EPF10K130EBC356-1N - 130K Gate FLEX-10KE FPGA, 356-BGA | Altera
部品番号: EPF10K130EBC356-1N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.4 | $324.00 |
| 100 | $25.9 | $2,590.00 |
| 500 | $21.75 | $10,875.00 |
| 1,000 | $18.2 | $18,200.00 |
EPF10K130EBC356-1N 概要
A field-programmable gate array (FPGA) is a reconfigurable logic IC that combines programmable logic fabric with optional embedded memory, multipliers, and high-speed transceivers, allowing digital designers to implement custom parallel datapaths, glue logic, and protocol bridges without spinning an ASIC. FPGAs occupy a tier above discrete logic and below custom silicon in the digital design hierarchy: FPGA -> programmable logic -> PLD -> semiconductor. The FLEX 10KE family was Altera's first embedded PLD line, embedding EAB RAM alongside the logic fabric so that designers can mix FIFO/dual-port memory with state machines on a single chip.
Key features of the EPF10K130EBC356-1N include 274 user I/O pins, 0.6 ns propagation delay, 333.33 MHz internal operation, IEEE Std. 1149.1-1990 JTAG boundary-scan support, and PCI Local Bus Specification Revision 2.2 compliance at 33 MHz or 66 MHz for 3.3 V operation. The embedded array blocks deliver 24,576 to 49,152 RAM bits depending on configuration, enabling on-chip buffering for communication pipelines. JTAG BST is built-in, consuming no additional logic resources, which simplifies board-level test.
Architecturally, the device combines a symmetrical logic-element array, column-based EAB RAM, and continuous routing channels with predictable delay. The -1 speed grade specifies timing closure at the slower end of the family envelope, simplifying static timing analysis at the cost of Fmax. PCI compliance at 33/66 MHz means the device meets the AC and DC requirements of Revision 2.2 of the PCI Local Bus Specification for both 3.3 V and 5.0 V signaling environments.
Typical applications include PCI interface bridges, industrial control glue logic, telecommunications backplane controllers, and embedded prototyping platforms where a high pin count and on-chip dual-port memory are valuable. The wide 274-I/O fan-out is well-suited to bus-intensive designs such as memory controllers and parallel data acquisition front-ends.
When designing with this device, ensure your board layout honors the LBGA-356 footprint's 1.0 mm ball pitch, route the JTAG chain to accessible test points, and verify that the Quartus II (or MAX+PLUS II) toolchain supports the -1N device ID before committing to the design. Consider the EAB-based memory architecture if you plan to instantiate large FIFOs or dual-port buffers.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes for legacy FLEX 10KE designs - information not consolidated on the manufacturer datasheet alone.
ドロップイン代替品: EPF10K130EBC356-1N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF10K130EBC356-1N （同一形状・フットプリント） — 相違点: Operating Temperature, Process Technology, Core Supply Voltage, Speed Grade, Package.
クイック比較ツール — 並列比較する代替部品を選択:
EPF10K130EBC356-3N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EPF10K130EBC356-3
✅ ドロップイン✓ 在庫あり
$35.2 / 個
データシートを見る →EPF10K130EBC356-1
✅ ドロップイン✓ 在庫あり
$95 / 個
データシートを見る →EPF10K130EBC356-2
✅ ドロップイン✓ 在庫あり
$185 / 個
データシートを見る →EPF10K130EBC356-1X
✅ ドロップイン✓ 在庫あり
$132 / 個
データシートを見る →EPF10K100EBC356-1N
✅ ドロップイン✓ 在庫あり
$108 / 個
データシートを見る →EPF10K130EBC356-1N 最大定格＆電気的特性
| Family | FLEX 10KE |
| Typical Gates | 130,000 |
| Logic Elements (LEs) | 6,656 |
| Total RAM Bits | 65,536 |
| User I/O Pins | 274 |
| パッケージ | 356-LBGA |
| Package Code | LBGA |
| Logic Family | CMOS |
| Process Technology | 0.22 µm |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V |
| Speed Grade | -1 |
| Propagation Delay | 0.6 ns |
| Maximum Internal Frequency | 333.33 MHz |
| 動作温度 | 0 °C to 70 °C (Commercial) |
| JTAG Boundary-Scan | IEEE Std. 1149.1-1990 compliant |
| PCI Compliance | PCI Local Bus Specification Rev. 2.2 (33/66 MHz, 3.3 V and 5.0 V) |
| 実装タイプ | Surface Mount |
EPF10K130EBC356-1N lbga ピン配置ガイド
EPF10K130EBC356-1N (lbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPF10K130EBC356-1N.
詳細は データシート をご参照ください。
主な用途
EPF10K130EBC356-1N の用途: 6 件s: PCI Bus Interface Bridge, Industrial Control and Glue Logic, Telecommunications Backplane Controller, Embedded Prototyping Platform, Legacy System Maintenance and Bridging, Data Acquisition Front-End.
PCI Bus Interface Bridge
The EPF10K130EBC356-1N is purpose-built for PCI Local Bus Revision 2.2 compliance at 33 MHz and 66 MHz, with built-in support for both 3.3 V and 5.0 V signaling. Its 274 user I/O pins give designers the bus fan-out required for 32-bit or 64-bit PCI data, address, and control signals plus side-band glue logic. The 6,656 logic elements comfortably absorb the state machines, parity generators, and target/initiator FIFOs typical of PCI bridge designs. Placed between a host CPU bus and a downstream peripheral, it consolidates what would otherwise require multiple discrete PLDs. Compared with a CPLD-only design, the FPGA fabric lets you extend the bridge with custom DMA engines or scatter-gather logic without changing silicon.
おすすめ
Industrial Control and Glue Logic
The wide 274-I/O count and on-chip EAB memory make the EPF10K130EBC356-1N a strong fit for industrial controllers where many discrete sensors, actuators, and bus interfaces must be aggregated. EAB blocks deliver dual-port RAM for inter-task message passing, while logic elements handle PID loops, encoder quadrature decoding, and fieldbus protocol state machines. Commercial temperature grade (0 °C to 70 °C) suits factory-floor enclosures with controlled climate. The -1 speed grade provides the broadest setup/hold margin for noisy industrial environments. Pair with opto-isolated I/O buffers for high-voltage motor control interfaces.
おすすめ
Telecommunications Backplane Controller
Telecom backplanes aggregate multiple serial links, clock domains, and switch-fabric fabrics - exactly the workload profile the EPF10K130EBC356-1N was designed for. Its 65536 bits of embedded RAM support small per-port FIFOs for rate-adaptation, while the 274 I/Os route parallel TDM buses, SPI/I2C management interfaces, and interrupt collectors. JTAG boundary-scan support (IEEE 1149.1-1990) simplifies board-level test on densely populated backplane PCBs. The -1 speed grade is adequate for sub-100 MHz backplane glue logic. Combined with external SERDES devices, this FPGA can glue multi-gigabit links without an ASIC.
おすすめ
Embedded Prototyping Platform
Engineers use the EPF10K130EBC356-1N as a flexible prototyping fabric for ASIC emulation, IP validation, and SoC bring-up. With 130,000 typical gates and EAB-based dual-port memory, it can host representative slices of a target ASIC well before mask commitment. Quartus II and MAX+PLUS II toolchains support FLEX 10KE, allowing bitstream-compatible design iteration. The 356-LBGA package exposes enough I/O for off-chip memory buses and high-speed probe headers. Once the design is verified, you can migrate to a structurally similar Cyclone or APEX device while reusing much of the RTL.
おすすめ
Legacy System Maintenance and Bridging
Many long-lifecycle industrial, medical, and aerospace products were designed around FLEX 10KE silicon. The EPF10K130EBC356-1N allows field-replacement and contract-manufactured rebuilds of those systems without requalifying an entirely new FPGA family. Its pin-compatible speed-grade variants let support engineers bin parts to match original timing budgets. The EAB memory preserves the original firmware's buffer and FIFO architecture. This part is a critical continuity-of-supply component for decades-old equipment where redesign is not economically viable.
おすすめ
Data Acquisition Front-End
Multi-channel data-acquisition boards benefit from the EPF10K130EBC356-1N's high I/O count and embedded dual-port memory for sample buffering. The 6,656 logic elements can implement channel multiplexing, triggering state machines, and digital signal conditioning in parallel. The 65,536 RAM bits accommodate small circular buffers per channel before DMA hand-off. The -1 speed grade comfortably meets typical 50-100 MHz sample-rate processing clocks. Pair with external high-speed ADCs and a downstream DSP or microcontroller for a complete acquisition pipeline.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF10K130EBC356-1N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF10K130EBC356-3N | EPF10K130EBC356-3 | EPF10K130EBC356-1 | EPF10K130EBC356-2 | EPF10K130EBC356-1X | EPF10K100EBC356-1N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 356-LBGA | 356-LBGA | 356-LBGA | 356-LBGA | 356-LBGA | 356-LBGA | 356-LBGA |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Typical Gates | 130,000 | 130,000 | 130,000 | 130,000 | 130,000 | 130,000 | 100,000 |
| Speed Grade | -1 | -3 (fastest) | -3 (fastest) | -1 | -2 (mid) | -1X (industrial temp) | -1 |
| Lead-Free (-N suffix) | Yes (-N) | Yes (-N) | No | No | No | No | Yes (-N) |
| Operating Temperature | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | -40 °C to +85 °C (Industrial) | 0 °C to 70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Faster speed-grade variant available in identical package （vs EPF10K130EBC356-3N)
- Lead-free terminal finish for RoHS assemblies （vs EPF10K130EBC356-1)
- Industrial-temperature variant available in same footprint （vs EPF10K130EBC356-1X)
- Lower-density option shares footprint for cost optimization （vs EPF10K100EBC356-1N)
設計ノート
The 356-LBGA package uses a 1.0 mm ball pitch on a 20x20 array (with depopulated corners) - approximately 35 mm x 35 mm body. Use a 4-layer or 6-layer PCB with continuous GND and PWR planes directly under the BGA to provide a low-impedance return path and thermal spreading. Escape the inner-row balls with microvia (0.1 mm) or dog-bone fan-out to inner signal layers. Keep all 274 I/O escapes within the BGA perimeter routing channels and avoid routing signals through the ball-grid array field.
The EPF10K130EBC356-1N requires a 2.5 V core supply and 3.3 V I/O supply, both of which must be decoupled with a bulk capacitor (typically 100 µF tantalum or polymer) and a network of 0.1 µF and 1 nF ceramics placed as close as possible to each supply pin. The -1 speed grade is the slowest and most power-friendly bin, but I/O switching current can still peak above 1 A on heavily loaded banks - use multiple VCCIO pins and decouple each bank individually. Power-on reset (POR) requires VCC to ramp monotonically before JTAG configuration begins.
The FLEX 10KE family is configured via JTAG or passive serial using MAX+PLUS II or Quartus II (legacy support) bitstreams - bitstream files for newer Cyclone or Stratix devices will not load. Do not assume modern Quartus Prime (post-v13.0) supports FLEX 10KE; use the legacy MAX+PLUS II 10.2 baseline or Quartus II 9.1 SP2. Also note that the -N suffix indicates Pb-free terminal finish but does not retroactively change the silicon - thermal and AC characteristics are identical to the non-N variant.
Differential-pair routing is not natively supported in FLEX 10KE I/O structures - use external LVDS driver/receiver parts if you need sub-nanosecond skew. For 66 MHz PCI, keep the PCI clock trace length-matched to within 100 mils of the PCI bus signals and maintain a 50 ohm controlled-impedance environment. Place the JTAG chain in a single daisy-chain across all programmable devices on the board, with TMS and TCK shared but TDI/TDO cascaded, and add a 10 kohm pull-up on TCK.
コンプライアンス情報
The -N suffix indicates Pb-free (lead-free) terminal finish, consistent with RoHS lead-free requirements. Formal RoHS, REACH, halogen-free, and conflict-minerals declarations were not present in the verified distributor data; consult the Intel/Altera legacy product compliance documentation for definitive statements.