EP4SGX360KF40I4 - Stratix IV GX FPGA, 360K LE, 744 I/O | Intel
부품 번호: EP4SGX360KF40I4 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9745.1 | $9,745.10 |
| 10 | $9350 | $93,500.00 |
| 100 | $8800 | $880,000.00 |
| 250 | $8450 | $2,112,500.00 |
| 500 | $8100 | $4,050,000.00 |
EP4SGX360KF40I4 개요
What is a Stratix IV GX FPGA? The Stratix IV GX family is Intel's (formerly Altera's) mid-to-high-end 40 nm FPGA line that combines a high-density programmable logic fabric with embedded transceivers, DSP blocks, and on-chip memory. FPGAs sit in the programmable-logic hierarchy above ASICs and CPLDs, offering the highest logic density and the richest I/O mix of any programmable device. The GX suffix indicates integrated multi-gigabit transceivers, distinguishing Stratix IV GX from the E (enhanced logic) and GT (highest transceiver count) variants.
Key differentiating features include: 8.5 Gbps integrated transceivers for chip-to-chip and backplane serial links; 1,920 18x18 hardware multipliers delivering up to ~150 GMACs of DSP throughput; partial reconfiguration support enabling in-field logic updates without halting I/O; and hardened PCI Express Gen2 hard IP blocks. The combination of massive parallel DSP fabric and high-speed serial I/O makes Stratix IV GX especially well suited to wireline protocols, wireless baseband, and high-performance DSP pipelines.
Architecturally, the device uses an Adaptive Logic Module (ALM)-based fabric feeding a hierarchical routing network, with 16 global clock networks, 8 PLLs, and 96 regional clocks. The transceiver blocks each contain their own PCS/PMA with CDR, pre-emphasis, and equalization, supporting protocols such as PCIe Gen2, XAUI, CEI-6G, CPRI, and Serial RapidIO. Embedded RAM is organized into true-dual-port and simple-dual-port M9K/M144K blocks for flexible on-chip buffering.
Typical applications include 100G/40G line-card packet processing, wireless LTE baseband processing, radar and SIGINT signal processing, high-frame-rate video broadcasting, and ASIC prototyping. The 1517-BGA package also supports high-pin-count daughter-card and backplane designs with 24+ transceiver lanes and 744 general-purpose I/Os simultaneously active.
When designing with this device, ensure power-rail sequencing respects the POR sequence, and pair the FPGA with the Stratix IV GX Development Kit reference design to reuse validated pin assignments. Estimated core power consumption under heavy DSP/transceiver load is approximately 15–25 W, so a multi-phase regulator and thermal management on the BGA substrate are recommended.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV GX family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP4SGX360KF40I4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360KF40I4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Transceivers, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX360KF40I4
✅ 드롭인✓ 재고 있음
$8100 / 개
데이터시트 보기 →EP4SGX360KF40I3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5120 / 개
데이터시트 보기 →EP4SGX360KF40C4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3360 / 개
데이터시트 보기 →EP4SGX360HF35I4N
✅ 드롭인✓ 재고 있음
$8.5 / 개
데이터시트 보기 →EP4SGX360KF40I4 최대 정격 & 전기적 특성
| Device Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| Embedded Memory | 23,105,536 bits |
| User I/O Count | 744 |
| DSP Blocks (18x18 multipliers) | 1,920 |
| Transceivers | 24 channels up to 8.5 Gbps |
| PLLs | 8 |
| Global Clock Networks | 16 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| 패키지 | 1517-pin FC-FBGA |
| 동작 온도 | −40 °C to +100 °C (industrial) |
| Speed Grade | I4 |
| PCIe Hard IP | PCIe Gen2 hard IP blocks |
| RoHS 상태 | Compliant |
EP4SGX360KF40I4 1517-pin fc-fbga 핀 구성 가이드
EP4SGX360KF40I4(1517-pin fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360KF40I4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX360KF40I4 적합 용도: 6 애플리케이션s: 100G/40G Line-Card Packet Processing, Wireless LTE Baseband Processing, Radar and SIGINT Signal Processing, ASIC Prototyping and Emulation, High-Frame-Rate Video Broadcast, High-Performance Computing and DSP Acceleration.
100G/40G Line-Card Packet Processing
The EP4SGX360KF40I4 is engineered for high-speed wireline line cards thanks to its 24 transceivers operating at up to 8.5 Gbps each, yielding more than 200 Gbps of aggregate serial bandwidth. Its 353,600 logic elements and 1,920 18x18 multipliers can run per-packet processing at line rate without external lookups. Hard PCIe Gen2 IP blocks ease CPU-to-FPGA paths, while the 1517-BGA footprint exposes enough I/O for direct attachment to multiple QSFP cages on the front panel.
추천
Wireless LTE Baseband Processing
Stratix IV GX devices are widely deployed in LTE and WiMAX baseband processing chains. The EP4SGX360KF40I4's 1,920 18x18 hardware multipliers deliver roughly 150 GMACs of DSP throughput — enough for 4x4 MIMO downlink peak rates — while the integrated CPRI and OBSAI serial links simplify connection to remote radio heads. Industrial temperature grade (−40 to +100 °C) allows outdoor cabinet deployment without additional thermal screening.
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Radar and SIGINT Signal Processing
Defense and SIGINT platforms benefit from the EP4SGX360KF40I4's combination of 23 Mbits embedded memory for sample buffering and massive parallel DSP throughput for FFT and pulse compression. With 8 PLLs and 16 global clocks, designers can route multi-channel ADC sample streams at hundreds of MHz into the FPGA fabric cleanly. Partial reconfiguration enables in-field mission-mode swapping without halting acquisition.
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ASIC Prototyping and Emulation
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High-Frame-Rate Video Broadcast
Broadcast video routers, multi-viewers and 4K/8K up-converters benefit from the EP4SGX360KF40I4's 744 user I/Os for direct attachment to multiple SDI/HDMI/DisplayPort interfaces. The device's M9K/M144K RAM blocks efficiently buffer pixel streams, while integrated transceivers carry 3G-SDI/12G-SDI over coax. Industrial temperature grade is essential for unattended head-end environments.
추천
High-Performance Computing and DSP Acceleration
In HPC and scientific computing, the EP4SGX360KF40I4 can be deployed as a co-processor with 8.5 Gbps links to host CPUs over PCIe Gen2. Its 1,920 18x18 multipliers and 23 Mbits of block RAM accelerate financial Monte Carlo, genomics alignment, and scientific simulations. Industrial temperature grade supports deployment in air-cooled server racks.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX360KF40I4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX360KF40I4 | EP4SGX360KF40I3N | EP4SGX360KF40C4N | EP4SGX360HF35I4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel (self-ref) | Intel | Intel | Intel |
| Package | 1517-pin FC-FBGA (KF40) | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1152-FCBGA (HF35) - DIFFERENT |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Speed Grade | I4 (industrial) | I4 | I3 (slower Fmax, ~10% slack) | C4 (faster Fmax, +10%) | I4 |
| Operating Temperature | −40 to +100 °C (industrial) | Industrial | Industrial | Commercial (0 to +85 °C) | Industrial |
| User I/O Count | 744 | 744 | 744 | 744 | 560-600 |
| Transceivers | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 16-24 x 8.5 Gbps |
| Embedded Memory | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits |
| DSP Multipliers (18x18) | 1,920 | 1,920 | 1,920 | 1,920 | 1,920 |
주요 차별점
- Highest LE density in the Stratix IV GX KF40 package (vs EP4SGX230KF40I4N)
- Faster speed grade than C4 commercial variant (vs EP4SGX360KF40C4N)
- More user I/Os than the smaller HF35 package alternative (vs EP4SGX360HF35I4N)
설계 노트
Estimated: at typical Stratix IV GX utilization (70% logic, 50% RAM, 50% DSP, all 24 transceivers at 6.25 Gbps PRBS31), core power draw is in the 12-18 W range. Use a multi-phase synchronous buck converter such as the LTM4628 or ISL62882 with output inductors in the 0.68-1.0 µH range. Implement Power-On-Reset sequencing: VCCINT must ramp before VCCAUX, which must ramp before VCCPD per Intel POR specification. Place 100 µF bulk + 22 µF ceramic + 0.1 µF/0402 decoupling within 5 mm of each FPGA power pin pair.
The 1517-FCBGA has a theta_JA in the 0.8-1.5 °C/W range with a properly designed heatsink. Use a high-performance thermal interface material (3 W/mK or higher) and a finned heatsink with 200+ LFM airflow. For enclosed chassis, derate by 20% above 25 °C ambient. The industrial-grade device is rated to 100 °C junction; aim for ≤85 °C under worst-case load to preserve long-term reliability.
Use at least an 8-layer PCB with HDI (microvia) technology to break out all 1517 balls. Recommended stack-up: signal-GND-signal-power-GND-signal-power-signal with 1-oz copper for outer layers. Match differential-pair lengths to within 5 mils for 6.25 Gbps transceivers and use length-matched impedance for DDR3 interfaces. Reuse the Stratix IV GX Development Kit reference PCB stack-up when possible to leverage Intel's pre-validated channel performance.
Critical pitfalls: (1) Never hot-swap the device — observe POR sequencing on every power cycle; (2) Do not exceed 8.5 Gbps transceiver VOD/VOD settings recommended in AN-558; (3) When migrating between KF40 and HF35 packages, the PCB must be respun because ball maps differ — they are NOT drop-in footprint-compatible; (4) Configure unused transceiver channels to disable state and ground their AC-coupling caps to avoid spurious emissions; (5) Apply the latest Quartus Prime service pack to obtain timing-closure fixes for I4 speed-grade silicon revision 2.
규정 준수 정보
RoHS and REACH compliant per Altera/Intel product page; not AEC-Q100 qualified (FPGA is not an automotive-grade part); lead-free reflow-compatible per JEDEC J-STD-020.
