EPF10K250EGI599-3 - FLEX 10KE FPGA 250K Gates 599-PGA | Intel
部品番号: EPF10K250EGI599-3 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $222.75 | $111,375.00 |
| 1,000 | $198 | $198,000.00 |
EPF10K250EGI599-3 概要
What is an embedded PLD/FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor containing an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and dedicated I/O and memory resources. The FLEX 10KE family extends the original FLEX 10K architecture by adding embedded array blocks (EABs) for synchronous RAM and ROM functions, making the family suitable for high-density glue-logic, datapath, and system-on-chip prototyping. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital semiconductor ICs.
Key features include up to 12,160 logic elements, 40,960 RAM bits distributed across embedded array blocks (EABs), 488 maximum user I/O pins, and PCI-compliant I/O support. The device supports in-system configuration via passive serial, active serial, and JTAG modes, with multi-volt I/O capability for interfacing with 2.5 V, 3.3 V, and 5 V buses. The –3 speed grade delivers the shortest pin-to-pin propagation delays available in this family.
The FLEX 10KE family is built on a 0.25 µm CMOS SRAM process with a 2.5 V core. Configuration data is stored in SRAM cells, requiring a configuration EPROM or controller at every power-up. The architecture combines a fine-grained logic fabric (each LE = one 4-input LUT plus a flip-flop) with coarse-grained EABs of 2,048 bits each, allowing designers to balance random logic and dense memory in a single device.
Typical applications include high-speed telecommunications backplanes, industrial control and instrumentation, ASIC prototyping, DSP coprocessor interfaces, and legacy PCI-bus glue logic. The large logic capacity and rich memory resources make the EPF10K250E one of the most popular "workhorse" FPGAs of its generation, still in use in long-lifecycle industrial and military programs.
Designers should note that the 599-pin PGA package is a through-hole pin-grid-array that requires a socket or plated-through-hole PCB and is not compatible with modern lead-free surface-mount reflow profiles. Configuration memory is volatile: the device loses its bitstream on every power-down and must be reconfigured at boot via an EPC configuration EPROM, a microcontroller, or JTAG. Engineers targeting new designs should consider Cyclone IV/V or MAX 10 as modern, lower-power, surface-mount alternatives.
This page consolidates distributor pricing, same-brand drop-in alternatives from the FLEX 10KE family, and practical design notes not assembled in any single manufacturer datasheet, giving procurement and engineering teams a single decision-ready reference.
ドロップイン代替品: EPF10K250EGI599-3 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF10K250EGI599-3 （同一形状・フットプリント） — 相違点: Package, Mounting Type, Logic Elements, Speed Grade, Core Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
EPF10K250EGC599-3
✅ ドロップイン✓ 在庫あり
$135 / 個
データシートを見る →EPF10K250EGC599-2
✅ ドロップイン✓ 在庫あり
$195 / 個
データシートを見る →EPF10K250EGC599-1
✅ ドロップイン✓ 在庫あり
$162 / 個
データシートを見る →EPF10K250EGI599-3-3
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EPF10K200EGC599-3
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$39.2 / 個
データシートを見る →EPF10K250EGI599-3 最大定格＆電気的特性
| Series | FLEX 10KE |
| Family | FLEX 10K Embedded Programmable Logic Device |
| Logic Elements (LEs) | 12,160 |
| Typical Gates | 250,000 |
| Maximum User I/O | 488 |
| Embedded Array Blocks (EABs) | 20 |
| Total RAM Bits | 40,960 |
| Core Voltage | 2.5 V |
| Supply Voltage Range | 2.3 V min |
| Speed Grade | –3 |
| 動作温度 | –40 °C to +85 °C (Industrial) |
| パッケージ | PGA-599 |
| 実装タイプ | Through-Hole (PGA) |
| Process Technology | 0.25 µm CMOS, SRAM-based |
| Configuration Mode | Passive Serial, Active Serial, JTAG |
| RoHS ステータス | Non-RoHS Compliant |
EPF10K250EGI599-3 pga-599 ピン配置ガイド
EPF10K250EGI599-3 (pga-599 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPF10K250EGI599-3.
詳細は データシート をご参照ください。
主な用途
EPF10K250EGI599-3 の用途: 6 件s: Telecommunications Backplane Glue Logic, Industrial Process Control, ASIC Prototyping and Emulation, Legacy PCI Card Designs, Test and Measurement Instrumentation, Military and Aerospace Avionics (Legacy).
Telecommunications Backplane Glue Logic
The EPF10K250EGI599-3's 12,160 LEs and 488 user I/O pins make it ideal as a high-density bus-bridging device on legacy telecom backplanes. Its PCI-compliant I/O buffers interface cleanly to 33 MHz/66 MHz PCI segments, while the 20 EABs (40,960 RAM bits) provide on-chip FIFOs and look-up tables for serial-protocol converters. The industrial temperature rating and –3 speed grade deliver deterministic timing for TDM, HDLC, and ATM framers still in service.
おすすめ
Industrial Process Control
With 250K gates and the industrial –40 °C to +85 °C operating range, the EPF10K250EGI599-3 is widely deployed in PLCs, motor controllers, and SCADA I/O concentrators. Its EABs implement encoder counters, PWM generators, and motion-control state machines without external memory. The PGA-599 package supports rugged socketed designs for field-replaceable modules in long-lifecycle factory-automation programs where redesign is not economically viable.
おすすめ
ASIC Prototyping and Emulation
The 250K-gate capacity and rich interconnect make the EPF10K250EGI599-3 a classic ASIC prototyping vehicle for pre-silicon validation of mid-complexity ASICs. Engineers partition the design across the LEs and EABs, validate timing closure in Quartus II, and reuse the same bitstream through multiple silicon revisions. Multi-FPGA emulation boards of the late 1990s/2000s frequently stacked four or more EPF10K250E devices to reach 1 M-gate equivalent capacity.
おすすめ
Legacy PCI Card Designs
PCI Local Bus 2.1 compliance and the abundant I/O count allow the EPF10K250EGI599-3 to host a complete custom PCI target or master with DMA engines, scatter-gather tables, and local bus bridges. The 2.5 V core draws from the PCI rail's 3.3 V via an on-board LDO. Industrial-grade temperature screening and –3 timing margins keep these designs in production for medical-imaging and test-equipment OEMs with multi-decade support windows.
おすすめ
Test and Measurement Instrumentation
High-speed logic analyzers, protocol testers, and arbitrary waveform generators leverage the EPF10K250EGI599-3's 12,160 LEs to implement deep trigger sequencers and pattern generators. The EAB RAM bits (40,960) store captured waveforms and trigger masks, while the 488 I/Os drive parallel front-end ADCs and DACs. The –3 speed grade's tight tCO/tSU timing ensures repeatable sub-nanosecond jitter on comparator strobes in production ATE.
おすすめ
Military and Aerospace Avionics (Legacy)
Long-lifecycle avionics and naval programs continue to specify the EPF10K250EGI599-3 because the part was qualified under legacy MIL-PRF and DSCC drawings and its PGA-599 package survives the harsh vibration and thermal profiles of airborne platforms. New programs should still evaluate modern rad-tolerant FPGAs such as Microsemi RTG4 or Xilinx Virtex-5QV for new designs, but existing line-replaceable units benefit from the drop-in FLEX 10KE family.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF10K250EGI599-3 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF10K250EGC599-3 | EPF10K250EGC599-2 | EPF10K250EGC599-1 | EPF10K250EGI599-3-3 | EPF10K200EGC599-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | PGA-599 | PGA-599 (same) | PGA-599 (same) | PGA-599 (same) | PGA-599 (same) | PGA-599 (same) |
| Logic Elements | 12,160 | 12,160 | 12,160 | 12,160 | 12,160 | 9,984 (–18 %) |
| Typical Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 | 200,000 |
| Speed Grade | –3 | –3 (same) | –2 (slower) | –1 (slowest) | –3 (same) | –3 (same) |
| Operating Temperature | –40 °C to +85 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | –40 °C to +85 °C (Industrial) | 0 °C to +85 °C (Commercial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| RoHS Compliant | No | No | No | No | No | No |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
主な差別化要因
- Industrial temperature rating on the highest-density FLEX 10KE device （vs EPF10K250EGC599-3)
- Fastest speed grade (–3) for timing-critical logic （vs EPF10K250EGC599-2)
- Highest logic density in the FLEX 10KE family （vs EPF10K200EGC599-3)
設計ノート
Estimated: ICC for an EPF10K250E under typical utilization is approximately 200–300 mA on VCCINT (2.5 V), plus up to 1 A additional peak in-rush during configuration. Decouple each VCC/VCCINT pin with a 0.1 µF X7R ceramic plus a 10 µF tantalum bulk capacitor placed within 5 mm of the pin. Power sequencing is not strictly required, but holding nCONFIG low until the 2.5 V rail reaches 2.3 V prevents partial-configuration failures.
The 599-pin PGA package uses 5.08 mm pin pitch and is intended for through-hole socket mounting (e.g. 3M Textool or equivalent). Allocate a continuous ground plane beneath the device to provide a low-impedance return path for the high-speed I/O. Provide test points on JTAG (TCK/TMS/TDO/TDI) and nCONFIG/nSTATUS lines so engineers can re-program the device in-circuit during board bring-up.
Common pitfalls: (1) forgetting the configuration EPROM — the EPF10K250E is SRAM-based and loses its bitstream on every power-down; an EPC16, EPC8, EPC2, or external microcontroller must reload it; (2) mixing 5 V and 3.3 V I/O banks without proper VCCIO selection — each bank is independent and must be tied to the rail matching its peripheral; (3) overlooking the NCNR/NRND status — order a safety stock equal to 12 months of consumption before the part goes obsolete; (4) running Quartus II versions newer than 13.0, which no longer support FLEX 10KE.
Estimated: at 250 mA ICC and 2.5 V VCCINT, the EPF10K250E dissipates roughly 0.6 W at the core. Adding worst-case I/O switching on 488 pins can push total dissipation to 2–3 W. Mount the PGA socket with thermal compound to a metal backing plate or PCB copper pour to keep the junction temperature below 100 °C; the industrial-grade part is rated to 85 °C ambient with proper airflow of 200 LFM.
コンプライアンス情報
Non-RoHS tin-lead finish confirmed via Fly-wing Electronic distributor snippet (MIXED CMOS INDUSTRIAL Non-RoHS Compliant). FPGAs are not AEC-Q100 automotive qualified. Reach status assumed compliant per Intel product policy but exact REACH dossier was not in the verified data.
