EP4SGX360KF40I4 - Stratix IV GX FPGA, 360K LE, 744 I/O | Intel
部品番号: EP4SGX360KF40I4 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $9745.1 | $9,745.10 |
| 10 | $9350 | $93,500.00 |
| 100 | $8800 | $880,000.00 |
| 250 | $8450 | $2,112,500.00 |
| 500 | $8100 | $4,050,000.00 |
EP4SGX360KF40I4 概要
What is a Stratix IV GX FPGA? The Stratix IV GX family is Intel's (formerly Altera's) mid-to-high-end 40 nm FPGA line that combines a high-density programmable logic fabric with embedded transceivers, DSP blocks, and on-chip memory. FPGAs sit in the programmable-logic hierarchy above ASICs and CPLDs, offering the highest logic density and the richest I/O mix of any programmable device. The GX suffix indicates integrated multi-gigabit transceivers, distinguishing Stratix IV GX from the E (enhanced logic) and GT (highest transceiver count) variants.
Key differentiating features include: 8.5 Gbps integrated transceivers for chip-to-chip and backplane serial links; 1,920 18x18 hardware multipliers delivering up to ~150 GMACs of DSP throughput; partial reconfiguration support enabling in-field logic updates without halting I/O; and hardened PCI Express Gen2 hard IP blocks. The combination of massive parallel DSP fabric and high-speed serial I/O makes Stratix IV GX especially well suited to wireline protocols, wireless baseband, and high-performance DSP pipelines.
Architecturally, the device uses an Adaptive Logic Module (ALM)-based fabric feeding a hierarchical routing network, with 16 global clock networks, 8 PLLs, and 96 regional clocks. The transceiver blocks each contain their own PCS/PMA with CDR, pre-emphasis, and equalization, supporting protocols such as PCIe Gen2, XAUI, CEI-6G, CPRI, and Serial RapidIO. Embedded RAM is organized into true-dual-port and simple-dual-port M9K/M144K blocks for flexible on-chip buffering.
Typical applications include 100G/40G line-card packet processing, wireless LTE baseband processing, radar and SIGINT signal processing, high-frame-rate video broadcasting, and ASIC prototyping. The 1517-BGA package also supports high-pin-count daughter-card and backplane designs with 24+ transceiver lanes and 744 general-purpose I/Os simultaneously active.
When designing with this device, ensure power-rail sequencing respects the POR sequence, and pair the FPGA with the Stratix IV GX Development Kit reference design to reuse validated pin assignments. Estimated core power consumption under heavy DSP/transceiver load is approximately 15–25 W, so a multi-phase regulator and thermal management on the BGA substrate are recommended.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV GX family, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: EP4SGX360KF40I4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4SGX360KF40I4 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Speed Grade, Transceivers, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP4SGX360KF40I4
✅ ドロップイン✓ 在庫あり
$8100 / 個
データシートを見る →EP4SGX360KF40I3N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5120 / 個
データシートを見る →EP4SGX360KF40C4N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3360 / 個
データシートを見る →EP4SGX360HF35I4N
✅ ドロップイン✓ 在庫あり
$8.5 / 個
データシートを見る →EP4SGX360KF40I4 最大定格＆電気的特性
| Device Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| Embedded Memory | 23,105,536 bits |
| User I/O Count | 744 |
| DSP Blocks (18x18 multipliers) | 1,920 |
| Transceivers | 24 channels up to 8.5 Gbps |
| PLLs | 8 |
| Global Clock Networks | 16 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| パッケージ | 1517-pin FC-FBGA |
| 動作温度 | −40 °C to +100 °C (industrial) |
| Speed Grade | I4 |
| PCIe Hard IP | PCIe Gen2 hard IP blocks |
| RoHS ステータス | Compliant |
EP4SGX360KF40I4 1517-pin fc-fbga ピン配置ガイド
EP4SGX360KF40I4 (1517-pin fc-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP4SGX360KF40I4.
詳細は データシート をご参照ください。
主な用途
EP4SGX360KF40I4 の用途: 6 件s: 100G/40G Line-Card Packet Processing, Wireless LTE Baseband Processing, Radar and SIGINT Signal Processing, ASIC Prototyping and Emulation, High-Frame-Rate Video Broadcast, High-Performance Computing and DSP Acceleration.
100G/40G Line-Card Packet Processing
The EP4SGX360KF40I4 is engineered for high-speed wireline line cards thanks to its 24 transceivers operating at up to 8.5 Gbps each, yielding more than 200 Gbps of aggregate serial bandwidth. Its 353,600 logic elements and 1,920 18x18 multipliers can run per-packet processing at line rate without external lookups. Hard PCIe Gen2 IP blocks ease CPU-to-FPGA paths, while the 1517-BGA footprint exposes enough I/O for direct attachment to multiple QSFP cages on the front panel.
おすすめ
Wireless LTE Baseband Processing
Stratix IV GX devices are widely deployed in LTE and WiMAX baseband processing chains. The EP4SGX360KF40I4's 1,920 18x18 hardware multipliers deliver roughly 150 GMACs of DSP throughput — enough for 4x4 MIMO downlink peak rates — while the integrated CPRI and OBSAI serial links simplify connection to remote radio heads. Industrial temperature grade (−40 to +100 °C) allows outdoor cabinet deployment without additional thermal screening.
おすすめ
Radar and SIGINT Signal Processing
Defense and SIGINT platforms benefit from the EP4SGX360KF40I4's combination of 23 Mbits embedded memory for sample buffering and massive parallel DSP throughput for FFT and pulse compression. With 8 PLLs and 16 global clocks, designers can route multi-channel ADC sample streams at hundreds of MHz into the FPGA fabric cleanly. Partial reconfiguration enables in-field mission-mode swapping without halting acquisition.
おすすめ
ASIC Prototyping and Emulation
おすすめ
High-Frame-Rate Video Broadcast
Broadcast video routers, multi-viewers and 4K/8K up-converters benefit from the EP4SGX360KF40I4's 744 user I/Os for direct attachment to multiple SDI/HDMI/DisplayPort interfaces. The device's M9K/M144K RAM blocks efficiently buffer pixel streams, while integrated transceivers carry 3G-SDI/12G-SDI over coax. Industrial temperature grade is essential for unattended head-end environments.
おすすめ
High-Performance Computing and DSP Acceleration
In HPC and scientific computing, the EP4SGX360KF40I4 can be deployed as a co-processor with 8.5 Gbps links to host CPUs over PCIe Gen2. Its 1,920 18x18 multipliers and 23 Mbits of block RAM accelerate financial Monte Carlo, genomics alignment, and scientific simulations. Industrial temperature grade supports deployment in air-cooled server racks.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4SGX360KF40I4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4SGX360KF40I4 | EP4SGX360KF40I3N | EP4SGX360KF40C4N | EP4SGX360HF35I4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel (self-ref) | Intel | Intel | Intel |
| Package | 1517-pin FC-FBGA (KF40) | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1152-FCBGA (HF35) - DIFFERENT |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Speed Grade | I4 (industrial) | I4 | I3 (slower Fmax, ~10% slack) | C4 (faster Fmax, +10%) | I4 |
| Operating Temperature | −40 to +100 °C (industrial) | Industrial | Industrial | Commercial (0 to +85 °C) | Industrial |
| User I/O Count | 744 | 744 | 744 | 744 | 560-600 |
| Transceivers | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 16-24 x 8.5 Gbps |
| Embedded Memory | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits |
| DSP Multipliers (18x18) | 1,920 | 1,920 | 1,920 | 1,920 | 1,920 |
主な差別化要因
- Highest LE density in the Stratix IV GX KF40 package （vs EP4SGX230KF40I4N)
- Faster speed grade than C4 commercial variant （vs EP4SGX360KF40C4N)
- More user I/Os than the smaller HF35 package alternative （vs EP4SGX360HF35I4N)
設計ノート
Estimated: at typical Stratix IV GX utilization (70% logic, 50% RAM, 50% DSP, all 24 transceivers at 6.25 Gbps PRBS31), core power draw is in the 12-18 W range. Use a multi-phase synchronous buck converter such as the LTM4628 or ISL62882 with output inductors in the 0.68-1.0 µH range. Implement Power-On-Reset sequencing: VCCINT must ramp before VCCAUX, which must ramp before VCCPD per Intel POR specification. Place 100 µF bulk + 22 µF ceramic + 0.1 µF/0402 decoupling within 5 mm of each FPGA power pin pair.
The 1517-FCBGA has a theta_JA in the 0.8-1.5 °C/W range with a properly designed heatsink. Use a high-performance thermal interface material (3 W/mK or higher) and a finned heatsink with 200+ LFM airflow. For enclosed chassis, derate by 20% above 25 °C ambient. The industrial-grade device is rated to 100 °C junction; aim for ≤85 °C under worst-case load to preserve long-term reliability.
Use at least an 8-layer PCB with HDI (microvia) technology to break out all 1517 balls. Recommended stack-up: signal-GND-signal-power-GND-signal-power-signal with 1-oz copper for outer layers. Match differential-pair lengths to within 5 mils for 6.25 Gbps transceivers and use length-matched impedance for DDR3 interfaces. Reuse the Stratix IV GX Development Kit reference PCB stack-up when possible to leverage Intel's pre-validated channel performance.
Critical pitfalls: (1) Never hot-swap the device — observe POR sequencing on every power cycle; (2) Do not exceed 8.5 Gbps transceiver VOD/VOD settings recommended in AN-558; (3) When migrating between KF40 and HF35 packages, the PCB must be respun because ball maps differ — they are NOT drop-in footprint-compatible; (4) Configure unused transceiver channels to disable state and ground their AC-coupling caps to avoid spurious emissions; (5) Apply the latest Quartus Prime service pack to obtain timing-closure fixes for I4 speed-grade silicon revision 2.
コンプライアンス情報
RoHS and REACH compliant per Altera/Intel product page; not AEC-Q100 qualified (FPGA is not an automotive-grade part); lead-free reflow-compatible per JEDEC J-STD-020.
