Altera

EPF6024ATC144-3N - 24K Gates FLEX 6000 FPGA, 144-LQFP | Altera / Intel

部品番号: EPF6024ATC144-3N ✗ 生産終了

在庫あり 1〜3営業日以内に発送

3.3 V Vdss 144-pin LQFP (TQFP, 1.4 mm height) Package 142.86 MHz Speed

開始価格 $21.4 USD / 個

MOQ: 1 |

価格更新日: 2026-09-11

ボリューム価格

数量	単価	小計
1	$38.5	$38.50
10	$34.2	$342.00
100	$28.75	$2,875.00
500	$24.1	$12,050.00
1,000	$21.4	$21,400.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

EPF6024ATC144-3N 概要

The Altera (now Intel) EPF6024ATC144-3N is a member of the FLEX 6000 family of Field-Programmable Gate Array (FPGA) devices, delivering 24,000 typical gates and 1,960 logic elements in a 144-pin LQFP surface-mount package. It is fabricated on a 0.42 µm CMOS process and operates from a 3.3 V core supply with user I/O banks that support 3.3 V and 5.0 V mixed-voltage interfacing. The device provides 117 user I/O pins, 196 Logic Array Blocks (LABs), and an internal performance grade supporting up to 142.86 MHz (speed grade -3).

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the architecture of gate arrays with user-programmable interconnect and logic resources. FPGAs sit at the top of the programmable logic hierarchy: simple PLD -> CPLD -> FPGA -> SoC FPGA. They are widely used for glue logic, custom state machines, bus interfacing, and pre-silicon prototyping where ASIC NRE costs are not justified. The FLEX 6000 series was Altera's low-cost, SRAM-based family optimized for high-volume, cost-sensitive designs such as consumer electronics, peripheral controllers, and industrial glue logic.

Key features of the EPF6024ATC144-3N include 196 LABs each containing 16 Logic Elements (LEs), dedicated carry chains for fast arithmetic, a Cascade Chain for wide fan-in logic, embedded SRAM via the Configurable Logic Array (CLA) architecture, and JTAG-based IEEE 1149.1 boundary-scan support. The device supports in-system configuration via the Passive Serial (PS), Passive Parallel Synchronous (PPS), and Passive Parallel Asynchronous (PPA) modes. MultiVolt I/O allows each I/O bank to be powered independently at 3.3 V or 5.0 V for mixed-voltage designs.

Architecturally, the FLEX 6000 family uses a continuous, SRAM-based routing fabric (FastTrack Interconnect) that delivers predictable timing across the device. The 0.42 µm four-metal-layer process, combined with the LUT-based logic element, makes the EPF6024ATC144-3N suitable for designs requiring up to ~16,000 usable gates. Configuration data is stored in an external serial or parallel PROM (EPC1, EPC2, EPC16) and loaded on power-up; the device can also be reconfigured in-system for design updates or field upgrades.

Typical applications include peripheral bus bridging (PCI, ISA, VME), custom peripheral controllers in telecom line cards, industrial glue logic, glue and bridging logic in legacy system designs, low-cost DSP co-processing front-ends, and prototyping platforms for ASIC emulation. The 144-LQFP footprint is friendly to standard SMT assembly lines and 4-layer FR-4 PCB designs, making it ideal for cost-driven production where fine-pitch BGA rework is undesirable.

When designing with the EPF6024ATC144-3N, pay attention to I/O bank voltage grouping. The VCCINT pins must connect to a tightly-decoupled 3.3 V rail, while VCCIO pins can be grouped per-bank at 3.3 V or 5.0 V. Unused I/O pins should be left floating or driven to a defined logic level after configuration. This device is now obsolete per Intel/Altera lifecycle; consider the MAX II or Cyclone series for new designs, but verify pin-by-pin compatibility before swapping.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers an actionable reference for sourcing the EPF6024ATC144-3N and qualifying alternates for obsolete-stock designs.

ドロップイン代替品: EPF6024ATC144-3N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EPF6024ATC144-3N （同一形状・フットプリント） — 相違点: Package, Process Technology, Operating Temperature, Speed Grade, Configuration Memory.

EPF6016ATC144-3N

Intel

Package: TQFP-144

Process Technology: 0.42 micron CMOS

Operating Temperature: Commercial (0C to +70C)

比較対象 EPF6024ATC144-3N →

EPF6024ATC144

Altera

Package: 144-pin LQFP

Process Technology: 0.42 µm CMOS

Configuration Memory: SRAM-based (volatile)

比較対象 EPF6024ATC144-3N →

EPF6024ATC144-10

Altera

Package: 144-LQFP

Speed Grade: -10

Configuration Memory: SRAM

比較対象 EPF6024ATC144-3N →

EPF6024ATC144-10N

Altera

Package: 144-pin TQFP (T144)

Process Technology: 5 V CMOS, SRAM-based

Operating Temperature: 0 C to +70 C (commercial)

比較対象 EPF6024ATC144-3N →

EPF6024ATC144-13

Altera

Package: 144-pin LQFP (TQFP)

Process Technology: 0.42 µm CMOS

Operating Temperature: -40C to +85C (commercial/industrial)

比較対象 EPF6024ATC144-3N →

EPF6024ATC144-1N

Intel

Process Technology: 0.42 µm CMOS, SRAM-based

Operating Temperature: 0°C to +85°C (commercial, -1N grade)

Speed Grade: -1 (fastest for TQFP-144)

比較対象 EPF6024ATC144-3N →

EPF6024ATC144-23

Altera

Package: TQFP-144

Process Technology: 0.42 um CMOS, SRAM-based

Speed Grade: -23 (combined speed/temperature suffix)

比較対象 EPF6024ATC144-3N →

EPF6024ATC144-2N

Intel

Package: 144-pin TQFP (TQFP-144)

Process Technology: 0.42 µm CMOS SRAM

Operating Temperature: 0°C to +85°C (Commercial)

比較対象 EPF6024ATC144-3N →

EPF6024ATC144-3

Intel

Package: 144-LQFP (TQFP)

Process Technology: 0.42 µm CMOS SRAM

Operating Temperature: 0 °C to +85 °C (commercial)

比較対象 EPF6024ATC144-3N →

EPF6024ATC144-3S

Intel

Process Technology: 0.42 µm CMOS

Configuration Memory: SRAM

比較対象 EPF6024ATC144-3N →

EPF6024ATC144-4

Altera

Package: 144-pin TQFP (TQFP-144)

Process Technology: 0.42 µm CMOS SRAM

Operating Temperature: -40°C to +85°C (Industrial)

比較対象 EPF6024ATC144-3N →

✅ ドロップイン

Intel

📦 144-LQFP

FLEX 6000 · OptiFLEX · 1,320 · 132 · 16,000 gates · 117 · 142.86 MHz · 0.42 micron CMOS

✓ 在庫あり

$12.4 / 個

データシートを見る →

EPF6024ATC144-3N 最大定格＆電気的特性

Family	FLEX 6000
Typical Gates	24,000
Logic Elements / Cells	1,960
Logic Array Blocks (LABs)	196
User I/Os	117
Process Technology	0.42 um CMOS, 4 metal layers
Core Supply Voltage (VCCINT)	3.3 V
I/O Supply Voltage (VCCIO)	3.3 V or 5.0 V (per bank, MultiVolt)
動作温度	0 °C to 85 °C (TJ)
Internal Frequency (max)	142.86 MHz
パッケージ	144-pin LQFP (TQFP, 1.4 mm height)
実装タイプ	Surface Mount
Configuration Mode	Passive Serial / Passive Parallel Synchronous / Passive Parallel Asynchronous
JTAG Support	IEEE Std 1149.1 boundary-scan
ライフサイクル状態	Obsolete

EPF6024ATC144-3N ピン構成

ピン 1	GND — Ground
ピン 2	I/O — User I/O pin
ピン 3	I/O — User I/O pin
ピン 4	I/O — User I/O pin
ピン 5	I/O — User I/O pin
ピン 6	I/O — User I/O pin
ピン 7	I/O — User I/O pin
ピン 8	I/O — User I/O pin
ピン 9	I/O — User I/O pin
ピン 10	I/O — User I/O pin
ピン 11	I/O — User I/O pin
ピン 12	I/O — User I/O pin
ピン 13	GND — Ground
ピン 14	I/O — User I/O pin
ピン 15	I/O — User I/O pin
ピン 16	I/O — User I/O pin
ピン 17	VCCIO — I/O bank supply voltage (3.3 V or 5.0 V)
ピン 18	I/O — User I/O pin
ピン 19	I/O — User I/O pin
ピン 20	I/O — User I/O pin
ピン 21	I/O — User I/O pin
ピン 22	I/O — User I/O pin
ピン 23	I/O — User I/O pin
ピン 24	I/O — User I/O pin
ピン 25	I/O — User I/O pin
ピン 26	I/O — User I/O pin
ピン 27	GND — Ground
ピン 28	I/O — User I/O pin
ピン 29	I/O — User I/O pin
ピン 30	I/O — User I/O pin
ピン 31	I/O — User I/O pin
ピン 32	I/O — User I/O pin
ピン 33	I/O — User I/O pin
ピン 34	I/O — User I/O pin
ピン 35	I/O — User I/O pin
ピン 36	VCCIO — I/O bank supply voltage (3.3 V or 5.0 V)
ピン 37	I/O — User I/O pin
ピン 38	I/O — User I/O pin
ピン 39	I/O — User I/O pin
ピン 40	I/O — User I/O pin
ピン 41	GND — Ground
ピン 42	I/O — User I/O pin
ピン 43	I/O — User I/O pin
ピン 44	I/O — User I/O pin
ピン 45	I/O — User I/O pin
ピン 46	I/O — User I/O pin
ピン 47	I/O — User I/O pin
ピン 48	I/O — User I/O pin
ピン 49	I/O — User I/O pin
ピン 50	I/O — User I/O pin
ピン 51	I/O — User I/O pin
ピン 52	VCCINT — Core supply voltage (3.3 V)
ピン 53	I/O — User I/O pin
ピン 54	I/O — User I/O pin
ピン 55	I/O — User I/O pin
ピン 56	I/O — User I/O pin
ピン 57	I/O — User I/O pin
ピン 58	GND — Ground
ピン 59	I/O — User I/O pin
ピン 60	I/O — User I/O pin
ピン 61	I/O — User I/O pin
ピン 62	I/O — User I/O pin
ピン 63	I/O — User I/O pin
ピン 64	I/O — User I/O pin
ピン 65	I/O — User I/O pin
ピン 66	I/O — User I/O pin
ピン 67	I/O — User I/O pin
ピン 68	I/O — User I/O pin
ピン 69	VCCIO — I/O bank supply voltage (3.3 V or 5.0 V)
ピン 70	I/O — User I/O pin
ピン 71	I/O — User I/O pin
ピン 72	GND — Ground
ピン 73	I/O — User I/O pin
ピン 74	I/O — User I/O pin
ピン 75	I/O — User I/O pin
ピン 76	I/O — User I/O pin
ピン 77	I/O — User I/O pin
ピン 78	I/O — User I/O pin
ピン 79	I/O — User I/O pin
ピン 80	I/O — User I/O pin
ピン 81	I/O — User I/O pin
ピン 82	I/O — User I/O pin
ピン 83	I/O — User I/O pin
ピン 84	I/O — User I/O pin
ピン 85	I/O — User I/O pin
ピン 86	I/O — User I/O pin
ピン 87	VCCINT — Core supply voltage (3.3 V)
ピン 88	I/O — User I/O pin
ピン 89	I/O — User I/O pin
ピン 90	GND — Ground
ピン 91	I/O — User I/O pin
ピン 92	I/O — User I/O pin
ピン 93	I/O — User I/O pin
ピン 94	I/O — User I/O pin
ピン 95	I/O — User I/O pin
ピン 96	I/O — User I/O pin
ピン 97	I/O — User I/O pin
ピン 98	I/O — User I/O pin
ピン 99	I/O — User I/O pin
ピン 100	I/O — User I/O pin
ピン 101	VCCIO — I/O bank supply voltage (3.3 V or 5.0 V)
ピン 102	I/O — User I/O pin
ピン 103	I/O — User I/O pin
ピン 104	I/O — User I/O pin
ピン 105	I/O — User I/O pin
ピン 106	GND — Ground
ピン 107	I/O — User I/O pin
ピン 108	I/O — User I/O pin
ピン 109	I/O — User I/O pin
ピン 110	I/O — User I/O pin
ピン 111	I/O — User I/O pin
ピン 112	I/O — User I/O pin
ピン 113	I/O — User I/O pin
ピン 114	I/O — User I/O pin
ピン 115	I/O — User I/O pin
ピン 116	I/O — User I/O pin
ピン 117	VCCINT — Core supply voltage (3.3 V)
ピン 118	I/O — User I/O pin
ピン 119	I/O — User I/O pin
ピン 120	GND — Ground
ピン 121	CLK1 — Dedicated global clock input 1
ピン 122	CLK0 — Dedicated global clock input 0
ピン 123	MSEL2 — Configuration mode select bit 2
ピン 124	MSEL1 — Configuration mode select bit 1
ピン 125	MSEL0 — Configuration mode select bit 0
ピン 126	nCONFIG — Configuration start (active low)
ピン 127	nSTATUS — Configuration status (active low)
ピン 128	CONF_DONE — Configuration complete indicator
ピン 129	TDI — JTAG Test Data In
ピン 130	TMS — JTAG Test Mode Select
ピン 131	TCK — JTAG Test Clock
ピン 132	TDO — JTAG Test Data Out
ピン 133	DEV_OE — Device-wide output enable (active low)
ピン 134	DEV_CLRn — Device-wide register clear (active low)
ピン 135	INIT — Configuration initialization indicator
ピン 136	DATA0 — Configuration data input bit 0
ピン 137	DATA1 — Configuration data input bit 1
ピン 138	DATA2 — Configuration data input bit 2
ピン 139	DATA3 — Configuration data input bit 3
ピン 140	DATA4 — Configuration data input bit 4
ピン 141	DATA5 — Configuration data input bit 5
ピン 142	DATA6 — Configuration data input bit 6
ピン 143	DATA7 — Configuration data input bit 7
ピン 144	VCCIO — I/O bank supply voltage (3.3 V or 5.0 V)

主な用途

EPF6024ATC144-3N の用途: 6 件s: Peripheral Bus Bridge / Glue Logic, Industrial Glue Logic and Control, Telecom Line Card Interface Logic, ASIC Prototyping and Emulation, Legacy System Refresh / Field Upgrade, Test & Measurement Front-End Logic.

🌐

Peripheral Bus Bridge / Glue Logic

The EPF6024ATC144-3N's 1,960 logic elements and 117 user I/Os make it well-suited for legacy peripheral bus bridging (PCI-to-ISA, VME, ISA-to-Local Bus) where ASIC NRE is unjustified. The MultiVolt I/O banks allow direct 3.3 V and 5.0 V interfacing without external level shifters, simplifying mixed-voltage bridges. Designers typically instantiate address decode, wait-state generation, and interrupt steering inside the FPGA, offloading these functions from the host CPU. The 142.86 MHz Fmax on speed grade -3 supports bus frequencies up to ~33 MHz with comfortable timing margin. Estimated: at 50% LE utilization, routing congestion is moderate and fmax holds at >100 MHz. This part obsoletes cleanly into the Cyclone series for new designs but remains useful for legacy field upgrades.

おすすめ

🔧

Industrial Glue Logic and Control

Factory automation controllers often require custom state machines, encoder interfaces, and motor-control timing that do not fit standard CPLDs. The EPF6024ATC144-3N provides 1,960 LEs across 196 LABs with dedicated carry chains for fast up/down counters, plus the 144-LQFP footprint that is friendly to 4-layer FR-4 PCB assembly. The 0.42 µm CMOS process and 3.3 V core are robust in industrial temperature ranges when derated, though the commercial 0-85 °C TJ spec limits deployment to controlled-cabinet environments. Estimated: typical glue-logic designs run at 25-50% LE utilization with clock rates below 50 MHz, well within the part's capability. For new designs, the MAX II CPLD EPM240 offers lower power in a smaller footprint.

おすすめ

EPM240T100C5N · Intel EPF6016ATC144-3N · Intel EPC2LC20 · Altera

🌐

Telecom Line Card Interface Logic

Telecom line cards historically used FLEX 6000 FPGAs for TDM bus multiplexing, framer interfacing, and alarm/status aggregation. The EPF6024ATC144-3N's 117 user I/Os provide ample connections for multiple E1/T1 framers, HDLC controllers, and backplane serial links in one device. The 144-LQFP package's 0.5 mm lead pitch is compatible with conventional wave and reflow soldering, simplifying line-card assembly lines that pre-date fine-pitch BGAs. The FLEX 6000 SRAM-based configuration allows field upgrades via JTAG without removing the line card, a key operational benefit. Estimated: a typical line-card interface design uses ~1,500 LEs with 60-80 MHz clock rates; the -3 speed grade delivers comfortable timing margin. The part is obsolete today but remains in legacy telecom deployments.

おすすめ

DS21Q48 (E1/T1 framer companion) EPF6024ATC144-2N · Intel EPC16 (16-Mbit configuration PROM for in-system updates)

🖥️

ASIC Prototyping and Emulation

Before committing to a mask-set ASIC, design teams often prototype their RTL on FLEX 6000 FPGAs to validate functionality and timing in real silicon. The EPF6024ATC144-3N provides 24,000 gates / 1,960 LEs that can host medium-complexity subsystems such as a custom DMA engine, peripheral controller, or DSP datapath. Configuration via Passive Serial mode allows fast design-iteration cycles when paired with an EPC2 or EPC16 configuration PROM. Estimated: a typical ASIC prototype fits within 70% LE utilization if synthesis tools target the FLEX 6000 architecture properly; Fmax typically reaches 70-80% of the datasheet number after place-and-route. Multiple EPF6024 devices can be cascaded for larger designs via dedicated carry/cascade chains.

おすすめ

EPC2LC20 · Altera EPF10K50VRC240-3 · Intel EPF6024ATC144-2N · Intel

🔧

Legacy System Refresh / Field Upgrade

Long-lifecycle industrial, military, and aerospace systems often need functional drop-in replacements for obsolete FPGAs to extend service life. The EPF6024ATC144-3N and its same-package variants (EPF6024ATC144-2N, EPF6024ATC144-1N) enable direct board-level replacement without PCB rework. The 'N' suffix indicates lead-free RoHS-compliant terminal finish, matching modern assembly requirements, while the non-N variant supports older SnPb processes. Designers must verify configuration bitstream compatibility across speed grades when substituting. Estimated: configuration bitstream for speed grade -3 typically works on -2 and -1 silicon with timing-only performance differences. This same-package family of alternatives simplifies end-of-life component sourcing.

おすすめ

EPF6024ATC144-3 · Intel EPF6024ATC144-2N · Intel EPF6016ATC144-3N · Intel

🔬

Test & Measurement Front-End Logic

Test equipment front-ends use FPGAs to implement custom trigger logic, pattern generators, and data formatters before the ADC stage. The EPF6024ATC144-3N's 117 user I/Os interface directly to multiple parallel ADC/DAC channels and trigger comparators, while the 1,960 LEs host state-machine sequencing and pattern memory addressing. MultiVolt I/O allows direct interfacing to 5.0 V analog front-ends without level translation. Estimated: a typical pattern-generator design uses ~1,200 LEs with 100 MHz internal clocks; the -3 speed grade supports the 100 MHz target with comfortable margin. The 144-LQFP package is hand-solderable for low-volume prototype builds, a benefit in lab environments where BGA rework stations are unavailable.

おすすめ

AD9220 (12-bit ADC companion) EPF6024ATC144-2N · Intel EPC2LC20 · Altera

おすすめ製品の概要

EPF6024ATC144-2N Intel 使用用途: Peripheral Bus Bridge / Glue Logic, Telecom Line Card Interface Logic, ASIC Prototyping and Emulation, Legacy System Refresh / Field Upgrade, Test & Measurement Front-End Logic EPC2LC20 Altera 使用用途: Peripheral Bus Bridge / Glue Logic, Industrial Glue Logic and Control, ASIC Prototyping and Emulation, Test & Measurement Front-End Logic EPF6016ATC144-3N Intel 使用用途: Peripheral Bus Bridge / Glue Logic, Industrial Glue Logic and Control, Legacy System Refresh / Field Upgrade EPM240T100C5N Intel 使用用途: Industrial Glue Logic and Control DS21Q48 E1/T1 framer companion 使用用途: Telecom Line Card Interface Logic EPC16 16-Mbit configuration PROM for in-system updates 使用用途: Telecom Line Card Interface Logic EPF10K50VRC240-3 Intel 使用用途: ASIC Prototyping and Emulation EPF6024ATC144-3 Intel 使用用途: Legacy System Refresh / Field Upgrade AD9220 12-bit ADC companion 使用用途: Test & Measurement Front-End Logic

What is the EPF6024ATC144-3N and which family does it belong to?

The EPF6024ATC144-3N is a member of the Altera (now Intel) FLEX 6000 family of SRAM-based Field-Programmable Gate Arrays (FPGAs). It provides 24,000 typical gates, 1,960 logic elements organized into 196 LABs, and 117 user I/O pins in a 144-pin LQFP package. According to manufacturer datasheets, it is fabricated on a 0.42 µm CMOS process and operates from a 3.3 V core supply with mixed-voltage I/O support.

What is the difference between EPF6024ATC144-3N and EPF6024ATC144-3?

The EPF6024ATC144-3N and EPF6024ATC144-3 are functionally identical FLEX 6000 FPGAs in the same 144-pin LQFP package, with the same 1,960 logic elements and 117 user I/O pins. The 'N' suffix designates lead-free / Pb-free terminal finish per JEDEC J-STD-609, while the non-N version typically uses a SnPb finish. Both share speed grade -3 and the same electrical characteristics; the 'N' variant is the RoHS-compliant option.

What is the operating voltage of EPF6024ATC144-3N?

The EPF6024ATC144-3N requires a 3.3 V core supply (VCCINT) and supports per-bank I/O voltages (VCCIO) of 3.3 V or 5.0 V via the MultiVolt I/O interface. According to the Altera FLEX 6000 datasheet, devices operating with VCCIO below 4.75 V incur a nominally greater timing delay (tOD2 instead of tOD1), so designers must check timing margins for 3.3 V-only I/O banks.

How many user I/O pins does the EPF6024ATC144-3N have?

The EPF6024ATC144-3N provides 117 user I/O pins in its 144-pin LQFP package, with the remaining pins allocated to VCCINT, VCCIO, GND, JTAG (TDI/TDO/TMS/TCK), configuration (nCONFIG, nSTATUS, CONF_DONE, MSEL pins), clock (CLK0/CLK1), and dedicated inputs (DEV_CLRn, DEV_OE, INIT). All 117 user I/Os support MultiVolt interfacing.

What is the maximum internal frequency of EPF6024ATC144-3N?

The EPF6024ATC144-3N speed grade -3 supports a maximum internal frequency of approximately 142.86 MHz. Actual achievable performance depends on routing congestion, logic utilization, and clock network selection (CLK0/CLK1 global or local). Speed grades -2 and -1 offer progressively lower Fmax for cost-sensitive designs. Designers should consult Quartus II timing reports for post-route numbers.

Is the EPF6024ATC144-3N still in production?

No, the EPF6024ATC144-3N is listed as obsolete by Intel/Altera per distributor lifecycle data from DigiKey and Octopart. Last-time-buy and limited obsolete-stock inventory may still be available through authorized distributors and aftermarket suppliers, but no new factory production is occurring. For new designs, Altera/Intel recommends migration to the MAX II or Cyclone series with verified pin compatibility.

Where to buy EPF6024ATC144-3N online?

The EPF6024ATC144-3N is available from authorized distributors and aftermarket suppliers listed on Octopart (14 distributors indexed) including DigiKey and Mouser for any remaining factory stock. As of 2026-09-12, expect prices in the $20-40 unit range depending on quantity; lead times vary because the part is obsolete. Independent distributors like Avaq and Jotrin may carry obsolete inventory at premium pricing.

What is the price of EPF6024ATC144-3N?

Pricing for the EPF6024ATC144-3N as of 2026-09-12 ranges from approximately $38.50 at qty 1 down to roughly $21.40 at qty 1,000 based on current distributor listings on DigiKey and Mouser. Because the part is obsolete, prices are subject to significant volatility depending on remaining inventory and market demand. Always request fresh quotes from multiple sources for production procurement.

What is the lead time for EPF6024ATC144-3N?

Lead time for the EPF6024ATC144-3N is variable because the part is obsolete and factory production has ended. As of 2026-09-12, authorized distributors show mixed stock: DigiKey and Mouser may ship from remaining inventory within 1-5 business days, while aftermarket suppliers quote 2-8 weeks depending on stock pulls. Always verify current lead time before committing to a design schedule.

Is EPF6024ATC144-3N in stock at distributors?

Stock availability for the EPF6024ATC144-3N varies by distributor and fluctuates weekly. DigiKey and Mouser historically list some quantity on the product page, and Octopart aggregates real-time stock from 14 sources. As of 2026-09-12, small quantities (under 100 pieces) are generally available, but larger volumes require quote-based sourcing from independent distributors.

What is the best drop-in replacement for EPF6024ATC144-3N?

The best drop-in same-package alternatives for the EPF6024ATC144-3N are other EPF6024ATC144 variants sharing the 144-pin LQFP footprint, such as EPF6024ATC144-2N (speed grade -2, lower Fmax) and EPF6024ATC144-1N (speed grade -1). These share the same die and pinout and differ only in internal timing performance. For a true modern replacement, the MAX II EPM240T100 (different package) or Cyclone series require PCB rework.

Can EPF6024ATC144-2N replace EPF6024ATC144-3N?

Yes, the EPF6024ATC144-2N can replace the EPF6024ATC144-3N as a drop-in alternative on the same 144-LQFP footprint with identical pinout. The only difference is speed grade: the -2N runs at a lower internal Fmax (slower timing) than the -3N. If your design meets timing at the -2 grade, the -2N is a fully pin-compatible substitute. The -3N-to-2N substitution typically has a small impact on fmax but no impact on logic functionality.

What is the difference between EPF6024ATC144-3N and EPF6016ATC144-3N?

Both the EPF6024ATC144-3N and EPF6016ATC144-3N belong to the FLEX 6000 family in the same 144-pin LQFP package, but the EPF6024 has 24,000 gates and 1,960 logic elements while the EPF6016 has 16,000 gates and 1,320 logic elements. The 6024 is the higher-density member; the 6016 is pin-compatible and can be a downward substitute if design utilization fits. They share the same configuration interface and JTAG chain.

Where to download the EPF6024ATC144-3N datasheet PDF?

The EPF6024ATC144-3N datasheet PDF is available from Altera/Intel and several distributor hosts. The verified source is alterasemi.com at https://www.alterasemi.com/datasheet/alterasemi/EPF6024ATC144-3N.pdf. The full FLEX 6000 family datasheet covering this part is published by Altera (now Intel PSG); original device family documentation is also archived at Intel's Altera product legacy page.

What is the pinout of EPF6024ATC144-3N in 144-LQFP?

The EPF6024ATC144-3N pinout in the 144-pin LQFP package assigns: pin 1 to GND, dedicated clock inputs on CLK0 and CLK1, configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL0/1/2) on a fixed bank, JTAG TDI/TDO/TMS/TCK on dedicated positions, four VCCINT and VCCIO bank supplies, and 117 user I/O on the remaining pins. Refer to the FLEX 6000 device handbook pin tables for the exact per-pin assignment.

When should I choose EPF6024ATC144-3N over EPF6016ATC144-3N?

Choose the EPF6024ATC144-3N when your design requires more than 1,320 logic elements or ~16,000 gates - the EPF6024 provides 1,960 LEs and 24K gates in the same 144-LQFP package, giving roughly 50% more logic capacity. Choose the EPF6016ATC144-3N when your design fits within 1,320 LEs and you want lower cost or better timing closure due to smaller die. Both are obsolete; pick by required logic density.

Is the EPF6024ATC144-3N suitable for new product designs?

The EPF6024ATC144-3N is not recommended for new product designs because it is marked obsolete by Altera/Intel and is no longer in factory production. Sourcing relies on obsolete-stock inventory with volatile pricing and lead times. For new designs, evaluate the MAX II CPLD series (CPLD, lower power) or Cyclone IV/V FPGAs (modern, higher density) with verified pin and tool compatibility for migration.

エンジニアリング参考データ: EPF6024ATC144-3N — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EPF6024ATC144-3N when your design needs 24,000 gates / 1,960 logic elements in a 144-LQFP FLEX 6000 FPGA and you require the highest speed grade (142.86 MHz Fmax) plus modern RoHS-compliant Pb-free assembly. Choose EPF6024ATC144-2N if your design meets timing at speed grade -2 and you can source the lower-grade part at lower cost. Choose EPF6024ATC144-1N only if timing margins are very loose. Choose EPF6016ATC144-3N as a downward substitute when your design fits within 1,320 LEs - same package, same speed grade, lower price. All variants are obsolete today; for new designs consider the MAX II CPLD family or Cyclone series FPGAs, but verify pin compatibility before committing to a layout.

代替品との比較

パラメータ	この製品	EPF6024ATC144-3	EPF6024ATC144-2N	EPF6024ATC144-1N	EPF6024ATC144	EPF6016ATC144-3N
Brand	Altera	Altera	Altera	Altera	Altera	Altera
Package	144-LQFP	144-LQFP - same	144-LQFP - same	144-LQFP - same	144-LQFP - same	144-LQFP - same
Family	FLEX 6000	FLEX 6000	FLEX 6000	FLEX 6000	FLEX 6000	FLEX 6000
Typical Gates	24,000	24,000	24,000	24,000	24,000	16,000
Logic Elements	1,960	1,960	1,960	1,960	1,960	1,320
LABs	196	196	196	196	196	132
User I/Os	117	117	117	117	117	117
Speed Grade	-3 (142.86 MHz)	-3 (142.86 MHz)	-2 (lower Fmax)	-1 (lowest Fmax)	unspecified	-3 (142.86 MHz)
RoHS (N suffix = Pb-free)	Yes (N suffix)	No (SnPb)	Yes	Yes	unknown	Yes
Lifecycle Status	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete

主な差別化要因

RoHS-compliant (Pb-free) terminal finish （vs EPF6024ATC144-3)
Highest speed grade in family (-3) （vs EPF6024ATC144-2N)
Higher logic density (1,960 LEs) （vs EPF6016ATC144-3N)

設計ノート

The EPF6024ATC144-3N requires a tightly-regulated 3.3 V core supply on VCCINT pins (multiple pins distributed around the package for low-impedance power distribution). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 3 mm of the pin, plus one bulk 33 µF tantalum per device. VCCIO pins support either 3.3 V or 5.0 V per bank; group I/O by voltage in your PCB schematic and place one decoupling cap per VCCIO pin. Estimated: total quiescent current ICCINT for a fully utilized EPF6024 is in the 50-150 mA range; verify with Quartus II PowerPlay early in the design cycle.

Use a 4-layer PCB stackup with continuous ground and power planes for the 144-LQFP footprint. Route all configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL0-2, DATA0-7) as short, parallel traces to the EPC configuration PROM. Keep JTAG chain signals away from switching I/O to avoid boundary-scan false triggers. The 0.5 mm lead pitch of LQFP requires 0.25 mm/0.20 mm trace/space design rules; larger packages like BGA-256 variants of this family would need 0.15 mm rules. Estimated: a 144-LQFP routes cleanly on 4-layer FR-4 with 4 mil traces and 4 mil spaces.

Three common pitfalls: (1) VCCIO bank mixing - all I/Os in a bank must share the same VCCIO voltage; mixing 3.3 V and 5.0 V outputs in the same bank damages the output drivers. (2) Configuration mode selection - MSEL0-2 pins must match the configuration mode (PS, PPS, PPA) hard-coded or driven at power-up; wrong MSEL settings leave the device unconfigured. (3) Speed-grade bitstream portability - bitstreams compiled for speed grade -3 generally work on -2 and -1 silicon but at reduced timing performance; never recompile if you only need to substitute speed grades. Estimated: configuration time from EPC2 PROM is ~50 ms typical for the EPF6024.

The EPF6024ATC144-3N in 144-LQFP is rated 0 °C to 85 °C junction temperature in the commercial grade. The LQFP package has a thermal resistance theta-JA around 35-45 °C/W (without airflow); with 1 W dissipation the junction rises ~40 °C above ambient. Estimated: a fully-utilized 1,960 LE design switching at 100 MHz dissipates 0.5-1.5 W depending on toggle rate; design margin should assume 2 W worst case for thermal verification. For designs approaching 2 W, use industrial-grade silicon where available or add 100 LFM airflow.

コンプライアンス情報

RoHS

Compliant

REACH

Unknown

AEC-Q100

Not Qualified

鉛フリー

Yes

ハロゲンフリー

Unknown

紛争鉱物

Unknown

Lead-free / Pb-free terminal finish per the 'N' suffix (JEDEC J-STD-609). RoHS compliance inferred from N-suffix designation per Altera/Intel product marking convention. AEC-Q100 qualification not applicable for commercial-grade FPGA. REACH, halogen-free, and conflict-mineral declarations not present in verified data and marked unknown.

データ検証日: 2026-09-12 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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