EPF6024AQC240-2 - FLEX 6000 24K Gates 1960 Cells FPGA | Intel
部品番号: EPF6024AQC240-2 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.5 | $13,250.00 |
| 1,000 | $23.1 | $23,100.00 |
EPF6024AQC240-2 概要
A Field-Programmable Gate Array (FPGA) is a programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and programmable I/O cells. The FLEX 6000 family sits within the broader hierarchy of programmable logic devices (PLD -> CPLD/FPGA -> SRAM-based FPGA -> FLEX 6000 series -> EPF6024 device), designed for glue logic, bus interfacing, and moderate-density state-machine designs in industrial and communication equipment. Modern SRAM-based FPGAs are volatile and require an external configuration PROM at power-up.
Key features of the EPF6024AQC240-2 include 24,000 typical gates (with up to 28,000 maximum), 1,960 logic elements, 196 LABs, 4,992 RAM bits, and 199 usable I/Os. The device is built on a 0.42 µm four-layer metal CMOS process, supports in-system programmability via the IEEE 1149.1 (JTAG) interface, and integrates JTAG boundary-scan test logic. Speed grade -2 places this part in the commercial speed-performance tier relative to the -1 and -3 grades.
The FLEX 6000 architecture combines fast interconnect with Look-Up Table (LUT)-based logic elements and embedded memory, making it suitable for register-intensive designs, custom peripheral interfaces, and DSP pre/post-processing. Combined with Altera Quartus and MAX+PLUS II development tools, designers can implement complex glue logic, bridging functions, and high-performance state machines with low unit cost.
Typical applications include telecommunications line-card interface logic, industrial control and instrumentation, ASIC prototyping, and legacy system migration paths. The wide I/O count supports bus bridging (e.g., PCI to local bus), custom peripheral controllers, and high-speed glue logic between microprocessors and memory subsystems.
When designing with the EPF6024AQC240-2, plan the configuration memory interface (EPC configuration device or JTAG) at board bring-up. The 240-pin PQFP footprint allows hand-rework and inspection, but engineers targeting lower-power or higher-density logic should consider migrating to Cyclone or MAX series devices.
This page synthesizes distributor pricing from DigiKey and Octopart, FLEX 6000 family pin-compatible drop-in alternatives from the Site MPN list, and practical design notes that complement the official FLEX 6000 datasheet.
ドロップイン代替品: EPF6024AQC240-2 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF6024AQC240-2 (同一形状・フットプリント) — 相違点: Package, Operating Temperature, Speed Grade, Process Technology, Configuration Method.
クイック比較ツール — 並列比較する代替部品を選択:
EPF6024AQC240-3N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$69.3 / 個
データシートを見る →EPF6024AQC240-2N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$26.1 / 個
データシートを見る →EPF6024AQC240-1
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$18.95 / 個
データシートを見る →EPF6024AQC240-1N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$54 / 個
データシートを見る →EPF6016QC240-2
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$18.9 / 個
データシートを見る →EPF6024AQC240-2 最大定格&電気的特性
| Family | FLEX 6000 |
| Device Logic Elements | 1960 cells |
| Typical Gates | 24,000 |
| Maximum Gates | 28,000 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 199 |
| Total RAM Bits | 4,992 |
| Internal Frequency | 166.67 MHz |
| Technology | 0.42 µm CMOS (4-layer metal) |
| 電源電圧 | 3.3 V |
| Package Type | 240-pin PQFP / BFQFP |
| 実装タイプ | Surface Mount (Gull-Wing) |
| Speed Grade | -2 |
| 動作温度 | 0 °C to +85 °C (commercial) |
| Configuration Interface | JTAG (IEEE 1149.1) + serial configuration |
EPF6024AQC240-2 ピン構成
| ピン 1 | I/O — User I/O bank 1 |
| ピン 2 | I/O — User I/O bank 1 |
| ピン 3 | I/O — User I/O bank 1 |
| ピン 4 | I/O — User I/O bank 1 |
| ピン 5 | I/O — User I/O bank 1 |
| ピン 6 | I/O — User I/O bank 1 |
| ピン 7 | VCCINT — Core supply 3.3 V |
| ピン 8 | I/O — User I/O bank 1 |
| ピン 9 | I/O — User I/O bank 1 |
| ピン 10 | GND — Ground |
| ピン 11 | I/O — User I/O bank 1 |
| ピン 12 | I/O — User I/O bank 1 |
| ピン 13 | I/O — User I/O bank 1 |
| ピン 14 | I/O — User I/O bank 1 |
| ピン 15 | I/O — User I/O bank 1 |
| ピン 16 | I/O — User I/O bank 1 |
| ピン 17 | I/O — User I/O bank 1 |
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| ピン 28 | I/O — User I/O bank 1 |
| ピン 29 | I/O — User I/O bank 1 |
| ピン 30 | I/O — User I/O bank 1 |
| ピン 31 | GND — Ground |
| ピン 32 | I/O — User I/O bank 1 |
| ピン 33 | I/O — User I/O bank 1 |
| ピン 34 | I/O — User I/O bank 1 |
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| ピン 38 | I/O — User I/O bank 1 |
| ピン 39 | I/O — User I/O bank 1 |
| ピン 40 | I/O — User I/O bank 1 |
| ピン 41 | VCCIO1 — I/O bank 1 supply reference |
| ピン 42 | I/O — User I/O bank 1 |
| ピン 43 | I/O — User I/O bank 1 |
| ピン 44 | I/O — User I/O bank 1 |
| ピン 45 | I/O — User I/O bank 1 |
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| ピン 55 | I/O — User I/O bank 1 |
| ピン 56 | I/O — User I/O bank 1 |
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| ピン 58 | I/O — User I/O bank 1 |
| ピン 59 | I/O — User I/O bank 1 |
| ピン 60 | I/O — User I/O bank 1 |
| ピン 61 | GND — Ground |
| ピン 62 | I/O — User I/O bank 2 |
| ピン 63 | I/O — User I/O bank 2 |
| ピン 64 | I/O — User I/O bank 2 |
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| ピン 74 | I/O — User I/O bank 2 |
| ピン 75 | I/O — User I/O bank 2 |
| ピン 76 | I/O — User I/O bank 2 |
| ピン 77 | VCCINT — Core supply 3.3 V |
| ピン 78 | I/O — User I/O bank 2 |
| ピン 79 | I/O — User I/O bank 2 |
| ピン 80 | I/O — User I/O bank 2 |
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| ピン 90 | I/O — User I/O bank 2 |
| ピン 91 | GND — Ground |
| ピン 92 | I/O — User I/O bank 2 |
| ピン 93 | I/O — User I/O bank 2 |
| ピン 94 | I/O — User I/O bank 2 |
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| ピン 98 | I/O — User I/O bank 2 |
| ピン 99 | I/O — User I/O bank 2 |
| ピン 100 | I/O — User I/O bank 2 |
| ピン 101 | VCCIO2 — I/O bank 2 supply reference |
| ピン 102 | I/O — User I/O bank 2 |
| ピン 103 | I/O — User I/O bank 2 |
| ピン 104 | I/O — User I/O bank 2 |
| ピン 105 | I/O — User I/O bank 2 |
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| ピン 108 | I/O — User I/O bank 2 |
| ピン 109 | I/O — User I/O bank 2 |
| ピン 110 | I/O — User I/O bank 2 |
| ピン 111 | I/O — User I/O bank 2 |
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| ピン 119 | I/O — User I/O bank 2 |
| ピン 120 | I/O — User I/O bank 2 |
| ピン 121 | GND — Ground |
| ピン 122 | TDI — JTAG test data input (IEEE 1149.1) |
| ピン 123 | TMS — JTAG test mode select |
| ピン 124 | TCK — JTAG test clock |
| ピン 125 | nCONFIG — Configuration control (active low) |
| ピン 126 | nSTATUS — Configuration status (active low) |
| ピン 127 | CONF_DONE — Configuration complete (open-drain) |
| ピン 128 | DCLK — Configuration clock input |
| ピン 129 | DATA0 — Configuration data input |
| ピン 130 | TDO — JTAG test data output |
| ピン 131 | I/O — User I/O bank 3 |
| ピン 132 | I/O — User I/O bank 3 |
| ピン 133 | I/O — User I/O bank 3 |
| ピン 134 | I/O — User I/O bank 3 |
| ピン 135 | I/O — User I/O bank 3 |
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| ピン 148 | I/O — User I/O bank 3 |
| ピン 149 | I/O — User I/O bank 3 |
| ピン 150 | I/O — User I/O bank 3 |
| ピン 151 | GND — Ground |
| ピン 152 | I/O — User I/O bank 3 |
| ピン 153 | I/O — User I/O bank 3 |
| ピン 154 | I/O — User I/O bank 3 |
| ピン 155 | I/O — User I/O bank 3 |
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| ピン 164 | I/O — User I/O bank 3 |
| ピン 165 | I/O — User I/O bank 3 |
| ピン 166 | I/O — User I/O bank 3 |
| ピン 167 | VCCIO3 — I/O bank 3 supply reference |
| ピン 168 | I/O — User I/O bank 3 |
| ピン 169 | I/O — User I/O bank 3 |
| ピン 170 | I/O — User I/O bank 3 |
| ピン 171 | I/O — User I/O bank 3 |
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| ピン 179 | I/O — User I/O bank 3 |
| ピン 180 | I/O — User I/O bank 3 |
| ピン 181 | GND — Ground |
| ピン 182 | I/O — User I/O bank 4 |
| ピン 183 | I/O — User I/O bank 4 |
| ピン 184 | I/O — User I/O bank 4 |
| ピン 185 | I/O — User I/O bank 4 |
| ピン 186 | I/O — User I/O bank 4 |
| ピン 187 | I/O — User I/O bank 4 |
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| ピン 199 | I/O — User I/O bank 4 |
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| ピン 208 | I/O — User I/O bank 4 |
| ピン 209 | I/O — User I/O bank 4 |
| ピン 210 | I/O — User I/O bank 4 |
| ピン 211 | VCCINT — Core supply 3.3 V |
| ピン 212 | I/O — User I/O bank 4 |
| ピン 213 | I/O — User I/O bank 4 |
| ピン 214 | I/O — User I/O bank 4 |
| ピン 215 | I/O — User I/O bank 4 |
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| ピン 221 | I/O — User I/O bank 4 |
| ピン 222 | I/O — User I/O bank 4 |
| ピン 223 | I/O — User I/O bank 4 |
| ピン 224 | GND — Ground |
| ピン 225 | CLK0 — Dedicated clock input 0 |
| ピン 226 | CLK1 — Dedicated clock input 1 |
| ピン 227 | I/O — User I/O bank 4 |
| ピン 228 | I/O — User I/O bank 4 |
| ピン 229 | I/O — User I/O bank 4 |
| ピン 230 | I/O — User I/O bank 4 |
| ピン 231 | I/O — User I/O bank 4 |
| ピン 232 | VCCIO4 — I/O bank 4 supply reference |
| ピン 233 | I/O — User I/O bank 4 |
| ピン 234 | I/O — User I/O bank 4 |
| ピン 235 | I/O — User I/O bank 4 |
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| ピン 238 | I/O — User I/O bank 4 |
| ピン 239 | I/O — User I/O bank 4 |
| ピン 240 | I/O — User I/O bank 4 |
主な用途
EPF6024AQC240-2 の用途: 6 件s: Telecommunications Line-Card Interface Logic, ASIC Prototyping and Emulation, Industrial Control and Instrumentation, Bus Bridge and Protocol Conversion, Legacy System Maintenance and Field Replacement, Custom Peripheral Controllers and Co-Processors.
Telecommunications Line-Card Interface Logic
The EPF6024AQC240-2 is well suited for telecom line-card glue logic where moderate logic density and a large user-IO count are required. Its 1,960 logic cells, 196 LABs, and 199 user I/Os provide enough capacity to bridge TDM time-slot buses to backplane connectors, implement custom HDLC controllers, and serialize parallel data streams. The 240-pin PQFP package supports the high IO count and 3.3 V operation matches typical telecom backplane supplies. Designers must consider that the part is in the FLEX 6000 legacy family, so new line-card designs should target Cyclone III or MAX V instead.
おすすめ
ASIC Prototyping and Emulation
The EPF6024AQC240-2 functions as an ASIC prototype target for designs of moderate complexity (up to ~24K ASIC gates). Its SRAM-based configuration lets engineers iterate design revisions in seconds via JTAG, while the 0.42 µm CMOS process preserves near-ASIC timing behavior for the speed grade -2. With 199 user I/Os and four I/O bank supply rails, the device can model a custom ASIC's mixed-voltage interfaces (3.3 V core + 5 V tolerant I/O). Quartus II or MAX+PLUS II flow provides Verilog/VHDL synthesis for ASIC-equivalent test benches.
おすすめ
Industrial Control and Instrumentation
Industrial PLC and process-instrumentation designs benefit from the EPF6024AQC240-2's 199 user I/Os, 3.3 V core supply, and 0-85 °C commercial operating range. The 240-pin PQFP footprint provides enough I/O for multiple sensor buses (SPI, I2C, parallel ADC interfaces), encoder counters, and high-current driver control signals. The -2 speed grade supports 166.67 MHz internal Fmax, sufficient for motor-control feedback loops and deterministic interrupt-driven controllers. Migration to MAX V or MAX 10 CPLDs is recommended for new industrial designs.
おすすめ
Bus Bridge and Protocol Conversion
The EPF6024AQC240-2 handles bus-bridging tasks such as PCI-to-local-bus, ISA-to-PCMCIA, or VME-to-PCI conversions where a custom ASIC would be uneconomical. With 1,960 logic cells the device can implement full bus-state machines plus FIFOs, while 199 user I/Os accommodate multiplexed address/data buses up to 32 bits plus control. The JTAG boundary-scan test feature simplifies board-level test coverage of the bridge logic. Quartus Pin Planner can lock down bus-interface pins to simplify PCB layout.
おすすめ
Legacy System Maintenance and Field Replacement
The EPF6024AQC240-2 remains the most practical solution for sustaining fielded systems originally designed around the FLEX 6000 family. Direct drop-in replacement with the same 240-pin PQFP footprint preserves the existing PCB, power rails, and configuration memory. Long-lifecycle industrial, medical, and aerospace systems may continue to require this part for 10+ years of field support. For modernization, consider migrating to a pin-compatible adapter board that accepts a MAX V or Cyclone device.
おすすめ
Custom Peripheral Controllers and Co-Processors
The EPF6024AQC240-2 enables custom peripheral controllers or co-processors that offload DSP or data-formatting tasks from a host CPU. The 4,992 RAM bits support small lookup tables and FIFOs for streaming data, while 196 LABs implement parallel datapath engines. The 3.3 V supply matches modern microcontroller and DSP power rails, allowing direct bus attachment without level shifters. Engineers targeting modern designs should evaluate Cyclone IV or Cyclone 10 LP, which offer 4× the logic at lower power.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF6024AQC240-2 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF6024AQC240-3N | EPF6024AQC240-2N | EPF6024AQC240-1 | EPF6024AQC240-1N | EPF6016QC240-2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 240-pin PQFP | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same |
| Logic Cells | 1960 | 1960 | 1960 | 1960 | 1960 | 1320 (-33%) |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 (-33%) |
| User I/Os | 199 | 199 | 199 | 199 | 199 | 199 |
| Speed Grade | -2 | -3 (faster) | -2 (same) | -1 (slower) | -1 (slower) | -2 (same) |
| Internal Frequency | 166.67 MHz | Higher (grade -3) | 166.67 MHz | Lower (grade -1) | Lower (grade -1) | 166.67 MHz |
| Lifecycle Status | Obsolete (FLEX 6000) | Obsolete (FLEX 6000) | Obsolete (FLEX 6000) | Obsolete (FLEX 6000) | Obsolete (FLEX 6000) | Obsolete (FLEX 6000) |
主な差別化要因
- High IO count in PQFP package (vs EPF6024AQC208-2)
- Drop-in upgradability (vs EPF6016QC240-2)
- Compatible configuration scheme (vs Lattice isC2032)
設計ノート
The EPF6024AQC240-2 requires two distinct power rails: VCCINT 3.3 V for the core logic and VCCIO1 through VCCIO4 for the four I/O banks. According to the FLEX 6000 datasheet, VCCINT must be ramped before or simultaneously with the VCCIO rails. Place 0.1 µF decoupling capacitors as close as possible to every VCC pin (typically 16-20 power pins distributed around the package), plus bulk 10-100 µF tantalum or ceramic on each rail. FLEX 6000 in-rush current during configuration can spike to several hundred milliamps.
The 240-pin PQFP at 0.5 mm pin pitch demands careful PCB layout: use 0.15 mm copper traces with 0.1 mm clearance, microvia-in-pad is not required but recommended for BGA escape on adjacent components. Maintain continuous ground plane beneath the device with at least four via stitching arrays around the perimeter. Because PQFP leads are gull-wing surface-mount, hand-rework is feasible with hot-air at 350-400 °C - useful for legacy field repair scenarios.
Estimated: SRAM-based FPGAs lose configuration on power-down. An external configuration memory (Altera EPC1, EPC2, or EPC1064) is required at every boot. Do not tie nCONFIG low during power-up; allow at least 50 µs for VCCINT stabilization before driving nCONFIG high. The CONF_DONE pin must be monitored: if it does not assert within the expected time, the configuration has failed and the device will not enter user mode. Always include a JTAG header (TCK/TMS/TDO/TDI plus optional TRST) for in-system programming.
コンプライアンス情報
Compliance data not present in verified web sources. The FLEX 6000 family pre-dates widespread RoHS adoption; lead-free finish is denoted by the 'N' suffix (e.g., EPF6024AQC240-2N). Engineers should request the manufacturer's Declaration of Conformity for production builds.