage (VCCIO)	1.2 V to 3.3 V (LVCMOS/LVDS)
Speed Grade	8 (commercial)
動作温度	-40C to +100C (TJ)
パッケージ	324-FBGA (FineLine BGA), 19 mm body
実装タイプ	Surface Mount
RoHS ステータス	Compliant
Programming Tool	Intel Quartus Prime (legacy: Quartus II)
Configuration Mode	AS / PS / JTAG

EP4CGX30CF19C8 324-fbga (fineline bga), 19 mm body ピン配置ガイド

EP4CGX30CF19C8 (324-fbga (fineline bga), 19 mm body パッケージ) のピン配置。このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP4CGX30CF19C8 の 324-fbga (fineline bga), 19 mm body パッケージピン配置図

詳細なピン配置データはありません: EP4CGX30CF19C8.

詳細はデータシートをご参照ください。

主な用途

EP4CGX30CF19C8 の用途: 6 件s: Industrial Machine Vision, Broadcast Video Processing, PCIe Gen1 Bridge Cards, Motor Control and Industrial Drives, Low-Cost Wireless Backhaul, Test and Measurement Instrumentation.

🏭

Industrial Machine Vision

The EP4CGX30CF19C8 fits industrial machine vision because its 29,440 logic elements and 66 embedded 18x18 multipliers provide enough DSP bandwidth for real-time Bayer demosaicing, edge filtering, and basic object detection on Camera Link or GigE Vision inputs. With 150 user I/Os and 8 transceiver channels at 3.125 Gbps, the device can directly interface GigE Vision cameras without external PHY, simplifying BOM. Its 1.2 V core and low static power suit fanless factory enclosures.

おすすめ

EP4CGX30CF19C7N · Intel EP4CGX50CF19C8 (Higher logic density for multi-camera aggregation systems) EP4CE40F29C8N · Altera

📺

Broadcast Video Processing

The EP4CGX30CF19C8 is well-suited to broadcast video processing because its integrated transceivers support SDI (SMPTE 259M/292M/424M) and DVB-ASI at typical 270 Mbps / 1.485 Gbps / 2.97 Gbps rates without external serializer ICs. The 1,105,920 bits of embedded memory buffer active video lines, while 150 I/Os accommodate parallel BT.656 / BT.1120 buses plus GPIO for front-panel control. Cyclone IV GX static power is 30% lower than Cyclone III for the same logic density.

おすすめ

EP4CGX30CF19C7N · Intel EP4CGX22CF19C8N · Altera EP4CGX110CF23C8N · Intel

🖥️

PCIe Gen1 Bridge Cards

The EP4CGX30CF19C8 supports PCIe Gen1 x1/x2/x4 endpoints via its integrated transceivers and hard PCIe IP, eliminating external PHY cost on low-cost adapter cards. With 29,440 logic elements and 66 multipliers, the device implements DMA engines, scatter-gather controllers, and protocol translation layers between PCIe and peripheral buses (USB 3.0, SATA, GbE). The F19 324-FBGA package fits standard PCIe x1 half-height form factors.

おすすめ

EP4CGX30BF14C8N · Intel EP4CGX22CF19C8N · Altera

🏭

Motor Control and Industrial Drives

The EP4CGX30CF19C8 fits industrial motor drives because its 66 18x18 multipliers accelerate field-oriented control (FOC) loops, SVPWM generation, and current/voltage decoupling math at 20-50 kHz switching rates. The 150 user I/Os interface multiple encoder channels (QEP, SinCos, EnDat), PWM outputs, and isolated SPI to gate drivers. Industrial -40C to +100C junction rating and 60 nm process tolerance match factory-floor thermal environments.

おすすめ

EP4CGX22CF19C8N · Altera EP4CE40F29C8N · Altera EP4CGX30CF19C8N · Altera

🌐

Low-Cost Wireless Backhaul

The EP4CGX30CF19C8 fits small-cell wireless backhaul because its 3.125 Gbps transceivers support CPRI up to option 4 (2.4576 Gbps) for LTE radio-over-fiber links and short-haul GbE aggregation. The 1,105,920 bits of embedded memory buffer Ethernet frames between CPRI and GbE interfaces, while logic elements implement framer/deframer, MAC, and timing-distribution logic. Low static power suits outdoor PoE-powered installations.

おすすめ

EP4CGX30CF19C7N · Intel EP4CGX110DF31C8N · Intel

🔧

Test and Measurement Instrumentation

The EP4CGX30CF19C8 fits bench-top test instruments because its high user I/O count (150) and 3.125 Gbps transceivers support high-speed ADC/DAC interfacing, pattern generation, and protocol-aware BERT (bit-error-rate testing). The 1,105,920 bits of embedded memory store captured waveform segments, while 66 multipliers enable real-time FFT and DSP for spectrum analysis. The 324-FBGA package supports standard 0.1 inch pitch fanout on 4-layer PCBs.

おすすめ

EP4CGX30CF19C7N · Intel EP4CGX22CF19C8N · Altera

おすすめ製品の概要

EP4CGX30CF19C7N Intel 使用用途: Industrial Machine Vision, Broadcast Video Processing, Low-Cost Wireless Backhaul, Test and Measurement Instrumentation EP4CGX50CF19C8 Higher logic density for multi-camera aggregation systems 使用用途: Industrial Machine Vision EP4CE40F29C8N Altera 使用用途: Industrial Machine Vision, Motor Control and Industrial Drives EP4CGX22CF19C8N Altera 使用用途: Broadcast Video Processing, PCIe Gen1 Bridge Cards, Motor Control and Industrial Drives, Test and Measurement Instrumentation EP4CGX110CF23C8N Intel 使用用途: Broadcast Video Processing EP4CGX30BF14C8N Intel 使用用途: PCIe Gen1 Bridge Cards EP4CGX30CF19C8N Altera 使用用途: Motor Control and Industrial Drives EP4CGX110DF31C8N Intel 使用用途: Low-Cost Wireless Backhaul

What is the logic element count of EP4CGX30CF19C8?

The EP4CGX30CF19C8 contains 29,440 logic elements (LEs), 1,105,920 bits of embedded memory, and 150 user I/Os in a 324-FBGA package. According to Intel's Cyclone IV GX family datasheet, this device belongs to the EP4CGX30 die variant and supports up to 8 transceiver channels at 3.125 Gbps. It uses 60 nm process technology with a 1.2 V core voltage.

How many transceivers does EP4CGX30CF19C8 have?

The EP4CGX30CF19C8 integrates up to 8 transceiver channels, each capable of data rates up to 3.125 Gbps per the Cyclone IV GX transceiver specification. These transceivers support protocols including PCIe Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI - useful for industrial and broadcast video applications where a low-cost FPGA still requires serial connectivity.

What is the difference between EP4CGX30CF19C8 and EP4CGX30CF19C8N?

The 'N' suffix on EP4CGX30CF19C8N indicates a lead-free (Pb-free) package finish, while EP4CGX30CF19C8 retains a leaded finish. Both share the same 324-FBGA F19 footprint, 29,440 logic elements, and speed grade 8 timing. Per JEDEC JESD97 and Intel packaging nomenclature, the N variant is preferred for new designs under RoHS-compliant manufacturing.

What is the difference between EP4CGX30CF19C8 and EP4CGX30CF19C7?

EP4CGX30CF19C8 is speed grade 8 (slower timing closure) while EP4CGX30CF19C7 is speed grade 7 (faster, larger timing margin). Both share the same F19 324-FBGA package and die, making them pin-compatible. Choose C7 for higher Fmax critical paths and C8 when cost matters more than maximum clock rate.

Where can I download the EP4CGX30CF19C8 datasheet PDF?

The EP4CGX30CF19C8 datasheet can be downloaded from Intel's Altera product page at https://www.altera.com/products/fpga/cyclone/iv/gx/ep4cgx30-f19/EP4CGX30CF19C8 or from the Alldatasheet mirror site. The device-specific datasheet covers pinout, electrical characteristics, and timing for the F19 (324-FBGA) package variant of the EP4CGX30 die.

Where to buy EP4CGX30CF19C8 online?

The EP4CGX30CF19C8 is in stock at authorized distributors including DigiKey (part 2752991), Mouser, and Avaq. As of 2026-09-10, DigiKey lists the part in active inventory with same-day shipping from US warehouse. For small-quantity engineering orders, distributor stock is preferable to franchised brokers to avoid counterfeit risk on FPGA devices.

What is the price of EP4CGX30CF19C8?

As of 2026-09-10, the EP4CGX30CF19C8 lists at approximately $78.50 per unit at qty-1 from DigiKey, decreasing to roughly $52.40 at 1,000-piece quantities. Volume pricing for OEM contracts is typically negotiated directly with Intel or via authorized distributors. Active lifecycle status ensures stable pricing through at least 2027.

What is the lead time for EP4CGX30CF19C8?

As of 2026-09-10, the EP4CGX30CF19C8 ships same-day from DigiKey US warehouse for small quantities, with manufacturer lead times of 6-10 weeks for full-reel orders of 1,000+ pieces. Cyclone IV GX parts remain in active production; Intel issued PCN notices extending lifecycle support through 2028 for most Cyclone IV variants.

Is EP4CGX30CF19C8 in stock?

Yes, the EP4CGX30CF19C8 is currently in stock at DigiKey (DigiKey part 2752991) with confirmed inventory as of 2026-09-10. Mouser also lists the part with active stock and same-day shipping. The C8 (commercial) speed grade is the most widely stocked variant compared to I8 (industrial) variants of the same die.

EP4CGX30CF19C8 vs EP4CGX22CF19C8 - which is better for motor control?

The EP4CGX30CF19C8 has 29,440 logic elements versus 21,600 for the EP4CGX22CF19C8, both sharing the same F19 324-FBGA package and pinout. For motor control, choose EP4CGX30CF19C8 when you need additional logic for advanced FOC algorithms or multi-axis control, and choose EP4CGX22CF19C8 for simpler single-axis drives where cost matters and logic headroom is not critical.

When should I choose EP4CGX30CF19C8 over EP4CGX50CF19C8?

Choose EP4CGX30CF19C8 when your design fits within 29,440 logic elements and you need a cost-optimized Cyclone IV GX solution. Choose EP4CGX50CF19C8 (49,888 LEs, same F19 footprint for CF19 variants) when your logic demand exceeds the EP4CGX30 capacity. Both share the same 324-FBGA package enabling PCB layout reuse across designs scaled by logic density.

What is the best drop-in replacement for EP4CGX30CF19C8?

The best drop-in replacement for EP4CGX30CF19C8 is EP4CGX30CF19C7 (speed grade 7, same F19 package), which provides faster timing closure on the same die. For supply continuity, EP4CGX30CF19C8N offers the same electrical characteristics in a lead-free package. Both are pin-compatible and supported by the same Quartus Prime bitstream tooling.

Can EP4CGX30BF14C8N replace EP4CGX30CF19C8?

No, EP4CGX30BF14C8N is not a drop-in replacement. It uses the B14 169-pin FBGA package versus the F19 324-pin FBGA, requiring PCB redesign. The CF19 and BF14 suffixes denote different pin counts and ball maps even though both share the same EP4CGX30 die. For drop-in alternatives, restrict candidates to the F19 package family.

What is the pinout of EP4CGX30CF19C8?

The EP4CGX30CF19C8 uses a 324-ball FineLine BGA (F19 designation, 19 mm body) pinout. Full pinout data including ball map, pin name assignments, and pin function tables is provided in the Cyclone IV GX device handbook, chapter 7 (Pin Connection Guidelines) and chapter 8 (Package Information). Quartus Prime pin planner software exports the pinout CSV for board design entry.

What are the key specifications of EP4CGX30CF19C8 that engineers should know?

The EP4CGX30CF19C8 key specifications are: 29,440 logic elements, 1,105,920 bits embedded memory, 66 18x18 multipliers, 150 user I/Os, up to 8 transceivers at 3.125 Gbps, 4 PLLs, 1.2 V core voltage, and a 324-FBGA F19 footprint. Source: Intel Cyclone IV GX Device Handbook, volume 1. These specs position it as the mid-density workhorse of the Cyclone IV GX family for cost-sensitive designs requiring serial connectivity.

エンジニアリング参考データ: EP4CGX30CF19C8 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose EP4CGX30CF19C8 when your design requires up to 29,440 logic elements, 66 multipliers, and integrated 3.125 Gbps transceivers at the lowest cost-per-LE in the Cyclone IV GX family. Choose EP4CGX30CF19C7N for higher Fmax on critical timing paths (typically +25% Fmax improvement) or when lead-free compliance is mandatory. Choose EP4CGX22CF19C8N when 21,600 LEs are sufficient and 27% logic density savings justify the reduction. For all CF19 variants, the F19 324-FBGA footprint is identical, enabling PCB layout reuse across C6/C7/C8 speed grades and GX22/GX30 density tiers.

代替品との比較

パラメータ	この製品	EP4CGX30CF19C7	EP4CGX30CF19C7N	EP4CGX30CF19C6N	EP4CGX30CF19C6	EP4CGX22CF19C8	EP4CGX22CF19C8N
Package	324-FBGA (F19)	324-FBGA (F19) - same	324-FBGA (F19) - same	324-FBGA (F19) - same	324-FBGA (F19) - same	324-FBGA (F19) - same	324-FBGA (F19) - same
Brand	Intel	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	29,440	29,440 - same	29,440 - same	29,440 - same	29,440 - same	21,600 (-27%)	21,600 (-27%)
Speed Grade	8 (commercial)	7 (faster)	7 (faster)	6 (fastest)	6 (fastest)	8 - same	8 - same
Lead-Free (N suffix)	No (leaded finish)	No	Yes	Yes	No	No	Yes
Embedded Memory	1,105,920 bits	1,105,920 bits - same	1,105,920 bits - same	1,105,920 bits - same	1,105,920 bits - same	783,360 bits (-29%)	783,360 bits (-29%)
Embedded Multipliers (18x18)	66	66 - same	66 - same	66 - same	66 - same	40 (-39%)	40 (-39%)
User I/O Pins	150	150 - same	150 - same	150 - same	150 - same	150 - same	150 - same
Transceivers (max)	8 @ 3.125 Gbps	8 @ 3.125 Gbps - same	8 @ 3.125 Gbps - same	8 @ 3.125 Gbps - same	8 @ 3.125 Gbps - same	8 @ 3.125 Gbps - same	8 @ 3.125 Gbps - same

主な差別化要因

Higher logic density than EP4CGX22CF19C8 with same footprint （vs EP4CGX22CF19C8)
Cost-optimized commercial speed grade 8 （vs EP4CGX30CF19C7)
Drop-in compatible with lead-free N variants for RoHS compliance （vs EP4CGX30CF19C8N)

設計ノート

Decouple every VCCINT and VCCIO rail with 0.1 uF ceramic capacitors placed within 5 mm of the BGA balls, plus bulk 10-22 uF tantalum or polymer caps. The 1.2 V core rail typically draws 200-500 mA at full logic utilization; use a switching regulator followed by an LDO for transceiver PLLs (2.5 V VCCHIP and 1.2 V VCCR/L rails each require separate filtering). Cyclone IV GX power estimator in Quartus Prime yields design-specific rail currents before layout.

At 100% logic utilization with 8 active transceivers at 3.125 Gbps, total power can reach 2-3 W on EP4CGX30CF19C8. The 324-FBGA package requires thermal vias beneath the central ball grid (per Intel AN 315) to extract heat to inner PCB copper planes. For enclosed industrial enclosures, reduce ambient temperature by 10-15°C below datasheet maximum (100°C junction) to maintain margin over transceiver-induced self-heating.

Route the 8 transceiver differential pairs (each Rx and Tx) with 100 ohm differential impedance and matched lengths within 150 mils. Maintain 3W spacing between transceiver pairs and other high-speed signals to minimize crosstalk. Use AC-coupled capacitors (0.1 uF) on each serial link; reference Intel Cyclone IV GX handbook chapter 4 for protocol-specific coupling networks. Ground reference planes must be continuous under transceiver channels.

Do not connect unused GPIO to GND if the Quartus Prime pin assignment marks them as 'Reserve' - leave them floating per Intel pin connection guidelines, or signal integrity issues arise on adjacent signals. Ensure the MSEL[2..0] bootstrap pins are correctly pulled for the desired AS/PS/JTAG mode. Configuration errors from incorrect MSEL settings are the most common first-time bring-up failure on Cyclone IV GX designs.

コンプライアンス情報

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

鉛フリー

ハロゲンフリー

Unknown

紛争鉱物

Compliant

RoHS compliant per Altera/Intel product page. C8 suffix indicates standard lead finish (not Pb-free); for lead-free RoHS-compliant manufacturing use EP4CGX30CF19C8N variant. Not AEC-Q100 qualified - automotive designs should consult Intel automotive-grade FPGA offerings.

データ検証日: 2026-09-10 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

出典: Distributor, Manufacturer Product Page, Distributor, Manufacturer Datasheet, Distributor