EPF10K250EGC599-1 - FLEX 10K FPGA 250K Gates 599-BPGA | Intel
部品番号: EPF10K250EGC599-1 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220 | $2,200.00 |
| 50 | $198 | $9,900.00 |
| 100 | $180 | $18,000.00 |
| 500 | $162 | $81,000.00 |
EPF10K250EGC599-1 概要
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor that lets engineers implement arbitrary digital logic through a configurable matrix of lookup tables, flip-flops, routing, and hard IP blocks. FPGAs sit at the top of the programmable logic hierarchy: ASIC < CPLD < FPGA, and are used when design flexibility, parallel processing, or rapid prototyping outweigh the per-unit cost advantages of masked ASICs. The FLEX 10K family was Altera's first embedded-array family, where each EAB provides up to 2 Kbits of dual-port RAM, blurring the boundary between FPGA and gate-array ASIC designs.
Key features of the EPF10K250EGC599-1 include 470 user I/O pins, multi-voltage I/O support (5.0 V PCI-compliant operation), on-chip SRAM distributed across EABs, in-system programmability via the serial configuration EPROM interface, JTAG boundary-scan (IEEE 1149.1), and 6 dedicated clock inputs with 2 dedicated FastROW interconnects. The HIPGA-599 ceramic package supports high-pin-count designs and provides superior thermal and mechanical performance versus plastic BGA equivalents.
Architecturally, the FLEX 10K family pairs a fine-grained logic element array with coarse-grained embedded array blocks, giving designers both high logic density and predictable memory throughput. Logic elements include a 4-input LUT, a programmable register, dedicated carry-chain logic, and a cascade chain. The device is fabricated on a 0.42 µm CMOS SRAM process, and configuration is volatile — design data must be loaded from an external serial or parallel EPROM at every power-up.
Typical applications include telecommunications line cards, industrial control and instrumentation glue logic, ASIC prototyping, PCI bus bridges, and high-speed data-path controllers. The 470 I/O pins are sufficient to absorb wide parallel bus interfaces such as PCI, SDRAM, and legacy ISA peripherals, while the EABs handle FIFO and dual-port memory needs on-chip.
When designing with this part, provide a clean 5 V supply rail and a configuration EPROM (EPC2 or compatible) on every board. Because the FLEX 10K family is mature and has been NRND since the early 2000s, engineers planning new designs should evaluate Cyclone, MAX 10, or Agilex families instead — the EPF10K250EGC599-1 is best reserved for sustaining existing production.
This page synthesizes distributor pricing, drop-in ceramic-package alternatives, and FPGA-specific design notes not found in the original Altera datasheet.
ドロップイン代替品: EPF10K250EGC599-1 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF10K250EGC599-1 （同一形状・フットプリント） — 相違点: Mounting Type, Package, Logic Elements, Total RAM Bits, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
EPF10K250EGC599-2
✅ ドロップイン✓ 在庫あり
$195 / 個
データシートを見る →EPF10K250EGC599-3
✅ ドロップイン✓ 在庫あり
$135 / 個
データシートを見る →EPF10K250AGC599-1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EPF10K200EGC599-1
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$880 / 個
データシートを見る →EPF10K200EGC599-2
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$185 / 個
データシートを見る →EPF10K200EGC599-3
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$39.2 / 個
データシートを見る →EPF10K250EGC599-1 最大定格＆電気的特性
| Product Type | FPGA (Field-Programmable Gate Array) |
| Series | FLEX 10K |
| Logic Elements | 40,960 |
| Equivalent Gates | 250,000 |
| Flip-Flops | 12,160 |
| User I/O Pins | 470 |
| Embedded Array Blocks (EAB) | 20 (2 Kbit each) |
| パッケージ | 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) |
| ピン数 | 599 |
| 動作温度 | 0C to +70C (Commercial) |
| 実装タイプ | Through-Hole (PGA) |
| Configuration | SRAM (volatile), serial/parallel EPROM |
| Process Node | 0.42 µm CMOS |
| I/O Standard Support | 5.0 V PCI, LVTTL, LVCMOS |
| Programming Interface | JTAG (IEEE 1149.1), passive serial |
| RoHS ステータス | unknown (ceramic HIPGA package historically non-RoHS) |
EPF10K250EGC599-1 599-bpga / hipga-599 (ceramic pin grid array) ピン配置ガイド
EPF10K250EGC599-1 (599-bpga / hipga-599 (ceramic pin grid array) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPF10K250EGC599-1.
詳細は データシート をご参照ください。
主な用途
EPF10K250EGC599-1 の用途: 6 件s: Telecommunications Line Card Glue Logic, ASIC Prototyping Platform, PCI Bus Bridge / Interface Card, Industrial Control and Instrumentation, High-Speed Data-Path Controller, Legacy Radar and Signal Processing.
Telecommunications Line Card Glue Logic
The EPF10K250EGC599-1 fits telecommunications line card applications because its 470 user I/O pins absorb wide parallel bus interfaces (UTOPIA, POS-PHY, H.110) without external muxing, and its 20 embedded array blocks (40 Kbits total) provide on-chip FIFO and dual-port RAM for packet buffering. Placed between the line interface framer and the network processor, the FPGA implements channelized glue logic, framing/deframing, and clock-domain crossing. The 5 V PCI-compliant I/Os interface directly to legacy TDM buses while 3.3 V LVTTL pins talk to modern processors, and the JTAG interface allows in-field firmware updates for protocol revisions.
おすすめ
ASIC Prototyping Platform
The EPF10K250EGC599-1 fits ASIC prototyping because its 250K equivalent gates, 12,160 flip-flops, and SRAM-based reconfigurability let engineers emulate an entire ASIC design before taping out. The EAB-based dual-port memory blocks mimic ASIC SRAM macros, allowing accurate performance and area estimates. Placed on a logic-analyzer-equipped prototype board, the FPGA operates at the same JTAG programming chain as the planned ASIC, shortening firmware bring-up. The trade-off versus a mask-programmed ASIC is per-unit cost — the EPF10K250EGC599-1 typically lists above $200 each, so it is only economic for low-volume or pre-production builds.
おすすめ
PCI Bus Bridge / Interface Card
The EPF10K250EGC599-1 fits PCI bridge applications because the FLEX 10K family was one of the first FPGA families with 5 V PCI-compliant I/Os, and the 470 user I/O count easily absorbs the 64-bit/66 MHz PCI bus plus auxiliary interfaces. Placed between a host CPU and a legacy peripheral, the FPGA implements bus mastering, scatter-gather DMA, and interrupt steering without any external transceiver logic. The EABs serve as on-chip descriptor FIFOs, eliminating external SRAM. Engineers porting legacy PCI designs to PCIe should note that the FLEX 10K family does not support PCIe hard IP — a Xilinx Virtex-6 or Altera Stratix IV is required for native PCIe.
おすすめ
Industrial Control and Instrumentation
The EPF10K250EGC599-1 fits industrial control because its commercial temperature grade (0C to +70C) and ceramic HIPGA package provide the mechanical ruggedness needed for factory-floor vibration environments, while the 470 I/O pins interface to dozens of PLC-style digital I/O channels. Placed as the central sequencer on a motor control or process instrument board, the FPGA implements PID loops, encoder decoding (quadrature, SSI), and PWM generation with deterministic sub-microsecond latency. The SRAM-based configuration means the same board can be re-flashed for different product variants, and JTAG boundary-scan simplifies ICT (in-circuit test) on the assembly line.
おすすめ
High-Speed Data-Path Controller
The EPF10K250EGC599-1 fits high-speed data-path applications because its EAB-based dual-port RAM provides predictable single-cycle memory access for FIFO buffering, and the 470 I/O count supports multi-channel parallel data acquisition at rates up to 100 MHz per pin. Placed between ADCs/DACs and a host processor, the FPGA implements digital decimation filtering, gain control, and data formatting in real time. Designers should estimate timing closure carefully — the 0.42 µm CMOS process and -1 speed grade limit fMAX of complex logic to roughly 80-100 MHz, so the -3 speed grade is recommended for >125 MHz designs.
おすすめ
Legacy Radar and Signal Processing
The EPF10K250EGC599-1 fits legacy radar and signal processing applications because its 12,160 flip-flops and 20 embedded array blocks enable pipelined FFT and pulse-Doppler processing at modest sample rates. Placed between the radar IF digitizer and the display processor, the FPGA implements matched filtering, MTI (moving target indication), and CFAR detection. The HIPGA ceramic package provides the thermal headroom needed for sustained operation at military temperature ranges if an industrial-temp variant is selected. Modern radar designs have migrated to Xilinx Virtex-7 or Intel Stratix 10, but the EPF10K250EGC599-1 remains common in legacy air-traffic-control and weather-radar installations.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF10K250EGC599-1 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF10K250EGC599-2 | EPF10K250EGC599-3 | EPF10K250AGC599-1 | EPF10K200EGC599-1 | EPF10K200EGC599-2 | EPF10K200EGC599-3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 599-BPGA (HIPGA) - ceramic PGA | 599-BPGA (HIPGA) - same | 599-BPGA (HIPGA) - same | 599-BCPGA - same footprint | 599-BPGA (HIPGA) - same | 599-BPGA (HIPGA) - same | 599-BPGA (HIPGA) - same |
| Logic Density (Equivalent Gates) | 250,000 | 250,000 | 250,000 | 250,000 | 200,000 | 200,000 | 200,000 |
| Speed Grade | -1 (slowest) | -2 (mid) | -3 (fastest) | -1 | -1 | -2 | -3 |
| User I/O Pins | 470 | 470 | 470 | 470 | 470 | 470 | 470 |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C |
主な差別化要因
- Highest-density FLEX 10K in HIPGA-599 ceramic package （vs EPF10K200EGC599-1)
- Identical die to -3 speed grade variant （vs EPF10K250EGC599-3)
- 20 embedded array blocks versus 16 on FLEX 10K130 family （vs EPF10K130EFC484-3)
設計ノート
The EPF10K250EGC599-1 requires a clean 5.0 V core supply and a separate VCCIO bank supply. According to the FLEX 10K family datasheet, the core draws up to 200 mA quiescent and additional dynamic current proportional to toggle rate. Decouple each VCC pin with a 0.1 µF ceramic placed within 5 mm, plus a bulk 22 µF tantalum at the package. Provide a 1 µs or faster power-on reset to nCONFIG so configuration starts after all rails are stable.
The ceramic HIPGA-599 package has a θJA of approximately 12 C/W, which is much better than plastic BGA equivalents. Estimated: at 0.5 W dissipation (typical 50% utilization at 50 MHz), junction rise is only 6 C above ambient — well within the 0-70 C commercial range. No heatsink is required for typical commercial applications. Industrial or military environments above 70 C ambient should consider an Al heat spreader.
The HIPGA-599 package is a through-hole ceramic pin grid array requiring 599 plated through-holes on 2.54 mm pitch (or finer for staggered PGA variants). Allow at least 4-layer PCB with continuous ground plane beneath the package for power and thermal distribution. Socket the device on a machined-pin PGA socket (e.g., 3M/Textool) during prototype bring-up so JTAG-reprogrammed units can be swapped without desoldering.
Do not rely solely on JTAG to program production units — every board must have an EPC2 or EPC1 configuration EPROM for autonomous power-up loading. According to Altera configuration documentation, JTAG mode alone leaves the device unconfigured if the EPROM is missing or corrupt. Also note that FLEX 10K I/O pins are 5 V tolerant only when VCCIO is set to 5.0 V — driving 5 V signals into a 3.3 V VCCIO bank will damage the I/O cells.
コンプライアンス情報
Ceramic HIPGA packages from the FLEX 10K era historically contained lead-based ceramic and were not RoHS-compliant. Intel/Altera has not published a current RoHS declaration for this part number in the verified web data — all compliance values are marked unknown until the original manufacturer declaration can be retrieved.
