EPF6024AQC240-2 - FLEX 6000 24K Gates 1960 Cells FPGA | Intel
N.º da peça: EPF6024AQC240-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.8 | $2.980,00 |
| 500 | $26.5 | $13.250,00 |
| 1.000 | $23.1 | $23.100,00 |
EPF6024AQC240-2 Visão geral
A Field-Programmable Gate Array (FPGA) is a programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and programmable I/O cells. The FLEX 6000 family sits within the broader hierarchy of programmable logic devices (PLD -> CPLD/FPGA -> SRAM-based FPGA -> FLEX 6000 series -> EPF6024 device), designed for glue logic, bus interfacing, and moderate-density state-machine designs in industrial and communication equipment. Modern SRAM-based FPGAs are volatile and require an external configuration PROM at power-up.
Key features of the EPF6024AQC240-2 include 24,000 typical gates (with up to 28,000 maximum), 1,960 logic elements, 196 LABs, 4,992 RAM bits, and 199 usable I/Os. The device is built on a 0.42 µm four-layer metal CMOS process, supports in-system programmability via the IEEE 1149.1 (JTAG) interface, and integrates JTAG boundary-scan test logic. Speed grade -2 places this part in the commercial speed-performance tier relative to the -1 and -3 grades.
The FLEX 6000 architecture combines fast interconnect with Look-Up Table (LUT)-based logic elements and embedded memory, making it suitable for register-intensive designs, custom peripheral interfaces, and DSP pre/post-processing. Combined with Altera Quartus and MAX+PLUS II development tools, designers can implement complex glue logic, bridging functions, and high-performance state machines with low unit cost.
Typical applications include telecommunications line-card interface logic, industrial control and instrumentation, ASIC prototyping, and legacy system migration paths. The wide I/O count supports bus bridging (e.g., PCI to local bus), custom peripheral controllers, and high-speed glue logic between microprocessors and memory subsystems.
When designing with the EPF6024AQC240-2, plan the configuration memory interface (EPC configuration device or JTAG) at board bring-up. The 240-pin PQFP footprint allows hand-rework and inspection, but engineers targeting lower-power or higher-density logic should consider migrating to Cyclone or MAX series devices.
This page synthesizes distributor pricing from DigiKey and Octopart, FLEX 6000 family pin-compatible drop-in alternatives from the Site MPN list, and practical design notes that complement the official FLEX 6000 datasheet.
Alternativas drop-in para EPF6024AQC240-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6024AQC240-2 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Speed Grade, Process Technology, Configuration Method.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6024AQC240-3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$69.3 / unidade
Ver ficha técnica →EPF6024AQC240-2N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$26.1 / unidade
Ver ficha técnica →EPF6024AQC240-1
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$18.95 / unidade
Ver ficha técnica →EPF6024AQC240-1N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$54 / unidade
Ver ficha técnica →EPF6016QC240-2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$18.9 / unidade
Ver ficha técnica →EPF6024AQC240-2 Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Device Logic Elements | 1960 cells |
| Typical Gates | 24,000 |
| Maximum Gates | 28,000 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 199 |
| Total RAM Bits | 4,992 |
| Internal Frequency | 166.67 MHz |
| Technology | 0.42 µm CMOS (4-layer metal) |
| Tensão de alimentação | 3.3 V |
| Package Type | 240-pin PQFP / BFQFP |
| Tipo de montagem | Surface Mount (Gull-Wing) |
| Speed Grade | -2 |
| Temperatura de operação | 0 °C to +85 °C (commercial) |
| Configuration Interface | JTAG (IEEE 1149.1) + serial configuration |
Configuração de pinos do EPF6024AQC240-2
| Pino 1 | I/O — User I/O bank 1 |
| Pino 2 | I/O — User I/O bank 1 |
| Pino 3 | I/O — User I/O bank 1 |
| Pino 4 | I/O — User I/O bank 1 |
| Pino 5 | I/O — User I/O bank 1 |
| Pino 6 | I/O — User I/O bank 1 |
| Pino 7 | VCCINT — Core supply 3.3 V |
| Pino 8 | I/O — User I/O bank 1 |
| Pino 9 | I/O — User I/O bank 1 |
| Pino 10 | GND — Ground |
| Pino 11 | I/O — User I/O bank 1 |
| Pino 12 | I/O — User I/O bank 1 |
| Pino 13 | I/O — User I/O bank 1 |
| Pino 14 | I/O — User I/O bank 1 |
| Pino 15 | I/O — User I/O bank 1 |
| Pino 16 | I/O — User I/O bank 1 |
| Pino 17 | I/O — User I/O bank 1 |
| Pino 18 | I/O — User I/O bank 1 |
| Pino 19 | I/O — User I/O bank 1 |
| Pino 20 | I/O — User I/O bank 1 |
| Pino 21 | I/O — User I/O bank 1 |
| Pino 22 | I/O — User I/O bank 1 |
| Pino 23 | I/O — User I/O bank 1 |
| Pino 24 | I/O — User I/O bank 1 |
| Pino 25 | I/O — User I/O bank 1 |
| Pino 26 | I/O — User I/O bank 1 |
| Pino 27 | I/O — User I/O bank 1 |
| Pino 28 | I/O — User I/O bank 1 |
| Pino 29 | I/O — User I/O bank 1 |
| Pino 30 | I/O — User I/O bank 1 |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — User I/O bank 1 |
| Pino 33 | I/O — User I/O bank 1 |
| Pino 34 | I/O — User I/O bank 1 |
| Pino 35 | I/O — User I/O bank 1 |
| Pino 36 | I/O — User I/O bank 1 |
| Pino 37 | I/O — User I/O bank 1 |
| Pino 38 | I/O — User I/O bank 1 |
| Pino 39 | I/O — User I/O bank 1 |
| Pino 40 | I/O — User I/O bank 1 |
| Pino 41 | VCCIO1 — I/O bank 1 supply reference |
| Pino 42 | I/O — User I/O bank 1 |
| Pino 43 | I/O — User I/O bank 1 |
| Pino 44 | I/O — User I/O bank 1 |
| Pino 45 | I/O — User I/O bank 1 |
| Pino 46 | I/O — User I/O bank 1 |
| Pino 47 | I/O — User I/O bank 1 |
| Pino 48 | I/O — User I/O bank 1 |
| Pino 49 | I/O — User I/O bank 1 |
| Pino 50 | I/O — User I/O bank 1 |
| Pino 51 | I/O — User I/O bank 1 |
| Pino 52 | I/O — User I/O bank 1 |
| Pino 53 | I/O — User I/O bank 1 |
| Pino 54 | I/O — User I/O bank 1 |
| Pino 55 | I/O — User I/O bank 1 |
| Pino 56 | I/O — User I/O bank 1 |
| Pino 57 | I/O — User I/O bank 1 |
| Pino 58 | I/O — User I/O bank 1 |
| Pino 59 | I/O — User I/O bank 1 |
| Pino 60 | I/O — User I/O bank 1 |
| Pino 61 | GND — Ground |
| Pino 62 | I/O — User I/O bank 2 |
| Pino 63 | I/O — User I/O bank 2 |
| Pino 64 | I/O — User I/O bank 2 |
| Pino 65 | I/O — User I/O bank 2 |
| Pino 66 | I/O — User I/O bank 2 |
| Pino 67 | I/O — User I/O bank 2 |
| Pino 68 | I/O — User I/O bank 2 |
| Pino 69 | I/O — User I/O bank 2 |
| Pino 70 | I/O — User I/O bank 2 |
| Pino 71 | I/O — User I/O bank 2 |
| Pino 72 | I/O — User I/O bank 2 |
| Pino 73 | I/O — User I/O bank 2 |
| Pino 74 | I/O — User I/O bank 2 |
| Pino 75 | I/O — User I/O bank 2 |
| Pino 76 | I/O — User I/O bank 2 |
| Pino 77 | VCCINT — Core supply 3.3 V |
| Pino 78 | I/O — User I/O bank 2 |
| Pino 79 | I/O — User I/O bank 2 |
| Pino 80 | I/O — User I/O bank 2 |
| Pino 81 | I/O — User I/O bank 2 |
| Pino 82 | I/O — User I/O bank 2 |
| Pino 83 | I/O — User I/O bank 2 |
| Pino 84 | I/O — User I/O bank 2 |
| Pino 85 | I/O — User I/O bank 2 |
| Pino 86 | I/O — User I/O bank 2 |
| Pino 87 | I/O — User I/O bank 2 |
| Pino 88 | I/O — User I/O bank 2 |
| Pino 89 | I/O — User I/O bank 2 |
| Pino 90 | I/O — User I/O bank 2 |
| Pino 91 | GND — Ground |
| Pino 92 | I/O — User I/O bank 2 |
| Pino 93 | I/O — User I/O bank 2 |
| Pino 94 | I/O — User I/O bank 2 |
| Pino 95 | I/O — User I/O bank 2 |
| Pino 96 | I/O — User I/O bank 2 |
| Pino 97 | I/O — User I/O bank 2 |
| Pino 98 | I/O — User I/O bank 2 |
| Pino 99 | I/O — User I/O bank 2 |
| Pino 100 | I/O — User I/O bank 2 |
| Pino 101 | VCCIO2 — I/O bank 2 supply reference |
| Pino 102 | I/O — User I/O bank 2 |
| Pino 103 | I/O — User I/O bank 2 |
| Pino 104 | I/O — User I/O bank 2 |
| Pino 105 | I/O — User I/O bank 2 |
| Pino 106 | I/O — User I/O bank 2 |
| Pino 107 | I/O — User I/O bank 2 |
| Pino 108 | I/O — User I/O bank 2 |
| Pino 109 | I/O — User I/O bank 2 |
| Pino 110 | I/O — User I/O bank 2 |
| Pino 111 | I/O — User I/O bank 2 |
| Pino 112 | I/O — User I/O bank 2 |
| Pino 113 | I/O — User I/O bank 2 |
| Pino 114 | I/O — User I/O bank 2 |
| Pino 115 | I/O — User I/O bank 2 |
| Pino 116 | I/O — User I/O bank 2 |
| Pino 117 | I/O — User I/O bank 2 |
| Pino 118 | I/O — User I/O bank 2 |
| Pino 119 | I/O — User I/O bank 2 |
| Pino 120 | I/O — User I/O bank 2 |
| Pino 121 | GND — Ground |
| Pino 122 | TDI — JTAG test data input (IEEE 1149.1) |
| Pino 123 | TMS — JTAG test mode select |
| Pino 124 | TCK — JTAG test clock |
| Pino 125 | nCONFIG — Configuration control (active low) |
| Pino 126 | nSTATUS — Configuration status (active low) |
| Pino 127 | CONF_DONE — Configuration complete (open-drain) |
| Pino 128 | DCLK — Configuration clock input |
| Pino 129 | DATA0 — Configuration data input |
| Pino 130 | TDO — JTAG test data output |
| Pino 131 | I/O — User I/O bank 3 |
| Pino 132 | I/O — User I/O bank 3 |
| Pino 133 | I/O — User I/O bank 3 |
| Pino 134 | I/O — User I/O bank 3 |
| Pino 135 | I/O — User I/O bank 3 |
| Pino 136 | I/O — User I/O bank 3 |
| Pino 137 | I/O — User I/O bank 3 |
| Pino 138 | I/O — User I/O bank 3 |
| Pino 139 | I/O — User I/O bank 3 |
| Pino 140 | I/O — User I/O bank 3 |
| Pino 141 | I/O — User I/O bank 3 |
| Pino 142 | I/O — User I/O bank 3 |
| Pino 143 | I/O — User I/O bank 3 |
| Pino 144 | I/O — User I/O bank 3 |
| Pino 145 | I/O — User I/O bank 3 |
| Pino 146 | I/O — User I/O bank 3 |
| Pino 147 | I/O — User I/O bank 3 |
| Pino 148 | I/O — User I/O bank 3 |
| Pino 149 | I/O — User I/O bank 3 |
| Pino 150 | I/O — User I/O bank 3 |
| Pino 151 | GND — Ground |
| Pino 152 | I/O — User I/O bank 3 |
| Pino 153 | I/O — User I/O bank 3 |
| Pino 154 | I/O — User I/O bank 3 |
| Pino 155 | I/O — User I/O bank 3 |
| Pino 156 | I/O — User I/O bank 3 |
| Pino 157 | I/O — User I/O bank 3 |
| Pino 158 | I/O — User I/O bank 3 |
| Pino 159 | I/O — User I/O bank 3 |
| Pino 160 | I/O — User I/O bank 3 |
| Pino 161 | I/O — User I/O bank 3 |
| Pino 162 | I/O — User I/O bank 3 |
| Pino 163 | I/O — User I/O bank 3 |
| Pino 164 | I/O — User I/O bank 3 |
| Pino 165 | I/O — User I/O bank 3 |
| Pino 166 | I/O — User I/O bank 3 |
| Pino 167 | VCCIO3 — I/O bank 3 supply reference |
| Pino 168 | I/O — User I/O bank 3 |
| Pino 169 | I/O — User I/O bank 3 |
| Pino 170 | I/O — User I/O bank 3 |
| Pino 171 | I/O — User I/O bank 3 |
| Pino 172 | I/O — User I/O bank 3 |
| Pino 173 | I/O — User I/O bank 3 |
| Pino 174 | I/O — User I/O bank 3 |
| Pino 175 | I/O — User I/O bank 3 |
| Pino 176 | I/O — User I/O bank 3 |
| Pino 177 | I/O — User I/O bank 3 |
| Pino 178 | I/O — User I/O bank 3 |
| Pino 179 | I/O — User I/O bank 3 |
| Pino 180 | I/O — User I/O bank 3 |
| Pino 181 | GND — Ground |
| Pino 182 | I/O — User I/O bank 4 |
| Pino 183 | I/O — User I/O bank 4 |
| Pino 184 | I/O — User I/O bank 4 |
| Pino 185 | I/O — User I/O bank 4 |
| Pino 186 | I/O — User I/O bank 4 |
| Pino 187 | I/O — User I/O bank 4 |
| Pino 188 | I/O — User I/O bank 4 |
| Pino 189 | I/O — User I/O bank 4 |
| Pino 190 | I/O — User I/O bank 4 |
| Pino 191 | I/O — User I/O bank 4 |
| Pino 192 | I/O — User I/O bank 4 |
| Pino 193 | I/O — User I/O bank 4 |
| Pino 194 | I/O — User I/O bank 4 |
| Pino 195 | I/O — User I/O bank 4 |
| Pino 196 | I/O — User I/O bank 4 |
| Pino 197 | I/O — User I/O bank 4 |
| Pino 198 | I/O — User I/O bank 4 |
| Pino 199 | I/O — User I/O bank 4 |
| Pino 200 | I/O — User I/O bank 4 |
| Pino 201 | I/O — User I/O bank 4 |
| Pino 202 | I/O — User I/O bank 4 |
| Pino 203 | I/O — User I/O bank 4 |
| Pino 204 | I/O — User I/O bank 4 |
| Pino 205 | I/O — User I/O bank 4 |
| Pino 206 | I/O — User I/O bank 4 |
| Pino 207 | I/O — User I/O bank 4 |
| Pino 208 | I/O — User I/O bank 4 |
| Pino 209 | I/O — User I/O bank 4 |
| Pino 210 | I/O — User I/O bank 4 |
| Pino 211 | VCCINT — Core supply 3.3 V |
| Pino 212 | I/O — User I/O bank 4 |
| Pino 213 | I/O — User I/O bank 4 |
| Pino 214 | I/O — User I/O bank 4 |
| Pino 215 | I/O — User I/O bank 4 |
| Pino 216 | I/O — User I/O bank 4 |
| Pino 217 | I/O — User I/O bank 4 |
| Pino 218 | I/O — User I/O bank 4 |
| Pino 219 | I/O — User I/O bank 4 |
| Pino 220 | I/O — User I/O bank 4 |
| Pino 221 | I/O — User I/O bank 4 |
| Pino 222 | I/O — User I/O bank 4 |
| Pino 223 | I/O — User I/O bank 4 |
| Pino 224 | GND — Ground |
| Pino 225 | CLK0 — Dedicated clock input 0 |
| Pino 226 | CLK1 — Dedicated clock input 1 |
| Pino 227 | I/O — User I/O bank 4 |
| Pino 228 | I/O — User I/O bank 4 |
| Pino 229 | I/O — User I/O bank 4 |
| Pino 230 | I/O — User I/O bank 4 |
| Pino 231 | I/O — User I/O bank 4 |
| Pino 232 | VCCIO4 — I/O bank 4 supply reference |
| Pino 233 | I/O — User I/O bank 4 |
| Pino 234 | I/O — User I/O bank 4 |
| Pino 235 | I/O — User I/O bank 4 |
| Pino 236 | I/O — User I/O bank 4 |
| Pino 237 | I/O — User I/O bank 4 |
| Pino 238 | I/O — User I/O bank 4 |
| Pino 239 | I/O — User I/O bank 4 |
| Pino 240 | I/O — User I/O bank 4 |
Aplicações típicas
EPF6024AQC240-2 é adequado para 6 aplicaçãos: Telecommunications Line-Card Interface Logic, ASIC Prototyping and Emulation, Industrial Control and Instrumentation, Bus Bridge and Protocol Conversion, Legacy System Maintenance and Field Replacement, Custom Peripheral Controllers and Co-Processors.
Telecommunications Line-Card Interface Logic
The EPF6024AQC240-2 is well suited for telecom line-card glue logic where moderate logic density and a large user-IO count are required. Its 1,960 logic cells, 196 LABs, and 199 user I/Os provide enough capacity to bridge TDM time-slot buses to backplane connectors, implement custom HDLC controllers, and serialize parallel data streams. The 240-pin PQFP package supports the high IO count and 3.3 V operation matches typical telecom backplane supplies. Designers must consider that the part is in the FLEX 6000 legacy family, so new line-card designs should target Cyclone III or MAX V instead.
Recomendado
ASIC Prototyping and Emulation
The EPF6024AQC240-2 functions as an ASIC prototype target for designs of moderate complexity (up to ~24K ASIC gates). Its SRAM-based configuration lets engineers iterate design revisions in seconds via JTAG, while the 0.42 µm CMOS process preserves near-ASIC timing behavior for the speed grade -2. With 199 user I/Os and four I/O bank supply rails, the device can model a custom ASIC's mixed-voltage interfaces (3.3 V core + 5 V tolerant I/O). Quartus II or MAX+PLUS II flow provides Verilog/VHDL synthesis for ASIC-equivalent test benches.
Recomendado
Industrial Control and Instrumentation
Industrial PLC and process-instrumentation designs benefit from the EPF6024AQC240-2's 199 user I/Os, 3.3 V core supply, and 0-85 °C commercial operating range. The 240-pin PQFP footprint provides enough I/O for multiple sensor buses (SPI, I2C, parallel ADC interfaces), encoder counters, and high-current driver control signals. The -2 speed grade supports 166.67 MHz internal Fmax, sufficient for motor-control feedback loops and deterministic interrupt-driven controllers. Migration to MAX V or MAX 10 CPLDs is recommended for new industrial designs.
Recomendado
Bus Bridge and Protocol Conversion
The EPF6024AQC240-2 handles bus-bridging tasks such as PCI-to-local-bus, ISA-to-PCMCIA, or VME-to-PCI conversions where a custom ASIC would be uneconomical. With 1,960 logic cells the device can implement full bus-state machines plus FIFOs, while 199 user I/Os accommodate multiplexed address/data buses up to 32 bits plus control. The JTAG boundary-scan test feature simplifies board-level test coverage of the bridge logic. Quartus Pin Planner can lock down bus-interface pins to simplify PCB layout.
Recomendado
Legacy System Maintenance and Field Replacement
The EPF6024AQC240-2 remains the most practical solution for sustaining fielded systems originally designed around the FLEX 6000 family. Direct drop-in replacement with the same 240-pin PQFP footprint preserves the existing PCB, power rails, and configuration memory. Long-lifecycle industrial, medical, and aerospace systems may continue to require this part for 10+ years of field support. For modernization, consider migrating to a pin-compatible adapter board that accepts a MAX V or Cyclone device.
Recomendado
Custom Peripheral Controllers and Co-Processors
The EPF6024AQC240-2 enables custom peripheral controllers or co-processors that offload DSP or data-formatting tasks from a host CPU. The 4,992 RAM bits support small lookup tables and FIFOs for streaming data, while 196 LABs implement parallel datapath engines. The 3.3 V supply matches modern microcontroller and DSP power rails, allowing direct bus attachment without level shifters. Engineers targeting modern designs should evaluate Cyclone IV or Cyclone 10 LP, which offer 4× the logic at lower power.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6024AQC240-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6024AQC240-3N | EPF6024AQC240-2N | EPF6024AQC240-1 | EPF6024AQC240-1N | EPF6016QC240-2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 240-pin PQFP | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same |
| Logic Cells | 1960 | 1960 | 1960 | 1960 | 1960 | 1320 (-33%) |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 (-33%) |
| User I/Os | 199 | 199 | 199 | 199 | 199 | 199 |
| Speed Grade | -2 | -3 (faster) | -2 (same) | -1 (slower) | -1 (slower) | -2 (same) |
| Internal Frequency | 166.67 MHz | Higher (grade -3) | 166.67 MHz | Lower (grade -1) | Lower (grade -1) | 166.67 MHz |
| Lifecycle Status | Obsolete (FLEX 6000) | Obsolete (FLEX 6000) | Obsolete (FLEX 6000) | Obsolete (FLEX 6000) | Obsolete (FLEX 6000) | Obsolete (FLEX 6000) |
Principais diferenciais
- High IO count in PQFP package (vs EPF6024AQC208-2)
- Drop-in upgradability (vs EPF6016QC240-2)
- Compatible configuration scheme (vs Lattice isC2032)
Notas de projeto
The EPF6024AQC240-2 requires two distinct power rails: VCCINT 3.3 V for the core logic and VCCIO1 through VCCIO4 for the four I/O banks. According to the FLEX 6000 datasheet, VCCINT must be ramped before or simultaneously with the VCCIO rails. Place 0.1 µF decoupling capacitors as close as possible to every VCC pin (typically 16-20 power pins distributed around the package), plus bulk 10-100 µF tantalum or ceramic on each rail. FLEX 6000 in-rush current during configuration can spike to several hundred milliamps.
The 240-pin PQFP at 0.5 mm pin pitch demands careful PCB layout: use 0.15 mm copper traces with 0.1 mm clearance, microvia-in-pad is not required but recommended for BGA escape on adjacent components. Maintain continuous ground plane beneath the device with at least four via stitching arrays around the perimeter. Because PQFP leads are gull-wing surface-mount, hand-rework is feasible with hot-air at 350-400 °C - useful for legacy field repair scenarios.
Estimated: SRAM-based FPGAs lose configuration on power-down. An external configuration memory (Altera EPC1, EPC2, or EPC1064) is required at every boot. Do not tie nCONFIG low during power-up; allow at least 50 µs for VCCINT stabilization before driving nCONFIG high. The CONF_DONE pin must be monitored: if it does not assert within the expected time, the configuration has failed and the device will not enter user mode. Always include a JTAG header (TCK/TMS/TDO/TDI plus optional TRST) for in-system programming.
Informações de conformidade
Compliance data not present in verified web sources. The FLEX 6000 family pre-dates widespread RoHS adoption; lead-free finish is denoted by the 'N' suffix (e.g., EPF6024AQC240-2N). Engineers should request the manufacturer's Declaration of Conformity for production builds.