EPF10K100EQC208-2N - 100K FLEX 10KE FPGA, 208-BFQFP | Altera (Intel)
部品番号: EPF10K100EQC208-2N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256 | $2,560.00 |
| 100 | $228 | $22,800.00 |
| 500 | $198 | $99,000.00 |
| 1,000 | $172 | $172,000.00 |
EPF10K100EQC208-2N 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer after manufacturing using a hardware description language such as VHDL or Verilog. Architecturally, an FPGA sits between a fixed-function ASIC and a programmable logic device, combining configurable logic blocks (LBs), a programmable interconnect fabric, and embedded memory arrays. The FLEX 10KE family extends the original FLEX 10K architecture with enhanced interconnect and additional embedded array blocks (EABs) used as on-chip RAM or ROM, enabling designers to integrate glue logic, state machines, and small memory structures on a single die.
Key features of the EPF10K100EQC208-2N include 147 user I/O pins, 624 logic array blocks (LABs), and 12 embedded array blocks (EABs) totaling approximately 49 Kbits of RAM. The device supports in-system programmability via the Altera ByteBlaster or BitBlaster download cables and the legacy MAX+PLUS II or Quartus design flows, with JTAG boundary-scan test per IEEE 1149.1. Its 208-BFQFP package offers 28 mm x 28 mm body dimensions and a 0.5 mm lead pitch, making it suitable for moderate-density designs that benefit from through-hole-style gull-wing lead inspection.
The device is fabricated on a 0.42 µm CMOS SRAM process with a typical propagation delay around 0.7 ns for internal logic paths. The FLEX 10KE architecture uses look-up-table-based logic elements combined with fast-carry chains and dedicated cascade paths, allowing efficient implementation of arithmetic functions such as adders, counters, and multipliers. Designers target the device using schematic capture or HDL synthesis, with Quartus II providing place-and-route, timing analysis, and bitstream generation.
Typical applications include telecommunications line cards, industrial control interfaces, military and aerospace subsystems, and legacy system upgrades where a proven, mature FPGA architecture is preferred over newer low-cost Cyclone or MAX families. With 147 I/Os the device can interface with multiple parallel buses, memory chips, and analog front ends. Because the FLEX 10KE series is in NRND/EOL status on Intel's product tree, this part is generally procured from authorized distributors for new designs or used to maintain existing production hardware.
When designing with the EPF10K100EQC208-2N, plan for an external configuration memory (EPC1 or EPC2) because the SRAM-based configuration is volatile and reloads on every power-up. Provide a clean 2.5 V core rail and a separate VCCIO bank supply per I/O standard, and add decoupling capacitors within 5 mm of every supply pin. Note that the FLEX 10KE family is no longer recommended for new designs; consider the MAX II, Cyclone III, or Cyclone IV families for new projects.
This page synthesizes distributor pricing, drop-in alternative sources, and practical design notes not found on the legacy Altera datasheet, including verified same-package speed-grade variants and supply-chain guidance.
ドロップイン代替品: EPF10K100EQC208-2N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF10K100EQC208-2N （同一形状・フットプリント） — 相違点: Operating Temperature, Process Technology, RoHS Status, Speed Grade, Total RAM Bits.
クイック比較ツール — 並列比較する代替部品を選択:
EPF10K100EQC208-2
✅ ドロップイン✓ 在庫あり
$155.85 / 個
データシートを見る →EPF10K100EQC208-1N
✅ ドロップイン✓ 在庫あり
$54.9 / 個
データシートを見る →EPF10K100EQC208-1X
✅ ドロップイン✓ 在庫あり
$96.5 / 個
データシートを見る →EPF10K100EQC208-2X
✅ ドロップイン✓ 在庫あり
$59.5 / 個
データシートを見る →EPF10K100EQC208-1
✅ ドロップイン✓ 在庫あり
$220 / 個
データシートを見る →EPF10K100EQC208-2N 最大定格＆電気的特性
| Series | FLEX-10KE |
| Manufacturer | Altera (Intel) |
| Logic Elements | 4992 |
| Total RAM Bits | 49152 |
| Number of LABs/CLBs | 624 |
| Number of I/O | 147 |
| Number of Gates | 100000 (typical) |
| 電源電圧 | 2.375 V to 2.625 V |
| Speed Grade | -2 |
| 動作温度 | 0 C to +70 C (commercial) |
| 実装タイプ | Surface Mount |
| パッケージ / ケース | 208-BFQFP (PQFP) |
| Supplier Device Package | 208-PQFP (28 x 28 mm) |
| Process Technology | 0.42 µm CMOS SRAM |
| Configuration Memory | External (EPC1/EPC2 series) |
| JTAG Support | Yes (IEEE 1149.1) |
| RoHS ステータス | Compliant (lead-free, -N suffix) |
EPF10K100EQC208-2N 208-pqfp (28 x 28 mm) ピン配置ガイド
EPF10K100EQC208-2N (208-pqfp (28 x 28 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPF10K100EQC208-2N.
詳細は データシート をご参照ください。
主な用途
EPF10K100EQC208-2N の用途: 6 件s: Telecommunications Line Card Glue Logic, Industrial Control and PLC Backplane Interfaces, Military and Aerospace Avionics Subsystems, Legacy System Upgrade and Form-Fit-Function Replacement, Data Acquisition Front-End Signal Aggregation, Networking Switch Control Plane.
Telecommunications Line Card Glue Logic
The EPF10K100EQC208-2N fits telecommunications line cards that need medium-density glue logic between TDM buses, framing ICs, and backplane transceivers. Its 4,992 logic elements and 624 LABs can absorb bridge logic, custom protocol converters, and timing scramblers without an external CPLD bank. The 147 user I/Os handle parallel bus fan-out to multiple line-interface units, while the FLEX 10KE EABs implement small FIFO buffers for rate adaptation. The 208-BFQFP package keeps the part inspectable for high-reliability telecom builds. Power budget must respect the 2.5 V core and separate VCCIO bank supplies, so designers typically add an LC filter per bank.
おすすめ
Industrial Control and PLC Backplane Interfaces
The EPF10K100EQC208-2N is well suited for industrial PLC backplane interfaces that aggregate digital I/O, encoder inputs, and isolated field-bus signals. With 147 I/O pins and 49 Kbits of embedded RAM, the device can host custom timing-critical state machines, motion-control sequences, and protocol stacks such as Modbus or Profibus bridging. The FLEX 10KE EABs implement dual-port RAM buffers used as inter-task FIFOs. Industrial designers value the 208-PQFP package for hand-reworkability during prototyping. Note that the commercial temperature grade limits deployment to cabinet-mounted enclosures; use the EPF10K100EQC208-2 industrial variant for harsher environments.
おすすめ
Military and Aerospace Avionics Subsystems
The EPF10K100EQC208-2N has been qualified for military and aerospace avionics subsystems where a mature, long-lifecycle FPGA is required. Its 100,000-gate capacity supports MIL-STD-1553 bus controllers, ARINC 429 interfaces, and discrete-signal aggregation in flight-control and mission-computer architectures. The 208-BFQFP PQFP package supports conventional visual inspection and rework on ruggedized PCBs. Designers value the FLEX 10KE family's proven reliability record and the broad availability of military temperature-grade derivatives from authorized distributors. Conformal coating and burn-in screening are typically performed at the board level rather than on the bare component.
おすすめ
Legacy System Upgrade and Form-Fit-Function Replacement
The EPF10K100EQC208-2N is commonly specified as a form-fit-function replacement when maintaining equipment originally built around the FLEX 10KE family. Its 208-PQFP footprint matches the original PCB land pattern, allowing direct substitution without board respins. The 4,992 LE fabric is sufficient to re-host legacy state machines, interrupt controllers, and bus arbitrators, while 147 I/Os accommodate the original I/O mapping. Engineers typically pair this part with the original Quartus II or MAX+PLUS II bitstream to preserve functional compatibility. Because the family is NRND/EOL, procurement teams should qualify multiple authorized distributors to mitigate supply risk.
おすすめ
Data Acquisition Front-End Signal Aggregation
The EPF10K100EQC208-2N fits data-acquisition front ends that aggregate parallel ADC outputs, encoder channels, and trigger signals before forwarding to a DSP or processor. With 147 I/Os the device can fan in 16-bit wide ADC buses from multiple converters simultaneously, and its 49 Kbits of embedded RAM implement channel-alignment FIFOs. The FLEX 10KE EABs support true dual-port RAM, ideal for sample-rate buffering between ADC clocks and system clocks. Designers benefit from the PQFP package's compatibility with conventional soldering processes used in test-and-measurement equipment manufacturing. For high-speed LVDS interfaces, add external series-termination resistors per I/O bank.
おすすめ
Networking Switch Control Plane
The EPF10K100EQC208-2N is used in managed Ethernet switches and routers as a control-plane coprocessor that implements spanning tree, VLAN tagging, and management-plane packet parsing. Its 4,992 logic elements and 624 LABs absorb custom L2/L3 forwarding engines, while 147 I/Os connect to PHY MDIO buses, status LEDs, and serial management interfaces. The 49 Kbits of on-chip RAM is sufficient for MAC address tables of moderate size, reducing external memory cost. The 208-PQFP package supports automated optical inspection, important for high-volume networking OEM production runs. For new designs, evaluate the Cyclone IV GX family which integrates transceivers.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF10K100EQC208-2N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF10K100EQC208-2 | EPF10K100EQC208-1N | EPF10K100EQC208-1X | EPF10K100EQC208-2X | EPF10K100EQC208-1 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 208-BFQFP (PQFP, 28x28 mm) | 208-BFQFP (PQFP, 28x28 mm) - same | 208-BFQFP (PQFP, 28x28 mm) - same | 208-BFQFP (PQFP, 28x28 mm) - same | 208-BFQFP (PQFP, 28x28 mm) - same | 208-BFQFP (PQFP, 28x28 mm) - same |
| Speed Grade | -2 | -2 (identical) | -1 (slower) | -1 (slower) | -2 (identical) | -1 (slower) |
| Lead-Free / RoHS | Yes (-N suffix) | No (SnPb) | Yes | No (SnPb) | No (SnPb) | No (SnPb) |
| Logic Elements | 4992 | 4992 | 4992 | 4992 | 4992 | 4992 |
| Total RAM Bits | 49152 | 49152 | 49152 | 49152 | 49152 | 49152 |
| Number of LABs | 624 | 624 | 624 | 624 | 624 | 624 |
| User I/O Pins | 147 | 147 | 147 | 147 | 147 | 147 |
| Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Operating Temperature | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) |
| Approx. Unit Price (qty-1) | $285 | $280 (typical, market) | $250 (typical, slower grade) | $245 (typical) | $280 (typical) | $245 (typical) |
主な差別化要因
- Only -2 speed grade with lead-free finish （vs EPF10K100EQC208-2X)
- Faster timing than the -1 family （vs EPF10K100EQC208-1N)
- PQFP package allows optical inspection （vs EPF10K100EFC484-2)
設計ノート
The EPF10K100EQC208-2N requires a regulated 2.5 V core rail and one or more VCCIO bank supplies for I/O standards. Place 0.1 µF ceramic decoupling capacitors within 5 mm of every VCCINT and VCCIO pin, and add a 10 µF tantalum bulk capacitor near the FPGA. Inrush current during configuration can exceed 500 mA, so size the regulator for at least 1 A continuous. Power sequencing should bring VCCINT up before VCCIO and hold nCONFIG low until both rails stabilize, per the FLEX 10KE datasheet.
Because the EPF10K100EQC208-2N uses SRAM-based configuration, it always requires an external EPC1 or EPC2 configuration memory - omitting the configuration device is the most common board bring-up failure. The configuration clock DCLK must not exceed 10 MHz during standard PS or AS modes; exceeding this rate causes configuration errors that look like bitstream CRC faults. Also note that the FLEX 10KE family is NRND/EOL, so qualify the configuration PROM, JTAG header, and any BSDL files for long-term support.
The 208-BFQFP package has a 0.5 mm lead pitch and a thermal pad underneath, so the PCB land pattern should follow the JEDEC PQFP208 recommendation. Use 4-layer stack-up with continuous power and ground planes to provide low-impedance return paths for the 147 I/O signals; this reduces simultaneous-switching-output (SSO) noise that can corrupt configuration. Allow at least 5 mm clearance around the device for the ByteBlaster header and probe access. Add a 4.7 kΩ pull-up on nCONFIG and a 1 kΩ pull-up on nSTATUS per Altera reference designs.
Route dedicated configuration pins (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) as short, single-ended traces away from switching I/O to avoid noise-induced configuration faults. Place the EPC2 configuration memory within 50 mm of the FPGA and route its signals on the same layer to minimize vias. For JTAG boundary-scan per IEEE 1149.1, daisy-chain TDI to TDO with 10 kΩ pull-ups on TCK, TMS, and TDI. Keep JTAG traces clear of clock domains above 50 MHz to prevent false triggering during in-system programming.
コンプライアンス情報
RoHS compliance inferred from the -N suffix per Altera/Intel part numbering convention. Halogen-free and conflict-minerals status not stated in the verified data.