EPF10K50VBC356-2N - FLEX 10K 50K-Gate FPGA | Intel | 356-BGA
部品番号: EPF10K50VBC356-2N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $399.83 | $399.83 |
| 10 | $377.2 | $3,772.00 |
| 100 | $355.85 | $35,585.00 |
| 500 | $335.71 | $167,855.00 |
| 1,000 | $316.7 | $316,700.00 |
EPF10K50VBC356-2N 概要
A FLEX 10K device is a class of programmable logic device (PLD) — a digital integrated circuit whose logic function and interconnect are defined after manufacturing by the end user. FPGAs sit in the broader hierarchy of programmable logic: PLD → CPLD → FPGA → System-on-Programmable-Chip (SOPC). The FLEX 10K family was notable for embedding an array block alongside logic elements, an early step toward modern heterogeneous FPGA fabrics that combine dedicated multipliers, block RAM, and processor cores. This positions the EPF10K50VBC356-2N as an SOPC-class device for gate-array density at relatively low power.
Key features include 50,000 typical gates, 2,880 logic cells, 20,480 typical bits of memory, 274 user I/Os, and 356-ball LBGA packaging. The device supports in-system programmability via SRAM configuration, allowing reconfigurable logic and rapid prototyping. It is built on a CMOS process with 3.3 V supply, making it suitable for mixed 5 V/3.3 V systems when paired with proper I/O buffering.
Typical applications include industrial control logic, glue logic replacement, custom bus interfaces, prototyping platforms, and embedded control where a moderate gate count is sufficient. The 356-BGA package and 0.42 µm process place this part in legacy designs that are still maintained in long-life-cycle systems such as factory automation controllers and telecom infrastructure.
When designing with this part, ensure your PCB layout accommodates the 1.27 mm BGA pitch and that decoupling capacitors are placed close to all supply balls. Note that FLEX 10K devices are largely NRND/EOL — verify current lifecycle status before new designs and plan obsolescence mitigation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EPF10K50VBC356-2N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF10K50VBC356-2N （同一形状・フットプリント） — 相違点: Speed Grade, Package, Operating Temperature, Process Technology, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EPF10K50VBC356-2
✅ ドロップイン✓ 在庫あり
$52.4 / 個
データシートを見る →EPF10K50VBC356-1N
✅ ドロップイン✓ 在庫あり
$162 / 個
データシートを見る →EPF10K50VBC356-3
✅ ドロップイン✓ 在庫あり
$22.15 / 個
データシートを見る →EPF10K50VBC356-2N 最大定格＆電気的特性
| Series | FLEX 10K |
| Family | FLEX 10K Embedded Programmable Logic Device Family |
| Logic Cells | 2,880 |
| Typical Gates | 50,000 |
| Total Memory Bits | 20,480 |
| User I/O | 274 |
| パッケージ | 356-LBGA |
| Internal Frequency | 66.67 MHz |
| Propagation Delay | 0.6 ns |
| Logic Family | CMOS |
| Process Technology | 0.42 µm |
| 電源電圧 | 3.3 V |
| 動作温度 | 0 °C to 70 °C (commercial) |
| 実装タイプ | Surface Mount |
| Speed Grade | -2 |
| Configuration | SRAM-based, in-system programmable |
| RoHS ステータス | Compliant |
EPF10K50VBC356-2N ピン構成
| ピン A1 | I/O — User I/O (bank-dependent) |
| ピン A19 | I/O — User I/O |
| ピン AF1 | I/O — User I/O |
| ピン AF19 | I/O — User I/O |
| ピン B1 | VCCINT — Core 3.3 V supply |
| ピン B19 | VCCINT — Core 3.3 V supply |
| ピン GND | GND — Ground (multiple balls) |
主な用途
EPF10K50VBC356-2N の用途: 6 件s: Industrial Control Logic, Glue Logic Replacement, Custom Bus Interface Bridging, ASIC Prototyping Platform, Embedded Control & State Machines, Telecom Infrastructure Legacy Systems.
Industrial Control Logic
The EPF10K50VBC356-2N suits industrial control logic with its 50,000 gates and 274 user I/Os. The 0.42 µm CMOS process at 3.3 V provides robust noise margins typical of factory-floor designs. The 356-LBGA package is well-suited to dense multi-axis motion controllers and PLC backplanes, where the 274 I/Os can absorb many discrete sensors and actuator drivers. Commercial 0–70 °C rating covers most factory cabinet environments, and SRAM-based in-system programmability allows field firmware updates over JTAG. Engineers should verify ambient temperature margin against cabinet internal temperatures, which can rise significantly when integrated with power stages.
おすすめ
Glue Logic Replacement
Replacing multiple PALs, GALs, and 74-series TTL with one EPF10K50VBC356-2N reduces board area and BOM count. The 2,880 logic cells comfortably absorb scattered combinational and sequential glue functions across buses, address decoding, and interrupt controllers. The 0.6 ns propagation delay per the verified web data enables sub-100 ns critical-path logic, fast enough for legacy 33 MHz PCI bus interfaces. The 3.3 V core interfaces directly with 3.3 V peripherals and 5 V logic through bus switches. Use Altera MAX+PLUS II or Quartus for legacy design capture.
おすすめ
Custom Bus Interface Bridging
The EPF10K50VBC356-2N bridges legacy parallel buses such as ISA, VME, or proprietary backplanes through its 274 user I/Os. The FLEX 10K embedded array supports bus-width conversion, byte-swapping, and protocol translation in a single device. With 66.67 MHz internal timing per the verified web data, the part can move 8-bit, 16-bit, or 32-bit data streams between asynchronous clock domains using dual-port RAM configurations. The 356-LBGA package allows fine-grained per-ball power/ground distribution, which simplifies signal-integrity layout for 50 MHz+ bus edges.
おすすめ
ASIC Prototyping Platform
With 50,000 gates and SRAM-based reconfigurability, the EPF10K50VBC356-2N is widely used as an ASIC prototyping vehicle for pre-silicon verification of mid-complexity designs. Engineers can validate RTL against real-world timing using the 0.6 ns propagation delay rating before committing to mask costs. The FLEX 10K embedded array integrates both fine-grained logic and coarse-grained memory blocks, mirroring the heterogeneous architecture of many ASICs. The 274 I/Os are sufficient to bring out an entire ASIC's peripheral pads for bench characterization.
おすすめ
Embedded Control & State Machines
The EPF10K50VBC356-2N serves embedded controllers requiring deterministic finite state machines — for example, motor commutation, sequencing for medical instruments, or test-equipment front panels. The 2,880 logic cells provide ample headroom for multi-state controllers plus peripheral glue, while 274 user I/Os accommodate the dense pin-out of stepper/servo interfaces. The 0.42 µm CMOS process is well-characterized for long-life industrial and medical platforms where 10–15 year field life is required. Verify FIT rate and MTBF with the manufacturer for safety-critical applications.
おすすめ
Telecom Infrastructure Legacy Systems
The EPF10K50VBC356-2N remains deployed in long-life telecom systems such as TDM cross-connects, base-station controllers, and access-multiplexer line cards designed in the late 1990s. Its 50K-gate density and 3.3 V core align with telecom-grade power architectures, while commercial temperature bin suits controlled-environment central offices. These systems are typically maintained for 15+ year service windows, where NRND parts like the EPF10K50VBC356-2N are still requested as service replacements. Engineer attention must focus on obsolescence risk and stocking strategy rather than redesign.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF10K50VBC356-2N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF10K50VBC356-2 | EPF10K50VBC356-1N | EPF10K50VBC356-3 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 356-LBGA | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same |
| Family | FLEX 10K | FLEX 10K - same | FLEX 10K - same | FLEX 10K - same |
| Typical Gates | 50,000 | 50,000 - same | 50,000 - same | 50,000 - same |
| Logic Cells | 2,880 | 2,880 - same | 2,880 - same | 2,880 - same |
| Speed Grade | -2 | -2 - same | -1 (slower) | -3 (slower) |
| User I/O | 274 | 274 - same | 274 - same | 274 - same |
| Internal Frequency | 66.67 MHz | 66.67 MHz - same | ~50 MHz (slower grade) | ~57 MHz (slower grade) |
| Operating Temperature | 0 °C to 70 °C | 0 °C to 70 °C - same | 0 °C to 70 °C - same | 0 °C to 70 °C - same |
主な差別化要因
- RoHS lead-free finish for modern assembly lines （vs EPF10K50VBC356-2)
- Faster speed grade than -3 variant （vs EPF10K50VBC356-3)
- Higher speed than -1 alternative variant （vs EPF10K50VBC356-1N)
設計ノート
The 356-ball LBGA package requires 1.27 mm-pitch PCB pad design with microvia or sub-via fanout. Place at least 8 dedicated VCCINT and GND balls with local 0.1 µF + 10 µF decoupling. Use a 4-layer stack-up with continuous GND plane beneath the BGA to control return paths for the 66.67 MHz internal clock and high-speed user I/Os. Avoid routing signal traces beneath the BGA escape region.
Estimated: at 3.3 V × 0.42 µm CMOS, typical FLEX 10K 50K-gate static current is around 10 mA per verified distributor data; dynamic current scales with toggle rate. Plan thermal relief assuming 0.5–2 W dissipation in typical designs. The 356-LBGA thermal resistance θJA is typically 18–25 °C/W with adequate PCB copper; derate ambient by 10–15 °C for sealed enclosures.
Do not confuse the -2N speed grade with the -2 industrial bin — the -N denotes lead-free finish, not industrial temperature. Do not assume JTAG pin compatibility with newer Altera/Intel families — the FLEX 10K uses 3.3 V JTAG with specific TCK/TMS/TDO/TDI pins. Always generate the configuration bitstream with MAX+PLUS II or Quartus II 9.1 (legacy), as modern Quartus no longer supports FLEX 10K.
コンプライアンス情報
RoHS compliant per 3achips listing; lead-free terminal finish confirmed by -N suffix. AEC-Q100 not applicable (commercial-grade FPGA, not automotive). Halogen-free and conflict-minerals status not stated in the verified web data.