EP4CGX30CF19I7 - Cyclone IV GX FPGA, 29K LE, 324-FBGA | Intel
部品番号: EP4CGX30CF19I7 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $64.8 | $6,480.00 |
| 500 | $58.2 | $29,100.00 |
| 1,000 | $52.4 | $52,400.00 |
EP4CGX30CF19I7 概要
A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs sit in the programmable logic taxonomy between fixed-function ASICs and software-driven microcontrollers; they deliver hardware parallelism, deterministic latency, and field-updatable functionality, which makes them preferable to ASICs for low-volume designs and to MCUs for high-throughput parallel DSP or multi-protocol I/O. The Cyclone IV GX family specifically targets applications that need integrated transceivers without the cost of a high-end transceiver FPGA.
Key features of the EP4CGX30CF19I7 include 66 embedded 18x18 multipliers, 4 PLLs, dedicated transceiver circuitry, and support for external memory interfaces including DDR2 SDRAM at up to 200 MHz. Configuration is supported through standard Intel/Altera schemes including JTAG, AS, AP, and FPP modes. The I temperature grade supports industrial ambient operation from -40C to +100C, suiting industrial and telecom edge equipment.
Architecturally, the device pairs a LUT-based logic fabric with column-based M9K memory blocks, multiplier/accumulator DSP blocks, and IOE (I/O element) structures supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. Hard PCI Express (PIPE) and transceiver physical coding sublayers reduce soft-logic overhead and shorten time-to-market for serial-protocol designs.
Typical applications include industrial video bridge and capture, low-cost wireline backplanes, broadcast signal processing, and embedded designs requiring parallel DSP throughput alongside a moderate number of high-speed serial links. Design considerations include careful power-rail decoupling for the 1.2V core, sequenced ramp of the multi-rail supply, and FPGA pinout-aware PCB layout to keep the eight transceiver channels within their reference-clock and length-matching constraints. This page synthesizes XAIPART distributor pricing, same-package drop-in alternatives within the Cyclone IV GX family, and practical board-level design notes beyond the manufacturer datasheet.
ドロップイン代替品: EP4CGX30CF19I7 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4CGX30CF19I7 （同一形状・フットプリント） — 相違点: Package, Transceivers, Process Technology, Operating Temperature, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP4CGX30CF19I7N
✅ ドロップイン✓ 在庫あり
$76.4 / 個
データシートを見る →EP4CGX30CF19C8N
✅ ドロップイン✓ 在庫あり
$24.6 / 個
データシートを見る →EP4CGX30CF19C7N
✅ ドロップイン✓ 在庫あり
$68.95 / 個
データシートを見る →EP4CGX30CF19C8
✅ ドロップイン✓ 在庫あり
$52.4 / 個
データシートを見る →EP4CGX30CF19C7
✅ ドロップイン✓ 在庫あり
$82 / 個
データシートを見る →EP4CGX30CF19C6N
✅ ドロップイン✓ 在庫あり
$85 / 個
データシートを見る →EP4CGX30CF19I6N
✅ ドロップイン✓ 在庫あり
$52.1 / 個
データシートを見る →EP4CGX30CF19I7 最大定格＆電気的特性
| Series | Cyclone IV GX |
| Logic Elements | 29,440 |
| Embedded Memory | 1,105,920 bits |
| User I/Os | 150 |
| パッケージ | FBGA-324 (19x19 mm) |
| Process Technology | 60 nm low-power CMOS |
| Core Voltage | 1.2 V |
| Number of LABs/CLBs | 1,840 |
| Embedded 18x18 Multipliers | 66 |
| PLLs | 4 |
| Transceivers | 8 (up to 3.125 Gbps) |
| 動作温度 | -40C to +100C (Industrial) |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 (168 hours) |
EP4CGX30CF19I7 fbga-324 (19x19 mm) ピン配置ガイド
EP4CGX30CF19I7 (fbga-324 (19x19 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP4CGX30CF19I7.
詳細は データシート をご参照ください。
主な用途
EP4CGX30CF19I7 の用途: 6 件s: Industrial Video Bridge and Capture, Low-Cost Wireline Backplane Aggregation, Broadcast Signal Processing and Format Conversion, Industrial Motor Control and Servo Drive, Medical Imaging Pre-Processing, Aerospace Avionics Databus Interface.
Industrial Video Bridge and Capture
The EP4CGX30CF19I7 is well suited for industrial video bridge and capture applications where parallel pixel data must be aggregated from camera links and serialized onto Gigabit Ethernet or 3G-SDI uplinks. Its 29,440 logic elements and 66 embedded 18x18 multipliers provide headroom for color-space conversion, image rescaling, and overlay blending at 1080p60, while the 8 integrated transceivers (up to 3.125 Gbps) handle CPRI, 3G-SDI, or GigE-Vision data rates without external PHY chips. Placed on the video processing board with a 1.2V core regulator and DDR2 SDRAM, it interfaces directly to image sensors via LVDS pairs, replacing more expensive dedicated video ASICS. Compared to pure processor-based designs, the FPGA delivers deterministic frame latency and parallel pixel processing.
おすすめ
Low-Cost Wireline Backplane Aggregation
For telecom and datacom backplanes requiring multiple 1G/2.5G serial links aggregated onto a higher-speed uplink, the EP4CGX30CF19I7 offers a compelling balance of logic density and transceiver count. Its 8 transceiver channels can be split between 6x 1G Ethernet SGMII links and 2x 2.5G PCIe or Interlaken bridges, with the 1.1 Mbit of embedded M9K memory buffering packet headers and statistics counters. The industrial temperature grade allows deployment in CO (central office) edge equipment with 70C ambient. Designers typically pair the FPGA with an external 100 MHz reference clock and configure the device via JTAG during production.
おすすめ
Broadcast Signal Processing and Format Conversion
Broadcast studios and outside-broadcast vehicles require FPGA-based format converters that bridge between SDI, HDMI, DisplayPort, and IP-based SMPTE 2022/2110 streams. The EP4CGX30CF19I7 fits this role by providing 29,440 logic elements for color-space, gamma, and scaling pipelines, plus 8 transceivers for multi-rate SDI (HD-SDI, 3G-SDI, 6G-SDI over quad-link). Its industrial temperature grade supports the elevated ambient of broadcast equipment racks. The DSP blocks handle audio embedding/de-embedding (AES3/EBU) without external DSP chips.
おすすめ
Industrial Motor Control and Servo Drive
In precision servo drives and industrial motion controllers, the EP4CGX30CF19I7 implements current-loop and field-oriented control (FOC) algorithms at PWM frequencies above 100 kHz, where microcontroller latency becomes a bottleneck. The 66 embedded 18x18 multipliers accelerate Park/Clarke transforms and PID loops, while the 8 transceivers connect to EtherCAT, Profinet, or CAN-FD industrial fieldbuses. The industrial temperature grade (-40C to +100C) covers factory-floor and outdoor cabinet environments. The 150 user I/Os handle quadrature encoder inputs, PWM outputs, and sigma-delta ADC interfaces for current sensing.
おすすめ
Medical Imaging Pre-Processing
Ultrasound, endoscopy, and patient-monitoring imaging front-ends use FPGAs to perform beamforming, speckle reduction, and real-time filtering before handing data to a host processor. The EP4CGX30CF19I7's combination of 66 multipliers and 1.1 Mbit embedded memory is well matched to mid-channel-count ultrasound beamformers (32 to 64 channels). The industrial temperature grade supports portable cart-based imaging equipment. The transceiver channels can stream pre-processed image data to a host PC over 3G-SDI or a custom serial protocol, while the LVDS I/Os interface to ADCs.
おすすめ
Aerospace Avionics Databus Interface
Avionics LRUs (line-replaceable units) terminate MIL-STD-1553, ARINC 429, and emerging Ethernet-based databuses, often using FPGAs to bridge legacy protocols to modern Ethernet switches. The EP4CGX30CF19I7 with industrial temperature grade and 8 transceivers is deployed in commercial-avionics Ethernet bridges and ARINC 664 (AFDX) endpoints. The robust FBGA-324 packaging withstands avionics vibration profiles, and the device's mature Quartus II toolchain supports DO-254 design-assistance workflows. Designers integrate BC/MT (bus controller/monitor terminal) logic in soft IP, with the FPGA acting as an AFDX switch fabric element.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4CGX30CF19I7 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4CGX30CF19I7N | EP4CGX30CF19C8N | EP4CGX30CF19C7N | EP4CGX30CF19C8 | EP4CGX30CF19I6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-324 (F19) 19x19 mm | FBGA-324 (F19) - same | FBGA-324 (F19) - same | FBGA-324 (F19) - same | FBGA-324 (F19) - same | FBGA-324 (F19) - same |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 29,440 | 29,440 |
| Embedded Memory | 1,105,920 bits | 1,105,920 bits | 1,105,920 bits | 1,105,920 bits | 1,105,920 bits | 1,105,920 bits |
| User I/Os | 150 | 150 | 150 | 150 | 150 | 150 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Industrial (-40C to +100C) |
| Speed Grade | 7 | 7 | 8 (faster) | 7 | 8 (faster) | 6 (slower) |
主な差別化要因
- Industrial temperature grade with 1.2V low-power 60nm process （vs EP4CGX30CF19C8N)
- 8 integrated 3.125 Gbps transceivers in mid-density FPGA （vs EP4CE40F29C7 (Cyclone IV E))
- 29,440 logic elements with 66 18x18 multipliers （vs EP4CGX22CF19C7)
設計ノート
The EP4CGX30CF19I7 requires multiple supply rails: 1.2V core (VCCINT), 2.5V/3.3V auxiliary (VCCAUX), 1.2V/2.5V transceiver analog (VCCT_GXB), and per-bank VCCIO. Estimated: typical core current at 29,440 LE utilization around 60-70% is approximately 500-800 mA at 1.2V (0.6-1.0 W), plus transceiver power scaled by active channels. Use a sequenced ramp circuit (typically a 4-channel power manager) to ensure VCCINT ramps before VCCAUX before VCCIO; this prevents I/O latch-up during configuration. Decouple each rail with a 100 uF bulk + 10 uF + 100 nF ladder placed close to the BGA balls.
Estimated: the FBGA-324 package has a typical theta-JA of approximately 15-18 C/W with adequate PCB thermal vias on a 4-layer board, and 10-12 C/W with a 12-layer board. Worst-case industrial-grade junction at 100C ambient allows only ~5 W dissipation with a 12-layer board (15 C/W * 75C rise = 5.6 W margin). For transceiver-heavy designs where each active GXB channel draws ~150 mA, designers should perform board-level thermal simulation and consider thermal vias under the central BGA balls. The Cyclone IV GX family datasheet includes derating curves for transceiver operation at elevated temperatures.
FBGA-324 at 1.0 mm ball pitch requires either microvia (laser-drilled) stack-ups with 4-6 mil laser vias or via-in-pad with epoxy-filled plating. Route all 8 transceiver pairs with 100 ohm differential impedance and length matching to within 5 mil; route reference clocks with 50 ohm single-ended or 100 ohm differential, with length matching to within 50 mil. Use a ground-reference plane on layer 2 beneath all high-speed serial traces. Avoid right-angle bends; use 45-degree or curved traces. The configuration JTAG chain (TCK/TMS/TDO/TDI) must be length-matched to within 1 inch and pulled up with 10 kohm resistors per Altera JTAG configuration guidelines.
Common pitfalls include (1) leaving nCONFIG or nSTATUS floating - both must be pulled up to 3.3V through 10 kohm; (2) failing to instantiate the RESET block after GXB link training, which can leave transceivers in an undefined state; (3) using incorrect MSEL[3:0] pin settings for the desired configuration mode (AS, AP, JTAG, FPP) - the EP4CGX30CF19I7 supports multiple modes and wrong MSEL values prevent configuration; (4) neglecting CONF_DONE pull-up; (5) attempting to use the same bitstream across speed grades (7 vs 8) - higher fMAX designs must use 8-grade bitstreams. Always verify MSEL and pull-up settings against the Cyclone IV GX configuration user guide.
コンプライアンス情報
RoHS/REACH compliance data not explicitly provided in the verified web data; marked as unknown per data authenticity rules. FPGA is not subject to AEC-Q100 (automotive) qualification. The -N suffix variants (e.g., EP4CGX30CF19I7N) are explicitly lead-free per Altera/Intel ordering information; the non-N variants use tin-lead terminal finish.
